TW394719B - Workpiece surface processing apparatus - Google Patents
Workpiece surface processing apparatus Download PDFInfo
- Publication number
- TW394719B TW394719B TW088101845A TW88101845A TW394719B TW 394719 B TW394719 B TW 394719B TW 088101845 A TW088101845 A TW 088101845A TW 88101845 A TW88101845 A TW 88101845A TW 394719 B TW394719 B TW 394719B
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece
- wafer
- pressure
- platen
- center
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7655198A JPH11254314A (ja) | 1998-03-10 | 1998-03-10 | ワーク面加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW394719B true TW394719B (en) | 2000-06-21 |
Family
ID=13608408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW088101845A TW394719B (en) | 1998-03-10 | 1999-02-06 | Workpiece surface processing apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US6068545A (fr) |
EP (1) | EP0941805A3 (fr) |
JP (1) | JPH11254314A (fr) |
KR (1) | KR19990077476A (fr) |
TW (1) | TW394719B (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111360687A (zh) * | 2018-12-26 | 2020-07-03 | 力山工业股份有限公司 | 自动研磨装置 |
CN113894680A (zh) * | 2021-09-13 | 2022-01-07 | 莱州市蔚仪试验器械制造有限公司 | 一种加压装置 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6705930B2 (en) | 2000-01-28 | 2004-03-16 | Lam Research Corporation | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
US6340326B1 (en) | 2000-01-28 | 2002-01-22 | Lam Research Corporation | System and method for controlled polishing and planarization of semiconductor wafers |
US6609950B2 (en) * | 2000-07-05 | 2003-08-26 | Ebara Corporation | Method for polishing a substrate |
US6585572B1 (en) | 2000-08-22 | 2003-07-01 | Lam Research Corporation | Subaperture chemical mechanical polishing system |
US6640155B2 (en) | 2000-08-22 | 2003-10-28 | Lam Research Corporation | Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head |
US6652357B1 (en) | 2000-09-22 | 2003-11-25 | Lam Research Corporation | Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing |
US7481695B2 (en) | 2000-08-22 | 2009-01-27 | Lam Research Corporation | Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head |
US6471566B1 (en) * | 2000-09-18 | 2002-10-29 | Lam Research Corporation | Sacrificial retaining ring CMP system and methods for implementing the same |
US6443815B1 (en) | 2000-09-22 | 2002-09-03 | Lam Research Corporation | Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing |
US7195535B1 (en) * | 2004-07-22 | 2007-03-27 | Applied Materials, Inc. | Metrology for chemical mechanical polishing |
GB0900949D0 (en) * | 2009-01-21 | 2009-03-04 | Ind Valve Services Pte Ltd | Safety calve re-machining |
DE102010063179B4 (de) * | 2010-12-15 | 2012-10-04 | Siltronic Ag | Verfahren zur gleichzeitigen Material abtragenden Bearbeitung beider Seiten mindestens dreier Halbleiterscheiben |
US20220297258A1 (en) * | 2021-03-17 | 2022-09-22 | Applied Materials, Inc. | Substrate polishing simultaneously over multiple mini platens |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3968598A (en) * | 1972-01-20 | 1976-07-13 | Canon Kabushiki Kaisha | Workpiece lapping device |
JPS6411757A (en) * | 1987-07-01 | 1989-01-17 | Tomoaki Goto | Grinding machine |
JP2644058B2 (ja) * | 1989-11-10 | 1997-08-25 | 不二越機械工業株式会社 | ウエハー加工装置 |
US5384986A (en) * | 1992-09-24 | 1995-01-31 | Ebara Corporation | Polishing apparatus |
US5435772A (en) * | 1993-04-30 | 1995-07-25 | Motorola, Inc. | Method of polishing a semiconductor substrate |
JP2910507B2 (ja) * | 1993-06-08 | 1999-06-23 | 信越半導体株式会社 | 半導体ウエーハの製造方法 |
US5791969A (en) * | 1994-11-01 | 1998-08-11 | Lund; Douglas E. | System and method of automatically polishing semiconductor wafers |
JPH08174411A (ja) * | 1994-12-22 | 1996-07-09 | Ebara Corp | ポリッシング装置 |
US5868605A (en) * | 1995-06-02 | 1999-02-09 | Speedfam Corporation | In-situ polishing pad flatness control |
US5674109A (en) * | 1995-09-13 | 1997-10-07 | Ebara Corporation | Apparatus and method for polishing workpiece |
JPH09277158A (ja) * | 1996-04-15 | 1997-10-28 | Speedfam Co Ltd | ディスクの条痕パターン形成方法及びその装置 |
-
1998
- 1998-03-10 JP JP7655198A patent/JPH11254314A/ja active Pending
-
1999
- 1999-01-21 US US09/235,099 patent/US6068545A/en not_active Expired - Fee Related
- 1999-02-06 TW TW088101845A patent/TW394719B/zh not_active IP Right Cessation
- 1999-02-08 EP EP99101694A patent/EP0941805A3/fr not_active Withdrawn
- 1999-02-25 KR KR1019990006264A patent/KR19990077476A/ko active IP Right Grant
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111360687A (zh) * | 2018-12-26 | 2020-07-03 | 力山工业股份有限公司 | 自动研磨装置 |
CN111360687B (zh) * | 2018-12-26 | 2021-06-01 | 力山工业股份有限公司 | 自动研磨装置 |
CN113894680A (zh) * | 2021-09-13 | 2022-01-07 | 莱州市蔚仪试验器械制造有限公司 | 一种加压装置 |
CN113894680B (zh) * | 2021-09-13 | 2023-03-31 | 莱州市蔚仪试验器械制造有限公司 | 一种加压装置 |
Also Published As
Publication number | Publication date |
---|---|
US6068545A (en) | 2000-05-30 |
JPH11254314A (ja) | 1999-09-21 |
KR19990077476A (ko) | 1999-10-25 |
EP0941805A2 (fr) | 1999-09-15 |
EP0941805A3 (fr) | 2002-06-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW394719B (en) | Workpiece surface processing apparatus | |
US6074277A (en) | Polishing apparatus | |
US6517414B1 (en) | Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus | |
KR100954534B1 (ko) | 얇은 원판형상 공작물의 양면 연삭방법 및 양면 연삭장치 | |
TW201900338A (zh) | 基板的研磨裝置和基板處理系統 | |
US6702646B1 (en) | Method and apparatus for monitoring polishing plate condition | |
US6066230A (en) | Planarization method, workpiece measuring method, and surface planarization apparatus having a measuring device | |
KR20170104925A (ko) | 평면 연마 장치 및 캐리어 | |
JP2002144201A (ja) | 円板形ワークの外周研磨装置及び研磨方法 | |
US20060194512A1 (en) | Thickness control method and double side polisher | |
JP4324933B2 (ja) | 平面研磨装置 | |
JP3389014B2 (ja) | 円盤状半導体ウェーハ面取部のミラー面取加工方法 | |
CN113211299A (zh) | 基板处理装置及基板处理方法 | |
JP2003145399A (ja) | 円盤状半導体ウェーハ面取部のミラー面取加工方法 | |
JPH1080861A (ja) | ウェーハの両面ラップ方法及び装置 | |
JP2001293653A (ja) | 平面研磨装置 | |
JPH10180613A (ja) | ポリッシング装置 | |
JPH01268032A (ja) | ウエハ研磨方法および装置 | |
JP3230551U (ja) | ウェハ研磨装置 | |
JP2001239457A (ja) | ポリッシング装置 | |
JP3214467B2 (ja) | 研磨材用ドレッシング方法及びその装置 | |
JPH08309659A (ja) | 被加工物の研磨方法及び装置 | |
JP3427670B2 (ja) | 研磨装置および研磨方法 | |
JPH0674259U (ja) | 定盤修正キャリア | |
JPH04778B2 (fr) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |