TW399814U - Test socket lattice - Google Patents

Test socket lattice

Info

Publication number
TW399814U
TW399814U TW088204939U TW88204939U TW399814U TW 399814 U TW399814 U TW 399814U TW 088204939 U TW088204939 U TW 088204939U TW 88204939 U TW88204939 U TW 88204939U TW 399814 U TW399814 U TW 399814U
Authority
TW
Taiwan
Prior art keywords
test socket
socket lattice
lattice
test
socket
Prior art date
Application number
TW088204939U
Other languages
English (en)
Chinese (zh)
Inventor
Isamu Yamamoto
Tomohiro Nakano
Akira Kaneshige
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of TW399814U publication Critical patent/TW399814U/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0483Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW088204939U 1998-04-01 1999-05-12 Test socket lattice TW399814U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10105894A JP3020030B2 (ja) 1998-04-01 1998-04-01 バーンインソケット

Publications (1)

Publication Number Publication Date
TW399814U true TW399814U (en) 2000-07-21

Family

ID=14419623

Family Applications (2)

Application Number Title Priority Date Filing Date
TW088204940U TW411060U (en) 1998-04-01 1999-05-12 Burn-in test socket
TW088204939U TW399814U (en) 1998-04-01 1999-05-12 Test socket lattice

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW088204940U TW411060U (en) 1998-04-01 1999-05-12 Burn-in test socket

Country Status (6)

Country Link
JP (1) JP3020030B2 (ko)
KR (2) KR100581237B1 (ko)
CN (2) CN1178065C (ko)
MY (2) MY123246A (ko)
TW (2) TW411060U (ko)
WO (2) WO1999050676A1 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6267603B1 (en) 1998-04-01 2001-07-31 Molex Incorporated Burn-in test socket
US6283780B1 (en) 1998-04-01 2001-09-04 Molex Incorporated Test socket lattice
JP2002164135A (ja) * 2000-11-26 2002-06-07 Isao Kimoto ソケット
JP3789789B2 (ja) * 2001-08-31 2006-06-28 株式会社エンプラス 電気部品用ソケット
JP4368132B2 (ja) 2003-04-25 2009-11-18 株式会社エンプラス 電気部品用ソケット
KR100898409B1 (ko) 2007-07-05 2009-05-21 주식회사 오킨스전자 리드프레임 방식 칩 패키지용 번인 소켓
KR101090303B1 (ko) * 2009-06-12 2011-12-07 (주)브이알인사이트 반도체 검증용 fpga 보드의 뱅크구조
US8888503B2 (en) * 2011-12-28 2014-11-18 Enplas Corporation Socket for electric parts
JP5836112B2 (ja) * 2011-12-28 2015-12-24 株式会社エンプラス 電気部品用ソケット
KR101485779B1 (ko) 2013-06-28 2015-01-26 황동원 반도체 소자 테스트용 소켓장치
KR101931623B1 (ko) * 2016-12-20 2018-12-21 주식회사 오킨스전자 래치 고정 락커를 포함하는 소켓
CN109342773A (zh) * 2018-08-17 2019-02-15 北方电子研究院安徽有限公司 一种金属管壳老化板夹具
WO2020157921A1 (ja) * 2019-01-31 2020-08-06 山一電機株式会社 検査用ソケット
KR102606908B1 (ko) * 2020-12-23 2023-11-24 (주)마이크로컨텍솔루션 반도체 칩 테스트 소켓

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3245747B2 (ja) * 1991-09-18 2002-01-15 日本テキサス・インスツルメンツ株式会社 ソケット
JPH0677467B2 (ja) * 1992-12-25 1994-09-28 山一電機株式会社 Icソケット
JP3259109B2 (ja) * 1993-02-08 2002-02-25 日本テキサス・インスツルメンツ株式会社 ソケット
JP2667633B2 (ja) * 1994-02-24 1997-10-27 山一電機株式会社 Icソケットにおけるic保持装置
JPH0888063A (ja) * 1994-09-16 1996-04-02 Yamaichi Electron Co Ltd Icソケットの接触構造
JPH09162332A (ja) * 1995-12-13 1997-06-20 Toshiba Chem Corp Bgaのicテスト用ソケット
JP3714642B2 (ja) * 1996-07-30 2005-11-09 株式会社エンプラス 電気的接続装置

Also Published As

Publication number Publication date
TW411060U (en) 2000-11-01
WO1999050677A1 (en) 1999-10-07
KR100581240B1 (ko) 2006-05-22
KR100581237B1 (ko) 2006-05-22
CN1178066C (zh) 2004-12-01
JP3020030B2 (ja) 2000-03-15
MY123246A (en) 2006-05-31
CN1266492A (zh) 2000-09-13
CN1178065C (zh) 2004-12-01
CN1266491A (zh) 2000-09-13
KR20010013205A (ko) 2001-02-26
WO1999050676A1 (en) 1999-10-07
JPH11297443A (ja) 1999-10-29
KR20010013206A (ko) 2001-02-26
MY124410A (en) 2006-06-30

Similar Documents

Publication Publication Date Title
TW438067U (en) LGA socket
SG81959A1 (en) Testing ic socket
GB0012407D0 (en) Test socket
GB9813039D0 (en) Socket holding device
GB2358934B (en) Cable testing
TW454989U (en) Integrated circuit test socket
EP1096622A4 (en) BASE FOR INTEGRATED CIRCUITS
TW420409U (en) Socket connector
TW399814U (en) Test socket lattice
GB2342863B (en) Probe
TW392942U (en) Fixture
GB9921487D0 (en) Manufacturing methods
TW392939U (en) Connector fixture
GB9820289D0 (en) Testing arrangement
GB0021952D0 (en) Electric socket tester
GB9904942D0 (en) Weak link
HUP9901727A3 (en) Multiple socket
TW381705U (en) Testing implement
GB2337871B (en) Test connector
CA84136S (en) Electrical socket
TW438097U (en) USB socket
TW411056U (en) Voice-controlled socket
TW414378U (en) Socket assembly
PL107887U1 (en) Vidion test chart
CA83191S (en) Dickie

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model