TW408362B - Method of removing inorganic contamination by chemical alteration and extraction in a supercritical fluid media - Google Patents

Method of removing inorganic contamination by chemical alteration and extraction in a supercritical fluid media Download PDF

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TW408362B
TW408362B TW086111091A TW86111091A TW408362B TW 408362 B TW408362 B TW 408362B TW 086111091 A TW086111091 A TW 086111091A TW 86111091 A TW86111091 A TW 86111091A TW 408362 B TW408362 B TW 408362B
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Monte A Douglas
Allen C Templeton
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Texas Instruments Inc
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046Dry cleaning only
    • HELECTRICITY
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
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    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00Cleaning and liquid contact with solids
    • Y10S134/902Semiconductor wafer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/902Capping layer

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Description

408362 a7 B7 五、發明説明(i ) 相關專利/專利申請案之交互參照 下列共同讓與之專利/專利申請案併入本文中作爲參者 專利號/序號 申請曰 τι索件號 7/25/1996 TI-21081 發明領域 .. 本發明係關於半導體元件之製造與加工;較明確地説, 係關於一種於超臨界流體介質中移除無機污染物之方法。 發明背景 , 在如積體電路及液晶顯示器之製造中,基質及其上半導 體層的污染會引起許多問題,應儘可能予以減少。此種污 染可舉例如殘留粒子、有機物及金屬。此外,污染可能出 現在半導體層之表面,或可能出現在半導體層與另一層( 如氧化物層 > 中間。基本上,製造半導體係利用濕處理。 濕清潔處理可包括一序列之顆粒移除及金屬移除步驟,於 其間施行清洗步驟,並以乾燥步驟結束。乾燥主要係藉旋 轉晶圓,使晶圓上的液體被旋離,或由熱異丙醇蒸氣冷凝 在晶圓表面來清洗晶圓及排除晶圓之水而完成。 經濟部中央標準局員工消費合作社印製 ------^_ —II 裝 i — (請先閱讀背面之注意事項再填寫本頁) 此類型之濕清潔處理遭遇到一個特别嚴重的缺點;明確 言之,大部分此類型之金屬移除方法(主要由強酸性混合 物所構成),都添加顆粒至晶圓表面;而顆粒移除方法( 主要由鹼性劑/氧化劑混合物所組成)則添加金屬至晶圓 表面。此外,大部份濕请潔處理所遭遇到的問題是:取得 電子級濕化學品之費用、廢棄用於濕清潔處理之腐蝕性化 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部中央標準局員工消費合作衽印製 408362 A7 一^_________ B7 . I ___ 五、發明説明(2 ) — 學品的費用、限制切止濕化學清潔處理達到高縱橫比特 性(像溝槽)之液體表面張力、及缺少對所有乾處理(其 較常被用於半導體加工中)之調和性。因此,金屬移除& 驟之後接著進行顆粒移除步驟,將造成金屬的殘留;而反 過來處理則會導致較少的顆粒,但可能在最後的清洗中被 金屬所污串。a 超臨界流體(即超臨界二氧化碳)近年來已受到相當的 注意,特别是在有關咖啡之去咖啡因及亞麻/精美服飾乾 洗之領域方面。此外,超臨界二氧化碳可被用於移除半導 體晶圓上之有機污染物。參見環境意識之設計與製造國際 期刊,第2册,83頁(1993 (陳述"超臨界二氧化碳最好被 用來移除中-至-低揮發性之有機化合物)。然而,超臨界 二氧化碳通常被認爲在清除半導體晶圓上之無機污染物( 即金屬 > 方面是無效的。 關於另一領域,一群研究者已發現由植物中去除金屬的 方法’係藉由使植物與超臨界二氧化碳接觸及用鉗合;劑中 和金屬來達成。見依莉沙白K.威爾遜之"以超臨界二氧化 碳萃取毒性金屬,’C&EN 27 ( 1996年4月15曰);及美國專 利案5,356,538。然而,此文述道"單獨地,非極性超臨界 一氡化破對於溶劑化正電荷之重金屬離子幾乎是無用的。 惟’研究人員已發現,若金屬首先被鉗合劑所中和,則金 屬可被溶劑化;更發現到,當鉗合劑被氟化時,溶解力會 戲韌性地增加”。然而,此方法有許多問題存在:第一、 於移除未帶電荷金屬方面有困難;第二、未氟化之甜合劑 本紙張尺度適用中國國家標隼(CNS)A4規格(210Χ297公釐) ί·ΙΊΙ.------裝-- (請先聞讀背面之注意事項再填寫本頁) 一訂 i 經濟部中央橾準局員工消費合作社印製 408362 Α7 Β7 五、發明説明(3 ) 爲昂貴的;第三、氟化斜合劑之大量合成是昂貴的;第四 、氟化及未氟化之鉗合劑具高度毒性,且於純化及廢棄上 均耗費成本;第五、可容易地被氟化鉗合劑所溶劑化之金 屬很有限;第六、當利用此公開案之方法時,未射合之金 屬進入其下面之半導體基質之擴散性會遭到損害。 因此,本發明之一目的在於提供一種由天然氧化物層和 半導體晶圓之間移除金屬污染物之*方法。本發明之另一目 的在於提供一種由天然氧化物層和半導體晶圓之間移除無 機污染物之方法。 發明概述 大體言之’本發明之一具體例爲一種方法,可克服有關 離子性及中性、輊及重無機(金屬)物種之化學改性的間 題;且此方法可使這些中性、輊及重無機(金屬)物種一 旦曝露於習用、便宜、高純度、非毒性之溶劑時爲可溶的 。本發明之方法包括步驟:移除天然氧化物,其係覆蓋在 無機污染物上(及/或其係出現在無機污染物和基質之間 ’及/或包園無機污杂物)藉此曝露無機污杂物(其係被 包含在天然氧化物内,或位在天然氧化物之下);化學性 地改變無機污染物;曝露此經化學故變之無機污染物至被 包含於超臨界流體(宜爲C0 2 )中之傳统溶劑中;及於超 臨界流體(SCF)中移除經傳統溶劑化、化學改變的無機污 染物。此無機污杂物的化學性改^可於曝露於SCF之前或 期間發生。本發明之關鍵在於:在天然氧化物内之無機污 染物之曝露係供其後之改性與移除;無機污杂物若無先前 本紙張又度逋用中國國家標準(CNS) A4規格(2mx297公釐) JJ-I^--.----装\—I (請先閱讀背面之注意事項再填寫本頁) 訂_ i .Γ 經濟部Φ央標準局貝工消費合作社印製 408362 A7 B7 五、發明説明(4 ) 的化學p變’係不溶於超臨导二氧化碳流醴中者;而經化 學改變的無機污染哕可同時随著把學改變步驟藉溶劑予以 移除。 本發明之一具體例爲一種由覆蓋基質之層中移除無機污 染物之方法,此方法包括步驟:以至少一種移除劑移除覆 蓋基質上之該層;使無機污染物與至少一種轉化劑民應, 藉此轉化無機污染物;使被轉化的無機污染物接觸至少一 種溶劑試劑以移除之,溶劑試劑係被包含於第一超臨界流 體中;且其中被轉化的無機污染物較無機污染物更高度可 溶於溶劑試劑中。理想中,轉化劑係選自:酸性劑、鹼性 劑、甜合劑、配位姻、含鹵素的試劑及彼等之任一組合。 尤其,轉化劑係由HF所組成且係被包含於超臨界C02中。 理想中,溶劑係選自:極性氣體、非極性氣體、極性超臨 界流體、非極性超臨界流體、極性物種、非極性物種、表 面活性劑、清潔劑、兩性物質或鉗合劑,且此溶劑試劑係 被包含於超臨界C02中。覆蓋層可由天然氧化物所組成。 以一種移除劑移除覆蓋基質之該層的步驟及將無機污杂物 與一種轉化劑反應之步驟可同時進行;另一種方式,以一 種移除劑移除覆蓋基質之該層的步驟、將無機污染物與一 種轉化劑反應的步驟、及移除經轉化之無機污杂物的步驟 係同時進行;或者-,在以一種移除劑移除覆蓋基質之該層 的步騍之後,接著進行將無機污染物與一種轉化劑反應的 步騍及移除經轉化之無機污尜物的步驟(其爲同時進行者 )。理想中,移除劑係由HF所組成且係被包含於第二超臨 本紙張尺度適用中國國家標準(CNS ) Α4規格(210 X 297公釐) ---„---— ------裝-- (請先閲讀背面之注意事項再填寫本頁) -訂 i vr 經濟部中央標準局員工消费合作社印製 通 408362 A7 _;____B7 五、發明説明(5 ) 界流體中。第二超臨界流體較佳係由超臨界c〇2所組成。 本發明之另一具體例爲一種由覆蓋基質的一層上移除無 機污染物之方法,此方法包括步驟:以至少一種移除劑移 除覆蓋基質上之該層,移除劑係被包含於第一超臨界流體 中;使無機污染物與至少一種轉化劑反應,藉此轉化無機 污染物’轉化劑係被包含於第二超臨界流體中;使被轉化 的無機污染物接觸至少一種溶劑試劑以移除之,溶劑試劑 係被包含於第三超臨界流體中;且其中被轉化的無機污染 物較無機污杂物更高度可溶於溶劑試劑中。以一種移除劑 移除覆蓋基質之該層的步驟及將無機污染物輿一種轉化劑 反應的步騍可同時進行〇然而,以一種移除劑移除覆蓋基 質之該層的步驟、將無機污染物與一種轉化劑反應的步驟 、及移除經轉化之無機污染物的步驟都可同時進行;或者 ,在以一種移除劑移除覆蓋基質之該層的步驟之後,接著 進行將無機污染物與一種轉化劑反應的步驟及移除經轉化 之無機污染物的步驟(其爲同時進行者)。 圖式之簡要説明 圖1是根據本發明一具體例之簡單清潔系統示意圖。 圖2a-2d係説明本發明之一具體例之橫截面圖。 本發明之詳細描述 圖1説明可被用來實行本發明方法之處理系統。待清潔 之樣品(有無機污染物存在之半導體晶圓)被置於容器16 中。超臨界流體(宜爲C0 2氣體)爲由一氣體貯存槽28所 供應,該氣體貯存槽28係藉導管30 (包括閥32>被連接至 本紙張又度適用中國國家揉準(CNS ) A4规格(2!0X:Z97公釐) ^--^---Γύ--L裝^-- (請先閲讀背面之注意事項再填寫本頁) 訂 408362 經濟部中央搮準局貝工消費合作社印製 A7 B7 五、發明説明(6 ) 增壓單元34,可在一大於約32¾下增加氣體壓力至大於约 70至75大氣壓以形成超臨界流體。超臨界流體(SCFy流經 閥36及導管38 ’而至裝有一固體、液體或氣體移除劑之貯 存槽11 (只要閥1和3開啓且閥2關閉)。可能的移除劑 列名於下。SCF通遇移徐劑時會發生作用而將改性劑結合 。KSCF中。與移除劑結合之SCF即離開貯存槽u進入容器16 。SCF混合物及無機污染物被導入,造成含有無機污杂物 之項層的移除’藉此曝露無機污染物(且可能同時將無機 污染物改性)。 在以移除劑將含有無機污染物之頂層移除之同時及其後( 藉此曝露無機污染物)及在移除經改性之無機污染物之同 時或其後’ SCF流經閥36和導管38而至裝有一固體、液體 或氣體改性制之貯存槽12 〇此係藉關閉閥1、3和5及開啓 閥2、4和6來達成。SCF通過改性劑時會發生作用而將改 性劑結合於SCF中。與改性劑結合之SCF即離開貯存槽14進 入容器16。SCF混合物及被曝露的無機污杂物被導入,藉 此造成位在樣品表面(宜爲半導體晶圓)上之無機污染物 的改性。 在移除頂層之同時及其後(藉此曝露無機污染物)及在 藉改性劑將半導體樣品上之無機污染物改性之同時或其後 ,SCF流經閥36和導管38而至裝有一固體、液體或氣體溶 劑試劑之貯存槽14。可能的溶劑試劑列名如下。此係藉關 閉閥1、3、4、6和9及開啓閥2、5和8來達成。SCF通過 溶劑試劑時會發生作用而將溶劑試劑結合於SCF中。與溶 -8 - 本紙張尺度適用中國圉家揉準(CNS > A4規格(210X 297公釐) I.^-------—襄-- (請先閲讀背面之注意事項再填寫本頁〕 訂. ¥ A7 B7 408362 五、發明説明(7 ) 劑試劑結合之SCF即離開貯存槽14進入容器16。SCF混合物 及被曝露和改性的無機污染物被導入,藉此造成被曝露和 故性之無機污柒物由樣品(宜爲半導體晶圓)之表面移除 〇 經改性的無機污染物及C〇2被移除並通過減壓閥18,使 得無機污染物沉救於容器20中。C0 2氣體隨後藉泵24經由 管線26被循環至·貯存槽28。無機污染物可經由管線22被移 除。 _ 本發明之一具例爲一種由天然氧化物層内,或由介於 在下面的半導體層與或天然氧化物層之間移除無機污染物 (宜爲金屬)之方法。較佳地,此方法係包括下列步嫌。 第。一、藉由與移除劑接觸來移除天然氧化物層(其爲約 30Α厚)。第二、將無機污杂物與轉化劑反應,以轉化無 機污染物(宜在較可溶的形式>,移除劑和轉化劑可由相 同成份所組成。第三、以溶劑試劑移除經轉化之無機污染 物;移除劑、改性劑及溶劑試劑可由相同成份所组成且可 同時或依序施行。 移除劑可由氫氟酸所组成◊此外,其可藉蒸氣曝露、電 漿曝露、或曝露半導體晶圓至含有HF之超臨界流體(宜爲 c〇 2 )中予以導入。轉化劑可由HF所組成,或其可包含任 何其他之含齒素試劑(宜爲氣)。轉化劑可藉蒸氣曝露至 晶圓、電漿曝露k晶圓、或藉曝露晶圓至含有轉化劑之超 臨界流體(宜爲C0 2 )中予以導入。理想中,轉化劑可包 含一酸(較佳爲KCN、HF、HC1、HI或KI >、一鹼(較佳爲 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇X297公釐) 命 麵 n . 0¾ (請先閱讀背面之+注意事項再填寫本頁) 訂 經濟部中央標準局貝工消費合作社印製 408362 A7 B7 五、發明説明(8 ) 邶401_、或肝3_>、一鉗合劑(宜爲卜一 或一含鹵素— 的試劑(宜爲Cl、F、Br、或連 辆) (較佳爲C0、NH3、N0、C0S、NE40Hm極性試劑 理想中,溶劑可包含極性氣體(宜爲C〇、rnc ^ ^ [JA ντττ 、或nf3 )、非極性氣體(宜爲ν2、Λ Md 極性SCF (宜爲NO 2 )、非極性SCF (宜爲c〇 2 } (宜爲水、乙醇、甲醇、丙銅、或乙二醇〇)2 )、極性物種 (宜爲切氳㈣或二甲基甲醯胺)、表雨活性:極 、或兩性物質(宜爲十二垸硫酸鈉、季錢里、m Wi 险:雜 >、旅雖导或兩性雖不类而法Μ如、 ^ 經濟部中央標牟局員工消費合作社印製 陰離子、非離子或兩性離子表面活性劑>、 ^ 、 宜爲厶-二酮、氣化或非氟化冠醚>,其宜被^合劑( 界流體(宜爲⑶2)中。 參考圖2a,,此具義之方法能移—在天然氧化物 K)2上面、在天然氧化物搬内部、或介於天然氧化物ι〇2 和其下層100之間的無機污染物104。此方法可用來移除天 然氧化物層102 (見圖2a及2b)、轉化無機污柰物使其在 後績移除步驟中較爲可溶(見圖2b和2c,其中無機污染物 104被改性成較可溶之無機污染物106)、及移除被轉化之 無機污染物(見圖2d)。轉化劑可由任何可使無機污染物 在後續移除步騍中較爲可溶(較容易移除)之試劑所组成 。因此,轉化劑可包含一鉗合劑。此外,天然氧化物之移 除及無機污染物之轉化可發生於一步驟中。移除劑可被或 不被包含於SCF中,且轉化劑可被或不被包含於SCF*。此 外,移除劑、轉化劑及溶劑試劑可同時被導入;或者,移 10 - 本紙張尺度適用中國國家標準(CNS ) A4规格(2丨0X297公釐) (請先閱讀背面之注$項再填寫本頁) -裝- * 1^1 —I— n 408362 A7 B7 五、發明説明(9 ) 除劑和轉化劑一起被導入,接著導入溶劑試劑;或者移除 劑先被導入,接著導入轉化劑和溶劑試劑之組合物。 例如,假定無機污柰物104係由鈉所組成,且此污染物 被分散在天然氧化物102之間(如圖2a所述〉。爲了移除 天然氧化物102,將HF導入元件108中。HF可被混合或不混 合於SCF中。此步驟之結果係示於圓2b。接下來,將元件 108曝露於HF中(此可與先前所述步騍同時完成)。此步 ' 驟導致鈉污染物之轉化/改變,其結果是NaF (於圖2c中 被認爲是污染物106)。接下來,將元件108與溶劑(被混 合於超臨界C0 2中之水 > 接觸,以移除較可溶的的污染物 106。其結果示於圖2d,其中天然氧化物及污染物被移除 了。 雖然本發明之特殊具體例已於本文中描述,但他們並不 構成本發明之限制。根據説明書之方法,本發明之許多具 體例對於熟悉此項技藝之人而言將是明顯的。本發明僅受 到附隨之申請專利範園之限制。 I n 訂 ll ·ξ (請先聞讀背面之注意事項再填寫本買) 經濟部中央標準局員工消費^-作社印裝 本紙張尺度適用中國國家榇隼(CNS ) A4規格(2丨OX2S7公釐)

Claims (1)

  1. 408362 ABCD 、申請專利範圍 1. 一種由覆蓋基質之層中移除無機染物之方珐,該方法包 括步驟: - 以至少一種移除劑移除覆蓋該基質之該層; 使該無機污染物與至少一種轉化劑反應,藉此轉化該 無機污染物; 使該被轉化的無機污染物接觸至少一種溶劑試劑以移 除之,該溶劑試劑被包含於第一超臨界流體中; 且其中該被轉化的無機污樂物較該無機污染物更高度 可溶於該溶劑試劑中。 . 2. 根據申請專利範園第1項之方法,其中該轉化劑係選自 :一酸性劑、一驗性劑 鉗合劑、一配位劑、一含卣 (請先聞讀背面之注意事項再填寫本頁) 裝--- 經濟部中夬標準局負工消費合作社印製 素的試劑及彼等之任一組合。 3. 根據申請專利範園第1項之方法,其中該轉化劑係由HF 所組成。 4. 根據申請專利範園第1項之方法,其中該轉化劑被包含 於超臨界C0 2中。 — 5. 根據申請專利範園第1項之方法,其中該溶劑試劑係選 自:一極性氣體、一非極性氣體、一極性超臨界流體、 一非極性超臨界流體、一極牲物種、.一非極性物種、一 表赴活性劑、一清潔劑、一兩性物賓或一鉗合劑。 6. 根據申請專利範園第1項之:方法,其中該溶劑試劑<包 含於超臨界C〇2中。 7. 根據申請專利範園第1項之方法,其中該覆蓋層係由夭 然氧化物所組成。 -12 - l»v( —t^i tn In ^^^1 ^^^1 I----— ^ n^i ^^^1 __ ^^^1 1 TeV、 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公嫠) 408362 經濟部中央標準局員工消費合作社印製 A8 B8 C8 D8六、申請專利範園 8. 根據申請專利範-園第1項之方法,其中該以移除劑移除 該覆蓋基質之層的步驟及使該無機污杂物與一種轉化劑 反應之步騍係同時實施。 9. 根據申請專利範圍第1項之方法,其中該以移除劑移除 該覆蓋基質之該層的步驟、使該無機污柰物與一種轉化 劑反應之步驟、及移除該經轉化的無機污染物的步驟係 ^ 同時實施〇 10. 根據申請專利範園第1項之方法,其中在實施該以移 除劑移除該覆蓋基質之該層的步驟之後,接著同時實施' 該無機污染物與一種轉化劑反應之步驟及移除該經轉化 之無機污染物的步驟。 11. 根據申請專利範園第1項之方法,其中該移除劑係由 HF所組成。 12. 拫據申請專利範園第11項之方法,其中該移除劑被包 含於第二超臨界流體中。 13. 根據申請專利範園第12項之方法,其中該第二超臨界 流體係由超臨界CO 2所組成。 14. 根據申請專利範園第1項之方法,其中該移除劑係由 HF所組成。 15. —種由覆蓋基質之層中移除無機污染物之方法,該方 法:包括步驟: 以至少一種移除劑移除覆蓋該基質之該層,該移除劑 被包含於第一超臨界流體中; 使該無機污染物與至少一種轉化劑反應,藉此轉化該 -13 - (請先閔讀背面之注意事項再填寫本頁) • ϋ I !· HI— - IT I - - I - -- - ^ I I 1 ^^1 - - n. - —11 I I I · —I « nflff fn 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部中央標準局舅工消費^作社印製 408362 ϋ C8 DS六、申請專利範圍 無機污染物,該轉化劑被包含於第二超臨界流體中; - 使該被轉化的無機污染物接觸至少一種溶劑試劑以移 除之,該溶劑試劑被包含於第三超臨界流體中; 且其中該被轉化的無機污染物較該無機污杂物更高度 可溶於該溶劑試劑中。 16. 根據申請專利範園第〗5項之方法,其中該以移除劑移 除該覆蓋基質之該層的步驟及使該無機污染物與一種轉 化劑反應之步騍係同時實施。 17. 根據申請專利範圍第15項之方法,其中該以移除劑移 除該覆蓋基質之該層的步驟、使該無機污染物與一種轉 化劑反應之步驟、及移除該經轉化的無機污染物的步驟 係同時實施。 18. 根據申請專利範園第15項之方法,其中在實施該以 移除劑移除該覆蓋基質之該層的步驟之後,接著同時實 施該無機污染物與一種轉化劑反應之步騍及移除該經轉 化之無機污染物的步驟。 (請先間讀背面之注意事項再填寫本頁) 本紙張尺皮適用中國國家標準(CNS ) A4規格(210X297公釐)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110899248A (zh) * 2019-06-21 2020-03-24 杭州杭氧股份有限公司 一种利用超临界流体批量清洗超高纯气体钢瓶的系统及其方法

Families Citing this family (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5955776A (en) * 1996-12-04 1999-09-21 Ball Semiconductor, Inc. Spherical shaped semiconductor integrated circuit
US6500605B1 (en) * 1997-05-27 2002-12-31 Tokyo Electron Limited Removal of photoresist and residue from substrate using supercritical carbon dioxide process
US6306564B1 (en) 1997-05-27 2001-10-23 Tokyo Electron Limited Removal of resist or residue from semiconductors using supercritical carbon dioxide
US6277753B1 (en) 1998-09-28 2001-08-21 Supercritical Systems Inc. Removal of CMP residue from semiconductors using supercritical carbon dioxide process
US6602349B2 (en) 1999-08-05 2003-08-05 S.C. Fluids, Inc. Supercritical fluid cleaning process for precision surfaces
US6558432B2 (en) 1999-10-15 2003-05-06 R. R. Street & Co., Inc. Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent
US7097715B1 (en) * 2000-10-11 2006-08-29 R. R. Street Co. Inc. Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent
US6755871B2 (en) * 1999-10-15 2004-06-29 R.R. Street & Co. Inc. Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent
US6355072B1 (en) * 1999-10-15 2002-03-12 R.R. Street & Co. Inc. Cleaning system utilizing an organic cleaning solvent and a pressurized fluid solvent
US6858089B2 (en) * 1999-10-29 2005-02-22 Paul P. Castrucci Apparatus and method for semiconductor wafer cleaning
US6748960B1 (en) 1999-11-02 2004-06-15 Tokyo Electron Limited Apparatus for supercritical processing of multiple workpieces
US6576066B1 (en) * 1999-12-06 2003-06-10 Nippon Telegraph And Telephone Corporation Supercritical drying method and supercritical drying apparatus
KR100693691B1 (ko) * 2000-04-25 2007-03-09 동경 엘렉트론 주식회사 금속 필름의 침착방법 및 초임계 건조/세척 모듈을포함하는 금속침착 복합공정장치
AU2001290171A1 (en) * 2000-07-26 2002-02-05 Tokyo Electron Limited High pressure processing chamber for semiconductor substrate
US20040011378A1 (en) * 2001-08-23 2004-01-22 Jackson David P Surface cleaning and modification processes, methods and apparatus using physicochemically modified dense fluid sprays
JP2002237481A (ja) * 2001-02-09 2002-08-23 Kobe Steel Ltd 微細構造体の洗浄方法
US6562146B1 (en) 2001-02-15 2003-05-13 Micell Technologies, Inc. Processes for cleaning and drying microelectronic structures using liquid or supercritical carbon dioxide
US20020189543A1 (en) * 2001-04-10 2002-12-19 Biberger Maximilian A. High pressure processing chamber for semiconductor substrate including flow enhancing features
US6958123B2 (en) * 2001-06-15 2005-10-25 Reflectivity, Inc Method for removing a sacrificial material with a compressed fluid
US6946055B2 (en) * 2001-08-22 2005-09-20 International Business Machines Corporation Method for recovering an organic solvent from a waste stream containing supercritical CO2
US6838015B2 (en) * 2001-09-04 2005-01-04 International Business Machines Corporation Liquid or supercritical carbon dioxide composition
US6706641B2 (en) 2001-09-13 2004-03-16 Micell Technologies, Inc. Spray member and method for using the same
US6619304B2 (en) 2001-09-13 2003-09-16 Micell Technologies, Inc. Pressure chamber assembly including non-mechanical drive means
US6782900B2 (en) 2001-09-13 2004-08-31 Micell Technologies, Inc. Methods and apparatus for cleaning and/or treating a substrate using CO2
US6666928B2 (en) 2001-09-13 2003-12-23 Micell Technologies, Inc. Methods and apparatus for holding a substrate in a pressure chamber
US6763840B2 (en) 2001-09-14 2004-07-20 Micell Technologies, Inc. Method and apparatus for cleaning substrates using liquid carbon dioxide
JP2005506694A (ja) * 2001-10-17 2005-03-03 プラクスエア・テクノロジー・インコーポレイテッド 中央二酸化炭素精製器
US7557073B2 (en) * 2001-12-31 2009-07-07 Advanced Technology Materials, Inc. Non-fluoride containing supercritical fluid composition for removal of ion-implant photoresist
US7326673B2 (en) * 2001-12-31 2008-02-05 Advanced Technology Materials, Inc. Treatment of semiconductor substrates using long-chain organothiols or long-chain acetates
EP1472017A4 (en) * 2002-01-07 2007-03-21 Praxair Technology Inc PROCESS FOR CLEANING AN ARTICLE
JP2003224099A (ja) * 2002-01-30 2003-08-08 Sony Corp 表面処理方法
US6924086B1 (en) * 2002-02-15 2005-08-02 Tokyo Electron Limited Developing photoresist with supercritical fluid and developer
US6953654B2 (en) 2002-03-14 2005-10-11 Tokyo Electron Limited Process and apparatus for removing a contaminant from a substrate
US20040003828A1 (en) * 2002-03-21 2004-01-08 Jackson David P. Precision surface treatments using dense fluids and a plasma
US6521466B1 (en) 2002-04-17 2003-02-18 Paul Castrucci Apparatus and method for semiconductor wafer test yield enhancement
US6764552B1 (en) 2002-04-18 2004-07-20 Novellus Systems, Inc. Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials
US20040045578A1 (en) * 2002-05-03 2004-03-11 Jackson David P. Method and apparatus for selective treatment of a precision substrate surface
US6669785B2 (en) * 2002-05-15 2003-12-30 Micell Technologies, Inc. Methods and compositions for etch cleaning microelectronic substrates in carbon dioxide
US20030217764A1 (en) * 2002-05-23 2003-11-27 Kaoru Masuda Process and composition for removing residues from the microstructure of an object
US6846380B2 (en) * 2002-06-13 2005-01-25 The Boc Group, Inc. Substrate processing apparatus and related systems and methods
US20040011386A1 (en) * 2002-07-17 2004-01-22 Scp Global Technologies Inc. Composition and method for removing photoresist and/or resist residue using supercritical fluids
US20040050406A1 (en) * 2002-07-17 2004-03-18 Akshey Sehgal Compositions and method for removing photoresist and/or resist residue at pressures ranging from ambient to supercritical
US6905556B1 (en) 2002-07-23 2005-06-14 Novellus Systems, Inc. Method and apparatus for using surfactants in supercritical fluid processing of wafers
US7282099B2 (en) * 2002-09-24 2007-10-16 Air Products And Chemicals, Inc. Dense phase processing fluids for microelectronic component manufacture
US20080004194A1 (en) * 2002-09-24 2008-01-03 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids
US20080000505A1 (en) * 2002-09-24 2008-01-03 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids
US6953041B2 (en) * 2002-10-09 2005-10-11 Micell Technologies, Inc. Compositions of transition metal species in dense phase carbon dioxide and methods of use thereof
US20040175948A1 (en) * 2002-10-10 2004-09-09 The University Of North Carolina At Chapel Hill Metal chelation in carbon dioxide
US6943139B2 (en) * 2002-10-31 2005-09-13 Advanced Technology Materials, Inc. Removal of particle contamination on patterned silicon/silicon dioxide using supercritical carbon dioxide/chemical formulations
US7485611B2 (en) * 2002-10-31 2009-02-03 Advanced Technology Materials, Inc. Supercritical fluid-based cleaning compositions and methods
US7011716B2 (en) * 2003-04-29 2006-03-14 Advanced Technology Materials, Inc. Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products
JP2004158534A (ja) * 2002-11-05 2004-06-03 Kobe Steel Ltd 微細構造体の洗浄方法
US20040112409A1 (en) * 2002-12-16 2004-06-17 Supercritical Sysems, Inc. Fluoride in supercritical fluid for photoresist and residue removal
US20040154647A1 (en) * 2003-02-07 2004-08-12 Supercritical Systems, Inc. Method and apparatus of utilizing a coating for enhanced holding of a semiconductor substrate during high pressure processing
US20040168709A1 (en) * 2003-02-27 2004-09-02 Drumm James M. Process control, monitoring and end point detection for semiconductor wafers processed with supercritical fluids
US6875709B2 (en) * 2003-03-07 2005-04-05 Taiwan Semiconductor Manufacturing Comapny, Ltd. Application of a supercritical CO2 system for curing low k dielectric materials
US20040198066A1 (en) * 2003-03-21 2004-10-07 Applied Materials, Inc. Using supercritical fluids and/or dense fluids in semiconductor applications
US6875285B2 (en) * 2003-04-24 2005-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for dampening high pressure impact on porous materials
EP1673802A1 (en) * 2003-10-14 2006-06-28 EKC Technology, INC. REMOVAL OF POST ETCH RESIDUES AND COPPER CONTAMINATION FROM LOW-K DIELECTRICS USING SUPERCRITICAL CO sb 2 /sb WITH DIKETONE ADDITIVES
US20050183740A1 (en) * 2004-02-19 2005-08-25 Fulton John L. Process and apparatus for removing residues from semiconductor substrates
US7553803B2 (en) * 2004-03-01 2009-06-30 Advanced Technology Materials, Inc. Enhancement of silicon-containing particulate material removal using supercritical fluid-based compositions
US7741012B1 (en) 2004-03-01 2010-06-22 Advanced Micro Devices, Inc. Method for removal of immersion lithography medium in immersion lithography processes
US20050261150A1 (en) * 2004-05-21 2005-11-24 Battelle Memorial Institute, A Part Interest Reactive fluid systems for removing deposition materials and methods for using same
US20050288485A1 (en) * 2004-06-24 2005-12-29 Mahl Jerry M Method and apparatus for pretreatment of polymeric materials utilized in carbon dioxide purification, delivery and storage systems
US7250374B2 (en) * 2004-06-30 2007-07-31 Tokyo Electron Limited System and method for processing a substrate using supercritical carbon dioxide processing
US7307019B2 (en) * 2004-09-29 2007-12-11 Tokyo Electron Limited Method for supercritical carbon dioxide processing of fluoro-carbon films
US20060065288A1 (en) * 2004-09-30 2006-03-30 Darko Babic Supercritical fluid processing system having a coating on internal members and a method of using
US20060102591A1 (en) * 2004-11-12 2006-05-18 Tokyo Electron Limited Method and system for treating a substrate using a supercritical fluid
US7491036B2 (en) * 2004-11-12 2009-02-17 Tokyo Electron Limited Method and system for cooling a pump
US20060102208A1 (en) * 2004-11-12 2006-05-18 Tokyo Electron Limited System for removing a residue from a substrate using supercritical carbon dioxide processing
US20060102590A1 (en) * 2004-11-12 2006-05-18 Tokyo Electron Limited Method for treating a substrate with a high pressure fluid using a preoxide-based process chemistry
US20060102204A1 (en) * 2004-11-12 2006-05-18 Tokyo Electron Limited Method for removing a residue from a substrate using supercritical carbon dioxide processing
US20060130966A1 (en) * 2004-12-20 2006-06-22 Darko Babic Method and system for flowing a supercritical fluid in a high pressure processing system
US20060135047A1 (en) * 2004-12-22 2006-06-22 Alexei Sheydayi Method and apparatus for clamping a substrate in a high pressure processing system
US7140393B2 (en) * 2004-12-22 2006-11-28 Tokyo Electron Limited Non-contact shuttle valve for flow diversion in high pressure systems
US7434590B2 (en) * 2004-12-22 2008-10-14 Tokyo Electron Limited Method and apparatus for clamping a substrate in a high pressure processing system
US20060180572A1 (en) * 2005-02-15 2006-08-17 Tokyo Electron Limited Removal of post etch residue for a substrate with open metal surfaces
US7291565B2 (en) * 2005-02-15 2007-11-06 Tokyo Electron Limited Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid
US20060180174A1 (en) * 2005-02-15 2006-08-17 Tokyo Electron Limited Method and system for treating a substrate with a high pressure fluid using a peroxide-based process chemistry in conjunction with an initiator
US7435447B2 (en) * 2005-02-15 2008-10-14 Tokyo Electron Limited Method and system for determining flow conditions in a high pressure processing system
US7767145B2 (en) 2005-03-28 2010-08-03 Toyko Electron Limited High pressure fourier transform infrared cell
US20060255012A1 (en) * 2005-05-10 2006-11-16 Gunilla Jacobson Removal of particles from substrate surfaces using supercritical processing
US7789971B2 (en) * 2005-05-13 2010-09-07 Tokyo Electron Limited Treatment of substrate using functionalizing agent in supercritical carbon dioxide
US7524383B2 (en) * 2005-05-25 2009-04-28 Tokyo Electron Limited Method and system for passivating a processing chamber
US20070012337A1 (en) * 2005-07-15 2007-01-18 Tokyo Electron Limited In-line metrology for supercritical fluid processing
JP4963815B2 (ja) * 2005-09-07 2012-06-27 ソニー株式会社 洗浄方法および半導体装置の製造方法
US7588995B2 (en) * 2005-11-14 2009-09-15 Taiwan Semiconductor Manufacturing Company, Ltd. Method to create damage-free porous low-k dielectric films and structures resulting therefrom
US7951723B2 (en) * 2006-10-24 2011-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated etch and supercritical CO2 process and chamber design
KR101047862B1 (ko) * 2009-03-13 2011-07-08 주식회사 에이앤디코퍼레이션 고압 처리기를 이용한 기판처리장치 및 고압 처리기의 가스재활용방법
JP5789614B2 (ja) * 2009-12-11 2015-10-07 ラム リサーチ コーポレーションLam Research Corporation めっき処理中の基板表面をウェットに維持するプロセス
KR101187375B1 (ko) 2011-01-27 2012-10-05 부경대학교 산학협력단 반도체 기판의 실리콘 산화막의 식각방법
WO2018198466A1 (ja) 2017-04-25 2018-11-01 東京応化工業株式会社 洗浄方法、洗浄装置、記憶媒体、及び洗浄組成物
CA3063680C (en) 2017-06-30 2023-01-17 Halliburton Energy Services, Inc. Geochemically-driven wettability modification for subterranean surfaces
CN114068305A (zh) * 2021-11-04 2022-02-18 上海至临半导体技术有限公司 一种利用超临界流体移除水分的方法以及水分移除腔

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4475993A (en) * 1983-08-15 1984-10-09 The United States Of America As Represented By The United States Department Of Energy Extraction of trace metals from fly ash
US4749440A (en) * 1985-08-28 1988-06-07 Fsi Corporation Gaseous process and apparatus for removing films from substrates
US5105556A (en) * 1987-08-12 1992-04-21 Hitachi, Ltd. Vapor washing process and apparatus
JPH01204427A (ja) * 1988-02-10 1989-08-17 Hitachi Ltd 半導体装置
US5068040A (en) * 1989-04-03 1991-11-26 Hughes Aircraft Company Dense phase gas photochemical process for substrate treatment
US4923828A (en) * 1989-07-07 1990-05-08 Eastman Kodak Company Gaseous cleaning method for silicon devices
CA2059841A1 (en) * 1991-01-24 1992-07-25 Ichiro Hayashida Surface treating solutions and cleaning method
US5225173A (en) * 1991-06-12 1993-07-06 Idaho Research Foundation, Inc. Methods and devices for the separation of radioactive rare earth metal isotopes from their alkaline earth metal precursors
US5274129A (en) * 1991-06-12 1993-12-28 Idaho Research Foundation, Inc. Hydroxamic acid crown ethers
US5213622A (en) * 1991-10-11 1993-05-25 Air Products And Chemicals, Inc. Cleaning agents for fabricating integrated circuits and a process for using the same
WO1993012161A1 (en) * 1991-12-18 1993-06-24 Schering Corporation Method for removing residual additives from elastomeric articles
US5401322A (en) * 1992-06-30 1995-03-28 Southwest Research Institute Apparatus and method for cleaning articles utilizing supercritical and near supercritical fluids
US5352327A (en) * 1992-07-10 1994-10-04 Harris Corporation Reduced temperature suppression of volatilization of photoexcited halogen reaction products from surface of silicon wafer
US5316591A (en) * 1992-08-10 1994-05-31 Hughes Aircraft Company Cleaning by cavitation in liquefied gas
US5261965A (en) * 1992-08-28 1993-11-16 Texas Instruments Incorporated Semiconductor wafer cleaning using condensed-phase processing
JPH06196472A (ja) * 1992-12-22 1994-07-15 Soltec:Kk ウェットエッチング方法及びウェット洗浄方法
JP3338134B2 (ja) * 1993-08-02 2002-10-28 株式会社東芝 半導体ウエハ処理方法
US5377705A (en) * 1993-09-16 1995-01-03 Autoclave Engineers, Inc. Precision cleaning system
US5656097A (en) * 1993-10-20 1997-08-12 Verteq, Inc. Semiconductor wafer cleaning system
US5417768A (en) * 1993-12-14 1995-05-23 Autoclave Engineers, Inc. Method of cleaning workpiece with solvent and then with liquid carbon dioxide
TW274630B (zh) * 1994-01-28 1996-04-21 Wako Zunyaku Kogyo Kk
DE69523208T2 (de) * 1994-04-08 2002-06-27 Texas Instruments Inc., Dallas Verfahren zur Reinigung von Halbleiterscheiben mittels verflüssigter Gase
US5637151A (en) * 1994-06-27 1997-06-10 Siemens Components, Inc. Method for reducing metal contamination of silicon wafers during semiconductor manufacturing
US5522938A (en) * 1994-08-08 1996-06-04 Texas Instruments Incorporated Particle removal in supercritical liquids using single frequency acoustic waves
US5501761A (en) * 1994-10-18 1996-03-26 At&T Corp. Method for stripping conformal coatings from circuit boards
US5679121A (en) * 1994-12-10 1997-10-21 Samsung Electronics Co., Ltd. Air filter attachment apparatus of air conditioner
US5681398A (en) * 1995-03-17 1997-10-28 Purex Co., Ltd. Silicone wafer cleaning method
US5679169A (en) * 1995-12-19 1997-10-21 Micron Technology, Inc. Method for post chemical-mechanical planarization cleaning of semiconductor wafers
KR100345214B1 (ko) * 1999-08-17 2002-07-25 이강춘 생체적합성 고분자가 수식된 펩타이드의 비점막 전달

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110899248A (zh) * 2019-06-21 2020-03-24 杭州杭氧股份有限公司 一种利用超临界流体批量清洗超高纯气体钢瓶的系统及其方法

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EP0822583A2 (en) 1998-02-04
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KR19980018262A (ko) 1998-06-05
US5868862A (en) 1999-02-09

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