TW379824U - Heat radiating apparatus - Google Patents

Heat radiating apparatus

Info

Publication number
TW379824U
TW379824U TW087221620U TW87221620U TW379824U TW 379824 U TW379824 U TW 379824U TW 087221620 U TW087221620 U TW 087221620U TW 87221620 U TW87221620 U TW 87221620U TW 379824 U TW379824 U TW 379824U
Authority
TW
Taiwan
Prior art keywords
heat radiating
radiating apparatus
heat
radiating
Prior art date
Application number
TW087221620U
Other languages
English (en)
Inventor
Bau-Lung Lin
Nian-Tian Cheng
Heng-Jr Liou
Shuo-Shiung Chen
Original Assignee
Foxconn Prec Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Prec Components Co Ltd filed Critical Foxconn Prec Components Co Ltd
Priority to TW087221620U priority Critical patent/TW379824U/zh
Priority to US09/427,144 priority patent/US6233150B1/en
Publication of TW379824U publication Critical patent/TW379824U/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
TW087221620U 1998-12-28 1998-12-28 Heat radiating apparatus TW379824U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW087221620U TW379824U (en) 1998-12-28 1998-12-28 Heat radiating apparatus
US09/427,144 US6233150B1 (en) 1998-12-28 1999-10-25 Memory module assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW087221620U TW379824U (en) 1998-12-28 1998-12-28 Heat radiating apparatus

Publications (1)

Publication Number Publication Date
TW379824U true TW379824U (en) 2000-01-11

Family

ID=21638941

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087221620U TW379824U (en) 1998-12-28 1998-12-28 Heat radiating apparatus

Country Status (2)

Country Link
US (1) US6233150B1 (zh)
TW (1) TW379824U (zh)

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DE102005012216B4 (de) * 2005-03-15 2008-11-13 Infineon Technologies Ag Oberflächenmontiertes Halbleiterbauteil mit Kühlkörper und Montageverfahren
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US7957134B2 (en) * 2007-04-10 2011-06-07 Hewlett-Packard Development Company, L.P. System and method having evaporative cooling for memory
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US20080266807A1 (en) * 2007-04-27 2008-10-30 Cray Inc. Electronic assembly with emi shielding heat sink
TWM340493U (en) * 2007-11-09 2008-09-11 Zhi-Yi Zhang Memory heat dissipating device with increasing cooling area
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CN101571738B (zh) * 2008-04-28 2012-07-18 富准精密工业(深圳)有限公司 散热器组合
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US8081473B2 (en) * 2008-08-04 2011-12-20 International Business Machines Corporation Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages
US9342121B2 (en) * 2008-05-06 2016-05-17 International Business Machines Corporatoin Cooling system for electronic components
US8004841B2 (en) 2008-05-06 2011-08-23 International Business Machines Corporation Method and apparatus of water cooling several parallel circuit cards each containing several chip packages
US7684196B2 (en) * 2008-05-13 2010-03-23 International Business Machines Corporation Enhancing the cooling of dual in-line memory modules
TWM355001U (en) * 2008-08-18 2009-04-11 Comptake Technology Inc Lateral locking memory heat sink
CN102414813B (zh) * 2009-04-29 2014-04-09 惠普开发有限公司 印刷电路板冷却组件
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US8248805B2 (en) * 2009-09-24 2012-08-21 International Business Machines Corporation System to improve an in-line memory module
GB2488738B (en) * 2010-03-08 2014-02-12 Ibm Liquid dimm cooling device
CN201725266U (zh) * 2010-06-17 2011-01-26 深圳富泰宏精密工业有限公司 内存条散热组件
TWM455243U (zh) * 2013-01-30 2013-06-11 A Data Technology Co Ltd 安全拆卸組件及其記憶體模組
TWI486100B (zh) * 2013-01-30 2015-05-21 威剛科技股份有限公司 拆裝組件及其記憶體模組
US10660236B2 (en) 2014-04-08 2020-05-19 General Electric Company Systems and methods for using additive manufacturing for thermal management
WO2015167528A1 (en) * 2014-04-30 2015-11-05 Hewlett-Packard Development Company, L.P. Thermal management assembly
US10356945B2 (en) 2015-01-08 2019-07-16 General Electric Company System and method for thermal management using vapor chamber
US9909448B2 (en) 2015-04-15 2018-03-06 General Electric Company Gas turbine engine component with integrated heat pipe
US10209009B2 (en) 2016-06-21 2019-02-19 General Electric Company Heat exchanger including passageways
US9974157B2 (en) 2016-08-15 2018-05-15 General Electric Company Circuit card cartridge for an electronic system
IT201600106718A1 (it) * 2016-10-24 2018-04-24 Eurotech S P A Scheda elettronica refrigerata
US10938161B2 (en) * 2019-03-29 2021-03-02 Intel Corporation Snap-on electromagnetic interference (EMI)-shielding without motherboard ground requirement
US10763191B1 (en) * 2019-06-11 2020-09-01 Hewlett Packard Enterprise Development Lp Dual in-line memory module (DIMM) Edgewater Spring (EWS) multi point contact cooling jacket
KR102675837B1 (ko) 2019-06-27 2024-06-14 삼성전자주식회사 메모리 장치
US11267551B2 (en) 2019-11-15 2022-03-08 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11260953B2 (en) 2019-11-15 2022-03-01 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11352120B2 (en) 2019-11-15 2022-06-07 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11260976B2 (en) 2019-11-15 2022-03-01 General Electric Company System for reducing thermal stresses in a leading edge of a high speed vehicle
US11427330B2 (en) 2019-11-15 2022-08-30 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11745847B2 (en) 2020-12-08 2023-09-05 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11407488B2 (en) 2020-12-14 2022-08-09 General Electric Company System and method for cooling a leading edge of a high speed vehicle
US11577817B2 (en) 2021-02-11 2023-02-14 General Electric Company System and method for cooling a leading edge of a high speed vehicle

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Also Published As

Publication number Publication date
US6233150B1 (en) 2001-05-15

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model