TW365024B - ROM with trench structure and manufacturing method thereof - Google Patents

ROM with trench structure and manufacturing method thereof

Info

Publication number
TW365024B
TW365024B TW084111774A TW84111774A TW365024B TW 365024 B TW365024 B TW 365024B TW 084111774 A TW084111774 A TW 084111774A TW 84111774 A TW84111774 A TW 84111774A TW 365024 B TW365024 B TW 365024B
Authority
TW
Taiwan
Prior art keywords
trench
wordline
silicon film
rom
manufacturing
Prior art date
Application number
TW084111774A
Other languages
Chinese (zh)
Inventor
Rung-Mau Wen
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW084111774A priority Critical patent/TW365024B/en
Application granted granted Critical
Publication of TW365024B publication Critical patent/TW365024B/en

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Abstract

A kind of ROM with trench structure and the manufacturing method thereof which is after the etching forming the trench on the substrate to dispose a polycrystalline silicon film on the substrate surface and fill in the trench as the bitline. By the shielding layer, the first dielectric layer formed by oxidation of polycrystalline silicon film will be set as the first data storage area. Then, by removing the shielding layer and employing the first dielectric layer as the mask to etch the silicon film and form the trench which the second dielectric layer is formed there and cover the second data storage area. Last, form the wordline on the first and second dielectric layers. So, the method can reduce the parasitic capacitors between the wordline and bitline, and from the wordline to substrate and there is no need for coding implantation to get the coding plan.
TW084111774A 1995-11-07 1995-11-07 ROM with trench structure and manufacturing method thereof TW365024B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW084111774A TW365024B (en) 1995-11-07 1995-11-07 ROM with trench structure and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW084111774A TW365024B (en) 1995-11-07 1995-11-07 ROM with trench structure and manufacturing method thereof

Publications (1)

Publication Number Publication Date
TW365024B true TW365024B (en) 1999-07-21

Family

ID=57941020

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084111774A TW365024B (en) 1995-11-07 1995-11-07 ROM with trench structure and manufacturing method thereof

Country Status (1)

Country Link
TW (1) TW365024B (en)

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