TW369456B - Chemical mechanical polishing device - Google Patents

Chemical mechanical polishing device

Info

Publication number
TW369456B
TW369456B TW085113475A TW85113475A TW369456B TW 369456 B TW369456 B TW 369456B TW 085113475 A TW085113475 A TW 085113475A TW 85113475 A TW85113475 A TW 85113475A TW 369456 B TW369456 B TW 369456B
Authority
TW
Taiwan
Prior art keywords
mechanical polishing
chemical mechanical
polishing device
ratio
insulation material
Prior art date
Application number
TW085113475A
Other languages
Chinese (zh)
Inventor
lai-zhu Chen
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW085113475A priority Critical patent/TW369456B/en
Priority to JP10657697A priority patent/JP3962121B2/en
Application granted granted Critical
Publication of TW369456B publication Critical patent/TW369456B/en

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A kind of new device and process for chemical mechanical polishing semiconductor wafer surface. Wherein the end of planarization detection is obtained by monitoring a ratio, and the said ratio is the removing rate of the insulation material in the pattern appearance areas divided by the removing rate of the insulation material outside the pattern appearance area, and the end detection is independent from the micro-image pattern density.
TW085113475A 1996-11-01 1996-11-01 Chemical mechanical polishing device TW369456B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW085113475A TW369456B (en) 1996-11-01 1996-11-01 Chemical mechanical polishing device
JP10657697A JP3962121B2 (en) 1996-11-01 1997-03-19 Chemical / mechanical polishing apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW085113475A TW369456B (en) 1996-11-01 1996-11-01 Chemical mechanical polishing device

Publications (1)

Publication Number Publication Date
TW369456B true TW369456B (en) 1999-09-11

Family

ID=21625528

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085113475A TW369456B (en) 1996-11-01 1996-11-01 Chemical mechanical polishing device

Country Status (2)

Country Link
JP (1) JP3962121B2 (en)
TW (1) TW369456B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005246491A (en) * 2004-03-01 2005-09-15 Disco Abrasive Syst Ltd Grinding apparatus and method for grinding wafer
CN112563132B (en) * 2020-11-13 2024-06-04 北京遥测技术研究所 Rapid thinning and polishing method for surface heterostructure

Also Published As

Publication number Publication date
JPH10144634A (en) 1998-05-29
JP3962121B2 (en) 2007-08-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees