TW377462B - Substrate processing apparatus - Google Patents
Substrate processing apparatusInfo
- Publication number
- TW377462B TW377462B TW086118110A TW86118110A TW377462B TW 377462 B TW377462 B TW 377462B TW 086118110 A TW086118110 A TW 086118110A TW 86118110 A TW86118110 A TW 86118110A TW 377462 B TW377462 B TW 377462B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid processing
- substrate
- external casing
- clamping arm
- processing apparatus
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32316696A JP3566475B2 (ja) | 1996-12-03 | 1996-12-03 | 処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW377462B true TW377462B (en) | 1999-12-21 |
Family
ID=18151823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086118110A TW377462B (en) | 1996-12-03 | 1997-12-02 | Substrate processing apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US5960225A (zh) |
JP (1) | JP3566475B2 (zh) |
KR (1) | KR100497299B1 (zh) |
SG (1) | SG67448A1 (zh) |
TW (1) | TW377462B (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW417148B (en) * | 1998-07-02 | 2001-01-01 | Tokyo Electron Ltd | Process solution supplying apparatus and fluid passageway opening-closing valve device for process solution supplying apparatus |
US6092937A (en) * | 1999-01-08 | 2000-07-25 | Fastar, Ltd. | Linear developer |
US6692572B1 (en) * | 1999-09-13 | 2004-02-17 | Precision Valve & Automation, Inc. | Active compensation metering system |
US6514344B2 (en) * | 1999-12-16 | 2003-02-04 | Tokyo Electron Limited | Film forming unit |
US6250822B1 (en) | 2000-02-04 | 2001-06-26 | Advanced Micro Device, Inc. | Semiconductor wafer manufacturing method and apparatus for an improved heat exchanger for a photoresist developer |
US6626996B1 (en) * | 2000-03-14 | 2003-09-30 | Pizza Hut, Inc. | Pizza sauce dispensing devices and methods |
US6368985B1 (en) * | 2000-05-30 | 2002-04-09 | Advanced Micro Devices, Inc. | Dual track/stepper interface configuration for wafer processing |
JP3585217B2 (ja) * | 2000-07-03 | 2004-11-04 | 東京エレクトロン株式会社 | 基板処理装置 |
JP3752136B2 (ja) * | 2000-08-14 | 2006-03-08 | 東京エレクトロン株式会社 | 現像処理装置および現像処理方法 |
US6379056B1 (en) | 2000-09-12 | 2002-04-30 | Tokyo Electron Limited | Substrate processing apparatus |
JP3754322B2 (ja) * | 2001-05-24 | 2006-03-08 | 東京エレクトロン株式会社 | 塗布膜形成方法及びその装置 |
US6559072B2 (en) | 2001-08-30 | 2003-05-06 | Micron Technology, Inc. | Develop processing method of a resist surface of a substrate for reduced processing time and reduced defect density |
US7396412B2 (en) * | 2004-12-22 | 2008-07-08 | Sokudo Co., Ltd. | Coat/develop module with shared dispense |
JP4842280B2 (ja) * | 2004-12-22 | 2011-12-21 | 株式会社Sokudo | 共有分配を伴うコート/現像モジュール |
US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
US7699021B2 (en) | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
US7694688B2 (en) | 2007-01-05 | 2010-04-13 | Applied Materials, Inc. | Wet clean system design |
US7950407B2 (en) * | 2007-02-07 | 2011-05-31 | Applied Materials, Inc. | Apparatus for rapid filling of a processing volume |
KR101036592B1 (ko) * | 2008-11-28 | 2011-05-24 | 세메스 주식회사 | 처리액 공급 유닛과, 이를 이용한 기판 처리 장치 |
JP4941570B2 (ja) * | 2010-03-04 | 2012-05-30 | 東京エレクトロン株式会社 | 液処理装置、液処理方法及び記憶媒体 |
US20150050105A1 (en) * | 2012-04-26 | 2015-02-19 | Applied Materials, Inc. | Vapor dryer module with reduced particle generation |
JP6447354B2 (ja) * | 2014-07-23 | 2019-01-09 | 東京エレクトロン株式会社 | 現像装置 |
DE102017212887A1 (de) * | 2017-07-26 | 2019-01-31 | Gebr. Schmid Gmbh | Verfahren, Vorrichtung und Anlage zur Leiterplattenherstellung |
JP2022124070A (ja) * | 2021-02-15 | 2022-08-25 | 株式会社Screenホールディングス | 基板処理装置、および、筒状ガードの加工方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58124241A (ja) * | 1982-01-21 | 1983-07-23 | Nec Corp | 半導体基板現像装置 |
US5002008A (en) * | 1988-05-27 | 1991-03-26 | Tokyo Electron Limited | Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state |
JP2843134B2 (ja) * | 1990-09-07 | 1999-01-06 | 東京エレクトロン株式会社 | 塗布装置および塗布方法 |
US5489337A (en) * | 1993-01-28 | 1996-02-06 | Kabushiki Kaisha Toshiba | Apparatus for applying organic material to semiconductor wafer in which the nozzle opening adjusts in response to data |
JP3299338B2 (ja) * | 1993-04-28 | 2002-07-08 | 東京エレクトロン株式会社 | 真空処理装置 |
DE634699T1 (de) * | 1993-07-16 | 1996-02-15 | Semiconductor Systems Inc | Gruppiertes fotolithografisches System. |
JP3122868B2 (ja) * | 1994-09-29 | 2001-01-09 | 東京エレクトロン株式会社 | 塗布装置 |
TW297910B (zh) * | 1995-02-02 | 1997-02-11 | Tokyo Electron Co Ltd |
-
1996
- 1996-12-03 JP JP32316696A patent/JP3566475B2/ja not_active Expired - Lifetime
-
1997
- 1997-12-02 SG SG1997004219A patent/SG67448A1/en unknown
- 1997-12-02 TW TW086118110A patent/TW377462B/zh active
- 1997-12-03 US US08/984,082 patent/US5960225A/en not_active Expired - Lifetime
- 1997-12-03 KR KR1019970065614A patent/KR100497299B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
SG67448A1 (en) | 1999-09-21 |
JP3566475B2 (ja) | 2004-09-15 |
KR19980063755A (ko) | 1998-10-07 |
US5960225A (en) | 1999-09-28 |
JPH10163293A (ja) | 1998-06-19 |
KR100497299B1 (ko) | 2005-09-20 |
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