CN113560960B - Diffuse reflection type calibration plate and preparation method thereof - Google Patents
Diffuse reflection type calibration plate and preparation method thereof Download PDFInfo
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- CN113560960B CN113560960B CN202010347388.8A CN202010347388A CN113560960B CN 113560960 B CN113560960 B CN 113560960B CN 202010347388 A CN202010347388 A CN 202010347388A CN 113560960 B CN113560960 B CN 113560960B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 65
- 230000007797 corrosion Effects 0.000 claims abstract description 57
- 238000005260 corrosion Methods 0.000 claims abstract description 57
- 239000005357 flat glass Substances 0.000 claims abstract description 54
- 238000000227 grinding Methods 0.000 claims abstract description 54
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000011651 chromium Substances 0.000 claims abstract description 44
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 44
- 238000001259 photo etching Methods 0.000 claims abstract description 28
- 238000000576 coating method Methods 0.000 claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 229920002120 photoresistant polymer Polymers 0.000 claims description 36
- 238000005520 cutting process Methods 0.000 claims description 29
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 19
- 238000004528 spin coating Methods 0.000 claims description 18
- 238000004544 sputter deposition Methods 0.000 claims description 18
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 18
- 238000006243 chemical reaction Methods 0.000 claims description 10
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 3
- 239000007888 film coating Substances 0.000 claims 1
- 238000009501 film coating Methods 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 238000005498 polishing Methods 0.000 abstract description 92
- 238000004026 adhesive bonding Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 7
- 238000002310 reflectometry Methods 0.000 abstract description 2
- 239000004576 sand Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 43
- 230000003746 surface roughness Effects 0.000 description 18
- 239000007788 liquid Substances 0.000 description 15
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 14
- 239000000919 ceramic Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 229910000420 cerium oxide Inorganic materials 0.000 description 6
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 6
- 238000013016 damping Methods 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- 229920002635 polyurethane Polymers 0.000 description 5
- 239000004814 polyurethane Substances 0.000 description 5
- 239000011859 microparticle Substances 0.000 description 4
- 239000010431 corundum Substances 0.000 description 3
- 229910052593 corundum Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005488 sandblasting Methods 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
The invention discloses a preparation method of a diffuse reflection type calibration plate, which comprises the following steps: grinding the upper surface and/or the lower surface of the polishing sheet/original plate glass for 10-40min by using a carborundum solution with the grain diameter of 20% -60% DN95 below 10 microns to obtain a first grinding surface, wherein the upper surface of the polishing sheet/original plate glass is a first grinding surface or plane; processing and manufacturing patterns on the upper surface of the polishing sheet/original plate glass by adopting a semiconductor mask pattern manufacturing process flow, and sequentially performing coating, gluing, photoetching, developing and corrosion to obtain a metal chromium layer; the invention also discloses a calibration plate manufactured by the method, which adopts a grinding process to manufacture a frosting effect, meets the requirement of high planeness, and has fine and controllable sand grain and reflectivity less than 0.1%.
Description
Technical Field
The invention relates to the field of calibration plates, in particular to a diffuse reflection type calibration plate and a preparation method thereof.
Background
In applications such as machine vision, image measurement, photogrammetry, three-dimensional reconstruction, etc., in order to correct lens distortion, a conversion relationship between physical dimensions and pixels is determined, and a correlation between a three-dimensional geometric position of a point on a surface of a spatial object and a corresponding point in an image is determined, so that a geometric model of camera imaging needs to be established. The geometric model of the camera can be obtained by shooting the pattern array flat plate with the fixed space through the camera and calculating through a calibration algorithm, so that high-precision measurement and reconstruction results are obtained. However, under the condition of the front light source, the glass calibration plate can reflect light.
At present, several existing technologies are used for solving the problem that the glass calibration plate reflects light:
1) The ceramic is used as a base material, chromium plating is carried out on the ceramic sheet, and the ceramic base material does not reflect light. However, alumina and zirconia ceramics are more costly than glass and have poorer flatness than glass. The general thickness of the ceramic substrate is only 1mm, the maximum processable size is about 200mm, the glass substrate can be of various thicknesses and can be processed into large sizes, and the current domestic maximum polishing equipment can be 1 meter.
2) The high molecular material film is coated on the surface of the glass, and the film layer does not reflect light. However, the adhesion of the high polymer material film coated on the surface of the glass is worse than that of the chromium film coated by magnetron sputtering, and the glass is not resistant to the environments such as weather, high temperature, acid and alkali.
At present, no technology for treating the surface of a glass calibration plate to solve the problem of light reflection exists, and the technology is found that the glass surface is damaged by utilizing the sand blasting processing frosted effect in the operation process and is not suitable for processing sheet glass.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the problems existing in the prior art are solved, and the diffuse reflection type calibration plate and the preparation method thereof are provided, the grinding effect is manufactured by adopting a grinding process, the requirement of high flatness is met by adopting a polishing process, and the requirements of fine lines and high precision machining are met by combining the process of a semiconductor mask plate.
The technical scheme adopted by the invention is as follows:
the preparation method of the diffuse reflection type calibration plate comprises the following steps:
first grinding: grinding the upper surface of the polishing sheet/original plate glass for 10-40min by using a carborundum solution with the grain diameter of less than 10 microns of 20% -60% DN95 to obtain a first grinding surface, wherein the upper surface of the polishing sheet/original plate glass is the first grinding surface; or grinding the lower surface of the polishing sheet/original plate glass for 10-40min to obtain a first grinding surface, wherein the upper surface of the polishing sheet/original plate glass is a plane; or grinding the upper surface and the lower surface of the polishing sheet/original plate glass for 10-40min simultaneously to obtain two first grinding surfaces, wherein the upper surface of the polishing sheet/original plate glass is the first grinding surface; the upper and/or lower surface of the polishing sheet/master glass is preferably abraded for 20 to 30 minutes using a silicon carbide solution having a grain size of 30 to 50% DN95 of 10 μm or less.
The key point of the grinding step is that: and the silicon carbide with different particle sizes is used for obtaining the roughness of different surfaces, and the surface roughness is controllable. By modifying the planarity of the abrasive disk surface, a high degree of planarity (up to within 5 microns) can be achieved.
And (3) making a graph: processing and manufacturing patterns on the upper surface of the polishing sheet/original plate glass by adopting a semiconductor mask pattern manufacturing process flow, and sequentially performing coating, gluing, photoetching, developing and corrosion to obtain metal chromium layer patterns;
precision cutting: and (5) performing precise cutting, wherein the dimensional accuracy is +/-0.05 mm.
Further, a polishing step is included between the first grinding step and the patterning step: and polishing a first grinding surface for 10-120min by using 10-30% of cerium oxide polishing solution with the DN95 particle size of 0.5-1.5 microns to obtain a polished surface. Preferably, one of the first abrasive surfaces is polished for 50-80 minutes using 20-30% DN95 particle size cerium oxide polishing solution of 1-1.5 microns.
Further, the other first polishing surface is polished at the same time to obtain the other polishing surface, and one of the polishing surfaces is polished for the second time to obtain the second polishing surface.
Further, the second lapping step is between the polishing step and the patterning step, or after the precision cutting step.
Further, the first polishing step of the lower surface of the polished sheet/master glass follows the precision cutting step.
Further, the first abrasive surface and/or the second abrasive surface has a surface roughness Ra of 1 to 5 micrometers and a surface micro particle size of 6 to 8 micrometers. Preferably, the first abrasive surface and/or the second abrasive surface has a surface roughness Ra of 2 to 4 microns and a surface micro particle size of 7 to 8 microns.
Further, the polished surface has a surface roughness Ra of 0.005-0.015nm, preferably 0.01-0.015nm.
Further, the coating process is that the polished wafer/original plate glass is put into a magnetron sputtering vacuum chamber after ultrasonic cleaning and drying, a layer of 80-120nm chromium film is coated on the front surface of a glass substrate by adopting a direct current magnetron sputtering process, and the ratio of Ar/N2/O2/CO 2 in the process gas in the sputtering process is 5-80:0-50:0-60:0-80, wherein the vacuum degree is 1-8 multiplied by 10-6, and the sputtering power is 0.2-5kw, so as to obtain a chromium film substrate; the preferred thickness is 100-120nm.
The photoresist coating process is spin coating by adopting a spin coating process, so that a photoresist film with the thickness of 100-500nm is obtained, the uniformity can reach +/-0.5%, and the resolution can reach 1 micron; the preferred thickness is 200-300nm.
The photoetching process is that an inlet photoetching machine with an I-line high-resolution lens is used for exposure, and lines can be manufactured to be 1 micrometer;
after the development corrosion is exposure, on the accurate full-automatic development corrosion equipment, firstly, 0.01% -0.3% TMAH is used for removing the exposure photoresist in a reaction way, the solution temperature is controlled at 23-25 ℃, the development time is controlled at 10-25s, then, a special corrosive liquid is used for removing the chromium layer exposed after the photoresist is removed in a development way, the corrosion time is 40-60s, the solution temperature is 23-25 ℃, and the process requirement of 1 micrometer lines is met.
Further, the pressure applied at the time of grinding is 100 to 500kgf;
polishing is performed on polyurethane and damping cloth;
the pressure applied during polishing is 100-300kgf.
Another aspect of the present invention relates to a diffuse reflection type calibration plate manufactured according to the above method.
Compared with the prior art, the invention has the following advantages:
1) The frosted grain diameter can be 7 microns, and the frosting effect is uniform.
2) The frosted surface is reflective to optical diffuse reflection, and the reflectivity is less than 0.1%.
3) The fine lines can be manufactured by adopting the manufacturing process of the semiconductor mask plate, and the precision is high. The minimum line can be manufactured to be 1 micron, the line control precision can reach 0.2 micron, and the pattern distance precision can be 1 meter deviation by 1 micron.
4) The flatness of the glass is higher than that of the ceramic sheet, the highest flatness of the glass can achieve flatness of 2 microns, and the ceramic is generally about 50 microns.
5) The glass has wide processable size range, and the size of the calibration plate can reach 1 meter. The glass thickness can be customized and is selected in many ways. The ceramic calibration plate is generally 1mm thick, and the current size is about 200mm at maximum.
6) The glass is suitable for a high-precision cutting process, is suitable for customized manufacturing by utilizing the existing product, reduces the development process and cost, and has the advantages of high ceramic precision cutting difficulty and high development cost.
7) The sand blasting processing frosted effect is utilized to damage the surface of the glass, and the glass is not suitable for processing sheet glass. The grinding can process 0.3-1mm glass sheet without damage to the glass surface.
8) The ground metal chromium film is environment-resistant, and is stable and wear-resistant compared with a high polymer film layer.
9) The grinding effect uniformity of grinding is good, and the sand blasting grinding effect is uneven.
Drawings
FIG. 1 is a schematic structural view of a diffuse reflection type calibration plate in embodiment 1-2 of the present invention;
FIG. 2 is a schematic structural diagram of a diffuse reflection type calibration plate in embodiment 3 of the present invention;
fig. 3 is a schematic structural diagram of a diffuse reflection type calibration plate in embodiment 7 of the present invention.
Detailed description of the preferred embodiments
In order to better understand the above technical solutions, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.
Example 1
For the calibration plate with no requirement on flatness, polishing sheets/original plate glass can be used for direct grinding, and the preparation method of the diffuse reflection type calibration plate with double-sided frosted surfaces comprises the following steps:
first grinding: the upper and lower surfaces of the polishing sheet/master glass were polished with a carborundum solution having a grain size of 20% DN95 of 10 μm or less at a pressure of 100kgf for 10 minutes, respectively, and the first polished surface had a surface roughness Ra of 5 μm and a surface micro grain size of 8. Mu.m.
And (3) making a graph: processing and manufacturing patterns on a first grinding surface of the upper surface of the polishing sheet/original plate glass by adopting a semiconductor mask pattern manufacturing process flow, and sequentially performing coating, gluing, photoetching, developing and corrosion to obtain metal chromium layer patterns;
the coating process is that the polishing sheet/original plate glass is put into a magnetron sputtering vacuum chamber after being cleaned and dried by ultrasonic, a layer of 80nm chromium film is coated on the front surface of a glass substrate by adopting a direct current magnetron sputtering process, and the proportion of process gas Ar\N2\O2\CO2 in the sputtering process is 35sccm:25sccm:0sccm:9sccm, a vacuum degree of 4X 10-6 and a sputtering power of 1.2kw, to obtain a chromium film substrate;
the photoresist coating process is spin coating by adopting a spin coating process, so that a photoresist film with the thickness of 100nm is obtained, the uniformity can reach +/-0.5%, and the resolution can reach 1 micron;
the photoetching process is that an inlet photoetching machine with an I-line high-resolution lens is used for exposure, and lines can be manufactured to be 1 micrometer;
after the development corrosion is exposure, on the accurate full-automatic development corrosion equipment, firstly, 0.01% TMAH is used for removing the exposure photoresist in a reaction way, the solution temperature is controlled at 23 ℃, the development time is controlled at 10 seconds, the special corrosion liquid is ceric ammonium nitrate, then, the special corrosion liquid is used for removing corrosion on the chromium layer exposed after the photoresist is removed in a development way, the corrosion time is controlled at 40 seconds, and the solution temperature is controlled at 23 ℃, so as to meet the process requirement of 1 micrometer lines.
Precision cutting: and (3) performing precise cutting by adopting an automatic cutter wheel cutting machine positioned by the ccd, so as to obtain good squareness and dimensional accuracy control, wherein the dimensional accuracy is +/-0.05 mm.
The prepared double-sided frosted diffuse reflection type calibration plate is shown in fig. 1, and comprises a polished sheet/original plate glass 1, wherein the upper surface and the lower surface of the polished sheet/original plate glass 1 are both first grinding surfaces 2, and a metal chromium layer 3 is manufactured on the first grinding surfaces 2 of the upper surfaces of the polished sheet/original plate glass.
Example 2
For the calibration plate with no requirement on flatness, polishing sheets/original plate glass can be used for direct grinding, and the preparation method of the diffuse reflection type calibration plate with double-sided frosted surfaces comprises the following steps:
first grinding: the upper surface of the polishing sheet/master glass was polished for 10 minutes using a corundum solution having a grain size of 20% DN95 of 10 μm or less under a pressure of 100kgf, the first polished surface had a surface roughness Ra of 5 μm and a surface microporosity of 8. Mu.m.
And (3) making a graph: processing and manufacturing patterns on a first grinding surface of the upper surface of the polishing sheet/original plate glass by adopting a semiconductor mask pattern manufacturing process flow, and sequentially performing coating, gluing, photoetching, developing and corrosion to obtain metal chromium layer patterns;
the coating process is that the polishing sheet/original plate glass is put into a magnetron sputtering vacuum chamber after being cleaned and dried by ultrasonic, a layer of 80nm chromium film is coated on the front surface of a glass substrate by adopting a direct current magnetron sputtering process, and the proportion of process gas Ar\N2\O2\CO2 in the sputtering process is 35sccm:25sccm:0sccm:9sccm, a vacuum degree of 4X 10-6 and a sputtering power of 1.2kw, to obtain a chromium film substrate;
the photoresist coating process is spin coating by adopting a spin coating process, so that a photoresist film with the thickness of 100nm is obtained, the uniformity can reach +/-0.5%, and the resolution can reach 1 micron;
the photoetching process is that an inlet photoetching machine with an I-line high-resolution lens is used for exposure, and lines can be manufactured to be 1 micrometer;
after the development corrosion is exposure, on the accurate full-automatic development corrosion equipment, firstly, 0.01% TMAH is used for removing the exposure photoresist in a reaction way, the solution temperature is controlled at 23 ℃, the development time is controlled at 10 seconds, the special corrosion liquid is ceric ammonium nitrate, then, the special corrosion liquid is used for removing corrosion on the chromium layer exposed after the photoresist is removed in a development way, the corrosion time is controlled at 40 seconds, and the solution temperature is controlled at 23 ℃, so as to meet the process requirement of 1 micrometer lines.
Precision cutting: and (3) performing precise cutting by adopting an automatic cutter wheel cutting machine positioned by the ccd, so as to obtain good squareness and dimensional accuracy control, wherein the dimensional accuracy is +/-0.05 mm.
First grinding: the lower surface of the polishing sheet/master glass was polished for 10 minutes using a corundum solution having a grain size of 20% DN95 of 10 μm or less under a pressure of 100kgf, the first polished surface had a surface roughness Ra of 5 μm and a surface microporosity of 8. Mu.m.
The prepared double-sided frosted diffuse reflection type calibration plate is shown in fig. 1, and comprises a polished sheet/original plate glass 1, wherein the upper surface and the lower surface of the polished sheet/original plate glass 1 are both first grinding surfaces 2, and a metal chromium layer 3 is manufactured on the first grinding surfaces 2 of the upper surfaces of the polished sheet/original plate glass.
Example 3
For a calibration plate with flatness of 10-30 micrometers, the single-sided polishing is performed after polishing by using a polishing sheet/original plate glass, and the preparation method of the diffuse reflection type calibration plate with single-sided frosted comprises the following steps:
first grinding: the upper and lower surfaces of the polishing sheet/master glass were polished with a carborundum solution having a grain size of 20% DN95 of 10 μm or less at a pressure of 100kgf for 10 minutes, respectively, and the first polished surface had a surface roughness Ra of 5 μm and a surface micro grain size of 8. Mu.m.
Polishing: polishing the first abrasive surface of the lower surface of the polishing sheet/master glass therein for 10 minutes using a 10% DN95 particle size cerium oxide polishing solution of 0.5 μm to obtain a polished surface; the surface roughness Ra of the polished surface was 0.015nm. The polishing step is performed on polyurethane and damping cloth; the pressure applied at the time of polishing was 100kgf.
And (3) making a graph: processing and manufacturing patterns on a first grinding surface of the upper surface of the polishing sheet/original plate glass by adopting a semiconductor mask pattern manufacturing process flow, and sequentially performing coating, gluing, photoetching, developing and corrosion to obtain metal chromium layer patterns;
the coating process is that the polishing sheet/original plate glass is put into a magnetron sputtering vacuum chamber after being cleaned and dried by ultrasonic, a layer of 80nm chromium film is coated on the front surface of a glass substrate by adopting a direct current magnetron sputtering process, and the proportion of process gas Ar\N2\O2\CO2 in the sputtering process is 35sccm:25sccm:0sccm:9sccm, a vacuum degree of 4X 10-6 and a sputtering power of 1.2kw, to obtain a chromium film substrate;
the photoresist coating process is spin coating by adopting a spin coating process, so that a photoresist film with the thickness of 100nm is obtained, the uniformity can reach +/-0.5%, and the resolution can reach 1 micron;
the photoetching process is that an inlet photoetching machine with an I-line high-resolution lens is used for exposure, and lines can be manufactured to be 1 micrometer;
after the development corrosion is exposure, on the accurate full-automatic development corrosion equipment, firstly, 0.01% TMAH is used for removing the exposure photoresist in a reaction way, the solution temperature is controlled at 23 ℃, the development time is controlled at 10 seconds, the special corrosion liquid is ceric ammonium nitrate, then, the special corrosion liquid is used for removing corrosion on the chromium layer exposed after the photoresist is removed in a development way, the corrosion time is controlled at 40 seconds, and the solution temperature is controlled at 23 ℃, so as to meet the process requirement of 1 micrometer lines.
Precision cutting: and (3) performing precise cutting by adopting a laser cutting machine positioned by the ccd to obtain good squareness and dimensional accuracy control, wherein the dimensional accuracy is +/-0.05 mm.
The prepared double-side frosted diffuse reflection type calibration plate is shown as fig. 2, and comprises a polished sheet/original plate glass 1, wherein the upper surface of the polished sheet/original plate glass 1 is a first grinding surface 2, the lower surface of the polished sheet/original plate glass 1 is a polishing surface 4, and a metal chromium layer 3 is manufactured on the first grinding surface 2 of the upper surface of the polished sheet/original plate glass.
Example 4
For calibration plates with flatness requirements within 10 microns, polishing sheets/master glass were used followed by double-sided polishing and single-sided polishing. The embodiment is a preparation method of a diffuse reflection type calibration plate with a frosted single surface, which comprises the following steps:
first grinding: the upper and lower surfaces of the polishing sheet/master glass were polished with a carborundum solution having a grain size of 20% DN95 of 10 μm or less at a pressure of 100kgf for 10 minutes, respectively, and the first polished surface had a surface roughness Ra of 5 μm and a surface micro grain size of 8. Mu.m.
Polishing: polishing the first abrasive surface of the upper and lower surfaces of the polishing sheet/master glass therein for 10 minutes using 10% DN95 particle size cerium oxide polishing solution of 0.5 μm to obtain polished surfaces; the surface roughness Ra of the polished surface was 0.015nm. The polishing step is performed on polyurethane and damping cloth; the pressure applied at the time of polishing was 100kgf.
Secondary grinding: the polished surface of the upper surface of the polishing sheet/master glass was polished with a carborundum solution having a grain size of 20% DN95 of 10 μm or less at a pressure of 100kgf for 10 minutes to obtain a second polished surface having a surface roughness Ra of 5 μm and a surface microporosity of 8. Mu.m.
And (3) making a graph: processing and manufacturing patterns on a second grinding surface of the upper surface of the polishing sheet/original plate glass by adopting a semiconductor mask pattern manufacturing process flow, and sequentially performing coating, gluing, photoetching, developing and corrosion to obtain metal chromium layer patterns;
the coating process is that the polishing sheet/original plate glass is put into a magnetron sputtering vacuum chamber after being cleaned and dried by ultrasonic, a layer of 80nm chromium film is coated on the front surface of a glass substrate by adopting a direct current magnetron sputtering process, and the proportion of process gas Ar\N2\O2\CO2 in the sputtering process is 35sccm:25sccm:0sccm:9sccm, a vacuum degree of 4X 10-6 and a sputtering power of 1.2kw, to obtain a chromium film substrate;
the photoresist coating process is spin coating by adopting a spin coating process, so that a photoresist film with the thickness of 100nm is obtained, the uniformity can reach +/-0.5%, and the resolution can reach 1 micron;
the photoetching process is that an inlet photoetching machine with an I-line high-resolution lens is used for exposure, and lines can be manufactured to be 1 micrometer;
after the development corrosion is exposure, on the accurate full-automatic development corrosion equipment, firstly, 0.01% TMAH is used for removing the exposure photoresist in a reaction way, the solution temperature is controlled at 23 ℃, the development time is controlled at 10 seconds, the special corrosion liquid is ceric ammonium nitrate, then, the special corrosion liquid is used for removing corrosion on the chromium layer exposed after the photoresist is removed in a development way, the corrosion time is controlled at 40 seconds, and the solution temperature is controlled at 23 ℃, so as to meet the process requirement of 1 micrometer lines.
Precision cutting: and (3) precisely cutting by adopting a dicing saw positioned by the ccd to obtain good squareness and dimensional accuracy control, wherein the dimensional accuracy is +/-0.05 mm.
Example 5
For calibration plates with flatness requirements within 10 microns, polishing sheets/master glass were used followed by double-sided polishing and single-sided polishing. The embodiment is a preparation method of a diffuse reflection type calibration plate with a frosted single surface, which comprises the following steps:
first grinding: the upper and lower surfaces of the polishing sheet/master glass were polished with a carborundum solution having a grain size of 20% DN95 of 10 μm or less at a pressure of 100kgf for 10 minutes, respectively, and the first polished surface had a surface roughness Ra of 5 μm and a surface micro grain size of 8. Mu.m.
Polishing: polishing the first abrasive surface of the upper and lower surfaces of the polishing sheet/master glass therein for 10 minutes using 10% DN95 particle size cerium oxide polishing solution of 0.5 μm to obtain polished surfaces; the surface roughness Ra of the polished surface was 0.015nm. The polishing step is performed on polyurethane and damping cloth; the pressure applied at the time of polishing was 100kgf.
And (3) making a graph: processing and manufacturing patterns on the polished surface of the upper surface of the polishing sheet/original plate glass by adopting a semiconductor mask pattern manufacturing process flow, and sequentially performing coating, gluing, photoetching, developing and corrosion to obtain a metal chromium layer pattern;
the coating process is that the polishing sheet/original plate glass is put into a magnetron sputtering vacuum chamber after being cleaned and dried by ultrasonic, a layer of 80nm chromium film is coated on the front surface of a glass substrate by adopting a direct current magnetron sputtering process, and the proportion of process gas Ar\N2\O2\CO2 in the sputtering process is 35sccm:25sccm:0sccm:9sccm, a vacuum degree of 4X 10-6 and a sputtering power of 1.2kw, to obtain a chromium film substrate;
the photoresist coating process is spin coating by adopting a spin coating process, so that a photoresist film with the thickness of 100nm is obtained, the uniformity can reach +/-0.5%, and the resolution can reach 1 micron;
the photoetching process is that an inlet photoetching machine with an I-line high-resolution lens is used for exposure, and lines can be manufactured to be 1 micrometer;
after the development corrosion is exposure, on the accurate full-automatic development corrosion equipment, firstly, 0.01% TMAH is used for removing the exposure photoresist in a reaction way, the solution temperature is controlled at 23 ℃, the development time is controlled at 10s, the special corrosion liquid adopts ceric ammonium nitrate, and then, the special corrosion liquid is used for removing the exposed chromium layer after the photoresist is removed in a development way, the solution temperature is controlled at 23 ℃, the development time is controlled at 10s, and the process requirement of 1 micrometer lines is met.
Precision cutting: and (3) performing precise cutting by adopting an automatic cutter wheel cutting machine positioned by the ccd, so as to obtain good squareness and dimensional accuracy control, wherein the dimensional accuracy is +/-0.05 mm.
Secondary grinding: the surface of the polished surface of the lower surface of the polishing sheet/master glass was polished for 10 minutes using a corundum solution having a grain size of 20% DN95 of 10 μm or less under a pressure of 100kgf at the time of polishing to obtain a second polished surface having a surface roughness Ra of 5 μm and a surface microporosity of 8. Mu.m.
Example 6
For the calibration plate with no requirement on flatness, polishing sheets/original plate glass can be used for direct grinding, and the preparation method of the diffuse reflection type calibration plate with single-sided frosted surface comprises the following steps:
first grinding: the upper surface of the polishing sheet/original plate glass was polished for 40 minutes using a silicon carbide solution having a grain size of 60% DN95 of 10 μm or less under a pressure of 500kgf at the time of polishing, and the upper surface of the polishing sheet/original plate glass was the first polished surface; the first abrasive surface had a surface roughness Ra of 1 micron and a surface micro particle size of 6 microns.
And (3) making a graph: processing and manufacturing patterns on the first grinding surface of the upper surface of the polishing sheet/original plate glass by adopting a semiconductor mask pattern manufacturing process flow, and sequentially performing coating, gluing, photoetching, developing and corrosion to obtain metal chromium layer patterns;
the coating process is that the polishing sheet/original plate glass is put into a magnetron sputtering vacuum chamber after being cleaned and dried by ultrasonic, a 120nm chromium film is coated on the front surface of a glass substrate by adopting a direct current magnetron sputtering process, and the proportion of process gas Ar\N2\O2\CO2 in the sputtering process is 35sccm:25sccm:0sccm:9sccm, a vacuum degree of 4X 10-6 and a sputtering power of 1.2kw, to obtain a chromium film substrate;
the photoresist coating process is spin coating by adopting a spin coating process, so that a photoresist film with the thickness of 500nm is obtained, the uniformity can reach +/-0.5%, and the resolution can reach 1 micron;
the photoetching process is that an inlet photoetching machine with an I-line high-resolution lens is used for exposure, and lines can be manufactured to be 1 micrometer;
after the development corrosion is exposure, on the accurate full-automatic development corrosion equipment, firstly, 0.3% TMAH is used for removing the exposure photoresist in a reaction way, the solution temperature is controlled at 25 ℃, the development time is controlled at 25 seconds, the special corrosion liquid adopts ceric ammonium nitrate, then, the special corrosion liquid is used for removing corrosion on the chromium layer exposed after the photoresist is removed in a development way, the corrosion time is controlled at 60 seconds, the solution temperature is controlled at 25 ℃, and the process requirement of 1 micrometer lines is met.
Precision cutting: high-precision cutting equipment such as an automatic cutter wheel cutting machine, a laser cutting machine, a scribing machine and the like positioned by a specific ccd are adopted for precision cutting, so that good squareness and dimensional accuracy control are obtained, and the dimensional accuracy is +/-0.05 mm.
Example 7
For a calibration plate with flatness of 10-30 micrometers, the single-sided polishing is performed after polishing by using a polishing sheet/original plate glass, and the preparation method of the diffuse reflection type calibration plate with single-sided frosted comprises the following steps:
the preparation method of the diffuse reflection type calibration plate comprises the following steps:
first grinding: using a 40% DN95 diamond solution with a particle size of less than 10 microns, applying a pressure of 300kgf during grinding, and grinding the lower surface of the polishing sheet/original plate glass for 25min to obtain a first grinding surface, wherein the upper surface of the polishing sheet/original plate glass is a plane; the first abrasive surface had a surface roughness Ra of 3 microns and a surface micro particle size of 7 microns.
Polishing: polishing the upper surface of the polishing sheet/master glass for 60 minutes using a cerium oxide polishing solution having a DN95 particle size of 1 μm to obtain a polished surface; the surface roughness Ra of the polished surface was 0.01nm. The polishing step is performed on polyurethane and damping cloth; the applied pressure at the time of polishing was 300kgf.
And (3) making a graph: processing and manufacturing patterns on the polished surface of the upper surface of the polishing sheet/original plate glass by adopting a semiconductor mask pattern manufacturing process flow, and sequentially performing coating, gluing, photoetching, developing and corrosion to obtain a metal chromium layer pattern;
the film plating process is that polishing sheet/original plate glass is put into a magnetron sputtering vacuum chamber after ultrasonic cleaning and drying, a layer of 100nm chromium film is plated on the front surface of a glass substrate by adopting a direct current magnetron sputtering process, and the proportion of process gas Ar\N2\O2\CO2 in the sputtering process is 35sccm:25sccm:0sccm:9sccm, a vacuum degree of 4X 10-6 and a sputtering power of 1.2kw, to obtain a chromium film substrate;
the photoresist coating process is spin coating by adopting a spin coating process, so that a photoresist film with the thickness of 300nm is obtained, the uniformity can reach +/-0.5%, and the resolution can reach 1 micron;
the photoetching process is that an inlet photoetching machine with an I-line high-resolution lens is used for exposure, and lines can be manufactured to be 1 micrometer;
after the development corrosion is exposure, on the accurate full-automatic development corrosion equipment, firstly, 0.01% -0.3% TMAH is used for removing the exposure photoresist in a reaction way, the solution temperature is controlled at 24 ℃, the development time is controlled at 15s, the special corrosion liquid is ceric ammonium nitrate, then, the special corrosion liquid is used for removing corrosion on the chromium layer exposed after the photoresist is removed in a development way, the corrosion time is controlled at 50s, the solution temperature is controlled at 24 ℃, and the process requirement of 1 micrometer lines is met.
Precision cutting: high-precision cutting equipment such as an automatic cutter wheel cutting machine, a laser cutting machine, a scribing machine and the like positioned by a specific ccd are adopted for precision cutting, so that good squareness and dimensional accuracy control are obtained, and the dimensional accuracy is +/-0.05 mm.
The prepared double-side frosted diffuse reflection type calibration plate is shown in fig. 3, and comprises a polished sheet/original plate glass 1, wherein the upper surface of the polished sheet/original plate glass 1 is a polished surface 4, the lower surface of the polished sheet/original plate glass 1 is a first polished surface 2, and a metal chromium layer 3 is manufactured on the polished surface 4 on the upper surface of the polished sheet/original plate glass.
Claims (2)
1. A preparation method of a diffuse reflection type calibration plate is characterized by comprising the following steps: the method comprises the following steps:
first grinding: using a silicon carbide solution with the grain diameter of less than 10 microns of 20% -60% DN95, and grinding the upper surface and the lower surface of original plate glass for 10-40min at the same time to obtain two first grinding surfaces;
and (3) making a graph: processing and manufacturing patterns on a first grinding surface of the upper surface of original plate glass by adopting a semiconductor mask pattern manufacturing process flow, and sequentially performing film coating, glue coating, photoetching, developing and corrosion to obtain metal chromium layer patterns;
precision cutting: performing precise cutting, wherein the dimensional precision is +/-0.05 mm;
the film plating process is to deposit a layer of 80-120nm chromium film on the upper surface of original plate glass by DC magnetron sputtering process in a magnetron sputtering vacuum chamber after the original plate glass is cleaned and dried by ultrasonic, ar and N in the process gas in the sputtering process 2、 O 2、 CO 2 The ratio of (3) is 5-80:0-50:0-60:0-80, vacuum degree of 1×10 -6 -8×10 -6 Pa, sputtering power is 0.2-5kw, and obtaining a chromium film substrate;
the photoresist coating process is spin coating by adopting a spin coating process, so that a photoresist film with the thickness of 100-500nm is obtained, the uniformity can reach +/-0.5%, and the resolution can reach 1 micron;
the photoetching process is an exposure process by using a photoetching machine with an I-line high-resolution lens;
after the development corrosion is exposure, on the accurate full-automatic development corrosion equipment, firstly, 0.01% -0.3% TMAH is used for removing the exposure photoresist in a reaction mode, the solution temperature is controlled at 23-25 ℃, the development time is controlled at 10-25 seconds, then, the corrosion solution is used for removing the exposed chromium layer after the photoresist is removed in a development mode, the corrosion time is 40-60 seconds, and the solution temperature is 23-25 ℃.
2. A diffusely reflective calibration plate manufactured using the diffusely reflective calibration plate manufacturing method of claim 1.
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| CN201421323Y (en) * | 2009-03-31 | 2010-03-10 | 深圳市纳研科技有限公司 | Two-dimensional calibration board |
| CN103042310A (en) * | 2011-10-12 | 2013-04-17 | 深圳市大族激光科技股份有限公司 | Manufacturing method of ground glass |
| CN104536262A (en) * | 2015-01-11 | 2015-04-22 | 南昌航空大学 | Method for manufacturing binary optical element with transparent ceramic as substrate material |
| CN106277813A (en) * | 2016-09-05 | 2017-01-04 | 信利光电股份有限公司 | A kind of manufacture method of pattern cover plate |
| CN109765036A (en) * | 2019-02-28 | 2019-05-17 | 人加智能机器人技术（北京）有限公司 | A kind of luminous scaling board and preparation method thereof for camera parameter calibration |
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| CN1280623C (en) * | 2004-07-16 | 2006-10-18 | 北京博奥生物芯片有限责任公司 | Calibration chip for fluorescent instrument calibration measurement and its preparing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201421323Y (en) * | 2009-03-31 | 2010-03-10 | 深圳市纳研科技有限公司 | Two-dimensional calibration board |
| CN103042310A (en) * | 2011-10-12 | 2013-04-17 | 深圳市大族激光科技股份有限公司 | Manufacturing method of ground glass |
| CN104536262A (en) * | 2015-01-11 | 2015-04-22 | 南昌航空大学 | Method for manufacturing binary optical element with transparent ceramic as substrate material |
| CN106277813A (en) * | 2016-09-05 | 2017-01-04 | 信利光电股份有限公司 | A kind of manufacture method of pattern cover plate |
| CN109765036A (en) * | 2019-02-28 | 2019-05-17 | 人加智能机器人技术（北京）有限公司 | A kind of luminous scaling board and preparation method thereof for camera parameter calibration |
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