TW374770B - Method for depositing substituted fluorocarbon polymeric layers - Google Patents

Method for depositing substituted fluorocarbon polymeric layers

Info

Publication number
TW374770B
TW374770B TW086109259A TW86109259A TW374770B TW 374770 B TW374770 B TW 374770B TW 086109259 A TW086109259 A TW 086109259A TW 86109259 A TW86109259 A TW 86109259A TW 374770 B TW374770 B TW 374770B
Authority
TW
Taiwan
Prior art keywords
depositing
fluorocarbon polymeric
substituted fluorocarbon
polymeric layers
substrate
Prior art date
Application number
TW086109259A
Other languages
English (en)
Inventor
Mark A Logan
Original Assignee
Novellus Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novellus Systems Inc filed Critical Novellus Systems Inc
Application granted granted Critical
Publication of TW374770B publication Critical patent/TW374770B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/62—Plasma-deposition of organic layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Chemical Vapour Deposition (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Physical Vapour Deposition (AREA)
TW086109259A 1996-07-03 1997-07-01 Method for depositing substituted fluorocarbon polymeric layers TW374770B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/675,664 US5759635A (en) 1996-07-03 1996-07-03 Method for depositing substituted fluorocarbon polymeric layers

Publications (1)

Publication Number Publication Date
TW374770B true TW374770B (en) 1999-11-21

Family

ID=24711484

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086109259A TW374770B (en) 1996-07-03 1997-07-01 Method for depositing substituted fluorocarbon polymeric layers

Country Status (6)

Country Link
US (1) US5759635A (zh)
EP (1) EP0815953A3 (zh)
JP (1) JP3219379B2 (zh)
KR (1) KR100294816B1 (zh)
SG (1) SG53005A1 (zh)
TW (1) TW374770B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6243112B1 (en) 1996-07-01 2001-06-05 Xerox Corporation High density remote plasma deposited fluoropolymer films
SG53005A1 (en) * 1996-07-03 1998-09-28 Novellus Systems Inc Method for depositing substituted fluorcarbon polymeric layers
JP3773340B2 (ja) * 1996-12-18 2006-05-10 大日本印刷株式会社 低屈折率ＳｉＯ２ 膜及びその製造方法
TW417249B (en) * 1997-05-14 2001-01-01 Applied Materials Inc Reliability barrier integration for cu application
FR2792003B1 (fr) * 1999-04-09 2001-06-01 Saint Gobain Vitrage Substrat transparent comportant un revetement hydrophobe/ oleophobe forme par cvd plasma
US6524360B2 (en) 2000-02-15 2003-02-25 Hollingsworth & Vose Company Melt blown composite HEPA filter media and vacuum bag
US6566263B1 (en) 2000-08-02 2003-05-20 Taiwan Semiconductor Manufacturing Company Method of forming an HDP CVD oxide layer over a metal line structure for high aspect ratio design rule
JP2004526318A (ja) * 2001-03-23 2004-08-26 ダウ・コーニング・コーポレイション 水素化シリコンオキシカーバイド膜を生産するための方法
WO2002089956A1 (en) * 2001-05-02 2002-11-14 Hollingsworth & Vose Company Filter media with enhanced stiffness and increased dust holding capacity
US20030203696A1 (en) * 2002-04-30 2003-10-30 Healey David Thomas High efficiency ashrae filter media
US6869818B2 (en) * 2002-11-18 2005-03-22 Redwood Microsystems, Inc. Method for producing and testing a corrosion-resistant channel in a silicon device
EP1670298A1 (en) * 2004-12-07 2006-06-14 Samsung SDI Germany GmbH Substrate for a display and method for manufacturing the same
JP5074059B2 (ja) * 2007-02-28 2012-11-14 東京エレクトロン株式会社 層間絶縁膜および配線構造と、それらの製造方法
KR20100081115A (ko) 2009-01-05 2010-07-14 주식회사 만도 디스크 브레이크
US20100212272A1 (en) * 2009-02-24 2010-08-26 Hollingsworth & Vose Company Filter media suitable for ashrae applications
EP2788433A1 (en) * 2011-12-05 2014-10-15 Solvay SA Use of atmospheric plasma for the surface of inorganic particles and inorganic particles comprising an organic fluorine-containing surface modification
TWI627192B (zh) * 2015-03-13 2018-06-21 村田製作所股份有限公司 Atomic layer deposition inhibiting material
US9899291B2 (en) * 2015-07-13 2018-02-20 Asm Ip Holding B.V. Method for protecting layer by forming hydrocarbon-based extremely thin film
CN106906456B (zh) * 2017-01-23 2018-04-20 江苏菲沃泰纳米科技有限公司 一种交联度可控的涂层的制备方法
CN107177835B (zh) * 2017-05-21 2018-06-19 江苏菲沃泰纳米科技有限公司 一种循环大占空比脉冲放电制备多功能性纳米防护涂层的方法
US10985009B2 (en) 2018-04-27 2021-04-20 Applied Materials, Inc. Methods to deposit flowable (gap-fill) carbon containing films using various plasma sources

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3205345A1 (de) * 1982-02-15 1983-09-01 Philips Patentverwaltung Gmbh, 2000 Hamburg "verfahren zur herstellung von fluordotierten lichtleitfasern"
US4557945A (en) * 1982-06-07 1985-12-10 Toshiharu Yagi Process for fluorination by inorganic fluorides in glow discharge
US4981713A (en) * 1990-02-14 1991-01-01 E. I. Du Pont De Nemours And Company Low temperature plasma technology for corrosion protection of steel
US5156919A (en) * 1990-04-03 1992-10-20 Segate Technology, Inc. Fluorocarbon coated magnesium alloy carriage and method of coating a magnesium alloy shaped part
JPH06101462B2 (ja) * 1991-04-30 1994-12-12 インターナショナル・ビジネス・マシーンズ・コーポレイション 過フッ化炭化水素ポリマ膜を基板に接着する方法および 基板
US5244730A (en) * 1991-04-30 1993-09-14 International Business Machines Corporation Plasma deposition of fluorocarbon
US5230929A (en) * 1992-07-20 1993-07-27 Dow Corning Corporation Plasma-activated chemical vapor deposition of fluoridated cyclic siloxanes
JPH07254592A (ja) * 1994-03-16 1995-10-03 Fujitsu Ltd 半導体装置の製造方法
JP3482725B2 (ja) * 1995-02-23 2004-01-06 東亞合成株式会社 フッ素含有シリコン酸化膜の製造方法
SG53005A1 (en) * 1996-07-03 1998-09-28 Novellus Systems Inc Method for depositing substituted fluorcarbon polymeric layers

Also Published As

Publication number Publication date
JP3219379B2 (ja) 2001-10-15
SG53005A1 (en) 1998-09-28
KR100294816B1 (ko) 2001-07-12
EP0815953A2 (en) 1998-01-07
US5759635A (en) 1998-06-02
EP0815953A3 (en) 2002-07-31
KR980009508A (ko) 1998-04-30
JPH10107023A (ja) 1998-04-24

Similar Documents

Publication Publication Date Title
TW374770B (en) Method for depositing substituted fluorocarbon polymeric layers
EP1340835A3 (en) Object coated with carbon film and method of manufacturing the same
TW335531B (en) Gapfill and planarization process for shallow trench isolation
TW376545B (en) Method of producing silicon layer having surface controlling to be even
TW366553B (en) Manufacturing method for capacitor of semiconductor device
GB2346898A (en) Deposition of a siloxane containing polymer
TW343375B (en) Low dielectric constant silicon dioxide sandwich layer
TW368688B (en) Method and apparatus for plasma-assisted film deposition
TW350135B (en) Semiconductor device and method of manufacturing the same the invention relates to a semiconductor device and method of manufacturing the same
TW200708174A (en) Film formation apparatus and film formation method
CA2155928A1 (en) Plastic articles of reduced gas transmission and method therefor
CA2121423A1 (en) Process for Barrier Coating of Plastic Objects
EP1382723A3 (en) Method of organic film deposition
TW347363B (en) Method for improving demolding effect of a mold by a low temperature plasma process
ZA945929B (en) Hydrophilic films by plasma polymerisation
EP0785579A4 (en) FIXED DIELECTRIC CAPACITOR AND METHOD FOR THE PRODUCTION THEREOF
CA2152769A1 (en) Synthesizing diamond film
TW368681B (en) Method for forming barrier metal film
TW353194B (en) Coated deposition chamber equipment
WO1997011481A3 (de) Dotierverfahren zur herstellung von homoübergängen in halbleitersubstraten
MY119325A (en) Method of manufacturing bi-layered ferroelectric thin film
TW349241B (en) Method for producing semiconductor device
AU3167097A (en) A method of modifying the surface of a solid polymer substrate and the product obtained
WO2001004929A3 (en) A method of forming a film in a chamber
TW351770B (en) Shield layer, method for forming shield layer and producing substrate