TW373250B - Cutting into plurality of drawing sketch field to produce high precision electric load beam sketch data method - Google Patents

Cutting into plurality of drawing sketch field to produce high precision electric load beam sketch data method

Info

Publication number
TW373250B
TW373250B TW086116236A TW86116236A TW373250B TW 373250 B TW373250 B TW 373250B TW 086116236 A TW086116236 A TW 086116236A TW 86116236 A TW86116236 A TW 86116236A TW 373250 B TW373250 B TW 373250B
Authority
TW
Taiwan
Prior art keywords
image
sketch
data
basic image
electric load
Prior art date
Application number
TW086116236A
Other languages
English (en)
Inventor
Hironobu Taoka
Koichi Moriizumi
Kinya Kamiyama
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW373250B publication Critical patent/TW373250B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/302—Controlling tubes by external information, e.g. programme control
    • H01J37/3023—Programme control
    • H01J37/3026—Patterning strategy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31761—Patterning strategy
    • H01J2237/31762—Computer and memory organisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31761—Patterning strategy
    • H01J2237/31764—Dividing into sub-patterns

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electron Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
TW086116236A 1996-12-06 1997-10-29 Cutting into plurality of drawing sketch field to produce high precision electric load beam sketch data method TW373250B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32708396 1996-12-06
JP13494797A JPH10223526A (ja) 1996-12-06 1997-05-26 荷電ビーム描画データ作成装置および方法ならびに荷電ビーム描画データ作成方法をコンピュータに実行させるためのプログラムを記録した機械可読な記憶媒体

Publications (1)

Publication Number Publication Date
TW373250B true TW373250B (en) 1999-11-01

Family

ID=26468930

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086116236A TW373250B (en) 1996-12-06 1997-10-29 Cutting into plurality of drawing sketch field to produce high precision electric load beam sketch data method

Country Status (4)

Country Link
US (1) US6088520A (zh)
JP (1) JPH10223526A (zh)
KR (1) KR100258170B1 (zh)
TW (1) TW373250B (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000020564A (ja) * 1998-06-29 2000-01-21 Mitsubishi Electric Corp レイアウトパターンデータ補正装置、レイアウトパターンデータ補正方法、その補正方法を用いた半導体装置の製造方法、および、半導体装置の製造プログラムを記録した記録媒体
US7320104B2 (en) 2000-02-12 2008-01-15 Adobe Systems Incorporated Text grid creation tools
US7071941B2 (en) * 2000-02-12 2006-07-04 Adobe Systems Incorporated Method for calculating CJK emboxes in fonts
US7305617B2 (en) * 2000-02-12 2007-12-04 Adobe Systems Incorporated Method for aligning text to baseline grids and to CJK character grids
US6993709B1 (en) * 2000-02-12 2006-01-31 Adobe Systems Incorporated Smart corner move snapping
US6622295B1 (en) * 2000-07-05 2003-09-16 Dupont Photomasks, Inc. Network-based photomask data entry interface and instruction generator for manufacturing photomasks
JP4101491B2 (ja) * 2000-09-25 2008-06-18 アドビ システムズ， インコーポレイテッド 合成フォント編集装置、合成フォント編集プログラム及びそれを記録した記録媒体
US7168037B2 (en) * 2000-09-25 2007-01-23 Adobe Systems Incorporated Text composition spacing amount setting device with icon indicators
US6928611B2 (en) * 2000-09-25 2005-08-09 Adobe Systems Incorporated Setting text composition spacing amount
US7296227B2 (en) 2001-02-12 2007-11-13 Adobe Systems Incorporated Determining line leading in accordance with traditional Japanese practices
JP2003045780A (ja) * 2001-07-30 2003-02-14 Nec Corp マスク描画データの作成方法
US7167274B2 (en) * 2001-09-28 2007-01-23 Adobe Systems Incorporated Line leading from an arbitrary point
US7039862B2 (en) 2002-05-10 2006-05-02 Adobe Systems Incorporated Text spacing adjustment
US7123261B2 (en) * 2002-12-26 2006-10-17 Adobe Systems Incorporated Coordinating grid tracking and mojikumi spacing of Japanese text
US20040125107A1 (en) * 2002-12-26 2004-07-01 Mccully Nathaniel M. Coordinating grid tracking and mojikumi spacing of Japanese text
US7594171B2 (en) 2004-10-01 2009-09-22 Adobe Systems Incorporated Rule-based text layout
JP4566772B2 (ja) * 2005-02-14 2010-10-20 キヤノン株式会社 画像処理装置、画像処理方法、及びプログラム
JP4877959B2 (ja) * 2006-09-25 2012-02-15 富士通セミコンダクター株式会社 電子線露光用データ作成方法、電子線露光方法、半導体装置の製造方法及び電子線露光装置
JP5068549B2 (ja) * 2007-01-23 2012-11-07 株式会社ニューフレアテクノロジー 描画データの作成方法及びレイアウトデータファイルの作成方法
JP5309930B2 (ja) * 2008-11-28 2013-10-09 大日本印刷株式会社 描画データ作成プログラム、描画データ作成方法、描画データ作成装置、描画システム
JP5403603B2 (ja) * 2009-05-28 2014-01-29 株式会社ニューフレアテクノロジー 描画装置の描画エラー検証方法及び描画装置の描画エラー検証用データの作成装置
JP2018170448A (ja) * 2017-03-30 2018-11-01 株式会社ニューフレアテクノロジー 描画データ作成方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5366847A (en) * 1992-02-24 1994-11-22 Trw Inc. Method and apparatus for optimizing semiconductor exposure process
EP0608657A1 (en) * 1993-01-29 1994-08-03 International Business Machines Corporation Apparatus and method for preparing shape data for proximity correction
US5481472A (en) * 1993-05-18 1996-01-02 International Business Machines Corporation Method and apparatus for automatically recognizing repeated shapes for data compaction
JP3549282B2 (ja) * 1995-04-28 2004-08-04 株式会社ルネサステクノロジ 荷電ビーム描画データ作成方法およびその作成装置
JP3334441B2 (ja) * 1995-08-01 2002-10-15 ソニー株式会社 フォトマスク描画用パターンデータ補正方法と補正装置
US5740068A (en) * 1996-05-30 1998-04-14 International Business Machines Corporation Fidelity enhancement of lithographic and reactive-ion-etched images by optical proximity correction

Also Published As

Publication number Publication date
JPH10223526A (ja) 1998-08-21
KR19980063588A (ko) 1998-10-07
KR100258170B1 (ko) 2000-06-01
US6088520A (en) 2000-07-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees