TW408362B - Method of removing inorganic contamination by chemical alteration and extraction in a supercritical fluid media - Google Patents
Method of removing inorganic contamination by chemical alteration and extraction in a supercritical fluid media Download PDFInfo
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- TW408362B TW408362B TW086111091A TW86111091A TW408362B TW 408362 B TW408362 B TW 408362B TW 086111091 A TW086111091 A TW 086111091A TW 86111091 A TW86111091 A TW 86111091A TW 408362 B TW408362 B TW 408362B
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- 238000000034 method Methods 0.000 title claims abstract description 46
- 239000012530 fluid Substances 0.000 title claims abstract description 28
- 238000011109 contamination Methods 0.000 title claims abstract description 12
- 239000000126 substance Substances 0.000 title claims description 8
- 238000000605 extraction Methods 0.000 title description 2
- 230000004075 alteration Effects 0.000 title 1
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 72
- 239000002904 solvent Substances 0.000 claims abstract description 32
- 238000006243 chemical reaction Methods 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 231100001240 inorganic pollutant Toxicity 0.000 claims description 57
- 239000003153 chemical reaction reagent Substances 0.000 claims description 26
- 239000000356 contaminant Substances 0.000 claims description 22
- 238000011049 filling Methods 0.000 claims description 9
- 230000001131 transforming effect Effects 0.000 claims description 6
- 230000002079 cooperative effect Effects 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 3
- 239000003599 detergent Substances 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 239000008186 active pharmaceutical agent Substances 0.000 claims 1
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- 210000003298 dental enamel Anatomy 0.000 claims 1
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- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims 1
- 229910052716 thallium Inorganic materials 0.000 claims 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002184 metal Substances 0.000 description 19
- 235000012431 wafers Nutrition 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 16
- 239000007789 gas Substances 0.000 description 11
- 229910002092 carbon dioxide Inorganic materials 0.000 description 10
- 238000003860 storage Methods 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 7
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- 239000003607 modifier Substances 0.000 description 5
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- 238000004519 manufacturing process Methods 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- YZCKVEUIGOORGS-NJFSPNSNSA-N Tritium Chemical compound [3H] YZCKVEUIGOORGS-NJFSPNSNSA-N 0.000 description 2
- 238000007385 chemical modification Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 235000003599 food sweetener Nutrition 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 235000015170 shellfish Nutrition 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 238000007614 solvation Methods 0.000 description 2
- 239000003765 sweetening agent Substances 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 229910052722 tritium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KAXKCARXVQDYOW-UHFFFAOYSA-N 9h-fluorene-1,2-dione Chemical compound C1=CC=C2C(C=CC(C3=O)=O)=C3CC2=C1 KAXKCARXVQDYOW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- QAQZPSSSGUWNMT-UHFFFAOYSA-N copper;prop-1-ene Chemical compound [Cu].CC=C QAQZPSSSGUWNMT-UHFFFAOYSA-N 0.000 description 1
- 150000003983 crown ethers Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003682 fluorination reaction Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 210000004185 liver Anatomy 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- ALTGURJQVWBILJ-UHFFFAOYSA-N n-(dimethylamino)formamide Chemical compound CN(C)NC=O ALTGURJQVWBILJ-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- -1 organics Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002888 zwitterionic surfactant Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/902—Capping layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Description
408362 a7 B7 五、發明説明(i ) 相關專利/專利申請案之交互參照 下列共同讓與之專利/專利申請案併入本文中作爲參者 專利號/序號 申請曰 τι索件號 7/25/1996 TI-21081 發明領域 .. 本發明係關於半導體元件之製造與加工;較明確地説, 係關於一種於超臨界流體介質中移除無機污染物之方法。 發明背景 , 在如積體電路及液晶顯示器之製造中,基質及其上半導 體層的污染會引起許多問題,應儘可能予以減少。此種污 染可舉例如殘留粒子、有機物及金屬。此外,污染可能出 現在半導體層之表面,或可能出現在半導體層與另一層( 如氧化物層 > 中間。基本上,製造半導體係利用濕處理。 濕清潔處理可包括一序列之顆粒移除及金屬移除步驟,於 其間施行清洗步驟,並以乾燥步驟結束。乾燥主要係藉旋 轉晶圓,使晶圓上的液體被旋離,或由熱異丙醇蒸氣冷凝 在晶圓表面來清洗晶圓及排除晶圓之水而完成。 經濟部中央標準局員工消費合作社印製 ------^_ —II 裝 i — (請先閱讀背面之注意事項再填寫本頁) 此類型之濕清潔處理遭遇到一個特别嚴重的缺點;明確 言之,大部分此類型之金屬移除方法(主要由強酸性混合 物所構成),都添加顆粒至晶圓表面;而顆粒移除方法( 主要由鹼性劑/氧化劑混合物所組成)則添加金屬至晶圓 表面。此外,大部份濕请潔處理所遭遇到的問題是:取得 電子級濕化學品之費用、廢棄用於濕清潔處理之腐蝕性化 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部中央標準局員工消費合作衽印製 408362 A7 一^_________ B7 . I ___ 五、發明説明(2 ) — 學品的費用、限制切止濕化學清潔處理達到高縱橫比特 性(像溝槽)之液體表面張力、及缺少對所有乾處理(其 較常被用於半導體加工中)之調和性。因此,金屬移除& 驟之後接著進行顆粒移除步驟,將造成金屬的殘留;而反 過來處理則會導致較少的顆粒,但可能在最後的清洗中被 金屬所污串。a 超臨界流體(即超臨界二氧化碳)近年來已受到相當的 注意,特别是在有關咖啡之去咖啡因及亞麻/精美服飾乾 洗之領域方面。此外,超臨界二氧化碳可被用於移除半導 體晶圓上之有機污染物。參見環境意識之設計與製造國際 期刊,第2册,83頁(1993 (陳述"超臨界二氧化碳最好被 用來移除中-至-低揮發性之有機化合物)。然而,超臨界 二氧化碳通常被認爲在清除半導體晶圓上之無機污染物( 即金屬 > 方面是無效的。 關於另一領域,一群研究者已發現由植物中去除金屬的 方法’係藉由使植物與超臨界二氧化碳接觸及用鉗合;劑中 和金屬來達成。見依莉沙白K.威爾遜之"以超臨界二氧化 碳萃取毒性金屬,’C&EN 27 ( 1996年4月15曰);及美國專 利案5,356,538。然而,此文述道"單獨地,非極性超臨界 一氡化破對於溶劑化正電荷之重金屬離子幾乎是無用的。 惟’研究人員已發現,若金屬首先被鉗合劑所中和,則金 屬可被溶劑化;更發現到,當鉗合劑被氟化時,溶解力會 戲韌性地增加”。然而,此方法有許多問題存在:第一、 於移除未帶電荷金屬方面有困難;第二、未氟化之甜合劑 本紙張尺度適用中國國家標隼(CNS)A4規格(210Χ297公釐) ί·ΙΊΙ.------裝-- (請先聞讀背面之注意事項再填寫本頁) 一訂 i 經濟部中央橾準局員工消費合作社印製 408362 Α7 Β7 五、發明説明(3 ) 爲昂貴的;第三、氟化斜合劑之大量合成是昂貴的;第四 、氟化及未氟化之鉗合劑具高度毒性,且於純化及廢棄上 均耗費成本;第五、可容易地被氟化鉗合劑所溶劑化之金 屬很有限;第六、當利用此公開案之方法時,未射合之金 屬進入其下面之半導體基質之擴散性會遭到損害。 因此,本發明之一目的在於提供一種由天然氧化物層和 半導體晶圓之間移除金屬污染物之*方法。本發明之另一目 的在於提供一種由天然氧化物層和半導體晶圓之間移除無 機污染物之方法。 發明概述 大體言之’本發明之一具體例爲一種方法,可克服有關 離子性及中性、輊及重無機(金屬)物種之化學改性的間 題;且此方法可使這些中性、輊及重無機(金屬)物種一 旦曝露於習用、便宜、高純度、非毒性之溶劑時爲可溶的 。本發明之方法包括步驟:移除天然氧化物,其係覆蓋在 無機污染物上(及/或其係出現在無機污染物和基質之間 ’及/或包園無機污杂物)藉此曝露無機污杂物(其係被 包含在天然氧化物内,或位在天然氧化物之下);化學性 地改變無機污染物;曝露此經化學故變之無機污染物至被 包含於超臨界流體(宜爲C0 2 )中之傳统溶劑中;及於超 臨界流體(SCF)中移除經傳統溶劑化、化學改變的無機污 染物。此無機污杂物的化學性改^可於曝露於SCF之前或 期間發生。本發明之關鍵在於:在天然氧化物内之無機污 染物之曝露係供其後之改性與移除;無機污杂物若無先前 本紙張又度逋用中國國家標準(CNS) A4規格(2mx297公釐) JJ-I^--.----装\—I (請先閱讀背面之注意事項再填寫本頁) 訂_ i .Γ 經濟部Φ央標準局貝工消費合作社印製 408362 A7 B7 五、發明説明(4 ) 的化學p變’係不溶於超臨导二氧化碳流醴中者;而經化 學改變的無機污染哕可同時随著把學改變步驟藉溶劑予以 移除。 本發明之一具體例爲一種由覆蓋基質之層中移除無機污 染物之方法,此方法包括步驟:以至少一種移除劑移除覆 蓋基質上之該層;使無機污染物與至少一種轉化劑民應, 藉此轉化無機污染物;使被轉化的無機污染物接觸至少一 種溶劑試劑以移除之,溶劑試劑係被包含於第一超臨界流 體中;且其中被轉化的無機污染物較無機污染物更高度可 溶於溶劑試劑中。理想中,轉化劑係選自:酸性劑、鹼性 劑、甜合劑、配位姻、含鹵素的試劑及彼等之任一組合。 尤其,轉化劑係由HF所組成且係被包含於超臨界C02中。 理想中,溶劑係選自:極性氣體、非極性氣體、極性超臨 界流體、非極性超臨界流體、極性物種、非極性物種、表 面活性劑、清潔劑、兩性物質或鉗合劑,且此溶劑試劑係 被包含於超臨界C02中。覆蓋層可由天然氧化物所組成。 以一種移除劑移除覆蓋基質之該層的步驟及將無機污杂物 與一種轉化劑反應之步驟可同時進行;另一種方式,以一 種移除劑移除覆蓋基質之該層的步驟、將無機污染物與一 種轉化劑反應的步驟、及移除經轉化之無機污杂物的步驟 係同時進行;或者-,在以一種移除劑移除覆蓋基質之該層 的步騍之後,接著進行將無機污染物與一種轉化劑反應的 步騍及移除經轉化之無機污尜物的步驟(其爲同時進行者 )。理想中,移除劑係由HF所組成且係被包含於第二超臨 本紙張尺度適用中國國家標準(CNS ) Α4規格(210 X 297公釐) ---„---— ------裝-- (請先閲讀背面之注意事項再填寫本頁) -訂 i vr 經濟部中央標準局員工消费合作社印製 通 408362 A7 _;____B7 五、發明説明(5 ) 界流體中。第二超臨界流體較佳係由超臨界c〇2所組成。 本發明之另一具體例爲一種由覆蓋基質的一層上移除無 機污染物之方法,此方法包括步驟:以至少一種移除劑移 除覆蓋基質上之該層,移除劑係被包含於第一超臨界流體 中;使無機污染物與至少一種轉化劑反應,藉此轉化無機 污染物’轉化劑係被包含於第二超臨界流體中;使被轉化 的無機污染物接觸至少一種溶劑試劑以移除之,溶劑試劑 係被包含於第三超臨界流體中;且其中被轉化的無機污染 物較無機污杂物更高度可溶於溶劑試劑中。以一種移除劑 移除覆蓋基質之該層的步驟及將無機污染物輿一種轉化劑 反應的步騍可同時進行〇然而,以一種移除劑移除覆蓋基 質之該層的步驟、將無機污染物與一種轉化劑反應的步驟 、及移除經轉化之無機污染物的步驟都可同時進行;或者 ,在以一種移除劑移除覆蓋基質之該層的步驟之後,接著 進行將無機污染物與一種轉化劑反應的步驟及移除經轉化 之無機污染物的步驟(其爲同時進行者)。 圖式之簡要説明 圖1是根據本發明一具體例之簡單清潔系統示意圖。 圖2a-2d係説明本發明之一具體例之橫截面圖。 本發明之詳細描述 圖1説明可被用來實行本發明方法之處理系統。待清潔 之樣品(有無機污染物存在之半導體晶圓)被置於容器16 中。超臨界流體(宜爲C0 2氣體)爲由一氣體貯存槽28所 供應,該氣體貯存槽28係藉導管30 (包括閥32>被連接至 本紙張又度適用中國國家揉準(CNS ) A4规格(2!0X:Z97公釐) ^--^---Γύ--L裝^-- (請先閲讀背面之注意事項再填寫本頁) 訂 408362 經濟部中央搮準局貝工消費合作社印製 A7 B7 五、發明説明(6 ) 增壓單元34,可在一大於約32¾下增加氣體壓力至大於约 70至75大氣壓以形成超臨界流體。超臨界流體(SCFy流經 閥36及導管38 ’而至裝有一固體、液體或氣體移除劑之貯 存槽11 (只要閥1和3開啓且閥2關閉)。可能的移除劑 列名於下。SCF通遇移徐劑時會發生作用而將改性劑結合 。KSCF中。與移除劑結合之SCF即離開貯存槽u進入容器16 。SCF混合物及無機污染物被導入,造成含有無機污杂物 之項層的移除’藉此曝露無機污染物(且可能同時將無機 污染物改性)。 在以移除劑將含有無機污染物之頂層移除之同時及其後( 藉此曝露無機污染物)及在移除經改性之無機污染物之同 時或其後’ SCF流經閥36和導管38而至裝有一固體、液體 或氣體改性制之貯存槽12 〇此係藉關閉閥1、3和5及開啓 閥2、4和6來達成。SCF通過改性劑時會發生作用而將改 性劑結合於SCF中。與改性劑結合之SCF即離開貯存槽14進 入容器16。SCF混合物及被曝露的無機污杂物被導入,藉 此造成位在樣品表面(宜爲半導體晶圓)上之無機污染物 的改性。 在移除頂層之同時及其後(藉此曝露無機污染物)及在 藉改性劑將半導體樣品上之無機污染物改性之同時或其後 ,SCF流經閥36和導管38而至裝有一固體、液體或氣體溶 劑試劑之貯存槽14。可能的溶劑試劑列名如下。此係藉關 閉閥1、3、4、6和9及開啓閥2、5和8來達成。SCF通過 溶劑試劑時會發生作用而將溶劑試劑結合於SCF中。與溶 -8 - 本紙張尺度適用中國圉家揉準(CNS > A4規格(210X 297公釐) I.^-------—襄-- (請先閲讀背面之注意事項再填寫本頁〕 訂. ¥ A7 B7 408362 五、發明説明(7 ) 劑試劑結合之SCF即離開貯存槽14進入容器16。SCF混合物 及被曝露和改性的無機污染物被導入,藉此造成被曝露和 故性之無機污柒物由樣品(宜爲半導體晶圓)之表面移除 〇 經改性的無機污染物及C〇2被移除並通過減壓閥18,使 得無機污染物沉救於容器20中。C0 2氣體隨後藉泵24經由 管線26被循環至·貯存槽28。無機污染物可經由管線22被移 除。 _ 本發明之一具例爲一種由天然氧化物層内,或由介於 在下面的半導體層與或天然氧化物層之間移除無機污染物 (宜爲金屬)之方法。較佳地,此方法係包括下列步嫌。 第。一、藉由與移除劑接觸來移除天然氧化物層(其爲約 30Α厚)。第二、將無機污杂物與轉化劑反應,以轉化無 機污染物(宜在較可溶的形式>,移除劑和轉化劑可由相 同成份所組成。第三、以溶劑試劑移除經轉化之無機污染 物;移除劑、改性劑及溶劑試劑可由相同成份所组成且可 同時或依序施行。 移除劑可由氫氟酸所组成◊此外,其可藉蒸氣曝露、電 漿曝露、或曝露半導體晶圓至含有HF之超臨界流體(宜爲 c〇 2 )中予以導入。轉化劑可由HF所組成,或其可包含任 何其他之含齒素試劑(宜爲氣)。轉化劑可藉蒸氣曝露至 晶圓、電漿曝露k晶圓、或藉曝露晶圓至含有轉化劑之超 臨界流體(宜爲C0 2 )中予以導入。理想中,轉化劑可包 含一酸(較佳爲KCN、HF、HC1、HI或KI >、一鹼(較佳爲 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇X297公釐) 命 麵 n . 0¾ (請先閱讀背面之+注意事項再填寫本頁) 訂 經濟部中央標準局貝工消費合作社印製 408362 A7 B7 五、發明説明(8 ) 邶401_、或肝3_>、一鉗合劑(宜爲卜一 或一含鹵素— 的試劑(宜爲Cl、F、Br、或連 辆) (較佳爲C0、NH3、N0、C0S、NE40Hm極性試劑 理想中,溶劑可包含極性氣體(宜爲C〇、rnc ^ ^ [JA ντττ 、或nf3 )、非極性氣體(宜爲ν2、Λ Md 極性SCF (宜爲NO 2 )、非極性SCF (宜爲c〇 2 } (宜爲水、乙醇、甲醇、丙銅、或乙二醇〇)2 )、極性物種 (宜爲切氳㈣或二甲基甲醯胺)、表雨活性:極 、或兩性物質(宜爲十二垸硫酸鈉、季錢里、m Wi 险:雜 >、旅雖导或兩性雖不类而法Μ如、 ^ 經濟部中央標牟局員工消費合作社印製 陰離子、非離子或兩性離子表面活性劑>、 ^ 、 宜爲厶-二酮、氣化或非氟化冠醚>,其宜被^合劑( 界流體(宜爲⑶2)中。 參考圖2a,,此具義之方法能移—在天然氧化物 K)2上面、在天然氧化物搬内部、或介於天然氧化物ι〇2 和其下層100之間的無機污染物104。此方法可用來移除天 然氧化物層102 (見圖2a及2b)、轉化無機污柰物使其在 後績移除步驟中較爲可溶(見圖2b和2c,其中無機污染物 104被改性成較可溶之無機污染物106)、及移除被轉化之 無機污染物(見圖2d)。轉化劑可由任何可使無機污染物 在後續移除步騍中較爲可溶(較容易移除)之試劑所组成 。因此,轉化劑可包含一鉗合劑。此外,天然氧化物之移 除及無機污染物之轉化可發生於一步驟中。移除劑可被或 不被包含於SCF中,且轉化劑可被或不被包含於SCF*。此 外,移除劑、轉化劑及溶劑試劑可同時被導入;或者,移 10 - 本紙張尺度適用中國國家標準(CNS ) A4规格(2丨0X297公釐) (請先閱讀背面之注$項再填寫本頁) -裝- * 1^1 —I— n 408362 A7 B7 五、發明説明(9 ) 除劑和轉化劑一起被導入,接著導入溶劑試劑;或者移除 劑先被導入,接著導入轉化劑和溶劑試劑之組合物。 例如,假定無機污柰物104係由鈉所組成,且此污染物 被分散在天然氧化物102之間(如圖2a所述〉。爲了移除 天然氧化物102,將HF導入元件108中。HF可被混合或不混 合於SCF中。此步驟之結果係示於圓2b。接下來,將元件 108曝露於HF中(此可與先前所述步騍同時完成)。此步 ' 驟導致鈉污染物之轉化/改變,其結果是NaF (於圖2c中 被認爲是污染物106)。接下來,將元件108與溶劑(被混 合於超臨界C0 2中之水 > 接觸,以移除較可溶的的污染物 106。其結果示於圖2d,其中天然氧化物及污染物被移除 了。 雖然本發明之特殊具體例已於本文中描述,但他們並不 構成本發明之限制。根據説明書之方法,本發明之許多具 體例對於熟悉此項技藝之人而言將是明顯的。本發明僅受 到附隨之申請專利範園之限制。 I n 訂 ll ·ξ (請先聞讀背面之注意事項再填寫本買) 經濟部中央標準局員工消費^-作社印裝 本紙張尺度適用中國國家榇隼(CNS ) A4規格(2丨OX2S7公釐)
Claims (1)
- 408362 ABCD 、申請專利範圍 1. 一種由覆蓋基質之層中移除無機染物之方珐,該方法包 括步驟: - 以至少一種移除劑移除覆蓋該基質之該層; 使該無機污染物與至少一種轉化劑反應,藉此轉化該 無機污染物; 使該被轉化的無機污染物接觸至少一種溶劑試劑以移 除之,該溶劑試劑被包含於第一超臨界流體中; 且其中該被轉化的無機污樂物較該無機污染物更高度 可溶於該溶劑試劑中。 . 2. 根據申請專利範園第1項之方法,其中該轉化劑係選自 :一酸性劑、一驗性劑 鉗合劑、一配位劑、一含卣 (請先聞讀背面之注意事項再填寫本頁) 裝--- 經濟部中夬標準局負工消費合作社印製 素的試劑及彼等之任一組合。 3. 根據申請專利範園第1項之方法,其中該轉化劑係由HF 所組成。 4. 根據申請專利範園第1項之方法,其中該轉化劑被包含 於超臨界C0 2中。 — 5. 根據申請專利範園第1項之方法,其中該溶劑試劑係選 自:一極性氣體、一非極性氣體、一極性超臨界流體、 一非極性超臨界流體、一極牲物種、.一非極性物種、一 表赴活性劑、一清潔劑、一兩性物賓或一鉗合劑。 6. 根據申請專利範園第1項之:方法,其中該溶劑試劑<包 含於超臨界C〇2中。 7. 根據申請專利範園第1項之方法,其中該覆蓋層係由夭 然氧化物所組成。 -12 - l»v( —t^i tn In ^^^1 ^^^1 I----— ^ n^i ^^^1 __ ^^^1 1 TeV、 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公嫠) 408362 經濟部中央標準局員工消費合作社印製 A8 B8 C8 D8六、申請專利範園 8. 根據申請專利範-園第1項之方法,其中該以移除劑移除 該覆蓋基質之層的步驟及使該無機污杂物與一種轉化劑 反應之步騍係同時實施。 9. 根據申請專利範圍第1項之方法,其中該以移除劑移除 該覆蓋基質之該層的步驟、使該無機污柰物與一種轉化 劑反應之步驟、及移除該經轉化的無機污染物的步驟係 ^ 同時實施〇 10. 根據申請專利範園第1項之方法,其中在實施該以移 除劑移除該覆蓋基質之該層的步驟之後,接著同時實施' 該無機污染物與一種轉化劑反應之步驟及移除該經轉化 之無機污染物的步驟。 11. 根據申請專利範園第1項之方法,其中該移除劑係由 HF所組成。 12. 拫據申請專利範園第11項之方法,其中該移除劑被包 含於第二超臨界流體中。 13. 根據申請專利範園第12項之方法,其中該第二超臨界 流體係由超臨界CO 2所組成。 14. 根據申請專利範園第1項之方法,其中該移除劑係由 HF所組成。 15. —種由覆蓋基質之層中移除無機污染物之方法,該方 法:包括步驟: 以至少一種移除劑移除覆蓋該基質之該層,該移除劑 被包含於第一超臨界流體中; 使該無機污染物與至少一種轉化劑反應,藉此轉化該 -13 - (請先閔讀背面之注意事項再填寫本頁) • ϋ I !· HI— - IT I - - I - -- - ^ I I 1 ^^1 - - n. - —11 I I I · —I « nflff fn 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部中央標準局舅工消費^作社印製 408362 ϋ C8 DS六、申請專利範圍 無機污染物,該轉化劑被包含於第二超臨界流體中; - 使該被轉化的無機污染物接觸至少一種溶劑試劑以移 除之,該溶劑試劑被包含於第三超臨界流體中; 且其中該被轉化的無機污染物較該無機污杂物更高度 可溶於該溶劑試劑中。 16. 根據申請專利範園第〗5項之方法,其中該以移除劑移 除該覆蓋基質之該層的步驟及使該無機污染物與一種轉 化劑反應之步騍係同時實施。 17. 根據申請專利範圍第15項之方法,其中該以移除劑移 除該覆蓋基質之該層的步驟、使該無機污染物與一種轉 化劑反應之步驟、及移除該經轉化的無機污染物的步驟 係同時實施。 18. 根據申請專利範園第15項之方法,其中在實施該以 移除劑移除該覆蓋基質之該層的步驟之後,接著同時實 施該無機污染物與一種轉化劑反應之步騍及移除該經轉 化之無機污染物的步驟。 (請先間讀背面之注意事項再填寫本頁) 本紙張尺皮適用中國國家標準(CNS ) A4規格(210X297公釐)
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- 1997-07-31 KR KR1019970036355A patent/KR19980018262A/ko not_active Application Discontinuation
- 1997-08-01 EP EP97305822A patent/EP0822583A3/en not_active Withdrawn
- 1997-08-01 JP JP9208037A patent/JPH10135170A/ja active Pending
- 1997-11-21 TW TW086111091A patent/TW408362B/zh not_active IP Right Cessation
Cited By (1)
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CN110899248A (zh) * | 2019-06-21 | 2020-03-24 | 杭州杭氧股份有限公司 | 一种利用超临界流体批量清洗超高纯气体钢瓶的系统及其方法 |
Also Published As
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EP0822583A3 (en) | 1998-04-01 |
EP0822583A2 (en) | 1998-02-04 |
JPH10135170A (ja) | 1998-05-22 |
KR19980018262A (ko) | 1998-06-05 |
US5868862A (en) | 1999-02-09 |
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