TW409309B - Semiconductor wafer mount-plate and semiconductor wafer polishing method using the mount-plate and management device thereof - Google Patents

Abstract

The object of the invention is to provide a semiconductor wafer mount-plate and semiconductor wafer polishing method using the mount-plate and management device thereof which eliminate the need for repairing of the mount-plates to efficiently polish the semiconductor wafers by preventing the deformation of the mount-plates due to the changes with age. To achieve the object, both a front face 11 and a rear face 12 of a mount-plate 1 are precisely flattened. The mount-plate 1 is inverted for each batch of polishing. In relation to the mount-plate 1 from which semiconductor wafers 10 are peeled off and which is cleaned, identification data and the surfaces in use are recognized, and the amount of deformation of the surfaces and the state of the frequencies of application, are sensed. When the deformation is not more than a specified value, the mount-plate is sent again to the process of mounting. When the deformation is more than the specified value, the mount-plate l is replaced with new one.

Description

V. Description of the invention Cl) The invention belongs to the technical field of the invention The present invention relates to a semiconductor wafer bonding plate constituting a polishing device for a semiconductor wafer, and the use of the plate makes it possible to stably manufacture a high plane: a method for polishing a semiconductor wafer and the Semiconductor wafer bonding device. As shown in FIG. 10 (a), the conventional technique for grinding semiconductor wafers requires that the body wafer 10 be adhered to the bonding plate 8. However, the σ plate 8 has been used in the past. The single-sided (hereafter referred to as "surface 81") i U 'sticking sheet is made of ceramic magnets, which has high rigidity and high flatness, but when the number of uses of the grinding process increases, as shown in Figure 10 (b) The surface 81 shown is modeled after the shape of the polishing device (not shown above). The deformation of the bonding surface occurs in micrometer units. Also, the flatness of the semiconductor wafer is extremely high. The stability of the wafer with the deformation degree of the adhesive plate is fatal. In order to restore the flatness of the adhesive sheet 8, conventionally, as shown in Figs. 10 (b) and (0), measures such as regenerating 81a after cutting the peripheral portion 83 appropriately were adopted. In the prior art of circular grinding and finishing to be as flat as possible, for example, the technique disclosed in JP-A-Sho 64-285 No. 7 does not use a specified fluid pressure to uniformly act on the surface of the adhesive sheet to suppress the adhesive sheet. Deformation of the wafer, or 'complicated' as described in Japanese Patent Publication No. 4 to 242929, published by the technical institute of Gong Er Mo Kai, π, and by lapping the fake wafer once on the sticking board, the lapping will cause a fixed deformation on the polishing cloth side. In the fifth, description of the invention ¢ 2) the deformed surface is then polished to adjust the shape of the adhesive sheet, and then the target semiconductor wafer is re-adhered and polished. Problems to be Solved by the Invention However, in the conventional method of appropriately cutting the peripheral portion, as the number of uses increases, the deformation of the adhesive sheet must be gradually emphasized, and soon the boundary cannot be corrected. Of course, there is also a method of cutting the periphery of the plate for bonding and cutting the convex portion 82a of the back surface 82 shown in FIG. 10 (c) at the same time to regenerate both sides to a high flatness. Doubled on one side, it is difficult to adopt in terms of productivity and economy. The regeneration frequency is once or twice every six months. However, if it is regenerated more than 4 times, in most cases, it will only be discarded. In addition, if the above-mentioned prior art causes fluid pressure to be applied, a new device must be introduced, and the adjustment of the polishing cloth side using a fake wafer and the use of the lapping and polishing of the adhesive sheet will certainly reduce productivity. The present invention was conceived in view of the above-mentioned situation, and an object thereof is to provide a technique of 'correcting the aging deformation of an adhesive plate by using a mechanical action of a grinding process of a semiconductor wafer without increasing the number of processes' There is no need for a development grinding process for regenerating the adhesive sheet that can be processed independently of the abrasive process, and the adhesive sheet itself can have a long life. Means for Solving the Problem Therefore, in the present invention, both the front and back surfaces of a semiconductor wafer bonding plate constituting a polishing device for a semiconductor wafer are subjected to high-precision plane processing. In addition, when grinding a semiconductor wafer adhered to a semiconductor wafer adhesion plate, at least in each batch of the grinding process, the adhesion plate is turned, and

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40930S V. Description of the invention (3) The flip surface is correspondingly pasted on the surface of the pasting plate, and then the semiconductor wafers are ground and polished. In addition, the parallelism is used as an index for evaluating the flatness of the bonding sheet, and whether or not the wafer bonding surface of the bonding sheet is changed according to the value. In addition, by automatically measuring the parallelism measurement mechanism, the discriminating snail on the surface of the wafer for distinguishing semiconductor wafers from the wafer is distinguished from the wafers for semiconductor wafers. The identification code constitutes a management device. After the number of times of use and the parallelism at that time are recorded in each batch of the adhesive sheet on the table, it is automatically judged whether the adhesive sheet continues to be used according to these data. , Abort, and change wafer bonding surfaces. According to this record, it is also possible to judge whether the operator of the grinding device should change the adhesive surface. By following the judgment of the management device, it is also possible to eliminate the change of judgment among the operators. In addition, by setting the turning-over and transfer mechanism of the sticking sheet, the sticking sheet can be automatically turned and moved to the sticking device based on the tube and the judgment result of the management device. Thereby, the surface can be pasted automatically. Embodiment of the Invention In terms of accuracy of the flatness of the above-mentioned semiconductor wafer bonding sheet (hereinafter referred to as "adhesive sheet"), it is desirable that the two surfaces on the front and back sides are parallel to each other. In the case of sticking a semiconductor wafer with a parallelism exceeding 2 " m = when the board is polished, the flatness of the semiconductor wafer is deteriorated, and the method meets the current high-precision specifications. "‘,

V. Description of the invention (4) Here, Ping Yi and its flatness. In addition, if it becomes easy to invent the adhesive plate for grinding, and the use of the respective adhesive plate, the change of the parallelism of each batch is small, such as According to the number of times of pasting the board, it is not correct to implement the different identification of the pasting board. If there is a sticky, codeable identification mechanism, each pasting between the sides of the board records the data and preset instructions for each pasting. . As a result, the accuracy of the veneer or the surface code is the interval between the two planes when the two planes of a certain imaginary parallel plane are sandwiched by the plane form in accordance with ‘JISB0620 '. Set the plate for pasting to identify the inside and outside of the watch. Grasp the difference in the deformation status of the watch over time. In the semiconductor wafer described above, at least the grinding process of the wafer after the semiconductor wafer is alternately pasted on the surface of each batch of the grinding process, the grinding process' force acts as if it offsets the deformation of the previous grinding process. Therefore, the deformation does not accumulate, and the long-term continuous change is small. In addition, it can also be applied in multiple batches in the grinding process. Due to the change in the parallelism of the grinding process in one batch, it is no problem to change it every 10 batches. Or there may be a condition where the sheet is deformed ', for example, a method called 6 cycles on the surface and a cycle called on the back surface j 〇. In the method described above, if the identification code in the table of the respective adhesive sheet setting area and the management of the adhesive sheet that distinguishes each adhesive sheet are reliable and easy, it is an advantage. The installation management device 'includes a measurement mechanism, which has these identification and = order degree measurement mechanisms and automatically measures and records the parallelism of each paste' and a comparison wheel-out mechanism, which distinguishes the plates used in the grinding device according to the use in the table The order of the times is the parallelism in the respective tables of the plates, and after comparing the recorded values, the change of the adhesion surface of the "adhesion plate" can be easily grasped for multiple adhesion plates Changes in stickiness over time, Watts ~ 0 —— θ 太 趟 φ & You'll easily decide whether to change the stickiness

409301 V. Description of the invention (5) Whether veneering can be continued or not There are multiple grinders used in the production scale. For each of these grinders', each sticking plate is not specifically used. Each adhesive sheet has subtle differences in properties and states, and because it has inherent characteristics of the device, it is not necessarily simply deformed with the same tendency. Therefore, it is necessary to take a detailed correspondence for each adhesive sheet. It is easier to deal with the above-mentioned details if a management device that manages the change in parallelism in a unitary manner is prepared for each face of each sticking plate. Hereinafter, the present invention will be described in more detail using examples. Before that, the drawings are explained a little. Fig. 1 is a side cross-sectional view showing the shape of an adhesive sheet, and Fig. 2 is a view showing the arrangement of the present invention to distinguish the front and back surfaces. A perspective view of an example of an identification plate for sticking. FIG. 3 is a flowchart showing an example of a method for polishing a semiconductor wafer of the present invention, and FIG. 4 is a measurement position for measuring a deformation amount of the sticking plate. Fig. 5 is a diagram showing the measurement position for measuring the deformation amount of the adhesive sheet, and Fig. 6 is a diagram showing the deformation amount over time of the adhesive sheet in Example 2, and Fig. 7 is shown in FIG. 8 is a diagram showing the amount of deformation of the pasting plate for the past. FIG. 8 is a schematic diagram showing the structure of the management device of the pasting plate for the fourth embodiment, and FIG. 9 is a view showing the pasting plate placement table. A diagram of the internal structure. EXAMPLES The present invention will be described in more detail using examples with reference to the drawings. Example 1 First, the adhesive sheet according to the present invention will be described.

Page 8 409309 V. Description of the invention (6) The conventional adhesive plate 8 shown in FIG. 10 (a) has only the surface 8 1 processed into a high flatness. However, this embodiment 1 listed in FIG. 1 0 " m 内 内。 The surface 11 and the back surface 12 of the adhesive sheet 1 are processed with high flatness, and the precision is processed to a parallelism of 2. 0 " m 内 内. And 'in the case of the conventional adhesive sheet, the parallelism of the surface is within 2-0 // m', but the parallelism of the back surface generally exceeds that in Example 1. Using the above-mentioned adhesive sheet, during the grinding process every- Use after the parent changes the paste surface. As a result, the deformation of each batch was offset, and the number of batches until the parallelism of the pasting plate exceeded 2.0 to m compared with the conventional method was "more slowly than the conventional method". In addition, in the first embodiment, "in order to use the sensor identification table and subsequent recording", identification codes 2} and 22 are provided on both sides of the surface of the adhesive sheet, as shown in Fig. 2. This is due to the same flatness finishing on both sides of the surface of the sticking plate. During the manufacturing process, only the operator's memory or records can cause a management error. By setting this identification code, when each batch is changed, When pasting the surface, the surface and the back can be reliably distinguished, so that the above-mentioned offsetting effect can be better exhibited. _ Example 2 Using the adhesive sheet of the present invention, >; A / dL You Yue uses "adhesion-grinding and peeling" shown in Fig. 3 as a cycle of grinding to produce a phase, * 2τ, Λ Every time the batch is completed, the parallelism of the side of the B yen side is measured. However, in the case of Guya-Taishencheng 9 Du 10 + the order value exceeds the preset value (in the present embodiment 2 is ± 2 / zm), Ao Cheng. Then, during the grinding process, set up a stick for each-day yak-yam, and you will measure the order of thousands of orders. Confirm that the quantity / value will increase with the number of batches used. And favoritism gradually decreased. Continue to use the photo like this

409308 V. Description of the invention (7) When the same surface is pasted, the measured value exceeds 0, and it starts to increase in the reverse direction. This changes the adhesive surface at a time when it exceeds 2 # m again. By doing so, the above-mentioned sticking sheet can be continuously used under the correct deformation. In the second embodiment, the above-mentioned parallelism is obtained by the following method. First, as shown in FIG. 5, two straight lines that pass through the center of the adhesive sheet 1 and are orthogonal to the four intersection points At, Di, A2, D2 of the outer periphery of the adhesive sheet, and There are 4 points of 3 equal parts in each of the three points &, C !, B2 'C2. A total of 8 points are determined as the measurement points. From the measurement points, B :, Q, Di, the measured values ai, h, c ,, Mountain, get measurement values a2, b2, c2, d2 from measurement points A2, B2, C2, and D2. Use these values to calculate Pi, P2, Qi, and Q2 using the following calculation formulas. Among them, especially for parallelism. Values P1 and P2 are used. In addition, 1 and Q2 will be described later. (Expression 1)

Pj = {(a) + dj)-(bj + Cj)}-^ 2 (Eq. 2) P2 = ((a2 + d2) _ (b2 + C2)) + 2 (Eq. 3) 〇! = {(Ai + b ^ -Cc ^ di)} + {(a2 + b2)-(c2 + d2)} (Eq. 4) Q2 = ((aj + bj)-(a2 + b2)) + {(cj + d!) -(c2 + d2)} (Equation 5) P = (iVP2) +2 The deformation amounts Pi and P2 are obtained from the above calculation formulas. * The deformation caused by bending or abrasion on the A1-D1 line and A2-D2 line. Size, about department P !,

Page 10 ___ 400309___ V. Description of Invention (8)

The value P 'of the average value of Pa is a deformation amount assuming that the deformation is uniform in the circumferential direction, and represents a value of parallelism. In the second embodiment, this value is described as parallelism.

Qi and Q2 are the values of the friction and deformation of the uneven sentence in the circumferential direction. This is based on the non-uniformity of the material of the adhesive sheet. The increase of this value cannot be corrected by changing the adhesive surface. In addition, in the case of polishing a wafer using an adhesive sheet that causes such uneven deformation, the flatness of the wafer is complicatedly affected. Therefore, if one of A and O2 exceeds the allowable range, it is best to discard the P value within the allowable range. Embodiment 3 In Embodiment 1, the method of changing the adhesion surface of the plates for adhesion is adopted in each batch. In Embodiment 2 ', the adhesion surface is changed when the measured value of the parallelism exceeds a preset value. In Example 3, 'continue to use under each batch of the grinding process to change the bonding surface' If the parallelism [P value] exceeds the + (positive) direction specified value (1.0 em) shown in Figure 7 'Stop turning, such as parallelism As small (as if the deformation is going in the negative direction), only stick to one side and continue to use. If the specified value on the _ (negative) side is exceeded soon, the change of the adhesion surface of each ratio is started again. Therefore, by selecting a predetermined value smaller than the allowable value of parallelism, the parallelism can be kept at a value far smaller than the allowable range. Also, by inserting the continuous use of only one side only for a short period of time like this, it is possible to use the method of changing the adhesive surface every batch for most of the use period. Therefore, the rate of change of parallelism during use is small, and production can be performed in a state where the flatness of the wafer is extremely stable.

40930S V. Description of the invention (9) In addition, in this embodiment 3 'the specified values are 1, 0 # in and -0.2 # in' but this is to make the period of use only after sticking on one side as short as possible 'and Due to the interaction with the polishing device, the flatness of the semiconductor wafer is better when the parallelism (P value) is on the slightly positive side. In FIG. 7, only the parallelism (P value) is shown, but Q! And Q2 ′ are actually less dependent on order, and are located within ± 1 · 0 # m. However, due to the non-uniformity of the material of the adhesive sheet, there are a few of them that are greater than ± 1.0 # m. Such an adhesive sheet is discarded as a defective product for the reasons described above. Embodiment 4 In this embodiment 4, a management device for a semiconductor wafer sticking plate is shown, which is connected to the wafer sticking device. According to the above-mentioned method for manufacturing a semiconductor wafer, the parallelism of the sticking plate is measured, and then The measured parallelism is compared with the specified value. In the case of exceeding the specified value, the wafer point surface of the bonding sheet is changed. As shown in FIG. 8, the management device of this embodiment 4 consists of a placement table 3 for placing an adhesion plate between the wafer adhesion device 7 and the wafer adhesion device 7. The placement plate 3 is individually identified and placed-Ϊ, and the σ3 adhesion plate is placed. ia Moreover, the identification unit 52 of the identification mechanism in the table is fixedly arranged above the placing table 3 and measures the measurement unit 5 of the measurement mechanism 5 and the free measurement unit 5 = shape amount Η2, * which ...: After changing the judgment of the sticking surface of the circle, the computer (not shown in the figure) that outputs the judgment result, and the "inspection of the change of the sticking surface" is displayed on the machine f, by turning the laminating sheet la The configuration of the wheel structure 6 of the adhesive surface is changed. Turning machine

40930S V. Description of the invention (ίο) The upper surface of the placing table 3 forms a flat surface as the displacement measurement becomes its reference, and on the mechanism, when the laminating sheet la is transported, as shown in FIG. The lower part of the lifting mechanism 31 raises the roller 34, and when the laminating sheet la is arranged at a desired position, it is lowered and placed on the placing table 3. In the deformation measurement unit 5, eight laser sensors 51 are fixed, and the interval between them is 1/3 of the diameter of the laminating sheet 1a as shown in the second embodiment. The turning mechanism 6 includes a fork rotation table 61, which is lifted and rotated by receiving the sticking sheet 1a carried from the placing table 3, thereby turning the sticking sheet. In the wafer sticking device, since the wafer is always pasted from the upper side of the plate for sticking, the flip surface is used to automatically change the sticking surface. The features of the adhesive sheet used in the fourth embodiment will be described below. As shown in FIG. 9, the diameter of the second surface 12a formed by the adhesive sheet ia of the fourth embodiment is larger than the diameter of the first surface 11a, and a bar code 13a is provided on the side of the first surface 11a. Therefore, the 'identifying unit 52 recognizes the inside and outside of the table by identifying the step difference 14a caused by the difference in the caliber, and recognizes each sticking plate by identifying the bar code 13a. The reason for setting the step difference 1 4a is' Table 1 on the surface of the adhesive sheet for the purpose of semi-permanent use, the use of coatings or labels, etc., may not be identified due to wear and tear during use. Use the shape difference to avoid this problem. In addition, since the same problem applies to barcodes, this method can be solved by using a method such as embedding black ceramic magnets when manufacturing a plate for sticking stations. I Factory 5

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40930S —____ V. Description of the Invention (li) --- By using such a structure, 'the method of the third embodiment described above is used to manage each of the plurality of bonding plates located in the conductor wafer polishing process. '' In this way, in the management of a number of sticking 柘 u ^ recovery tablets used in the production scale of parallel Tang management below the specified value, can be used for a life of 10 times w * W of the conventional. Also, the required management can also be automated using a computer. Effects of the Invention The present invention is configured as described above, and has the following effects. (1) In the semiconductor wafer polishing process, due to the use of the mechanical action of the bridge in the manufacturing process to deform the pasting plate, it is not necessary to independently < place a part of the cutting and pasting plate process as before, production efficiency 生产Ancient =, κ Ah, and the durability of the adhesive sheet has been significantly extended. For example, in the past, it was regenerated once or twice every half a year, and the grinding was carried out at most 4 to 5 times. Using this invention, you can get a life of more than 10 times. (2) Therefore, the amount of adhesive plates used in the grinding process is significantly higher in semiconductor wafers. (3) Due to the stability of the parallelism of the adhesive plates, the variation in the flatness between batch grinding chambers is reduced. (4) In the simplest embodiment, it is not necessary to add a new device, and it can be applied to a conventional device as it is. "(5) · Make the specified value of parallelism smaller, which can easily increase the flatness of the semiconductor wafer stuck there and polished. This is because the specified value is changed to 1, and it will not spread as it is known. Increase the frequency of grinding, reduce the life of the sticking plate, reduce the production efficiency, etc.

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40930S V. Description of the invention (12) Figure 1 is a side cross-sectional view showing the shape of the sheet for adhesion. Fig. 2 is a perspective view showing an example of an adhesive plate provided with an identification code for distinguishing the inside and outside of the watch according to the present invention. Fig. 3 is a flowchart showing an example of a method for polishing a semiconductor wafer according to the present invention. Fig. 4 is a diagram showing a measurement position for measuring the amount of deformation of an adhesive sheet. Fig. 5 is a diagram showing a measurement position for measuring a deformation amount of a sheet for sticking.圊 6 is a graph showing the amount of deformation of the pasting sheet in Example 2 over time. Fig. 7 is a graph showing the amount of deformation of the pasting sheet in Example 3 over time. Fig. 8 is a schematic diagram showing the structure of a management device for a pasting sheet in the fourth embodiment. FIG. 9 is a schematic diagram showing the internal structure of a plate placement table for sticking. Fig. 10 is a side cross-sectional view showing the shape of a conventional adhesive sheet and its deformation caused by the passage of time. Explanation of symbols I Adhesive sheet II Surface 12 Back la Adhesive sheet 11a First side

Page 15 V. Description of the invention (13) 409308 12a Second face 13a Bar code 14a Segment difference 21 Identification code 22 Identification code 3 Placement table 31 Lifting mechanism 34 Roller 4 Roller belt 5 Displacement sensing unit 51 Sensor 52 Identification unit 6 Turning mechanism 61 Rotary table of forks 7 Wafer bonding device 10 Semiconductor wafer

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Claims (1)

40930S VI. Application for Patent Scope 1. A semiconductor wafer sticking plate constitutes a polishing device for semiconductor wafers and is used to adhere a semiconductor wafer to be polished to one side thereof, which is characterized by high precision on both the front and back sides. Plane processing. 2. For example, for the semiconductor wafer sticking plate in the first patent application, the two surfaces on the front and back are processed with high precision to achieve parallelism within 2. 3. For the semiconductor wafer sticking plate in the scope of the patent application, an identification code for identifying the inside of the table is set. 4. For the semiconductor wafer sticking plate in the second scope of the patent application, an identification code for identifying the inside of the table is set. 5. For the “Semiconductor Wafer Adhesive Sheets” in the scope of patent application No. 丨, 2, 3 or 4, the identification code is used to distinguish each semiconductor wafer sticking sheet between the semiconductor wafer polishing devices. . 6. —Semiconductor wafer polishing method 'characterized in that, when grinding a semiconductor wafer adhered to a semiconductor wafer bonding plate, at least in a polishing batch, the semiconductor wafer is alternately adhered to the semiconductor wafer adhesion. Use the sheet inside. 7—A method for polishing semiconductor wafers, which is characterized in that: ================================ the king of semiconductor wafers in the semiconductor wafer sticking plate of semiconductor wafers; Then, the parallelism is used as an index to determine the surface where the semiconductor wafer should be pasted. 8. A kind of management device for semiconductor wafer pasting, scoop identification mechanism, identifying the semiconductor wafer pasting == and the inside of the heart. ; Measure the parallelism of each side with a measurement mechanism; and compare the rotation mechanism Page 17 409308 7. The scope of the patent application is to distinguish each of the semiconductor wafer sticking plates between the polishing devices for semiconductor wafers, and record the parallelism in the respective tables according to the order of the number of times the surface is used. Compared with the preset value, an instruction is output as to whether the adhesive surface of the semiconductor wafer-adhesive plate is changed. Circle_ · page 18