TW373252B - Exposure method, exposure apparatus and method of producing exposure apparatus - Google Patents

Exposure method, exposure apparatus and method of producing exposure apparatus

Info

Publication number
TW373252B
TW373252B TW087104443A TW87104443A TW373252B TW 373252 B TW373252 B TW 373252B TW 087104443 A TW087104443 A TW 087104443A TW 87104443 A TW87104443 A TW 87104443A TW 373252 B TW373252 B TW 373252B
Authority
TW
Taiwan
Prior art keywords
substance
exposure
exposure apparatus
sensitization
producing
Prior art date
Application number
TW087104443A
Other languages
English (en)
Inventor
Naoyuki Yamamoto
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Application granted granted Critical
Publication of TW373252B publication Critical patent/TW373252B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW087104443A 1997-03-26 1998-03-25 Exposure method, exposure apparatus and method of producing exposure apparatus TW373252B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9091461A JPH10270305A (ja) 1997-03-26 1997-03-26 露光方法

Publications (1)

Publication Number Publication Date
TW373252B true TW373252B (en) 1999-11-01

Family

ID=14027022

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087104443A TW373252B (en) 1997-03-26 1998-03-25 Exposure method, exposure apparatus and method of producing exposure apparatus

Country Status (4)

Country Link
EP (1) EP0867776A3 (zh)
JP (1) JPH10270305A (zh)
KR (1) KR19980080650A (zh)
TW (1) TW373252B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2076099A (en) * 1998-01-29 1999-08-16 Nikon Corporation Exposure method and device
JP4250637B2 (ja) 2006-06-14 2009-04-08 キヤノン株式会社 走査露光装置及びデバイス製造方法
US9304412B2 (en) * 2007-08-24 2016-04-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2704734B2 (ja) * 1988-09-05 1998-01-26 キヤノン株式会社 ステージ位置決め補正方法及び装置
JPH03101409U (zh) * 1990-02-05 1991-10-23
JPH04179115A (ja) * 1990-11-08 1992-06-25 Nec Kyushu Ltd 縮小投影露光装置
JP3255297B2 (ja) * 1992-01-17 2002-02-12 株式会社ニコン 露光方法及び装置、並びに半導体素子の製造方法
JP3218466B2 (ja) * 1992-03-30 2001-10-15 株式会社ニコン 露光方法及び装置
US5461237A (en) * 1993-03-26 1995-10-24 Nikon Corporation Surface-position setting apparatus
JPH06310397A (ja) * 1993-04-23 1994-11-04 Hitachi Ltd 投影露光装置の露光像面測定装置
JP3572430B2 (ja) * 1994-11-29 2004-10-06 株式会社ニコン 露光方法及びその装置
JPH1070065A (ja) * 1996-08-27 1998-03-10 Nikon Corp 露光装置
JPH1074687A (ja) * 1996-08-29 1998-03-17 Nikon Corp ステージ装置
KR19980019031A (ko) * 1996-08-27 1998-06-05 고노 시게오 스테이지 장치(a stage apparatus)
JPH10177950A (ja) * 1996-12-16 1998-06-30 Nikon Corp ステージ装置及び投影光学装置

Also Published As

Publication number Publication date
KR19980080650A (ko) 1998-11-25
EP0867776A3 (en) 2000-02-23
EP0867776A2 (en) 1998-09-30
JPH10270305A (ja) 1998-10-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees