TW409309B - Semiconductor wafer mount-plate and semiconductor wafer polishing method using the mount-plate and management device thereof - Google Patents
Semiconductor wafer mount-plate and semiconductor wafer polishing method using the mount-plate and management device thereof Download PDFInfo
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五、發明說明Cl) 發明所屬技術領域 本發明係關於構成半導體晶圓用研磨裝置之半導體晶 圓黏貼用板片、利用該板片使得可穩定地製造高平面: 半導體晶圓之研磨方法以及該半導體晶圓黏貼 理裝置。 攸a < e 習知技術 在研磨半導體晶圓時’如圖l〇(a)所示,需要將 體晶圓1 0黏在黏貼用板片8,但是以前一直採用σ 用板片8之單面(以下設為『表面81』)黏貼之方i U ' 黏貼用板片本身用陶磁等製作,剛性高,平面度高, 但是在研磨製程之使用次數增加時,如圖10(b)所示间 面81倣照研磨裝置之下平則上未示)之形狀變形成微 =:黏貼用板片之變形以微米單位發生,也因半導體晶圓 要未之平面度係極高水準,該黏貼用板片之變形 度晶圓之穩定造有致命性作用。 為了恢復黏貼用板片8之平面度,以前如圖i〇(b)、 (Ο所示,採用適當地切削周邊部83後再生 81a等對策。 卞一义衣如 又,此外也在用以將晶圓研磨精加工成儘可能平坦之 先行技術上,例如在特開昭64_285 7號公報公開之技術所 不’藉著令指定之流體壓力均勻地作用於黏貼用板片之表 面,抑制黏貼用板片之變形,或如在特開平4〜242929號公 二么開之技術所π ’也有複雜的’藉著在黏貼用板月一度 黏貼假晶圓後研磨,令在研磨布侧發生固定之變形,在該 五、發明說明¢2) 變形面再將黏貼用板片進行展成研磨’調整形狀後,重新 黏貼目的之半導體晶圓後研磨。 發明要解決之課題 可是,在習知之適當地切削周邊部之方式,隨著使用 次數增加’必定逐漸地強調黏貼用板片之變形,不久達到 無法修正之界限。當然,也有切削黏貼用板片之周邊,同 時切削圖10(c)所示之背面82之凸部82a,將兩面都再生為 平面度高的方法,但是因修所需時間及費用比只修正單面 增加一倍,在生產力、經濟性上難採用° 以别之再生頻次係每半年1次或2次’但是若再生超過 4次,在大部分之情況,變成只有丟棄之狀態。 又’上述之先行技術之令流體壓力作用的,必需引進 新的裝置,而利用假晶圓之研磨布側之調整和利用黏貼用 板片之展成研磨的,生產力當然降低。 本發明係鑑於上述之狀況而想出來的,其目的在於提 供一種一種技術’藉著依然利用在半導體晶圓之研磨製程 之機械式作用修正黏貼用板片之老化變形,不會增加製程 數’不需要只能和研磨製程獨立加工之用以再生黏貼用板 片之展成研磨製程’而且黏貼用板片本身可長壽命化。 解決課題之手段 因而’在本發明,將構成半導體晶圓用研磨裝置之半 導體晶圓黏貼用板片之表裡兩面高精度平面加工。 又’在研磨黏在半導體晶圓黏貼用板片之半導體晶圓 時,至少在研磨製程每一批令該黏貼用板片翻面,而且和V. Description of the invention Cl) The invention belongs to the technical field of the invention The present invention relates to a semiconductor wafer bonding plate constituting a polishing device for a semiconductor wafer, and the use of the plate makes it possible to stably manufacture a high plane: a method for polishing a semiconductor wafer and the Semiconductor wafer bonding device. As shown in FIG. 10 (a), the conventional technique for grinding semiconductor wafers requires that the body wafer 10 be adhered to the bonding plate 8. However, the σ plate 8 has been used in the past. The single-sided (hereafter referred to as "surface 81") i U 'sticking sheet is made of ceramic magnets, which has high rigidity and high flatness, but when the number of uses of the grinding process increases, as shown in Figure 10 (b) The surface 81 shown is modeled after the shape of the polishing device (not shown above). The deformation of the bonding surface occurs in micrometer units. Also, the flatness of the semiconductor wafer is extremely high. The stability of the wafer with the deformation degree of the adhesive plate is fatal. In order to restore the flatness of the adhesive sheet 8, conventionally, as shown in Figs. 10 (b) and (0), measures such as regenerating 81a after cutting the peripheral portion 83 appropriately were adopted. In the prior art of circular grinding and finishing to be as flat as possible, for example, the technique disclosed in JP-A-Sho 64-285 No. 7 does not use a specified fluid pressure to uniformly act on the surface of the adhesive sheet to suppress the adhesive sheet. Deformation of the wafer, or 'complicated' as described in Japanese Patent Publication No. 4 to 242929, published by the technical institute of Gong Er Mo Kai, π, and by lapping the fake wafer once on the sticking board, the lapping will cause a fixed deformation on the polishing cloth side. In the fifth, description of the invention ¢ 2) the deformed surface is then polished to adjust the shape of the adhesive sheet, and then the target semiconductor wafer is re-adhered and polished. Problems to be Solved by the Invention However, in the conventional method of appropriately cutting the peripheral portion, as the number of uses increases, the deformation of the adhesive sheet must be gradually emphasized, and soon the boundary cannot be corrected. Of course, there is also a method of cutting the periphery of the plate for bonding and cutting the convex portion 82a of the back surface 82 shown in FIG. 10 (c) at the same time to regenerate both sides to a high flatness. Doubled on one side, it is difficult to adopt in terms of productivity and economy. The regeneration frequency is once or twice every six months. However, if it is regenerated more than 4 times, in most cases, it will only be discarded. In addition, if the above-mentioned prior art causes fluid pressure to be applied, a new device must be introduced, and the adjustment of the polishing cloth side using a fake wafer and the use of the lapping and polishing of the adhesive sheet will certainly reduce productivity. The present invention was conceived in view of the above-mentioned situation, and an object thereof is to provide a technique of 'correcting the aging deformation of an adhesive plate by using a mechanical action of a grinding process of a semiconductor wafer without increasing the number of processes' There is no need for a development grinding process for regenerating the adhesive sheet that can be processed independently of the abrasive process, and the adhesive sheet itself can have a long life. Means for Solving the Problem Therefore, in the present invention, both the front and back surfaces of a semiconductor wafer bonding plate constituting a polishing device for a semiconductor wafer are subjected to high-precision plane processing. In addition, when grinding a semiconductor wafer adhered to a semiconductor wafer adhesion plate, at least in each batch of the grinding process, the adhesion plate is turned, and
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40930S 五、發明說明(3) 翻面對應地對該黏貼用板片之表裡面交互地黏貼半導體晶 圓後研磨。 又,在用以評偻黏貼用板片之平面度之指標上使用平 行度,依據該值判斷該黏貼用板片之晶圓黏貼面是否變 更。 此外,藉著自動量測平行度之量測機構、自動地判別 區別半導體晶圓黏貼用板片之表裡面之識別蜗和區別半導 體晶圓用研磨裝置間之各個半導體晶圓黏貼用板片之識別 碼,構成管理裝置,對於各個黏貼用板片之表裡面各自在 研磨製程每一批記錄使用次數和那時平行度之量測值後, 依照這些資料自動地判斷黏貼用板片是否繼續使用、中止 以及變更晶圓黏貼面。 依據該記錄’也可判斷研磨裝置之操作者是否應變更 黏貼面’藉著按照管理裝置之判斷,也可消除操作者間之 判斷之變動。此外,藉著設置黏貼用板片之翻面、移送機 構’也可依據該管也可依據該管理裝置之判斷結果自動地 令黏貼用板片翻面後移到黏貼裝置。藉此,可自動地 黏貼面。 發明之實施形態 在表示上述半導體晶圓黏貼用板片(以下稱為「黏貼 ^板片」)之平面度之精度上,希望表裡兩面各自之平行 ^在以内。在將半導體晶圓黏在平行度超過2"m之黏 =用板片後研磨之情況,半導體晶圓之平面度惡化,益法 滿足現在之高精度規格。 “‘、40930S V. Description of the invention (3) The flip surface is correspondingly pasted on the surface of the pasting plate, and then the semiconductor wafers are ground and polished. In addition, the parallelism is used as an index for evaluating the flatness of the bonding sheet, and whether or not the wafer bonding surface of the bonding sheet is changed according to the value. In addition, by automatically measuring the parallelism measurement mechanism, the discriminating snail on the surface of the wafer for distinguishing semiconductor wafers from the wafer is distinguished from the wafers for semiconductor wafers. The identification code constitutes a management device. After the number of times of use and the parallelism at that time are recorded in each batch of the adhesive sheet on the table, it is automatically judged whether the adhesive sheet continues to be used according to these data. , Abort, and change wafer bonding surfaces. According to this record, it is also possible to judge whether the operator of the grinding device should change the adhesive surface. By following the judgment of the management device, it is also possible to eliminate the change of judgment among the operators. In addition, by setting the turning-over and transfer mechanism of the sticking sheet, the sticking sheet can be automatically turned and moved to the sticking device based on the tube and the judgment result of the management device. Thereby, the surface can be pasted automatically. Embodiment of the Invention In terms of accuracy of the flatness of the above-mentioned semiconductor wafer bonding sheet (hereinafter referred to as "adhesive sheet"), it is desirable that the two surfaces on the front and back sides are parallel to each other. In the case of sticking a semiconductor wafer with a parallelism exceeding 2 " m = when the board is polished, the flatness of the semiconductor wafer is deteriorated, and the method meets the current high-precision specifications. "‘,
五、發明說明(4) 在此,平 以和其平 此外,若 變成易於 在研磨上 對該黏貼用板 發明,在各自 黏貼用板片之 使用,平行度 之每批變更 化很小,例如 依據黏貼用板 次般重復非對 在實施上 別黏貼用板片 識別瑪,有黏 又,可設 碼之識別機構 用板片之各面 間之各個黏貼 錄各個黏貼用 之資料和預設 指令。藉此, 貼面之精度或 面 碼 行度係按照JISB0620規定的’設置某假想平 行之2平面夾著平面形態時2平面間之間隔。 在黏貼用板片設置用以識別表裡面之識别 掌握隨時間經過之表裡面之變形狀況之差。 述之半導體晶圓時,至少在研磨製程每一批 片之表裡面交互地黏貼半導體晶圓後研磨之 之研磨製程’力如抵消在上次之研磨製程之 變形般作用。因而,變形不累積,長期連續 之變化也小。又,也可在研磨製程之多批 黏貼面。因在1批之研磨製程之平行度之變 每10批才變更在實用上也沒問題。或者也有 片之變形之狀況’例如如表面6次、背面j 〇 稱之循環之方法。 述之方法時’若在各自之黏貼用板片設置區 之表裡面之識別碼和區別各個黏貼用板片之 貼用板片之管理變得確實、容易之優點。 置管理裝置’包括量測機構,具有這些識別 和=订度之量測機構並自動量測記錄各黏貼 之平行度’及比較輪出機構,區別研磨裝置 用板片後’按照表裡面之使用次數之順序記 板片各自之表裡面之平行度,而且將所記錄 值比較後’輪出黏貼用板片之黏貼面之變更 對於多個黏貼用拓y ^ W板片,可容易地掌各自之黏 隨時間經過之變化,瓦〜0 士 — θ太趟φ & 又儿’可容易決定是否變更黏V. Description of the invention (4) Here, Ping Yi and its flatness. In addition, if it becomes easy to invent the adhesive plate for grinding, and the use of the respective adhesive plate, the change of the parallelism of each batch is small, such as According to the number of times of pasting the board, it is not correct to implement the different identification of the pasting board. If there is a sticky, codeable identification mechanism, each pasting between the sides of the board records the data and preset instructions for each pasting. . As a result, the accuracy of the veneer or the surface code is the interval between the two planes when the two planes of a certain imaginary parallel plane are sandwiched by the plane form in accordance with ‘JISB0620 '. Set the plate for pasting to identify the inside and outside of the watch. Grasp the difference in the deformation status of the watch over time. In the semiconductor wafer described above, at least the grinding process of the wafer after the semiconductor wafer is alternately pasted on the surface of each batch of the grinding process, the grinding process' force acts as if it offsets the deformation of the previous grinding process. Therefore, the deformation does not accumulate, and the long-term continuous change is small. In addition, it can also be applied in multiple batches in the grinding process. Due to the change in the parallelism of the grinding process in one batch, it is no problem to change it every 10 batches. Or there may be a condition where the sheet is deformed ', for example, a method called 6 cycles on the surface and a cycle called on the back surface j 〇. In the method described above, if the identification code in the table of the respective adhesive sheet setting area and the management of the adhesive sheet that distinguishes each adhesive sheet are reliable and easy, it is an advantage. The installation management device 'includes a measurement mechanism, which has these identification and = order degree measurement mechanisms and automatically measures and records the parallelism of each paste' and a comparison wheel-out mechanism, which distinguishes the plates used in the grinding device according to the use in the table The order of the times is the parallelism in the respective tables of the plates, and after comparing the recorded values, the change of the adhesion surface of the "adhesion plate" can be easily grasped for multiple adhesion plates Changes in stickiness over time, Watts ~ 0 —— θ 太 趟 φ & You'll easily decide whether to change the stickiness
409301 五、發明說明(5) 貼面或可否繼續使用 在生產規模使用之研磨機有多台,對於這些各台研磨 機’未特定地使用各個黏貼用板片。各黏貼用板片在性質 和=態上有微妙的差異,而且因也有裝置固有之特性,未 必單純地以同一傾向變形。因而,需要對於各個黏貼用板 片採取細部之對應。 若準備對於各個黏貼用板片之各自之面,相對於使用 次數一元式地管理平行度之變化之管理裝置,上述之細部 之對應更容易。 以下利用實施例更詳細說明本發明,在此之前稍微說 明圖面,圖1係強調黏貼用板片之形狀後表示之侧面剖面 圖,圖2係表示本發明之設置了用以區別表面和背面之識 別碼之黏貼用板片之一例之立體圖,圖3係表示本發明之 半導體晶圓之研磨方法之一例之流程圖,圖4係表示量測 黏貼用板片之變形量之量測位置之圖,圖5係表示量測黏 貼用板片之變形量之量測位置之圖,圖6係表示在實施例2 之黏貼用板片之隨時間經過之變形量之圖,圖7係表示在 實施例3之黏貼用板片之隨時間經過之變形量之圖,圖8係 表示實施例4之黏貼用板片之管理裝置之構造之模式圖, 圖9係表示黏貼用板片放置台之内部構造之模式圖。 實施例 邊參照圖面邊利用實施例更詳細說明本發明。 實施例1 首先3兒明本發明之黏貼用板片。409301 V. Description of the invention (5) Whether veneering can be continued or not There are multiple grinders used in the production scale. For each of these grinders', each sticking plate is not specifically used. Each adhesive sheet has subtle differences in properties and states, and because it has inherent characteristics of the device, it is not necessarily simply deformed with the same tendency. Therefore, it is necessary to take a detailed correspondence for each adhesive sheet. It is easier to deal with the above-mentioned details if a management device that manages the change in parallelism in a unitary manner is prepared for each face of each sticking plate. Hereinafter, the present invention will be described in more detail using examples. Before that, the drawings are explained a little. Fig. 1 is a side cross-sectional view showing the shape of an adhesive sheet, and Fig. 2 is a view showing the arrangement of the present invention to distinguish the front and back surfaces. A perspective view of an example of an identification plate for sticking. FIG. 3 is a flowchart showing an example of a method for polishing a semiconductor wafer of the present invention, and FIG. 4 is a measurement position for measuring a deformation amount of the sticking plate. Fig. 5 is a diagram showing the measurement position for measuring the deformation amount of the adhesive sheet, and Fig. 6 is a diagram showing the deformation amount over time of the adhesive sheet in Example 2, and Fig. 7 is shown in FIG. 8 is a diagram showing the amount of deformation of the pasting plate for the past. FIG. 8 is a schematic diagram showing the structure of the management device of the pasting plate for the fourth embodiment, and FIG. 9 is a view showing the pasting plate placement table. A diagram of the internal structure. EXAMPLES The present invention will be described in more detail using examples with reference to the drawings. Example 1 First, the adhesive sheet according to the present invention will be described.
第8頁 409309 五、發明說明(6) 在圖1 0 (a)之習知之黏貼用板片8,係只有表面8 1被加 工成高平面度的’但是在圖1列舉之本實施例1之黏貼用板 片1之表面11及背面12都高平面度加工,其精度加工到平 行度2. 0"m以内。而’在習知之黏貼用板片之情況,表面 之平行度係2_〇//m以内’但是背面之平行度一般超過 在本實施例1,使用上述黏貼用板片,在研磨製程每 —批父互變更黏貼面後使用。結果每一批之變形相抵消, 和習知相比’變形之進行極慢’到黏貼用板片之平行度超 過2. 0以m為止之批數係習知之1 〇倍以上。 此外,在本實施例1 ’為了可用感測器識別表裡和進 行以後之記錄’在黏貼用板片之表裡兩面設置識別碼2}、 22,如圖2所示。這是由於黏貼用板片之表裡兩面都進行 一樣之平面度精加工,在製程只靠操作者之記憶或記錄可 月b發生管理失誤’藉著設置這種識別碼,當每一批變更黏 貼面時,因可確實地區別表裡面,可更良好地發揮上述抵 消效果。 _ 實施例2 使用本發明之黏貼用板片, > ⑴缺A /dL 攸月以圖3所示「黏貼—研磨 剝離」為一循環之研磨製鞀一 曰®相,*二 τ , Λ 程批每次完了 ’量測黏貼了 Β日圓側之面之平行度。而,古亚— 太眘成也丨9杜10 +订度值超過了預設值(在 本貫施例2為±2 /zm)之情況,傲 程。然後,在研磨製程每—抵夕亚—Λ囱设杖入研磨裟 钏佶踣芏你田々批奴祕l 代之千订度之量測’確認其量 /則值隨者使用之批數增加而揼私 逐渐減少。照這樣繼續使用相Page 8 409309 V. Description of the invention (6) The conventional adhesive plate 8 shown in FIG. 10 (a) has only the surface 8 1 processed into a high flatness. However, this embodiment 1 listed in FIG. 1 0 " m 内 内。 The surface 11 and the back surface 12 of the adhesive sheet 1 are processed with high flatness, and the precision is processed to a parallelism of 2. 0 " m 内 内. And 'in the case of the conventional adhesive sheet, the parallelism of the surface is within 2-0 // m', but the parallelism of the back surface generally exceeds that in Example 1. Using the above-mentioned adhesive sheet, during the grinding process every- Use after the parent changes the paste surface. As a result, the deformation of each batch was offset, and the number of batches until the parallelism of the pasting plate exceeded 2.0 to m compared with the conventional method was "more slowly than the conventional method". In addition, in the first embodiment, "in order to use the sensor identification table and subsequent recording", identification codes 2} and 22 are provided on both sides of the surface of the adhesive sheet, as shown in Fig. 2. This is due to the same flatness finishing on both sides of the surface of the sticking plate. During the manufacturing process, only the operator's memory or records can cause a management error. By setting this identification code, when each batch is changed, When pasting the surface, the surface and the back can be reliably distinguished, so that the above-mentioned offsetting effect can be better exhibited. _ Example 2 Using the adhesive sheet of the present invention, >; A / dL You Yue uses "adhesion-grinding and peeling" shown in Fig. 3 as a cycle of grinding to produce a phase, * 2τ, Λ Every time the batch is completed, the parallelism of the side of the B yen side is measured. However, in the case of Guya-Taishencheng 9 Du 10 + the order value exceeds the preset value (in the present embodiment 2 is ± 2 / zm), Ao Cheng. Then, during the grinding process, set up a stick for each-day yak-yam, and you will measure the order of thousands of orders. Confirm that the quantity / value will increase with the number of batches used. And favoritism gradually decreased. Continue to use the photo like this
409308 五、發明說明(7) 同之黏貼面時,量測值越過0,向反向開始增大。這在再 度超過2 # m時刻變更黏貼面。藉著照這樣做,在修正變形 下可一直持續使用上述黏貼用板片。 在本實施例2用如下之方法求上述之平行度。 首先,如圖5所示將通過黏貼用板片1之中心並正交之 2條直線和黏貼用板片外周之4個交點At、Di、A2、D2及將A 「Di間、A2-D2間各自3等分之4個點&、C!、B2 ' C2共8個點決 定為量測點。自量測點、Β:、Q、Di得到量測值ai、h、 c,、山,自量測點A2、B2、C2、D2得到量測值a2、b2、c2、d 2。使用這些值利用如下之計算式求Pi、P2、Qi、Q2。 其中尤其在代表平行度之值上使用P1、P2。此外,關 於1、Q2將後述。 (式1)409308 V. Description of the invention (7) When the same surface is pasted, the measured value exceeds 0, and it starts to increase in the reverse direction. This changes the adhesive surface at a time when it exceeds 2 # m again. By doing so, the above-mentioned sticking sheet can be continuously used under the correct deformation. In the second embodiment, the above-mentioned parallelism is obtained by the following method. First, as shown in FIG. 5, two straight lines that pass through the center of the adhesive sheet 1 and are orthogonal to the four intersection points At, Di, A2, D2 of the outer periphery of the adhesive sheet, and There are 4 points of 3 equal parts in each of the three points &, C !, B2 'C2. A total of 8 points are determined as the measurement points. From the measurement points, B :, Q, Di, the measured values ai, h, c ,, Mountain, get measurement values a2, b2, c2, d2 from measurement points A2, B2, C2, and D2. Use these values to calculate Pi, P2, Qi, and Q2 using the following calculation formulas. Among them, especially for parallelism. Values P1 and P2 are used. In addition, 1 and Q2 will be described later. (Expression 1)
Pj = { (a] + dj) - (bj + Cj)} -^2 (式2) P2 = {(a2 + d2)_(b2 + C2)} +2 (式3) 〇! = { (ai + b^-Cc^di) } + { (a2 + b2) -(c2 + d2) } (式4) Q2 = {(aj + bj) - (a2 + b2) } + { (cj + d! ) - (c2 + d2)} (式5) P=(iVP2) +2 由上述計算式得知變形量Pi、P2各自表*A1-D1線上、 A2-D2線上之彎曲或摩耗所引起之變形之大小,關於係P!、Pj = {(a) + dj)-(bj + Cj)}-^ 2 (Eq. 2) P2 = ((a2 + d2) _ (b2 + C2)) + 2 (Eq. 3) 〇! = {(Ai + b ^ -Cc ^ di)} + {(a2 + b2)-(c2 + d2)} (Eq. 4) Q2 = ((aj + bj)-(a2 + b2)) + {(cj + d!) -(c2 + d2)} (Equation 5) P = (iVP2) +2 The deformation amounts Pi and P2 are obtained from the above calculation formulas. * The deformation caused by bending or abrasion on the A1-D1 line and A2-D2 line. Size, about department P !,
第10頁 ___ 400309___ 五、發明說明(8)Page 10 ___ 400309___ V. Description of Invention (8)
Pa之平均值之P ’係假設變形在圓周方向均勻之情況之變 形量’係代表平行度之值。在本實施例2,將此值記述為 平行度。The value P 'of the average value of Pa is a deformation amount assuming that the deformation is uniform in the circumferential direction, and represents a value of parallelism. In the second embodiment, this value is described as parallelism.
Qi、Q2係表示在圓周方向不均句之摩耗和變形之大小 之值。這係依據黏貼用板片材質之不均勻性等的,此值之 增加無法藉著黏貼面之變更修正。又,在使用引起這種不 均勻之變形之黏貼用板片研磨晶圓之情況,對晶圓之平面 度有複雜之影響。因此,在A、〇2之一超過可容許範圍之 情況,P值係在容許範圍内也最好丟棄。 實施例3 在實施例1採用每一批變更黏貼用板片之黏貼面之方 法°在實施例2 ’當平行度之量測值超過預設值時變更黏 貼面。 在實施例3 ’在研磨製程每一批變更黏貼面下繼續使 用’若平行度[P值]超過圖7所示+ (正)方向之規定值(1.0 em) ’停止翻面,如平行度變小般(如變形朝向負方向進 行般)只黏在單面後繼續使用。若不久超過了 _(負)側之規 定值,再開始每一比之黏貼面之變更。於是’ 藉著選擇比平行度之容許值小之規定值,可將平行度一直 保持在遠小於容許範圍之值。 又’像這樣藉著只是在很短之期間插入只有單面之連 續使用’可在大部分之使用期間採用每一批更換黏貼面之 使用方法。因而,使用期間中之平行度之變化速度小,可 在晶圓之平面度極穩定之狀態生產。Qi and Q2 are the values of the friction and deformation of the uneven sentence in the circumferential direction. This is based on the non-uniformity of the material of the adhesive sheet. The increase of this value cannot be corrected by changing the adhesive surface. In addition, in the case of polishing a wafer using an adhesive sheet that causes such uneven deformation, the flatness of the wafer is complicatedly affected. Therefore, if one of A and O2 exceeds the allowable range, it is best to discard the P value within the allowable range. Embodiment 3 In Embodiment 1, the method of changing the adhesion surface of the plates for adhesion is adopted in each batch. In Embodiment 2 ', the adhesion surface is changed when the measured value of the parallelism exceeds a preset value. In Example 3, 'continue to use under each batch of the grinding process to change the bonding surface' If the parallelism [P value] exceeds the + (positive) direction specified value (1.0 em) shown in Figure 7 'Stop turning, such as parallelism As small (as if the deformation is going in the negative direction), only stick to one side and continue to use. If the specified value on the _ (negative) side is exceeded soon, the change of the adhesion surface of each ratio is started again. Therefore, by selecting a predetermined value smaller than the allowable value of parallelism, the parallelism can be kept at a value far smaller than the allowable range. Also, by inserting the continuous use of only one side only for a short period of time like this, it is possible to use the method of changing the adhesive surface every batch for most of the use period. Therefore, the rate of change of parallelism during use is small, and production can be performed in a state where the flatness of the wafer is extremely stable.
40930S 五、發明說明(9) 此外,在本實施例3 ’規定值係1,〇 # in和-0. 2 # in ’但 是這是為了使得只在單面黏貼後使用之期間儘量短’又由 於和研磨裝置之相互作用’平行度(P值)位於稍正側時半 導體晶圓之平面度比較好。 又,在圖7只表示平行度(P值),但是關於Q!、Q2 ’實 際上不太有次數相依性,位於± 1 · 0 # m以内。但,由於黏 貼用板片之材質之不均勻性,這變成±1.0#m以上的存在 少數。這種黏貼用板片由於上述理由而當作不良品丢棄。 實施例4 在本實施例4,表示一種半導體晶圓黏貼用板片之管 理裝置,和晶圓黏貼裝置連結,按照上述半導體晶圓之製 造方法,量測黏貼用板片之平行度後,將所量測之平行度 和規定值比較’在超過規定值之情況變更黏貼用板片之晶 圓點貼面。 如圖8所示,本實施例4之管理裝置由在和晶圓黏貼裝 置7之間放置黏貼用板片〗a之放置台3、係個別地識別放置 —Ϊ、放置σ3之黏貼用板片ia而且區別表裡面之識別機構之 識別單元52、係固定配置於放置台3之上方並量測 ^測機構之量測單元5、係自由量測單元5所得 = 形量Η2,*其… :變更曰曰圓之黏貼面之判斷,輸出判斷結果之逛 之電腦(圖上未示)、以及偵測指示黏貼面之變更之』出機 f後,藉著將黏貼用板片la翻面而變更該黏貼面之該輪 構6構成。 又翻面機40930S V. Description of the invention (9) In addition, in this embodiment 3 'the specified values are 1, 0 # in and -0.2 # in' but this is to make the period of use only after sticking on one side as short as possible 'and Due to the interaction with the polishing device, the flatness of the semiconductor wafer is better when the parallelism (P value) is on the slightly positive side. In FIG. 7, only the parallelism (P value) is shown, but Q! And Q2 ′ are actually less dependent on order, and are located within ± 1 · 0 # m. However, due to the non-uniformity of the material of the adhesive sheet, there are a few of them that are greater than ± 1.0 # m. Such an adhesive sheet is discarded as a defective product for the reasons described above. Embodiment 4 In this embodiment 4, a management device for a semiconductor wafer sticking plate is shown, which is connected to the wafer sticking device. According to the above-mentioned method for manufacturing a semiconductor wafer, the parallelism of the sticking plate is measured, and then The measured parallelism is compared with the specified value. In the case of exceeding the specified value, the wafer point surface of the bonding sheet is changed. As shown in FIG. 8, the management device of this embodiment 4 consists of a placement table 3 for placing an adhesion plate between the wafer adhesion device 7 and the wafer adhesion device 7. The placement plate 3 is individually identified and placed-Ϊ, and the σ3 adhesion plate is placed. ia Moreover, the identification unit 52 of the identification mechanism in the table is fixedly arranged above the placing table 3 and measures the measurement unit 5 of the measurement mechanism 5 and the free measurement unit 5 = shape amount Η2, * which ...: After changing the judgment of the sticking surface of the circle, the computer (not shown in the figure) that outputs the judgment result, and the "inspection of the change of the sticking surface" is displayed on the machine f, by turning the laminating sheet la The configuration of the wheel structure 6 of the adhesive surface is changed. Turning machine
40930S 五、發明說明(ίο) 放置台3之上面如在位移量量測變成其基準般形成平 坦面,而在機構上,在搬運黏貼用板片la時,如圖9所 示,利用設於其下部之升降機構31令滾子34上升,在將黏 貼用板片la配置於所要位置時將其降下,放置於放置台3 上。 在變形量量測單元5,固定8個雷射式感測器51,其間 隔如在實施例2所示,係黏貼用板片1 a之直徑之1 / 3。 翻面機構6具有叉之旋轉台61,藉著接受自放置台3搬 運之黏貼用板片1 a後升降和旋轉,令黏貼用板片翻面。在 晶圓黏貼裝置,因總是自黏貼用板片上面側黏貼晶圓,利 用此翻面,自動地變更黏貼面。 此外’在此說明在本實施例4使用之黏貼用板片之特 徵。 如圖9所示,本實施例4之黏貼用板片ia成形成之第2 面12a之直徑大於第1面11a之直徑,而且在第1面lla之側 面設置條碼13a。因此’識別單元52分別藉著識別該口徑 之差異所引起之段差1 4a,判斷表裡面,和藉著識別條碼 13a,識別各黏貼用板片。 ' 設置段差1 4a之理由係’在以半永久性使用為目的之 黏貼用板片,在利用塗料或標籤等手段之表裡面之表一、, 在使用途中因磨耗' 劣化而可能無法識別,若利用形^ 差異’可迴避這種問題。又,因對於條碼也有同樣之之 題’這也若採用在製作黏站用板片時埋入黑色陶磁 時烘烤等方法即可解決。 I厂540930S V. Description of the invention (ίο) The upper surface of the placing table 3 forms a flat surface as the displacement measurement becomes its reference, and on the mechanism, when the laminating sheet la is transported, as shown in FIG. The lower part of the lifting mechanism 31 raises the roller 34, and when the laminating sheet la is arranged at a desired position, it is lowered and placed on the placing table 3. In the deformation measurement unit 5, eight laser sensors 51 are fixed, and the interval between them is 1/3 of the diameter of the laminating sheet 1a as shown in the second embodiment. The turning mechanism 6 includes a fork rotation table 61, which is lifted and rotated by receiving the sticking sheet 1a carried from the placing table 3, thereby turning the sticking sheet. In the wafer sticking device, since the wafer is always pasted from the upper side of the plate for sticking, the flip surface is used to automatically change the sticking surface. The features of the adhesive sheet used in the fourth embodiment will be described below. As shown in FIG. 9, the diameter of the second surface 12a formed by the adhesive sheet ia of the fourth embodiment is larger than the diameter of the first surface 11a, and a bar code 13a is provided on the side of the first surface 11a. Therefore, the 'identifying unit 52 recognizes the inside and outside of the table by identifying the step difference 14a caused by the difference in the caliber, and recognizes each sticking plate by identifying the bar code 13a. The reason for setting the step difference 1 4a is' Table 1 on the surface of the adhesive sheet for the purpose of semi-permanent use, the use of coatings or labels, etc., may not be identified due to wear and tear during use. Use the shape difference to avoid this problem. In addition, since the same problem applies to barcodes, this method can be solved by using a method such as embedding black ceramic magnets when manufacturing a plate for sticking stations. I Factory 5
第13頁Page 13
40930S —____ 五、發明說明(li) --- 利用這樣的構造’以上述實施例3之方法營理位於 導體晶圓研磨製程中之多個黏貼用板片之每〜個。' 藉此在將在生產規模使用之多個黏貼用柘u ^ 恢片之平行唐 管理成於規定值以内之下,能以習知之1 〇倍w * W上之壽命持 續使用。又’所需之管理也可利用電腦自動化。 發明之效果 本發明如上述所示構成,具有如下之效果。 (1) 在半導體晶圓之研磨製程,因利用製程中之機械 式作用橋正黏貼用板月之變形,不必如以前般獨立地<置 切削黏貼用板片之一部分之製程,生產效率楹古 = , κ阿,而且黏 貼用板片之耐用次數也顯著延長。例如,在以前每半年再 生1次或2次,而進行展成研磨至多4至5次,徊县w士 ^ *一疋右利用本 發明,可得到1 0倍以上之壽命。 (2) 因而’在研磨製程使用之黏貼用板片之使用量顯 在半導體晶圊之各 (3)因黏貼用板片之平行度穩定 批研磨間之平面度之變動減少。 (4) 以最簡單之實施形態,不必附加新的裝置,可原 封不動地應用於習知裝置。 ” (5) ·使平行度之規定值更小,可容易地更提高黏在那 裡並被研磨之半導體晶圓之平面度。這是由於使規定值變 1,也不會如習知般展成研磨之頻次増加、黏貼用板片之 舞命減少、生產效率降低等。 圖式簡單說明40930S —____ V. Description of the Invention (li) --- By using such a structure, 'the method of the third embodiment described above is used to manage each of the plurality of bonding plates located in the conductor wafer polishing process. '' In this way, in the management of a number of sticking 柘 u ^ recovery tablets used in the production scale of parallel Tang management below the specified value, can be used for a life of 10 times w * W of the conventional. Also, the required management can also be automated using a computer. Effects of the Invention The present invention is configured as described above, and has the following effects. (1) In the semiconductor wafer polishing process, due to the use of the mechanical action of the bridge in the manufacturing process to deform the pasting plate, it is not necessary to independently < place a part of the cutting and pasting plate process as before, production efficiency 生产Ancient =, κ Ah, and the durability of the adhesive sheet has been significantly extended. For example, in the past, it was regenerated once or twice every half a year, and the grinding was carried out at most 4 to 5 times. Using this invention, you can get a life of more than 10 times. (2) Therefore, the amount of adhesive plates used in the grinding process is significantly higher in semiconductor wafers. (3) Due to the stability of the parallelism of the adhesive plates, the variation in the flatness between batch grinding chambers is reduced. (4) In the simplest embodiment, it is not necessary to add a new device, and it can be applied to a conventional device as it is. "(5) · Make the specified value of parallelism smaller, which can easily increase the flatness of the semiconductor wafer stuck there and polished. This is because the specified value is changed to 1, and it will not spread as it is known. Increase the frequency of grinding, reduce the life of the sticking plate, reduce the production efficiency, etc.
第14頁Page 14
40930S 五、發明說明(12) 圖1係強調黏貼用板片之形狀後表示之側面剖面圖。 圖2係表示本發明之設置了用以區別表裡面之識別碼 之黏貼用板片之一例之立體圖。 圖3係表示本發明之半導體晶圓之研磨方法之一例之 流程圖。 圖4係表示量測黏貼用板片之變形量之量測位置之 圖。 圖5係表示量測黏貼用板片之變形量之量測位置之 圖。 圊6係表示在實施例2之黏貼用板片之隨時間經過之變 形量之圖。 圖7係表示在實施例3之黏貼用板片之隨時間經過之變 形量之圖。 圖8係表示實施例4之黏貼用板片之管理裝置之構造之 模式圖。 圖9係表示黏貼用板片放置台之内部構造之模式圖。 圖1 0係強調習知之黏貼用板片之形狀及其隨時間經過 之所引起之變形後表示之侧面剖面圖。 符號說明 I 黏貼用板片 II 表面 12 背面 la 黏貼用板月 11a 第1面40930S V. Description of the invention (12) Figure 1 is a side cross-sectional view showing the shape of the sheet for adhesion. Fig. 2 is a perspective view showing an example of an adhesive plate provided with an identification code for distinguishing the inside and outside of the watch according to the present invention. Fig. 3 is a flowchart showing an example of a method for polishing a semiconductor wafer according to the present invention. Fig. 4 is a diagram showing a measurement position for measuring the amount of deformation of an adhesive sheet. Fig. 5 is a diagram showing a measurement position for measuring a deformation amount of a sheet for sticking.圊 6 is a graph showing the amount of deformation of the pasting sheet in Example 2 over time. Fig. 7 is a graph showing the amount of deformation of the pasting sheet in Example 3 over time. Fig. 8 is a schematic diagram showing the structure of a management device for a pasting sheet in the fourth embodiment. FIG. 9 is a schematic diagram showing the internal structure of a plate placement table for sticking. Fig. 10 is a side cross-sectional view showing the shape of a conventional adhesive sheet and its deformation caused by the passage of time. Explanation of symbols I Adhesive sheet II Surface 12 Back la Adhesive sheet 11a First side
第15頁 五、發明說明(13) 409308 12a 第2面 13a 條 碼 14a 段 差 21 識 別碼 22 識 別 碼 3 放 置 台 31 升 降 機 構 34 滾 子 4 滾 子 衔 送 帶 5 位 移 感 測 單 元 51 感 測 器 52 識 別 單 元 6 翻 面 機 構 61 叉 之 旋 轉 台 7 晶 圓 黏 貼 裝 置 10 半 導 體 晶 圓Page 15 V. Description of the invention (13) 409308 12a Second face 13a Bar code 14a Segment difference 21 Identification code 22 Identification code 3 Placement table 31 Lifting mechanism 34 Roller 4 Roller belt 5 Displacement sensing unit 51 Sensor 52 Identification unit 6 Turning mechanism 61 Rotary table of forks 7 Wafer bonding device 10 Semiconductor wafer
第16頁Page 16
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JP7735698A JPH11277415A (en) | 1998-03-25 | 1998-03-25 | Semiconductor wafer mount-plate and semiconductor wafer polishing method using mount-plate and management device thereof |
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TW088104550A TW409309B (en) | 1998-03-25 | 1999-03-23 | Semiconductor wafer mount-plate and semiconductor wafer polishing method using the mount-plate and management device thereof |
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JP4992306B2 (en) * | 2006-06-12 | 2012-08-08 | セイコーエプソン株式会社 | Work carrier, manufacturing method thereof and double-side polishing machine |
JP5678724B2 (en) * | 2011-03-02 | 2015-03-04 | 旭硝子株式会社 | Manufacturing method of glass substrate and carrier warp direction detecting device used in the method |
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1998
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