TW374044B - A wafer carrier assembly for chem-mech polishing - Google Patents

A wafer carrier assembly for chem-mech polishing

Info

Publication number
TW374044B
TW374044B TW087100196A TW87100196A TW374044B TW 374044 B TW374044 B TW 374044B TW 087100196 A TW087100196 A TW 087100196A TW 87100196 A TW87100196 A TW 87100196A TW 374044 B TW374044 B TW 374044B
Authority
TW
Taiwan
Prior art keywords
carrier assembly
wafer carrier
chem
fluid
mech polishing
Prior art date
Application number
TW087100196A
Other languages
English (en)
Inventor
Thomas R Fisher Jr
Carol E Gustafson
Michael F Lofaro
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW374044B publication Critical patent/TW374044B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW087100196A 1997-06-19 1998-01-08 A wafer carrier assembly for chem-mech polishing TW374044B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/878,567 US6030487A (en) 1997-06-19 1997-06-19 Wafer carrier assembly

Publications (1)

Publication Number Publication Date
TW374044B true TW374044B (en) 1999-11-11

Family

ID=25372299

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087100196A TW374044B (en) 1997-06-19 1998-01-08 A wafer carrier assembly for chem-mech polishing

Country Status (6)

Country Link
US (1) US6030487A (zh)
JP (1) JP2962412B2 (zh)
KR (1) KR100370245B1 (zh)
MY (1) MY115584A (zh)
SG (1) SG67515A1 (zh)
TW (1) TW374044B (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6572453B1 (en) * 1998-09-29 2003-06-03 Applied Materials, Inc. Multi-fluid polishing process
US6429131B2 (en) * 1999-03-18 2002-08-06 Infineon Technologies Ag CMP uniformity
US6300247B2 (en) * 1999-03-29 2001-10-09 Applied Materials, Inc. Preconditioning polishing pads for chemical-mechanical polishing
US6302771B1 (en) * 1999-04-01 2001-10-16 Philips Semiconductor, Inc. CMP pad conditioner arrangement and method therefor
US6225224B1 (en) * 1999-05-19 2001-05-01 Infineon Technologies Norht America Corp. System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer
US6196900B1 (en) * 1999-09-07 2001-03-06 Vlsi Technology, Inc. Ultrasonic transducer slurry dispenser
JP2001113455A (ja) * 1999-10-14 2001-04-24 Sony Corp 化学的機械研磨装置及び方法
JP2001237208A (ja) 2000-02-24 2001-08-31 Ebara Corp 研磨装置の研磨面洗浄方法及び洗浄装置
WO2001091973A1 (en) * 2000-05-31 2001-12-06 Philips Semiconductors, Inc. Method and apparatus for dispensing slurry at the point of polish
US6409579B1 (en) 2000-05-31 2002-06-25 Koninklijke Philips Electronics N.V. Method and apparatus for conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish
US6872329B2 (en) 2000-07-28 2005-03-29 Applied Materials, Inc. Chemical mechanical polishing composition and process
US6454637B1 (en) 2000-09-26 2002-09-24 Lam Research Corporation Edge instability suppressing device and system
JP3797861B2 (ja) * 2000-09-27 2006-07-19 株式会社荏原製作所 ポリッシング装置
FR2838365B1 (fr) * 2002-04-11 2004-12-10 Soitec Silicon On Insulator Machine de polissage mecanico-chimique d'une plaquette de materiau et dispositif de distribution d'abrasif equipant une telle machine
CN1914004B (zh) * 2004-01-26 2010-06-02 Tbw工业有限公司 用于化学机械平面化的多步骤、原位垫修整方法
JP2005340328A (ja) * 2004-05-25 2005-12-08 Fujitsu Ltd 半導体装置の製造方法
US20140323017A1 (en) * 2013-04-24 2014-10-30 Applied Materials, Inc. Methods and apparatus using energized fluids to clean chemical mechanical planarization polishing pads
CN106098865B (zh) * 2016-06-27 2018-11-09 山东浪潮华光光电子股份有限公司 一种改善led用蓝宝石衬底研磨掉边的方法
JP1651623S (zh) * 2019-07-18 2020-01-27

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4098031A (en) * 1977-01-26 1978-07-04 Bell Telephone Laboratories, Incorporated Method for lapping semiconductor material
US4141180A (en) * 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
DE3132028A1 (de) * 1981-08-13 1983-03-03 Roehm Gmbh Verbesserte polierteller zum polieren von kunststoffoberflaechen
JPS6114855A (ja) * 1984-06-28 1986-01-23 Toshiba Mach Co Ltd ポリシング装置
US4850157A (en) * 1987-11-23 1989-07-25 Magnetic Peripherals Inc. Apparatus for guiding the flow of abrasive slurry over a lapping surface
US4910155A (en) * 1988-10-28 1990-03-20 International Business Machines Corporation Wafer flood polishing
US4954142A (en) * 1989-03-07 1990-09-04 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5554064A (en) * 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
US5456627A (en) * 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
JPH07223162A (ja) * 1994-02-04 1995-08-22 Sony Corp 研磨布のドレッシング方法及びその装置
US5650039A (en) * 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
JP3465425B2 (ja) * 1995-07-25 2003-11-10 アイシン精機株式会社 シートスライド装置
US5575706A (en) * 1996-01-11 1996-11-19 Taiwan Semiconductor Manufacturing Company Ltd. Chemical/mechanical planarization (CMP) apparatus and polish method
KR100202659B1 (ko) * 1996-07-09 1999-06-15 구본준 반도체웨이퍼의 기계화학적 연마장치

Also Published As

Publication number Publication date
JPH1110524A (ja) 1999-01-19
SG67515A1 (en) 1999-09-21
JP2962412B2 (ja) 1999-10-12
MY115584A (en) 2003-07-31
US6030487A (en) 2000-02-29
KR19990006434A (ko) 1999-01-25
KR100370245B1 (ko) 2003-04-07

Similar Documents

Publication Publication Date Title
TW374044B (en) A wafer carrier assembly for chem-mech polishing
AU2003274812A8 (en) Method for chemical mechanical polishing (cmp) of low-k dielectric materials
MY120573A (en) Slurry comprising a ligand or chelating agent for polishing a surface.
TW200706307A (en) Semiconductor wafer peripheral edge polisher and method therefor
AU5148198A (en) Method for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing pad
MY128145A (en) In-situ method and apparatus for end point detection in chemical mechanical polishing
ATE168306T1 (de) Vorrichtung zum chemisch-mechanischen polieren mit verbesserter verteilung der polierzusammensetzung
WO2005072338A3 (en) Multi-step pad conditioningh system and method for chemical planarization
SG163546A1 (en) Use of cmp for aluminum mirror and solar cell fabrication
ATE288948T1 (de) Schleifzusammensetzung enthaltend einen inhibitor für das ätzen von wolfram
AU2003263536A8 (en) Cmp method utilizing amphiphilic non-ionic surfactants
TW428225B (en) A method of polishing a surface of a substrate, a method of manufacturing semiconductor device, and an apparatus of manufacturing the same
WO2004013242A3 (en) Polishing slurry system and metal poslishing and removal process
EP1566421A3 (en) CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate.
EP1018400A3 (en) Planarization apparatus and method
WO2002044293A3 (en) Method and composition for the removal of residual materials during substrate planarization
DE60029437D1 (de) Verfahren zum reinigen eines chemisch-mechanischen polierkissens
KR970061445A (ko) 웨이퍼 및 기판의 재생방법 및 장치
ATE512758T1 (de) Spülen nach einem auf einen wafer angewandten chemisch-mechanischen planarisierungsprozess
WO2001024969A3 (en) Fluid dispensing fixed abrasive polishing pad
EP0842738A3 (en) Method of and apparatus for polishing and cleaning planar workpiece
TW474852B (en) Method and apparatus for polishing workpieces
MY121626A (en) Chemical mechanical polishing process for layers of isolating materials based on silicon derivatives or silicon
JP2007123523A5 (zh)
US6227948B1 (en) Polishing pad reconditioning via polishing pad material as conditioner

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees