TW380303B - Gold alloy thin wire for semiconductor devices - Google Patents

Abstract

To provide a gold alloy thin wire advantageously applicable to high density packaging of semiconductor devices, in which the wire deformation upon resin molding is reduced to successfully achieve reduction in the bonding pitch and the wire diameter, a gold alloy thin wire according to the present invention consists of 0.015 to 1.0wt% Cu, 0.0002 to 0.02 wt% Ca, and the balance consisting of Au and unavoidable impurities. Preferably, the Cu content is 0.1 to 1.0 wt% and the Ca content is 0.001 to 0.02 wt%, and more preferably, Cu and Ca are present in a weight content ratio Cu/Ca of from 40 to 800. The gold alloy thin wire further preferably contains one or more of Pt, Pd and In in a total amount of from 0.01 to 3.0 wt% and/or one or more of Y, La, and Ce in a total amount of from 0.0003 to 0.03 wt%.

Description

V. Description of the invention

Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 1. Field of the Invention The present invention relates to a type or electrical connection of electrodes to the outside; 丨 line α gold thin wire for semiconductor device wiring 2. Description of related technology External leads. The circuit winding electrodes are mainly connected by wiring. At present, semiconductors are progressively shrinking the 1C chip M product and the trend of diversified functions requires devices. To achieve pin or terminal containment requires high-density packaging semiconductor chips to remove and increase the width of the wiring. Right: = 'The internal lead must be made by Shi Xijing. To strictly control the shape of the loop' The long wiring width of the coffee needs to be straight and reduce dispersion. The pin θ addition also needs to be reduced or finer ~ the number of blades is increased by the line pitch ⑽㈣ or less, for example, a thinner line with a minimum number of pins is required. Good connection = set and development has; good = = 'I have worked hard to change back to the masculine packaging semiconductor device, Yu, ", the main problem is to prevent the adjacent metal, the long-span undesired connection 戈 successfully 4 = And the wire and the chip or inside, when the wiring span is increased, although the number of pins and the small pitch is 42. Measure and prevent the wire M, and the road control to ensure the material is heavy. When using a variety of epoxy resin molding methods, The ground loop is bent. With the increase of the wiring span, the distance increases and the connection is not known. Therefore, there are often adjacent metal wires. Please read the precautions on the back before filling in this page.

、 1 1 Q! -4- A 7 ------------ B7. 5. Description of the invention ~ ^ '^ 钿 Small wiring pitch also needs to make the wire thinner or the wire diameter smaller, so The problem of bending the wire when the servo circuit is formed, and the problem of wire sweeping during the resin molding process is more serious. It can be expected that the strength of the wire decreases proportionally with the square of the wire diameter. The reduction of the wiring pitch also requires the reduction of the bead size, which makes it difficult to wire. From the viewpoint of thinning the wire and ensuring the wiring, the influence of additive alloying elements on thin gold alloy wires has been studied. For example, Japanese Patent Laid-Open No. 119148 discloses that cu is an effective added element. However, cu must be present in an amount of j to 5 wt ° /. To provide substantial results, but such high amounts may cause bead-shaped defects and undesirably hardening. Japanese Patent Publication No. 2-215140 also discloses that Mw, Cu, and Ni are not added to the gold wire in a selected amount. Its only relationship is to inhibit AWA1 linkers from forming chemical compounds. SUMMARY OF THE INVENTION The object of the present invention is to provide a thin gold alloy wire suitable for high-density packaging semiconductor devices, in which the deformation of the wire is reduced during resin molding, and the reduction of the wiring pitch and the wire thinning are successfully achieved. Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs to achieve this goal. The inventor conducted various researches on the linear properties required for high-density packaging semiconductor devices. . Kao Xingren further studied the relationship between various alloying elements of gold alloy thin wires and circuit straightness and line sweeping. For the first time, it was found that the combined addition of Cu and Ca can effectively suppress line sweeping, that is, when Cu and Ca with limited Cu / The Ca content ratio is most effective when present. The inventors also found that the addition of Pt, Pd, and In can improve the paper size of the heating-affected section line. The Chinese national standard (Qvs) A4 specification (210X 297 Gongao) is printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. The invention explains that (3) the strength is close to beads; and the addition of Y, La, and Ce can improve the line sweep resistance during resin molding. To achieve the object of the first aspect of the invention, a gold alloy thin wire is provided including 0.015 to 1.0 ^^% 匸 11, 0.0002 to 0.02 and 1 ° /. € 3, and the difference includes Au and unavoidable impurities. According to a second aspect of the present invention, there is also provided a gold alloy thin wire including 0: 1 to 1.0 wt% Cu, 0.001 to 0.02 wt ° /. Ca, and the difference includes Au and unavoidable impurities. According to a third aspect, the gold alloy thin wire of the first or second aspect has a Cu / Ca weight content ratio of 40 to 800. According to the fourth aspect, the gold alloy thin wire of the first, second or third aspect further contains one or more Pt, and the total amount of Pd and In is 0.01 to 3.0 wt%. According to a fifth aspect, the gold alloy thin wire of the first, second or third aspect further contains one or more Y, La and Ce in a total amount of 0.0003 to 0.03 wt%. According to the sixth aspect, the first, The second or third aspect of the gold alloy thin wire further contains one or more kinds of Pt, Pd and In in a total amount of 0.01 to 3.0 wt% and one or more kinds of Y, and a total amount of La and Ce is 0.0003 to 0.03 wt%. Description of preferred specific examples The gold alloy thin wire of the present invention will be described in detail. To estimate the straightness of the circuit and the resistance to line sweeping during resin molding, you need to use thin metal wires for wiring, and then measure the deformation of the wire circuit thus formed. After the resin molding, measure the wire wiring samples and wire sweeping. Due to circuit degeneration and wire sweeping, it is obviously according to the operating parameters of the wiring device and / or resin molding device. The paper size is applicable to China National Standard (CNS) A4 specification (210X 297 mm) -6-(Please read the notes on the back (Fill in this page again)

Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7., B7 V. The description of the invention (4) and the type of molding resin, so it is difficult to separate the material factors of the thin metal wires. The inventor studied the relationship between the straightness of the loop and the line sweep during resin molding and the mechanical properties of the thin metal wire (including tensile strength, elastic constant, and drop strength), etc., and found that as the breaking strength measured by the tensile test increased, the loop was straight The degree of improvement and the line sweep during resin molding are also suppressed. Although more rigorous analysis needs to include other properties such as elastic constant, yield strength, and bending elasticity, etc., it is easy to measure the tensile strength to estimate the properties of thin metal wires to reduce the wiring pitch and wire diameter. The tensile strength of thin gold alloy wires generally increases with the combined addition of Cu and Ca. Adding Cu alone will increase the room temperature strength but the effect is too small to meet the needs of high density packaging. In this regard, the addition of Ca alone can increase the strength, but when a large amount of Ca is added, Ca-shaped defects occur in Ca oxidation. The upper limit of the amount of Ca is determined by the shape of the beads, and the addition of Ca alone cannot provide sufficient strength to reduce the wire diameter. Table 1 shows the effects of Cu and Ca additions on the tensile strength. A wire with a diameter of 24 was subjected to a horizontal screw annealing and subjected to a tensile test to determine the breaking strength and elastic constant of the wire. Since the thin metal wires of semiconductor devices usually have an elongation at break of 3 to 5%, the annealing temperature can be selected to provide an elongation of 4%. It can be seen from Table 1 that the optimum tensile strength of Cu and Ca added in combination is 30 to 50% higher than the optimum amount of Cu or Ca added alone. The inventors learned from experience that when a thin metal wire has a tensile strength of 13.5 gf or more or an elastic constant of 8500 kgf / mni2 or more, for a long wiring span of about 5 mm, the wire deformation can be reduced to a practically acceptable level. According to the sample 1 of the present invention, the size of the paper added is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) --------- Μ Packing -------- Order --- --- 1 J: i (-Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs A7 _ —— ____ B7 丨 'V. Description of the Invention (5) ~~~

Cu and Ca can satisfy the aforementioned conditions. Due to the following reasons, the content of Cu and Ca must be within the specified range. When the content is less than 0.015% or (^ content is less than 0.0002%), there is no significant improvement in mechanical properties. In terms of it, when the content exceeds G Q2, it is a gift. Day; Or the sphericity of the beads is reduced; or when Cu content = more than 1_0 wt%, 'the linear delay increases by 2 and the hardening enhances the mold's accelerated wear.' Line bending often occurs' As the diameter of the wire decreases, this tendency is more significant One solution is to perform intermediate annealing multiple times, but the production process is complicated. Better, the Cu content is 0.1 to 1.0 wtQ / (^ Ca content is 0.0000 丨 to 002 wt% /., Because the Cu content is When the content is 0.1 wt% or more and the content is 0.001 wt% or more, the tensile strength and elastic constant are further increased. Combined addition of Cu and Ca can improve the tensile strength and elastic constant, especially when the Cu / Ca weight content ratio is This is particularly the case when it is within the specified range. In Table 1, the addition of Ca alone has a similar effect on the strength, as shown in samples (b) and ⑷; in terms of it, in samples 1 and 2 according to the present invention, the same amount (^ addition To samples (b) and (c) 'Tensile strength and elastic constant increase, the sample The increase is more significant. The Cu / Ca weight content ratio of 40 to 800 provides the most significant combination effect. In sample 2 with a content ratio of 1400, the increase in tensile strength is quite small. In sample 1 with a content ratio of 300, the resistance is obtained. The tensile strength is as high as 15 red or more and the elastic constant is as high as 900 kgf / ranging 2 or more. Although the improvement mechanism of these elements is not fully understood, the inventors believe that there is an interaction between Cu and Ca to cause precipitation, or the Au-based The material forming compound phase provides improved mechanical properties, especially when Cu and Ca are present in the regulations ________ ____________ ___ ^ _ This paper size is applicable to the Chinese National Standard (CNS) A4 grid (210 X 297 mm) -8-f Please read first (Notes on the back then fill out this page)

Printed by the Consumers' Cooperatives of the Ministry of Economic Affairs of the People's Republic of China A7 _____________B7 1 V. Description of the Invention (6). This is especially true for the Cu / Ca weight content ratio range of ~~~~-. The weight content ratio Cu / Ca is preferably in the range of 4G to _ to provide improved tensile strength and sharpness constant by the combined addition of Cu and Ca. The combined addition of Cu and Ca is still effective outside the aforementioned preferred range, but the weight content ratio greater than lion can only provide a small increase in resistance, and the content ratio of less than 40 can increase the tensile strength but cause the formation of melting lines. The problem that the hardness increases and the underlying silicon wafer is damaged during wiring. The wire strength is proportional to the square of the wire diameter, so as the wire diameter decreases, the wire material strength must be increased to ensure wire sweep resistance. Gold alloy thin wires with a diameter of 25 to 30 Am are currently used, but not suitable for fine pitch. Added according to the invention via merger. And gold with improved strength. Gold thin wires are preferably used for smaller wire diameters of 25 / zm or less. Via combination: The added strength of Cu and C a is particularly good when the wire diameter is 2 3 # m or less, where the wire strength is 25% or more higher than the 25 / zm wire. To reduce the wiring pitch, the wireframe must have fewer internal wires, but swinging during shipping may cause problems. In order to provide anti-swaying properties, the neck just above the bead has higher strength. To achieve this, the coarsening of recrystallized grains caused by thermal effects must be suppressed in this part. In addition to the combined addition of Cu and Ca, one or more of pt, pd & In is preferably contained in the neck fines to enhance the strength of the neck. Simply adding pt, pd & In cannot inhibit the recrystallization of the neck, but combined with Cu & Ca can increase the synergistic effect of improving the strength of the song. The total amount of Pt, Pd and In must be 0.01 W /. Or above to ensure that the aforementioned effect is obtained. However, the amount of pt, pd & ir ^ | cannot be more than 3.0 wt%, to prevent the beads from flattening to ensure the good sphericity of the beads, so there is ___ 6. Read the precautions on the back ^ before filling in the last page] i. National Standard (〇 呢) People 4 Specifications (210 '乂 297 mm) -9- Consumer Co-operation of the Central Standards Bureau of the Ministry of Economic Affairs. Printed by the Society—A7, ~~ I' ------ B7 V. Description of the Invention (7) '— Helps to form the beads needed to narrow the pitch to connect the greening & raft line. Excessive addition of Pt, Pd, and h! Also causes the bead to harden, which damages the silicon wafer during the %% cycloid process. " ^ Molding process towel 'High-strength thermal SI resin is poured at a high speed on a mold which is heated to 150 to 2CK) C to deform the wiring. The deformation of the wiring caused by the resin flow is mainly related to the properties of the wire. In particular, the heating properties of the wire. It is possible to add one or more kinds of Y, La and Ce in a total amount of 0.0003 to 0.03 wt // 0 for improved local temperature line strength. Add Y, ^^, and to slightly improve to: line strength and ~ and. Combined addition is a significant improvement in room temperature line strength = ~ the amount of Y 'La & cd' l 'must be 〇_〇〇〇〇3 wt ° / 〇 or above 俾 to provide a significant improvement in high / dish line strength, but can not exceed ㈣3⑽ To prevent the beads from forming shrinkage holes or the sphericity of the beads to deteriorate. The examples are obtained by using electrolytic gold with a purity of 99 " 5 wt% or more, having 〒,., And forming a gold alloy as shown in Table 2 in a melting furnace, submerged into a prayer roll, and drawn to form a final diameter 24 thin gold alloy wire and then annealed in an air towel to provide a wire with controlled elongation. y δ gold beads are formed by wiring. High-speed automatic wiring machines are formed by electric solitary discharge at the wire ends. The beads can be observed under a scanning electron microscope. The beads of Λ Examples 1 to 29 of this month were observed to be spherical. A detailed observation of the bead surface revealed that several beads had shrinkage holes at the ends of the beads. In Table 2, the symbol "'0" means "with a contraction point" and the symbol "Tiger" "◎" means "without a contraction point". To study the damage to the wafer that may occur during the wiring operation, the wiring device is immersed in a gold alloy wire and aluminum electrode in aqua regia, and then the wafer contacts are observed under an optical microscope. Figure a29 of the present invention does not appear to be substantially unacceptable. 0 Please read the notes on the back before filling in this ear, >-裴 -'II.-泉. Lingxian 7 ^^^ X 297 ^ ¥ Τ ^ ur: A7 —---_______ _ B7, · V. Description of the invention ~~ ~ -—, know. . In Table 2, the symbol “0” indicates that microcracks were observed and the symbol “◎” indicates that no damage was observed. 欲 / The neck strength after the circuit is deformed is fixed, the wire frame and the semiconductor wafer are fixed = in the holder, and the wiring is pulled in the middle Gold alloy wire. The neck strength is estimated from the average of the tensile strength of 100 samples, that is, the tensile strength at the time of breaking. The mountain is measured by bending the wire, and the wire is connected with a wiring span of 4.5 mm (with a wire connection, From the table) and viewed from above in the projector in a generally vertical direction to measure the normal length from the outermost point of the arched line to the straight line passing through the terminal end. The line bending is evaluated by the average of 80 samples To measure the wire sweep during resin molding, the wire frame with the wire frame of the semiconductor device attached and the wire joined with a 4.5-leg span is molded with epoxy resin on the molding device, and the inside of the resin molding device is soft. The χ_light viewer observes when χ_ light is projected, in which the sweep distance of the outermost point of the arched line is measured in the same way as the line is bent, and the line sweep is based on the sweep distance relative to the 4 · 5 _ span The percentage of length is shown. The line scan is from 8 The average value of each sample is estimated. Table 2 summarizes the results of examples of the chemical composition of the present invention in the specified range, and Table 3 summarizes the results of the comparative examples with the chemical composition outside the specified range. In Table 2, Examples 1 to 29 are related to the first aspect of the present invention, and Examples 2 to 17 and 22 to 29 are the second aspect, examples. Examples 丨 to mouth and even "related to the third aspect, Example 7 And m is the fourth aspect, examples 12 to 15 are the fifth aspect, and examples 16 to 17 are the sixth aspect. In Table j, Comparative Examples C1 to C4 have a line sweep of up to 6% or more during resin molding, indicating that flaws occur due to undesired connections between adjacent lines. ΓΓΓ The paper shape is applicable to China (CNS) (210 ^ 97 ^ ¾) Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs This paper is printed in accordance with China National Standards (CNS) A4 specifications (210 × 297 mm) A7 ._B7_ '— V. Description of the invention (9) Probability of South, also has Line ridges of 20 // m or more indicate undesired dispersion of loop shapes. In contrast, examples 1 to 4 according to the first aspect of the present invention have a line sweep value reduced to 5% or less. Examples 2 to 17 and 22 to 29 contain. . 丨 to 〇〇wt% Cu and 0.001 to 〇.02 wt% Ca has a Cu / Ca weight content ratio controlled in the range of 40 to 800, and its line sweep value is further reduced to 4% or less and has good wiring Performance; Results of Comparative Examples 20 and 21, Examples 20 and 21 contained Cu and Ca in a weight content ratio Cu / Ca greater than 800. In Comparative Example C5 containing more than 1.0 wt% Cu, the drawing process required three intermediate annealings to prevent mold abrasion and wire bending due to high drawing resistance during the drawing process. Comparing the foregoing examples 2 to 17 and 22 to 29 with better Cu / Ca values, and examples 20 and 21 (containing Cu and Ca within the specified range, but the weight content ratio of Cu / Ca is greater than 800) have slightly larger line scans The flick value is about 4.5%, but various properties are roughly improved. In terms of it, Examples 18 and 19 contain Cu and Ca within the specified range, but the Cu / Ca weight content ratio is less than 40, and Examples 18 and 19 have a small amount on the surface of the wiring chip. Microcracks> Examples 7 to 11 containing Pt, Pd, and In according to the fourth aspect of the present invention have improved tensile strength of 7 gf or more, where the line must be broken just above the neck to provide increased neck strength . In contrast, Examples 22 and 23 containing a total amount of less than 0.01 wt% Pt, Pd, and In did not clearly show the foregoing effects; in this respect, Examples 24 and 25 containing a total amount of more than 3.0 wt% Pt, Pd, and In showed that the bonded wafers were slightly Damaged, but the aforementioned effects are also obtained. -12- C Please read the precautions on the back before filling this page).-. Βτ A7 B7 V. Description of the invention (10) According to the examples 12 to 15 of the fifth aspect, the line sweep is suppressed to 3% or the following. In contrast, Examples 26 and 27 containing less than 0.0003 wt% Y, La, and Ce showed a lower degree of the aforementioned effect; in this respect, Examples 28 and 29 containing more than 0.03 wt% Y, La, and Ce showed There is a small contraction hole of about 2-3 em at the tip of the bead. As described in the foregoing, the present invention provides a thin gold alloy wire having a reduced wire bend during wiring and a reduced wire sweep during resin molding, which can be excellently applied to high-density semiconductor wafer packages requiring a reduced wiring pitch. Table 1 (Please read the precautions on the back before filling in this page). Installation · Sample additives Tensile strength (gf) Elastic constant (kgfiW) ⑻ Cu alone (0.6wt%) 9 · 5 ± 0_3 8000 ± 200 (b) Ca alone (0.002wt%) 11 · 8 ± 0.4 7800 ± 200 (c) Ca alone (0.00043wt%) 11.4 ± 0_4 7600 ± 150 1 Cu + Ca, (a) + (b), Cu / Ca = 300 15 8 ± 0_4 9400 ± 100 2 Cu + Ca, (a) + (c), Cu / Ca = 1400 13. 9 ± 0.3 8600 ± 200 Au (purity > 99.999%) 6. 2 ± 0.3 6000 ± 200

1T c Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs This paper size applies to the Chinese National Standard (CNS) A4 (210X 297 mm) V. Description of the invention (11

r〇 UJ

Η CO Μ σ \ A7B7 Η 0. ’s • 05 .48 15 P02

Cu 0.0025 0 .0025 -0025 ’°° 25 -0030 .0030 -0030 -oso’ 0008 -0 ° 05 .0040 • 0020 -003. °° 3 -0025 .Q025 -0025 .0025 -003 .003

• CIS .003 -003 -015 -018 • 00 ^ -003 0-001 G.oos

Ca 2.〇00 0.001 0.001 Q. 8 0.3 °. ° s 0,015

Pt: 2.500 2.000 0.8 °. 5 0.8 1.5 P02

Pd 1.000 P °° Q3 0.05 0.05

In 0,0200 P0002 0.0050

0 .QOS o.oso 0 · 0005 P0150 0 · 0002 0.0050 0.0050 0.0010

La

0.0150 ololl20 I P0Q20 0.0100 0.0050

Ce 绁 2 * 繇 »Miscellaneous skimmers ws« 繇 * 繇 »Miscellaneous skimmers Skimmers ί Skimmers

I ® 繇 mm skimming »s mm

Au 280.0 280 280 so l0101

Is 1000

ISO 0 20.0 25 233 233 2S0 2S °

2S

2S 160 166 166 60 33

Moo 150 0 0 0'0 ', 7

Cu / Ca

SB Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 15 · 0 U. 15. 15. 15 ‘15. 16 · 16. 19 · 2 °. 10 · 10. 1 · 15,

If

If 14. 15. 16. 16, 15 · 15, 15. 1 °, 12. 15

S .6 17 · 0 19.8 -®wl k5) (1)

3 ^ ΐΞ3 y < s 5ίΐϋ 一 S 〔Paper size: Chinese National Standard (CNS) A4 size (210X 297mm)

TT4T

V. Description of the invention (12) C6 0-w: 2 0.15 o. 01 A7 B7 ί- o · 01

Cu 0.0300 0.0030 0.00008 0 · 03 0.G005

Ca 2

In ίβββ. ^ A. 谢 3 ss

Ce ί. 00. s ·

Au 2 ^ .7 400.0 1S75 0 · 0 To-'o

Cu / Ca S0 Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs

IP 11, 25, 35. 0S (ΞΙΙ) i.5 H Γδ ~ (Please read the precautions on the back before filling this page)

The paper * size applies to China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

η .ι ^ ιγ ^ ι. 1 · —12W6. Patent Application Fanyuan A8 B8 C8 D8 Patent Application No. 86110146 Application for Patent Scope Amendment Date of Amendment: 1988 Jan 1. A gold alloy thin Line, which includes 0.015 to i 0 wt% of ❹, 0.002 to 0.02 wt.% Ca, and the difference includes Au and unavoidable impurities A thin gold alloy wire having a Cu / Ca weight content ratio of 40 to 800. 3. A thin gold alloy wire 'which includes 0.1 to 1.0 wt% Cu, 0.0001 to 0.02 wt% Ca, and the difference includes Aua and unavoidable impurities. 4. If the amalgamation of item 3 of the patent application scope has a cya weight content ratio of 40 to 800. : I ^ fit-22 5. If the scope of patent application is No. 1, 2, 3, or alloy thin wire, it also contains Pt with a total of 1 to 0.001 to 3.0% by weight: fSlr {Please read the back first Please fill out one or more of the following precautions. 6. If the patent application scope is 1, 2, 3 or gold alloy thin wire, which contains a total of 0.0003 to 0.03 wt%, one of $ ia and Ce is more or less. Printed by the Consumer Standards Cooperative of the Ministry of Standards of the People's Republic of China. 丨., 17 · If the patent application scope is 1, 2, 3, or 4 gold alloy thin wires, the total amount is 0.001 to 3.0 wt%. One or more of Pt, Pd, and In and one of Y, La, and Ce in a total amount of 0.0003 to 0.03 wt% or. The paper containing multi-threaded paper is applicable from China National Samples (CNS) M ( 21 OX297 Gong Chu " T η .ι ^ ιγ ^ ι. 1 · —12W6. Patent Application Park A8 B8 C8 D8 Patent Application No. 86110146 Amendment to the scope of patent application Amendment date: 8 years Month 1. A gold alloy thin wire, which includes 0.015 to i 0wt% of rhenium, 0.0002 to 0.02 wt.% Of Ca, and the difference includes Au and unavoidable impurities 〇2. Such as The gold alloy thin wire of the scope of the patent application has a Cu / Ca weight content ratio of 40 to 800. 3. A kind of gold alloy thin wire including 0.1 to 1.0 wt% Cu, 0.001 to 0.02 wt% of Ca, The difference includes Aua and unavoidable impurities. 4. If the amalgamation of item 3 in the scope of patent application, it has a cya weight content ratio of 40 to 800.: i ^ fit-22 5. If the scope of patent application is the first ,, 2, 3 or alloy thin wire, which in turn contains one or more of 0.001 to 3.0% by weight of Pt: fSlr (Please read the precautions on the back before filling this page) or more 6. If the patent application scope is 1, 2, 3 or gold alloy thin wire, which contains a total of 0.0003 to 0.03 wt%, one of $ ia and Ce or more ic- t Producer of Consumer Cooperatives, Central Standards Bureau, Ministry of Economic Affairs.丨., 17 · If the patent application scope of the 1, 2, 3 or 4 gold alloy thin wire, it has a total of one or more of Pt, Pd and In of 0.001 to 3.0 wt% Or one of Y, La and Ce in a total amount of 0.0003 to 0.03 wt%; Contains multiple threads This paper is suitable for use from China National Samples (CNS) M (21 OX297 Gongchu " T