CN114605081B - Preparation method of low-fragment-rate ultrathin glass - Google Patents
Preparation method of low-fragment-rate ultrathin glass Download PDFInfo
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- CN114605081B CN114605081B CN202210451680.3A CN202210451680A CN114605081B CN 114605081 B CN114605081 B CN 114605081B CN 202210451680 A CN202210451680 A CN 202210451680A CN 114605081 B CN114605081 B CN 114605081B
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- 239000011521 glass Substances 0.000 title claims abstract description 404
- 238000002360 preparation method Methods 0.000 title claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 323
- 239000012790 adhesive layer Substances 0.000 claims abstract description 203
- 238000005530 etching Methods 0.000 claims abstract description 13
- 230000008439 repair process Effects 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 34
- 239000003292 glue Substances 0.000 claims description 31
- 239000010410 layer Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000004140 cleaning Methods 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 7
- 238000000227 grinding Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 6
- 239000003638 chemical reducing agent Substances 0.000 description 12
- 238000010408 sweeping Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 238000013467 fragmentation Methods 0.000 description 3
- 238000006062 fragmentation reaction Methods 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 230000002401 inhibitory effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
The embodiment of the application discloses a preparation method of low-fragment-rate ultrathin glass, which comprises the following steps: providing a glass substrate; sequentially adhering a first adhesive layer and a first backboard on the first surface of the glass substrate; etching the second surface of the glass substrate, and thinning the glass substrate to a preset thickness; performing surface restoration on the second surface; sequentially sticking a second adhesive layer and a second backboard on the second surface; separating the first adhesive layer and the first back plate from the first surface; performing surface restoration on the first surface; the second adhesive layer and the second back plate are separated from the second surface. Therefore, the preparation method does not need to take and paste the thinned glass substrate when thinning and surface repairing are carried out, is beneficial to reducing the difficulty of ultrathin glass preparation, improves the working efficiency, effectively reduces the breaking rate and greatly improves the breaking rate.
Description
Technical Field
The application relates to the technical field of ultrathin glass, in particular to a preparation method of ultrathin glass with low breaking rate.
Background
The ultrathin glass (UltraThin Glass, UTG for short) is mainly used in the photoelectric industries of folding screens, displays and the like. The ultrathin glass in the current industry is thinned by an etching thinning process, the thickness of the ultrathin glass is about 30-50 mu m, and the ultrathin glass product is easy to bend and deform due to the fact that the ultrathin glass is thin, so that the problem of broken pieces easily occurs when the surface of the ultrathin glass is subjected to bad repair, the surface repair of the ultrathin glass in the preparation process of the ultrathin glass is limited, and the smooth process of the preparation of the ultrathin glass is also influenced. Therefore, the preparation method of the ultrathin glass, which can well realize surface repair of the ultrathin glass and is helpful for inhibiting the fragmentation problem, is an important research point for the person skilled in the art.
Disclosure of Invention
In order to solve the technical problems, the embodiment of the application provides a preparation method of low-breaking-rate ultrathin glass, which can better realize surface repair of ultrathin glass in the preparation process of ultrathin glass and is also beneficial to inhibiting the breaking problem in the surface repair process of ultrathin glass.
In order to solve the problems, the embodiment of the application provides the following technical scheme:
A preparation method of low-fragment-rate ultrathin glass comprises the following steps:
Providing a glass substrate;
A first adhesive layer is stuck on the first surface of the glass substrate;
adhering a first backboard to one side, away from the first surface of the glass substrate, of the first adhesive layer by using the first adhesive layer;
Etching the second surface of the glass substrate, and thinning the glass substrate to a preset thickness, wherein the second surface of the glass substrate is opposite to the first surface of the glass substrate;
performing surface repair on the second surface of the glass substrate;
a second adhesive layer is stuck on the second surface of the glass substrate;
adhering a second backboard to one side, away from the second surface of the glass substrate, of the second adhesive layer by using the second adhesive layer;
separating the first glue layer and the first back plate from the first surface of the glass substrate;
performing surface repair on the first surface of the glass substrate;
and separating the second adhesive layer and the second backboard from the second surface of the glass substrate to obtain the ultrathin glass with the thickness of a target thickness.
Optionally, the first adhesive layer is UV-reduced adhesive, and adhering the first adhesive layer on the first surface of the glass substrate includes:
the first adhesive layer is adhered to the first surface of the glass substrate in a rolling mode;
and cutting the first adhesive layer so that the size of the first adhesive layer is the same as the size of the glass substrate.
Optionally, the second adhesive layer is a high-temperature glue reducing layer, and adhering the second adhesive layer on the second surface of the glass substrate includes:
Bonding the second adhesive layer on the second surface of the glass substrate in a pressing mode;
And cutting the second adhesive layer so that the size of the second adhesive layer is the same as the size of the glass substrate.
Optionally, separating the first glue layer and the first back plate from the first surface of the glass substrate includes:
after repairing the surface of the second surface of the glass substrate, carrying out UV irradiation on the whole formed by the first back plate, the first adhesive layer, the glass substrate, the second adhesive layer and the second back plate in sequence, and separating the first adhesive layer and the first back plate from the first surface of the glass substrate;
separating the second glue layer and the second back plate from the glass substrate second surface comprises:
after the surface of the first surface of the glass substrate is repaired, the whole body formed by the glass substrate, the second adhesive layer and the second back plate in sequence is placed in an oven, heating treatment is carried out, and the second adhesive layer and the second back plate are separated from the second surface of the glass substrate.
Optionally, performing surface repair on the second surface of the glass substrate includes:
After the glass substrate is thinned to a preset thickness, performing surface repair on the second surface of the glass substrate by using physical grinding;
Then, cleaning the glass substrate;
surface repair of the first surface of the glass substrate includes:
After the first adhesive layer and the first backboard are separated from the first surface of the glass substrate, performing surface repair on the first surface of the glass substrate by physical grinding, and enabling the first surface of the glass substrate to be apparent to be consistent with the second surface of the glass substrate;
And then, cleaning the glass substrate.
Optionally, after the first surface of the glass substrate is adhered with a first adhesive layer and the first back plate is adhered to a side, away from the first surface of the glass substrate, of the first adhesive layer by using the first adhesive layer, the method further includes:
Defoaming bubbles between the first adhesive layer and the first surface of the glass substrate and bubbles between the first adhesive layer and the first backboard;
after the second adhesive layer is adhered to the second surface of the glass substrate and the second back plate is adhered to one side, away from the second surface of the glass substrate, of the second adhesive layer by using the second adhesive layer, the method further comprises the following steps:
and defoaming bubbles between the second adhesive layer and the second surface of the glass substrate and bubbles between the second adhesive layer and the second backboard.
Optionally, the size of the glass substrate is not less than 400mm by 500mm, and the target thickness is 30 μm.
Optionally, the first back plate has a size larger than the glass substrate, and the second back plate has a size larger than the glass substrate.
Compared with the prior art, the technical scheme has the following advantages:
The technical scheme provided by the application comprises the following steps: providing a glass substrate; sequentially adhering a first adhesive layer and a first backboard to the first surface of the glass substrate; etching the second surface of the glass substrate, and thinning the glass substrate to a preset thickness; performing surface repair on the second surface of the glass substrate; sequentially sticking a second adhesive layer and a second backboard on the second surface of the glass substrate; separating the first glue layer and the first back plate from the first surface of the glass substrate; performing surface repair on the first surface of the glass substrate; and separating the second adhesive layer and the second back plate from the second surface of the glass substrate. Therefore, when the preparation method is used for thinning and surface repairing, the glass substrate with the thickness being thinned to be the preset thickness does not need to be taken and stuck for many times, the thickness of the ultrathin glass is quite thin, the taking difficulty is quite high, and the risk of breaking is high, so that the preparation method provided by the embodiment of the application is beneficial to reducing the difficulty of preparing the ultrathin glass, improving the working efficiency, and effectively reducing the breaking rate, and the breaking rate of the preparation method is about 1 percent, even lower, compared with the breaking rate of 60 percent of the existing method, the breaking rate of the preparation method provided by the embodiment of the application is greatly improved.
In addition, in the preparation process, the glass substrate is always supported by the back plate in the process of thinning and surface repairing of the glass substrate, so that the glass substrate can be effectively prevented from being broken. In addition, in the process of thinning and surface repairing of the glass substrate, the glass substrate is always attached to the back plate, so that the glass substrate is very convenient to take and place in the preparation process, and the working efficiency of preparing ultrathin glass is improved.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for preparing low breaking rate ultrathin glass, which is provided by the embodiment of the application;
fig. 2 to fig. 9 are schematic structural diagrams formed after different process steps in the preparation method of the low-breaking-rate ultrathin glass according to the embodiment of the application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, but the present application may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present application is not limited to the specific embodiments disclosed below.
In the following detailed description of the embodiments of the present application, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration only, and in which is shown by way of illustration only, and in which the scope of the application is not limited for ease of illustration. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
As described in the background art, the preparation method of the ultrathin glass, which can well realize the surface repair of the ultrathin glass and is helpful for inhibiting the fragmentation problem of the ultrathin glass, is an important research point for the person skilled in the art.
The ultrathin glass has wide application in the photoelectric industries such as folding screens, display screens and the like, at present, glass master sheets are thinned through an etching process, but scratches on the surfaces of glass products are amplified by etching, so that micro scratches which are originally difficult to detect on the surfaces of the glass products are amplified into obvious scratches, and even deep scratches influence the appearance of the ultrathin glass, and therefore, the surface of the ultrathin glass is required to be repaired. However, the thickness of the ultrathin glass is generally 30-50 μm, so that the ultrathin glass has the problems of easy bending and deformation, and the problem of breakage easily occurs when the surface of the ultrathin glass is repaired.
When the existing method is used for preparing ultrathin glass, the middle piece glass with the thickness of about 0.5mm is generally adopted as a master piece, the thickness of the master piece glass is etched to about 35 mu m in a chemical etching mode, then a glass substrate with the thickness of about 35 mu m is cut into ultrathin granules through laser cutting, the size is generally below 7 inches, the ultrathin granules are attached to a backboard with the thicker thickness through UV curing glue, and then surface repair is carried out on the ultrathin granules through twice single-sided light sweeping. When the surface is repaired, two sides of the ultrathin small particle are required to be repaired, so that the ultrathin small particle stuck on the back plate is required to be taken and stuck again, and the ultrathin small particle is small in size and thin in thickness, so that the difficulty in taking the ultrathin small particle during surface repair is great, the working efficiency is influenced, and meanwhile, the high fragmentation risk still exists during taking due to the fact that the thickness of the ultrathin small particle is very thin.
In addition, along with the development of the photoelectric industry, the size of the required ultra-thin glass is also changed in a diversified manner, when the size of the ultra-thin glass is larger, along with the increase of the size of the ultra-thin glass, the bonding difficulty of the ultra-thin glass and the backboard is gradually increased, and the breaking rate is also gradually increased when the surface of the ultra-thin glass is repaired, especially for the large-size ultra-thin glass with the size of 400mm or more and 500mm, the bonding difficulty of a large-size glass substrate and the backboard is large, the breaking rate is high, the breaking rate is up to 60 percent, even higher, the normal performance of the surface repair in the preparation process of the ultra-thin glass is seriously influenced, the smooth preparation of the ultra-thin glass is also influenced, and the further development of the ultra-thin glass is limited.
Based on the above research, the embodiment of the application provides a preparation method of low-fragmentation-rate ultrathin glass, as shown in fig. 1, which comprises the following steps:
S1: as shown in fig. 2, a glass substrate 10 is provided;
s2: as shown in fig. 3, a first adhesive layer 21 is adhered to the first surface of the glass substrate 10:
S3: as shown in fig. 4, the first back plate 31 is adhered to the side, facing away from the first surface of the glass substrate 10, of the first adhesive layer 21 by using the first adhesive layer 21, so as to form a multi-layer structure sequentially composed of the first back plate 31, the first adhesive layer 21 and the glass substrate 10, and the first back plate and the first surface of the glass substrate are adhered by the first adhesive layer, so that the glass substrate is adhered to the first back plate;
S4: as shown in fig. 5, etching the second surface of the glass substrate 10, thinning the second surface of the glass substrate 10, and thinning the glass substrate 10 to a preset thickness, wherein the first surface of the glass substrate 10 is opposite to the second surface of the glass substrate 10; in the embodiment of the present application, the second surface of the glass substrate is etched, and the glass substrate is thinned to a preset thickness, where the preset thickness is about 35 μm;
S5: surface repair is performed on the second surface of the glass substrate 10, and appearance defects, including surface scratches and the like, of the second surface of the glass substrate 10 caused by etching and thinning processes by using a chemical thinning process are repaired, so that the second surface of the glass substrate 10 is good in appearance;
s6: as shown in fig. 6, a second adhesive layer 22 is adhered to the second surface of the glass substrate 10;
S7: as shown in fig. 7, a second back plate 32 is adhered to a side, facing away from the second surface of the glass substrate 10, of the second adhesive layer 22 by using the second adhesive layer 22, so as to form a multi-layer structure sequentially composed of the first back plate 31, the first adhesive layer 21, the glass substrate 10, the second adhesive layer 22 and the second back plate 32, and the second back plate and the second surface of the glass substrate are adhered by using the second adhesive layer, so that the glass substrate is adhered to the second back plate;
S8: as shown in fig. 8, the first adhesive layer 21 and the first back plate 31 are separated from the first surface of the glass substrate 10, that is, the first adhesive layer 21 and the first back plate 31 are removed from the first surface of the glass substrate 10;
s9: surface repair is performed on the first surface of the glass substrate 10, so that the first surface of the glass substrate 10 is good in appearance, and the first surface of the glass substrate is consistent with the second surface of the glass substrate in appearance;
S10: as shown in fig. 9, the second adhesive layer 22 and the second back plate 32 are separated from the second surface of the glass substrate 10, that is, the second adhesive layer 22 and the second back plate 32 are removed from the second surface of the glass substrate 10, and only the ultra-thin glass with the thickness being the target thickness and after the surface repair is maintained, so as to complete the preparation of the ultra-thin glass, and the target ultra-thin glass is prepared. It should be noted that, after the second surface of the glass substrate is etched and the glass substrate is thinned to a preset thickness, the preparation method further includes surface repairing the first surface and the second surface of the glass substrate, and the glass substrate is thinned in the process of surface repairing, so that the thickness of the obtained glass substrate is smaller than the thickness of the glass substrate after the second surface of the glass substrate is etched, and the thickness of the glass substrate after the surface repairing is the thickness of the ultrathin glass to be obtained by the preparation method, namely the target thickness.
Specifically, in one embodiment of the present application, the preparation method includes sequentially adhering a first adhesive layer and a first back plate on a first surface of a glass substrate, etching a second surface of the glass substrate, thinning the glass substrate to a preset thickness, repairing the second surface of the glass substrate, and repairing appearance defects of the second surface of the glass substrate due to etching. And after the surface of the second surface of the glass substrate is repaired, sequentially adhering a second adhesive layer and a second backboard to the second surface of the glass substrate, separating the first adhesive layer and the first backboard from the first surface of the glass substrate, repairing the surface of the first surface of the glass substrate, and finally removing the second adhesive layer and the second backboard to prepare the ultrathin glass with the thickness of a target thickness and good appearance. Therefore, after the glass substrate is etched to a preset thickness and the surface of the second surface of the glass substrate is repaired, the second backboard is adhered to one side, away from the second surface of the glass substrate, of the second adhesive layer through the second adhesive layer, namely the second backboard is adhered to the second surface of the glass substrate, the repaired second surface is protected, the first adhesive layer and the first backboard are removed, the first surface of the glass substrate is exposed, the first surface of the glass substrate is repaired, in the process, the thinned glass substrate is not required to be removed from the first backboard, then the thinned glass substrate is adhered to the second backboard, namely the glass substrate with a smaller thickness is not required to be taken and adhered for multiple times, and the adhesive layer of the first surface is removed, so that the repair work of the two surfaces of the glass substrate can be completed. The ultrathin glass is thin, the taking difficulty is high, and the risk of breaking is high, so that the preparation method provided by the embodiment of the application is beneficial to reducing the difficulty of ultrathin glass preparation, improving the working efficiency, effectively reducing the breaking rate, and greatly improving the breaking rate when the preparation method is used for preparing the ultrathin glass, compared with the breaking rate of 60% when the preparation method is used for preparing the ultrathin glass, the breaking rate when the preparation method is used for preparing the ultrathin glass.
In addition, in the preparation method provided by the embodiment of the application, in the process of preparing the ultrathin glass, the second surface of the glass substrate is etched, when the glass substrate is thinned to a preset thickness and the second surface of the glass substrate is subjected to surface repair, the glass substrate is always attached to the first backboard, and after the glass substrate is etched to the preset thickness and the second surface of the glass substrate is subjected to surface repair, when the first surface of the glass substrate is subjected to surface repair, the glass substrate is always attached to the second backboard, namely, in the process of thinning and surface repair of the glass substrate, the glass substrate is always supported through the backboard, so that the glass substrate can be effectively prevented from being broken. In addition, in the process of thinning and surface repairing of the glass substrate, the glass substrate is always attached to the back plate, so that the glass substrate is very convenient to take and place in the preparation process, and the working efficiency of preparing ultrathin glass is improved.
On the basis of the foregoing embodiment, in one embodiment of the present application, the first adhesive layer is UV-reduced adhesive, and adhering the first adhesive layer on the first surface of the glass substrate includes: the first adhesive layer is adhered to the first surface of the glass substrate in a rolling mode, namely, the first adhesive layer is adhered to the non-thinned surface of the glass substrate; and then cutting the first adhesive layer so that the size of the first adhesive layer is the same as the size of the glass substrate. Specifically, in the embodiment of the present application, the process of adhering the UV-reducing adhesive to the first surface of the glass substrate is specifically: the method comprises the steps of taking a UV (ultraviolet) glue reducing agent, tearing a protective film on one side of the UV glue reducing agent, uniformly adhering one side of the torn protective film to the first surface of the glass substrate in a rolling mode, uniformly adhering the UV glue reducing agent to the first surface of the glass substrate, cutting the UV glue reducing agent, and removing redundant and exposed UV glue reducing agents, wherein the size of the UV glue reducing agent is the same as that of the glass substrate, namely the size of the first glue layer is the same as that of the glass substrate, so that the first surface of the glass substrate is completely covered by the first glue layer. And after the first adhesive layer is adhered to the first surface of the glass substrate, tearing the protective film on the side, which is not adhered to the glass substrate, of the first adhesive layer, and adhering the first back plate on the side, which is away from the first foot surface of the glass substrate, of the first adhesive layer.
In the embodiment of the present application, the first adhesive layer is adhered to the first surface of the glass substrate, so that the size of the first adhesive layer is the same as the size of the glass substrate, specifically, the size of the first adhesive layer is the same as the size of the first surface of the glass substrate. It should be further noted that, after the first adhesive layer is adhered to the first surface of the glass substrate, before the first back plate is adhered to the side, facing away from the first surface of the glass substrate, of the first adhesive layer by using the first adhesive layer, the preparation method further includes: placing the first backboard into cleaning equipment such as a cleaning machine for cleaning; after the glass substrate is cleaned, the first back plate is adhered to one side, away from the first surface of the glass substrate, of the first adhesive layer by utilizing the first adhesive layer, and the glass substrate to which the first adhesive layer is adhered is attached to the first back plate.
On the basis of the foregoing embodiment, in one embodiment of the present application, the second adhesive layer is a high-temperature glue reducing layer, and adhering the second adhesive layer on the second surface of the glass substrate includes: bonding the second adhesive layer on the second surface of the glass substrate in a pressing mode; and cutting the second adhesive layer so that the size of the second adhesive layer is the same as the size of the glass substrate. Specifically, in the embodiment of the application, a high-temperature glue reducing agent is taken, the size of the high-temperature glue reducing agent is larger than that of the second surface of the glass substrate, a protective film on one side of the high-temperature glue reducing agent is torn, one side of the torn protective film is uniformly adhered to the second surface of the glass substrate in a pressing mode, so that the second glue layer is adhered to the second surface of the glass substrate, then the high-temperature glue reducing agent is cut, and the high-temperature glue reducing agent is cut into the same size as the glass substrate, so that the second surface of the glass substrate is completely covered by the second glue layer. And after the second adhesive layer is adhered to the second surface of the glass substrate, tearing the protective film on the side, which is not adhered to the glass substrate, of the second adhesive layer, and adhering the second back plate on the side, which is away from the first surface of the glass substrate, of the second adhesive layer.
In the embodiment of the present application, the second adhesive layer is adhered to the second surface of the glass substrate, so that the size of the second adhesive layer is the same as the size of the glass substrate, specifically, the size of the second adhesive layer is the same as the size of the second surface of the glass substrate. It should be further noted that, after the second adhesive layer is adhered to the second surface of the glass substrate, before the second back plate is adhered to the side, facing away from the second surface of the glass substrate, of the second adhesive layer by using the second adhesive layer, the preparation method further includes: placing the second backboard into cleaning equipment such as a cleaning machine for cleaning; after the glass substrate is cleaned, the second back plate is adhered to one side, away from the second surface of the glass substrate, of the second adhesive layer by utilizing the second adhesive layer, and the glass substrate adhered with the second adhesive layer is adhered to the second back plate.
It should be noted that, in the above embodiment, after the first adhesive layer and the second adhesive layer are adhered to the first surface of the glass substrate and the second surface of the glass substrate, the first adhesive layer and the second adhesive layer are cut so that the sizes of the first adhesive layer and the second adhesive layer are respectively the same as those of the first surface of the glass substrate and the second surface of the glass substrate, but in other embodiments of the present application, the first adhesive layer and the second adhesive layer may be cut first so that the sizes of the first adhesive layer and the second adhesive layer are the same as those of the glass substrate, which is the case may be. In addition, in other embodiments of the present application, the first adhesive layer may be adhered to the first surface of the glass substrate by pressing, and the second adhesive layer may be adhered to the second surface of the glass substrate by rolling, where appropriate.
On the basis of the above embodiment, in one embodiment of the present application, the first adhesive layer is UV-reduced adhesive, the first adhesive layer loses adhesion due to UV irradiation, the second adhesive layer is high-temperature-reduced adhesive, and the second adhesive layer loses adhesion at high temperature, so in one embodiment of the present application, separating the first adhesive layer and the first back plate from the first surface of the glass substrate includes: and carrying out UV irradiation on the whole formed by the first back plate, the first adhesive layer, the glass substrate, the second adhesive layer and the second back plate in sequence, so that the first adhesive layer loses viscosity, the first adhesive layer and the first back plate are separated from the first surface of the glass substrate, namely the first surface of the glass substrate is exposed, and the first surface of the glass substrate can be repaired.
And, on the basis of the above embodiment, in an embodiment of the present application, separating the second adhesive layer and the yielding back plate from the second surface of the glass substrate includes: after the surface of the glass substrate is repaired, the whole formed by the glass substrate, the second adhesive layer and the second back plate is placed in an oven for heating treatment, and as the second adhesive layer is high-temperature glue reducing glue, the whole formed by the glass substrate, the second adhesive layer and the second back plate is heated, so that the second adhesive layer loses the adhesiveness, the second adhesive layer and the second back plate are separated from the second surface of the glass substrate, and the two surfaces of the glass substrate thinned to the target thickness and subjected to surface repair are not provided with the adhesive layer and the back plate, so that the preparation of the ultrathin glass is completed. Specifically, in one embodiment of the present application, the whole body composed of the glass substrate, the second adhesive layer and the second back plate in sequence is placed in an oven at 120 ℃ for heating treatment, and baked for about 15 minutes, so that the high-temperature glue reducing agent loses viscosity, and the second back plate is separated from the glass substrate.
In summary, the first adhesive layer is UV-adhesive-reducing, the second adhesive layer is high-temperature adhesive-reducing, and the conditions for losing the adhesion are different, so that the adhesion loss of the first adhesive layer can be ensured, the second adhesive layer maintains good adhesion in the process of separating the first back plate from the glass substrate, the second back plate is ensured not to be separated from the glass substrate, and only the first surface of the glass substrate is exposed, so that the first surface of the glass substrate is subjected to surface repair. And moreover, the conditions of losing the viscosity of the first adhesive layer and the second adhesive layer are different, the first adhesive layer and the second adhesive layer can be respectively made to lose the viscosity by utilizing different conditions, the specific surface is exposed, and the surface of the glass substrate is repaired, so that the glass substrate which is thinned to the preset thickness is not required to be taken and stuck for multiple times when the surface is repaired, and the glass substrate is effectively prevented from being broken. It should be noted that, in one embodiment of the present application, the first adhesive layer is UV-reduced adhesive, and the second adhesive layer is high-temperature-reduced adhesive, but the present application is not limited thereto, in other embodiments of the present application, the first adhesive layer may be high-temperature-reduced adhesive, the second adhesive layer may be UV-reduced adhesive, or the first adhesive layer and the second adhesive layer may be two other types of adhesive with different adhesion reducing conditions, depending on the case, but since the UV-reduced adhesive and the high-temperature-reduced adhesive are easy to operate and will not remain on the surface of the glass substrate, in the embodiment of the present application, the first adhesive layer and the second adhesive layer are preferably UV-reduced adhesive and high-temperature-reduced adhesive.
On the basis of the foregoing embodiments, in one embodiment of the present application, performing surface repair on the second surface of the glass substrate includes: after the glass substrate is thinned to a preset thickness, performing surface repair on the second surface of the glass substrate by using physical grinding; and then, cleaning the glass substrate. Specifically, a multi-layer structure composed of a glass substrate (thinned to a glass substrate with a preset thickness), a first adhesive layer and a first back plate is attached to a light sweeping adsorption pad, wherein the first back plate is attached to the light sweeping adsorption pad, the second surface of the glass substrate is subjected to surface restoration by using the light sweeping pad and polishing liquid containing cerium oxide, appearance defects such as scratches on the second surface of the glass substrate are restored, and after the surface restoration is performed, the whole composed of the glass substrate, the first adhesive layer and the first back plate is cleaned so as to clean the glass substrate, and polishing powder and other substances on the surface of the glass substrate are cleaned.
On the basis of the foregoing embodiment, in an embodiment of the present application, performing surface repair on the first surface of the glass substrate includes: after the first adhesive layer and the first backboard are separated from the first surface of the glass substrate, performing surface repair on the first surface of the glass substrate by physical grinding, and enabling the first surface of the glass substrate to be apparent to be consistent with the second surface of the glass substrate; and then, cleaning the glass substrate. The method comprises the steps of adhering a multi-layer structure consisting of a glass substrate, a second adhesive layer and a second back plate to a light sweeping adsorption pad, adhering the second back plate to the light sweeping adsorption pad, repairing the surface of the first surface of the glass substrate through the light sweeping pad and polishing solution containing cerium oxide, repairing apparent defects such as scratches on the first surface of the glass substrate, and cleaning the whole consisting of the glass substrate, the second adhesive layer and the second back plate after repairing the surface so as to clean the glass substrate and clean substances such as polishing powder on the surface of the glass substrate.
On the basis of the foregoing embodiment, in one embodiment of the present application, after the first adhesive layer is adhered to the first surface of the glass substrate, before the first back plate is adhered to the side, facing away from the first surface of the glass substrate, of the first adhesive layer by using the first adhesive layer, the method further includes: the method comprises the steps that a steam drum between the first adhesive layer and the first surface of the glass substrate is subjected to defoaming treatment, so that when obvious bubbles exist between the first adhesive layer and the first surface of the glass substrate and between the first adhesive layer and the first back plate, the bubbles between the first adhesive layer and the first surface of the glass substrate and between the first adhesive layer and the first back plate are removed, and the first back plate and the glass substrate are tightly and firmly bonded through the first adhesive layer; and after the second adhesive layer is adhered to the second surface of the glass substrate and the second back plate is adhered to the side, away from the second surface of the glass substrate, of the second adhesive layer by using the second adhesive layer, the method further comprises: and defoaming bubbles between the second adhesive layer and the second surface of the glass substrate and bubbles between the second adhesive layer and the second back plate so as to remove bubbles between the second adhesive layer and the second surface of the glass substrate and between the second adhesive layer and the second back plate when obvious bubbles exist between the second adhesive layer and the second surface of the glass substrate and between the second adhesive layer and the second back plate, thereby being beneficial to tightly and firmly bonding the second back plate and the glass substrate through the second adhesive layer.
It should be noted that, along with the increase of the size of the ultra-thin glass, when the surface of the ultra-thin glass is repaired, the attaching difficulty of the ultra-thin glass and the backboard is gradually increased, and the breaking rate is also gradually increased, and when the ultra-thin glass is prepared by the preparation method, the glass substrate with thinner thickness does not need to be taken and pasted for many times, so that the preparation method is suitable for preparing the ultra-thin glass with large size, and when the glass substrate is attached to the backboard, the glass substrate is not thinned yet, and has thicker thickness, so that the attachment of the glass substrate and the backboard is easier, and the breaking is not easy to occur, and the method is suitable for preparing the ultra-thin glass with large size. Thus, in one embodiment of the present application, the size of the glass substrate is not less than 400mm by 500mm, i.e., the size of the glass substrate is greater than or equal to 400mm by 500mm, on the basis of the above-described embodiments. In addition, in the embodiment of the present application, the target thickness is 30 μm, that is, the thickness of the ultrathin glass to be obtained by the preparation method is 30 μm, it should be noted that, it is known that the thickness of the glass substrate will be thinned to about 35 μm by etching, and when the surface is repaired by physical polishing, the thickness of the glass substrate will be thinned, and in general, the thickness of the glass substrate thinned during surface repair on one side is about 2 μm, and the thickness of the thinned during surface repair is also different depending on the apparent condition of the glass substrate, and the thickness of the thinned during surface repair is larger, whereas the thickness of the thinned is smaller, and meanwhile, the thinned during surface repair also has a problem of accuracy, for example, if the thinned during surface repair is thinned by about 2 μm, the thinned thickness of the thinned is only about 2 μm as much as possible and cannot be accurately made to hundred percent, so that the target thickness of the present application is about 30 μm. However, the comparison of the present application is not limited, and in other embodiments of the present application, the size and target thickness of the glass substrate may be other values, as the case may be.
On the basis of the above embodiments, in one embodiment of the present application, in the process of preparing ultra-thin glass, in order to ensure the support and protection of the back plate on the glass substrate, the size of the first back plate is larger than the size of the glass substrate, and the size of the second back plate is larger than the size of the glass substrate. In the embodiment of the present application, the size of the first back plate is larger than the size of the glass substrate, specifically, the size of the first back plate is larger than the size of the first surface of the glass substrate, and the size of the second back plate is larger than the size of the glass substrate, specifically, the size of the second back plate is larger than the size of the second surface of the glass substrate. However, the difference between the dimensions of the first back plate and the second back plate and the dimensions of the glass substrate according to the embodiment of the present application is not limited, and the specific situation is determined according to the present application.
In summary, the embodiment of the application provides a preparation method of low-breaking-rate ultrathin glass, which comprises the following steps: providing a glass substrate; sequentially adhering a first adhesive layer and a first backboard to the first surface of the glass substrate; etching the second surface of the glass substrate, and thinning the glass substrate to a preset thickness; performing surface repair on the second surface of the glass substrate; sequentially sticking a second adhesive layer and a second backboard on the second surface of the glass substrate; separating the first glue layer and the first back plate from the first surface of the glass substrate; performing surface repair on the first surface of the glass substrate; and separating the second adhesive layer and the second back plate from the second surface of the glass substrate. Therefore, when the preparation method is used for thinning and surface repairing, the glass substrate with the thickness being thinned to be the preset thickness is not required to be taken and stuck, the thickness of the ultrathin glass is very thin, the taking difficulty is high, and the risk of breaking is high, so that the preparation method provided by the embodiment of the application is beneficial to reducing the difficulty of preparing the ultrathin glass, improving the working efficiency, and effectively reducing the breaking rate, and the breaking rate of the preparation method is about 1 percent or even lower when the preparation method is used for preparing the ultrathin glass, and compared with the breaking rate of 60 percent of the existing method, the breaking rate of the preparation method provided by the embodiment of the application is greatly improved.
In addition, in the preparation process, the glass substrate is always supported by the back plate in the process of thinning and surface repairing of the glass substrate, so that the glass substrate can be effectively prevented from being broken. In addition, in the process of thinning and surface repairing of the glass substrate, the glass substrate is always attached to the back plate, so that the glass substrate is very convenient to take and place in the preparation process, and the working efficiency of preparing ultrathin glass is improved.
In the description, each part is described in a parallel and progressive mode, and each part is mainly described as a difference with other parts, and all parts are identical and similar to each other.
The features described in the various embodiments of the present disclosure may be interchanged or combined with one another in the description to enable those skilled in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. The preparation method of the low-fragment-rate ultrathin glass is characterized by comprising the following steps of:
Providing a glass substrate;
A first adhesive layer is stuck on the first surface of the glass substrate; the first adhesive layer is UV glue reducing adhesive;
adhering a first backboard to one side, away from the first surface of the glass substrate, of the first adhesive layer by using the first adhesive layer;
Etching the second surface of the glass substrate, and thinning the glass substrate to a preset thickness, wherein the second surface of the glass substrate is opposite to the first surface of the glass substrate;
performing surface repair on the second surface of the glass substrate;
a second adhesive layer is stuck on the second surface of the glass substrate; the second adhesive layer is high-temperature glue reducing adhesive;
adhering a second backboard to one side, away from the second surface of the glass substrate, of the second adhesive layer by using the second adhesive layer;
separating the first glue layer and the first back plate from the first surface of the glass substrate;
performing surface repair on the first surface of the glass substrate;
and separating the second adhesive layer and the second backboard from the second surface of the glass substrate to obtain the ultrathin glass with the thickness of a target thickness.
2. The method of manufacturing according to claim 1, wherein attaching the first adhesive layer to the first surface of the glass substrate comprises:
the first adhesive layer is adhered to the first surface of the glass substrate in a rolling mode;
and cutting the first adhesive layer so that the size of the first adhesive layer is the same as the size of the glass substrate.
3. The method of manufacturing according to claim 2, wherein attaching the second adhesive layer to the second surface of the glass substrate comprises:
Bonding the second adhesive layer on the second surface of the glass substrate in a pressing mode;
And cutting the second adhesive layer so that the size of the second adhesive layer is the same as the size of the glass substrate.
4. The method of manufacturing of claim 3, wherein separating the first glue layer and the first back plate from the first surface of the glass substrate comprises:
after repairing the surface of the second surface of the glass substrate, carrying out UV irradiation on the whole formed by the first back plate, the first adhesive layer, the glass substrate, the second adhesive layer and the second back plate in sequence, and separating the first adhesive layer and the first back plate from the first surface of the glass substrate;
separating the second glue layer and the second back plate from the glass substrate second surface comprises:
after the surface of the first surface of the glass substrate is repaired, the whole body formed by the glass substrate, the second adhesive layer and the second back plate in sequence is placed in an oven, heating treatment is carried out, and the second adhesive layer and the second back plate are separated from the second surface of the glass substrate.
5. The method of claim 1, wherein surface repairing the second surface of the glass substrate comprises:
After the glass substrate is thinned to a preset thickness, performing surface repair on the second surface of the glass substrate by using physical grinding;
Then, cleaning the glass substrate;
surface repair of the first surface of the glass substrate includes:
After the first adhesive layer and the first backboard are separated from the first surface of the glass substrate, performing surface repair on the first surface of the glass substrate by physical grinding, and enabling the first surface of the glass substrate to be apparent to be consistent with the second surface of the glass substrate;
And then, cleaning the glass substrate.
6. The method of claim 1, further comprising, after adhering a first adhesive layer to the first surface of the glass substrate and adhering a first back plate to a side of the first adhesive layer facing away from the first surface of the glass substrate using the first adhesive layer:
Defoaming bubbles between the first adhesive layer and the first surface of the glass substrate and bubbles between the first adhesive layer and the first backboard;
after the second adhesive layer is adhered to the second surface of the glass substrate and the second back plate is adhered to one side, away from the second surface of the glass substrate, of the second adhesive layer by using the second adhesive layer, the method further comprises the following steps:
and defoaming bubbles between the second adhesive layer and the second surface of the glass substrate and bubbles between the second adhesive layer and the second backboard.
7. The method of claim 1, wherein the glass substrate has a size of not less than 400mm by 500mm, and the target thickness is 30 μm.
8. The method of manufacturing according to claim 1, wherein the first back plate has a size larger than the glass substrate and the second back plate has a size larger than the glass substrate.
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