TW373034B - Automatic plating method and apparatus thereof - Google Patents

Automatic plating method and apparatus thereof

Info

Publication number
TW373034B
TW373034B TW087114875A TW87114875A TW373034B TW 373034 B TW373034 B TW 373034B TW 087114875 A TW087114875 A TW 087114875A TW 87114875 A TW87114875 A TW 87114875A TW 373034 B TW373034 B TW 373034B
Authority
TW
Taiwan
Prior art keywords
plating
tank
height
liquid
plating method
Prior art date
Application number
TW087114875A
Other languages
English (en)
Inventor
Kazuo Ohba
Original Assignee
Kazuo Ohba
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP09298572A external-priority patent/JP3083138B2/ja
Priority claimed from JP18391498A external-priority patent/JP2969104B1/ja
Application filed by Kazuo Ohba filed Critical Kazuo Ohba
Application granted granted Critical
Publication of TW373034B publication Critical patent/TW373034B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
TW087114875A 1997-10-30 1998-09-08 Automatic plating method and apparatus thereof TW373034B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP09298572A JP3083138B2 (ja) 1997-10-30 1997-10-30 自動めっき方法および装置
JP18391498A JP2969104B1 (ja) 1998-06-30 1998-06-30 連続メッキ槽

Publications (1)

Publication Number Publication Date
TW373034B true TW373034B (en) 1999-11-01

Family

ID=26502177

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087114875A TW373034B (en) 1997-10-30 1998-09-08 Automatic plating method and apparatus thereof

Country Status (3)

Country Link
US (1) US6071387A (zh)
KR (1) KR100312038B1 (zh)
TW (1) TW373034B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004064039A (ja) * 2002-06-07 2004-02-26 Fuji Photo Film Co Ltd パターン形成方法及びパターン形成装置
US8559163B2 (en) * 2004-09-09 2013-10-15 Showa Denko K. K. Reaction vessel for producing capacitor element, production method for capacitor element, capacitor element and capacitor
JP5457010B2 (ja) * 2007-11-01 2014-04-02 アルメックスＰｅ株式会社 連続めっき処理装置
ITBG20110045A1 (it) * 2011-10-19 2013-04-20 Trasmetal Spa Impianto per il trattamento superficiale di manufatti.
KR101328513B1 (ko) 2013-06-11 2013-11-13 배민수 집중유량 구조를 갖는 전해도금용 도금조
CN105350048A (zh) * 2015-11-30 2016-02-24 成都市天目电子设备有限公司 一种pcb板电镀生产线
WO2019006009A1 (en) * 2017-06-29 2019-01-03 Lam Research Corporation REMOTE DETECTION OF VENEER ON WAFER SUPPORT APPARATUS
JP6469204B1 (ja) * 2017-11-28 2019-02-13 丸仲工業株式会社 保守点検作業が容易な水平搬送式の電解メッキ装置
KR102427664B1 (ko) * 2022-06-10 2022-07-29 변희동 도금 대상물의 직선 이동이 가능한 아노다이징 처리 시스템

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1116449C (zh) * 1994-05-11 2003-07-30 比利时西门子公司 电路板的处理设备
DE19539868C1 (de) * 1995-10-26 1997-02-20 Lea Ronal Gmbh Transportvorrichtung und Transportsystem zur vertikalen Führung von plattenähnlichen Gegenständen zur chemischen oder elektrolytischen Oberflächenbehandlung
JP3037179B2 (ja) * 1997-01-29 2000-04-24 栄電子工業株式会社 自動メッキ装置
US5985123A (en) * 1997-07-09 1999-11-16 Koon; Kam Kwan Continuous vertical plating system and method of plating

Also Published As

Publication number Publication date
KR100312038B1 (ko) 2002-06-27
KR19990036854A (ko) 1999-05-25
US6071387A (en) 2000-06-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees