TW377462B - Substrate processing apparatus - Google Patents

Substrate processing apparatus

Info

Publication number
TW377462B
TW377462B TW086118110A TW86118110A TW377462B TW 377462 B TW377462 B TW 377462B TW 086118110 A TW086118110 A TW 086118110A TW 86118110 A TW86118110 A TW 86118110A TW 377462 B TW377462 B TW 377462B
Authority
TW
Taiwan
Prior art keywords
liquid processing
substrate
external casing
clamping arm
processing apparatus
Prior art date
Application number
TW086118110A
Other languages
English (en)
Inventor
Akihiro Fujimoto
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TW377462B publication Critical patent/TW377462B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
TW086118110A 1996-12-03 1997-12-02 Substrate processing apparatus TW377462B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32316696A JP3566475B2 (ja) 1996-12-03 1996-12-03 処理装置

Publications (1)

Publication Number Publication Date
TW377462B true TW377462B (en) 1999-12-21

Family

ID=18151823

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086118110A TW377462B (en) 1996-12-03 1997-12-02 Substrate processing apparatus

Country Status (5)

Country Link
US (1) US5960225A (zh)
JP (1) JP3566475B2 (zh)
KR (1) KR100497299B1 (zh)
SG (1) SG67448A1 (zh)
TW (1) TW377462B (zh)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW417148B (en) * 1998-07-02 2001-01-01 Tokyo Electron Ltd Process solution supplying apparatus and fluid passageway opening-closing valve device for process solution supplying apparatus
US6092937A (en) * 1999-01-08 2000-07-25 Fastar, Ltd. Linear developer
US6692572B1 (en) * 1999-09-13 2004-02-17 Precision Valve & Automation, Inc. Active compensation metering system
US6514344B2 (en) * 1999-12-16 2003-02-04 Tokyo Electron Limited Film forming unit
US6250822B1 (en) 2000-02-04 2001-06-26 Advanced Micro Device, Inc. Semiconductor wafer manufacturing method and apparatus for an improved heat exchanger for a photoresist developer
US6626996B1 (en) * 2000-03-14 2003-09-30 Pizza Hut, Inc. Pizza sauce dispensing devices and methods
US6368985B1 (en) * 2000-05-30 2002-04-09 Advanced Micro Devices, Inc. Dual track/stepper interface configuration for wafer processing
JP3585217B2 (ja) * 2000-07-03 2004-11-04 東京エレクトロン株式会社 基板処理装置
JP3752136B2 (ja) * 2000-08-14 2006-03-08 東京エレクトロン株式会社 現像処理装置および現像処理方法
US6379056B1 (en) 2000-09-12 2002-04-30 Tokyo Electron Limited Substrate processing apparatus
JP3754322B2 (ja) * 2001-05-24 2006-03-08 東京エレクトロン株式会社 塗布膜形成方法及びその装置
US6559072B2 (en) 2001-08-30 2003-05-06 Micron Technology, Inc. Develop processing method of a resist surface of a substrate for reduced processing time and reduced defect density
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
JP4842280B2 (ja) * 2004-12-22 2011-12-21 株式会社Ｓｏｋｕｄｏ 共有分配を伴うコート／現像モジュール
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
KR101036592B1 (ko) * 2008-11-28 2011-05-24 세메스 주식회사 처리액 공급 유닛과, 이를 이용한 기판 처리 장치
JP4941570B2 (ja) * 2010-03-04 2012-05-30 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
US20150050105A1 (en) * 2012-04-26 2015-02-19 Applied Materials, Inc. Vapor dryer module with reduced particle generation
JP6447354B2 (ja) * 2014-07-23 2019-01-09 東京エレクトロン株式会社 現像装置
DE102017212887A1 (de) * 2017-07-26 2019-01-31 Gebr. Schmid Gmbh Verfahren, Vorrichtung und Anlage zur Leiterplattenherstellung
JP2022124070A (ja) * 2021-02-15 2022-08-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、筒状ガードの加工方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58124241A (ja) * 1982-01-21 1983-07-23 Nec Corp 半導体基板現像装置
US5002008A (en) * 1988-05-27 1991-03-26 Tokyo Electron Limited Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state
JP2843134B2 (ja) * 1990-09-07 1999-01-06 東京エレクトロン株式会社 塗布装置および塗布方法
US5489337A (en) * 1993-01-28 1996-02-06 Kabushiki Kaisha Toshiba Apparatus for applying organic material to semiconductor wafer in which the nozzle opening adjusts in response to data
JP3299338B2 (ja) * 1993-04-28 2002-07-08 東京エレクトロン株式会社 真空処理装置
DE634699T1 (de) * 1993-07-16 1996-02-15 Semiconductor Systems Inc Gruppiertes fotolithografisches System.
JP3122868B2 (ja) * 1994-09-29 2001-01-09 東京エレクトロン株式会社 塗布装置
TW297910B (zh) * 1995-02-02 1997-02-11 Tokyo Electron Co Ltd

Also Published As

Publication number Publication date
SG67448A1 (en) 1999-09-21
JP3566475B2 (ja) 2004-09-15
KR19980063755A (ko) 1998-10-07
US5960225A (en) 1999-09-28
JPH10163293A (ja) 1998-06-19
KR100497299B1 (ko) 2005-09-20

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