TW369451B - Solder composition and method of using to interconnect electronic components to circuits on thermoplastic substrates - Google Patents
Solder composition and method of using to interconnect electronic components to circuits on thermoplastic substratesInfo
- Publication number
- TW369451B TW369451B TW086105044A TW86105044A TW369451B TW 369451 B TW369451 B TW 369451B TW 086105044 A TW086105044 A TW 086105044A TW 86105044 A TW86105044 A TW 86105044A TW 369451 B TW369451 B TW 369451B
- Authority
- TW
- Taiwan
- Prior art keywords
- powder
- solder
- temperature
- eutectic
- heat deflection
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64476596A | 1996-05-10 | 1996-05-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW369451B true TW369451B (en) | 1999-09-11 |
Family
ID=24586245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086105044A TW369451B (en) | 1996-05-10 | 1997-04-18 | Solder composition and method of using to interconnect electronic components to circuits on thermoplastic substrates |
Country Status (5)
Country | Link |
---|---|
EP (2) | EP1084790B1 (zh) |
JP (1) | JP2000511466A (zh) |
CA (1) | CA2253483A1 (zh) |
TW (1) | TW369451B (zh) |
WO (1) | WO1997043081A1 (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6156132A (en) * | 1998-02-05 | 2000-12-05 | Fuji Electric Co., Ltd. | Solder alloys |
DE19825451A1 (de) * | 1998-06-06 | 1999-12-09 | Ego Elektro Geraetebau Gmbh | Keramischer Träger mit einer elektrischen Schaltung und mit einer Anschlußvorrichtung |
GB9903552D0 (en) * | 1999-02-16 | 1999-04-07 | Multicore Solders Ltd | Reflow peak temperature reduction of solder alloys |
US6409930B1 (en) | 1999-11-01 | 2002-06-25 | Bmc Industries, Inc. | Lamination of circuit sub-elements while assuring registration |
US6468439B1 (en) | 1999-11-01 | 2002-10-22 | Bmc Industries, Inc. | Etching of metallic composite articles |
US6365057B1 (en) | 1999-11-01 | 2002-04-02 | Bmc Industries, Inc. | Circuit manufacturing using etched tri-metal media |
EP1289707A1 (en) * | 2000-05-24 | 2003-03-12 | Stephen F. Corbin | Variable melting point solders and brazes |
US6740544B2 (en) * | 2002-05-14 | 2004-05-25 | Freescale Semiconductor, Inc. | Solder compositions for attaching a die to a substrate |
GB2413565A (en) * | 2004-04-15 | 2005-11-02 | Henkel Loctite Adhesives Ltd | Lead-free, bismuth-free solder alloy powders and a method of production thereof |
DE102004034035A1 (de) * | 2004-07-13 | 2006-02-09 | W.C. Heraeus Gmbh | Bleifreie Lotpasten mit erhöhter Zuverlässigkeit |
US7628871B2 (en) * | 2005-08-12 | 2009-12-08 | Intel Corporation | Bulk metallic glass solder material |
CN100368133C (zh) * | 2005-12-19 | 2008-02-13 | 西北工业大学 | 导电杆钎焊方法 |
JP5023583B2 (ja) * | 2006-07-07 | 2012-09-12 | 富士電機株式会社 | ソルダーペースト組成物及びそれを用いたプリント配線基板への電子部品実装方法 |
WO2008016140A1 (en) | 2006-08-04 | 2008-02-07 | Panasonic Corporation | Bonding material, bonded portion and circuit board |
JP4444995B2 (ja) * | 2007-08-10 | 2010-03-31 | 有限会社ナプラ | 基板配線用導電性組成物、回路基板及び電子デバイス |
US7910837B2 (en) | 2007-08-10 | 2011-03-22 | Napra Co., Ltd. | Circuit board, electronic device and method for manufacturing the same |
MX2013009113A (es) * | 2012-05-10 | 2013-11-01 | Senju Metal Industry Co | Aleacion de soldadura para audio. |
CN103056561A (zh) * | 2012-12-30 | 2013-04-24 | 广东普赛特电子科技股份有限公司 | 一种高绝缘性无卤助焊剂及其制备方法 |
KR101630935B1 (ko) * | 2014-09-02 | 2016-06-16 | 에이에치코리아주식회사 | 전자부품 실장용 무연땜납 |
US11267080B2 (en) | 2019-05-09 | 2022-03-08 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
JP7091405B2 (ja) * | 2019-09-11 | 2022-06-27 | 株式会社新菱 | Sn-Bi-In系低融点接合部材および、その製造方法、ならびに半導体電子回路およびその実装方法 |
JP7080867B2 (ja) * | 2019-09-11 | 2022-06-06 | 株式会社新菱 | Sn-Bi-In系低融点接合部材、微小部材および半導体電子回路、バンプの製造方法ならびに半導体電子回路の実装方法 |
US20220395935A1 (en) * | 2019-09-11 | 2022-12-15 | Shinryo Corporation | Sn-bi-in-based low melting-point joining member, production method therefor, semiconductor electronic circuit, and mounting method therefor |
JP7091406B2 (ja) * | 2019-09-11 | 2022-06-27 | 株式会社新菱 | Sn-Bi-In系低融点接合部材、微小部材および半導体電子回路、バンプの製造方法ならびに半導体電子回路の実装方法 |
DE102020132808B4 (de) * | 2020-12-09 | 2023-03-09 | Schweizer Electronic Aktiengesellschaft | Leiterplattenmodul, Leiterplatte, Kühlkörper und Wärmeleitelement |
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Publication number | Priority date | Publication date | Assignee | Title |
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US4657589A (en) * | 1986-02-03 | 1987-04-14 | Mcdonnell Douglas Corporation | Solder cream |
US5229070A (en) * | 1992-07-02 | 1993-07-20 | Motorola, Inc. | Low temperature-wetting tin-base solder paste |
US5328521A (en) * | 1993-03-08 | 1994-07-12 | E. I. Du Pont De Nemours And Company | Kinetic solder paste composition |
US5389160A (en) * | 1993-06-01 | 1995-02-14 | Motorola, Inc. | Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties |
US5382300A (en) * | 1994-03-22 | 1995-01-17 | At&T Corp. | Solder paste mixture |
US5415944A (en) * | 1994-05-02 | 1995-05-16 | Motorola, Inc. | Solder clad substrate |
US5429293A (en) * | 1994-12-19 | 1995-07-04 | Motorola, Inc. | Soldering process |
-
1997
- 1997-04-18 TW TW086105044A patent/TW369451B/zh active
- 1997-05-01 EP EP00122960A patent/EP1084790B1/en not_active Expired - Lifetime
- 1997-05-01 WO PCT/GB1997/001186 patent/WO1997043081A1/en not_active Application Discontinuation
- 1997-05-01 JP JP09540613A patent/JP2000511466A/ja active Pending
- 1997-05-01 CA CA002253483A patent/CA2253483A1/en not_active Abandoned
- 1997-05-01 EP EP97918275A patent/EP0946330A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO1997043081A1 (en) | 1997-11-20 |
EP1084790A1 (en) | 2001-03-21 |
JP2000511466A (ja) | 2000-09-05 |
EP0946330A1 (en) | 1999-10-06 |
CA2253483A1 (en) | 1997-11-20 |
EP1084790B1 (en) | 2003-01-29 |
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