TW364177B - Method to produce barrier-free semiconductor memory device and said integrated semiconductor memory device - Google Patents

Method to produce barrier-free semiconductor memory device and said integrated semiconductor memory device

Info

Publication number
TW364177B
TW364177B TW086114190A TW86114190A TW364177B TW 364177 B TW364177 B TW 364177B TW 086114190 A TW086114190 A TW 086114190A TW 86114190 A TW86114190 A TW 86114190A TW 364177 B TW364177 B TW 364177B
Authority
TW
Taiwan
Prior art keywords
memory device
semiconductor memory
free
produce barrier
integrated semiconductor
Prior art date
Application number
TW086114190A
Other languages
English (en)
Inventor
Frank Hintermaier
Carlos Mazure-Espejo
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of TW364177B publication Critical patent/TW364177B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
TW086114190A 1996-09-30 1997-09-30 Method to produce barrier-free semiconductor memory device and said integrated semiconductor memory device TW364177B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19640413A DE19640413A1 (de) 1996-09-30 1996-09-30 Verfahren zur Herstellung barrierenfreier Halbleiterspeicheranordnungen

Publications (1)

Publication Number Publication Date
TW364177B true TW364177B (en) 1999-07-11

Family

ID=7807519

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086114190A TW364177B (en) 1996-09-30 1997-09-30 Method to produce barrier-free semiconductor memory device and said integrated semiconductor memory device

Country Status (8)

Country Link
US (2) US6297526B1 (zh)
EP (1) EP0931342B1 (zh)
JP (1) JP3676381B2 (zh)
KR (1) KR100326494B1 (zh)
CN (1) CN1149663C (zh)
DE (2) DE19640413A1 (zh)
TW (1) TW364177B (zh)
WO (1) WO1998015003A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19640413A1 (de) * 1996-09-30 1998-04-02 Siemens Ag Verfahren zur Herstellung barrierenfreier Halbleiterspeicheranordnungen
DE19834649C1 (de) * 1998-07-31 2000-03-16 Siemens Ag Verfahren zum Herstellen einer Speicherzelle
DE60042155D1 (de) * 1999-03-24 2009-06-18 Second Sight Medical Prod Inc Retinale farbprothese zur wiederherstellung des farbsehens
JP2002184946A (ja) * 2000-12-11 2002-06-28 Murata Mfg Co Ltd Ｍｉｍキャパシタおよびその製造方法
DE10131626B4 (de) * 2001-06-29 2006-07-27 Infineon Technologies Ag Verfahren zum Herstellen einer Halbleiterspeichereinrichtung
US20040171346A1 (en) * 2003-04-14 2004-09-02 Ten Ventures Inc. Method of Adding Wireless Remote Control to Audio Playback Devices Equipped for Wired Remote Control
DE102004042071B3 (de) 2004-08-31 2006-04-20 Infineon Technologies Ag Verfahren zum Herstellen einer Speichervorrichtung
TWI296036B (en) * 2006-04-28 2008-04-21 Delta Electronics Inc Light emitting apparatus

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0516031A1 (en) * 1991-05-29 1992-12-02 Ramtron International Corporation Stacked ferroelectric memory cell and method
US5329486A (en) * 1992-04-24 1994-07-12 Motorola, Inc. Ferromagnetic memory device
US5313089A (en) * 1992-05-26 1994-05-17 Motorola, Inc. Capacitor and a memory cell formed therefrom
DE4223878C2 (de) * 1992-06-30 1995-06-08 Siemens Ag Herstellverfahren für eine Halbleiterspeicheranordnung
US5381302A (en) * 1993-04-02 1995-01-10 Micron Semiconductor, Inc. Capacitor compatible with high dielectric constant materials having a low contact resistance layer and the method for forming same
JP3319869B2 (ja) * 1993-06-24 2002-09-03 三菱電機株式会社 半導体記憶装置およびその製造方法
US5439840A (en) * 1993-08-02 1995-08-08 Motorola, Inc. Method of forming a nonvolatile random access memory capacitor cell having a metal-oxide dielectric
US5567636A (en) * 1995-02-27 1996-10-22 Motorola Inc. Process for forming a nonvolatile random access memory array
US5959319A (en) * 1995-04-18 1999-09-28 Nippon Steel Corporation Semiconductor memory device having word line conductors provided at lower level than memory cell capacitor and method of manufacturing same
US5585998A (en) * 1995-12-22 1996-12-17 International Business Machines Corporation Isolated sidewall capacitor with dual dielectric
US5914851A (en) * 1995-12-22 1999-06-22 International Business Machines Corporation Isolated sidewall capacitor
DE19640413A1 (de) * 1996-09-30 1998-04-02 Siemens Ag Verfahren zur Herstellung barrierenfreier Halbleiterspeicheranordnungen

Also Published As

Publication number Publication date
KR20000048750A (ko) 2000-07-25
DE59711242D1 (de) 2004-02-26
US6297526B1 (en) 2001-10-02
CN1232574A (zh) 1999-10-20
KR100326494B1 (ko) 2002-03-12
EP0931342A1 (de) 1999-07-28
JP3676381B2 (ja) 2005-07-27
JP2000511359A (ja) 2000-08-29
US20010039106A1 (en) 2001-11-08
EP0931342B1 (de) 2004-01-21
CN1149663C (zh) 2004-05-12
WO1998015003A1 (de) 1998-04-09
US6605505B2 (en) 2003-08-12
DE19640413A1 (de) 1998-04-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees