HK1045560B - 高溫檢測器及其製造方法 - Google Patents

高溫檢測器及其製造方法

Info

Publication number
HK1045560B
HK1045560B HK02107021.6A HK02107021A HK1045560B HK 1045560 B HK1045560 B HK 1045560B HK 02107021 A HK02107021 A HK 02107021A HK 1045560 B HK1045560 B HK 1045560B
Authority
HK
Hong Kong
Prior art keywords
high temp
production
high temperature
temperature detector
detector
Prior art date
Application number
HK02107021.6A
Other languages
English (en)
Other versions
HK1045560A1 (en
Inventor
Bernitz Georg
Zitzmann Heinrich
Original Assignee
博格瓦納貝魯系統有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 博格瓦納貝魯系統有限公司 filed Critical 博格瓦納貝魯系統有限公司
Publication of HK1045560A1 publication Critical patent/HK1045560A1/xx
Publication of HK1045560B publication Critical patent/HK1045560B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H01C3/10—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration
    • H01C3/12—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids the resistive element having zig-zag or sinusoidal configuration lying in one plane
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H01C3/04—Iron-filament ballast resistors; Other resistors having variable temperature coefficient
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Thermistors And Varistors (AREA)
  • Radiation Pyrometers (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Control Of Temperature (AREA)
HK02107021.6A 1999-08-05 2002-09-26 高溫檢測器及其製造方法 HK1045560B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19936924A DE19936924C1 (de) 1999-08-05 1999-08-05 Vorrichtung zur Hochtemperaturerfassung und Verfahren zur Herstellung derselben
PCT/EP2000/006966 WO2001011325A1 (de) 1999-08-05 2000-07-20 Vorrichtung zur hochtemperaturerfassung und verfahren zur herstellung derselben

Publications (2)

Publication Number Publication Date
HK1045560A1 HK1045560A1 (en) 2002-11-29
HK1045560B true HK1045560B (zh) 2003-08-29

Family

ID=7917294

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02107021.6A HK1045560B (zh) 1999-08-05 2002-09-26 高溫檢測器及其製造方法

Country Status (8)

Country Link
US (1) US6686828B2 (zh)
EP (2) EP1286144B1 (zh)
JP (1) JP3652647B2 (zh)
KR (1) KR100452794B1 (zh)
AT (2) ATE237801T1 (zh)
DE (3) DE19936924C1 (zh)
HK (1) HK1045560B (zh)
WO (1) WO2001011325A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19936924C1 (de) 1999-08-05 2001-06-13 Georg Bernitz Vorrichtung zur Hochtemperaturerfassung und Verfahren zur Herstellung derselben
JP2004241754A (ja) * 2002-07-16 2004-08-26 Chem Art Technol:Kk 基板処理方法及び基板処理装置
DE10356367B4 (de) * 2003-11-28 2009-06-10 Georg Bernitz Verfahren zur Herstellung eines Bauelements und Bauelement
US7316507B2 (en) * 2005-11-03 2008-01-08 Covidien Ag Electronic thermometer with flex circuit location
US7749170B2 (en) 2007-05-22 2010-07-06 Tyco Healthcare Group Lp Multiple configurable electronic thermometer
US8496377B2 (en) 2007-12-31 2013-07-30 Covidien Lp Thermometer having molded probe component
DK2312288T3 (da) * 2009-10-16 2013-02-18 Jumo Gmbh & Co Kg Temperatursensor med printplade med flere lag
DE102010048309A1 (de) * 2010-10-14 2012-04-19 Continental Automotive Gmbh Verfahren zur Herstellung eines Hochtemperatur-Sensors und Hochtemperatur-Sensor
DE102010050315C5 (de) * 2010-11-05 2014-12-04 Danfoss Silicon Power Gmbh Verfahren zur Herstellung von gesinterten, elektrischen Baugruppen und damit hergestellte Leistungshalbleitermodule
DE102011103827B4 (de) * 2011-06-01 2014-12-24 Heraeus Sensor Technology Gmbh Verfahren zur Herstellung eines Temperatursensors
DE102011103828B4 (de) * 2011-06-01 2017-04-06 Heraeus Sensor Technology Gmbh Massenproduktion kleiner Temepratursensoren mit Flip-Chips
DE102011089608A1 (de) * 2011-12-22 2013-06-27 Horst Siedle Gmbh & Co. Kg Gehäuseteil für einen elektrischen Sensorsowie Verfahren zur Herstellung des Gehäuseteils

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3105229A (en) * 1958-12-08 1963-09-24 Sturm Justin Temperature sensing device
DE3068764D1 (en) * 1979-03-20 1984-09-06 Matsushita Electric Ind Co Ltd Ceramic type sensor device
US4485670A (en) * 1981-02-13 1984-12-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Heat pipe cooled probe
US4505807A (en) * 1982-02-22 1985-03-19 Ngk Spark Plug Co., Ltd. Oxygen sensor
DE3733193C1 (de) * 1987-10-01 1988-11-24 Bosch Gmbh Robert NTC-Temperaturfuehler sowie Verfahren zur Herstellung von NTC-Temperaturfuehlerelementen
JPH0310131A (ja) * 1989-06-07 1991-01-17 Ngk Spark Plug Co Ltd 高温用サーミスタ
DE3941837C2 (de) * 1989-12-19 1994-01-13 Bosch Gmbh Robert Widerstandsmeßfühler zur Erfassung des Sauerstoffgehaltes in Gasgemischen und Verfahren zu seiner Herstellung
EP0471316B1 (de) * 1990-08-17 1996-09-18 Sensycon Gesellschaft Für Industrielle Sensorsysteme Und Prozessleittechnik Mbh Sensor für thermische Massenstrommesser
JP3175890B2 (ja) * 1993-12-27 2001-06-11 日本碍子株式会社 温度センサ
US6014073A (en) * 1995-05-11 2000-01-11 Matsushita Electric Industrial Co., Ltd. Temperature sensor element, temperature sensor having the same and method for producing the same temperature sensor element
DE19621000C2 (de) * 1996-05-24 1999-01-28 Heraeus Sensor Nite Gmbh Temperatur-Sensor mit einem Meßwiderstand
US6140906A (en) * 1996-11-08 2000-10-31 Tdk Corporation Resistive temperature sensor and manufacturing method therefor
US6081182A (en) * 1996-11-22 2000-06-27 Matsushita Electric Industrial Co., Ltd. Temperature sensor element and temperature sensor including the same
DE19742696A1 (de) * 1997-09-26 1999-05-06 Siemens Matsushita Components Bauelement mit planarer Leiterbahn
DE19750123C2 (de) * 1997-11-13 2000-09-07 Heraeus Electro Nite Int Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung
EP0973020B1 (de) * 1998-07-16 2009-06-03 EPIQ Sensor-Nite N.V. Elektrischer Temperatur-Sensor mit Mehrfachschicht
DE19901184C1 (de) * 1999-01-14 2000-10-26 Sensotherm Temperatursensorik Platintemperatursensor und Verfahren zur Herstellung desselben
DE19901183C2 (de) * 1999-01-14 2001-01-25 Sensotherm Temperatursensorik Platintemperatursensor und Herstellungsverfahren für denselben
DE19936924C1 (de) 1999-08-05 2001-06-13 Georg Bernitz Vorrichtung zur Hochtemperaturerfassung und Verfahren zur Herstellung derselben

Also Published As

Publication number Publication date
KR20020032543A (ko) 2002-05-03
US6686828B2 (en) 2004-02-03
KR100452794B1 (ko) 2004-10-14
EP1196747A1 (de) 2002-04-17
DE50001807D1 (de) 2003-05-22
HK1045560A1 (en) 2002-11-29
JP3652647B2 (ja) 2005-05-25
JP2003506705A (ja) 2003-02-18
ATE237801T1 (de) 2003-05-15
EP1196747B1 (de) 2003-04-16
ATE504814T1 (de) 2011-04-15
DE50016092D1 (de) 2011-05-19
US20020118093A1 (en) 2002-08-29
EP1286144B1 (de) 2011-04-06
DE19936924C1 (de) 2001-06-13
WO2001011325A1 (de) 2001-02-15
EP1286144A1 (de) 2003-02-26

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20140720