TW344115B - Process to integrate a double gate oxide, with a mixed-mode capacitor - Google Patents

Process to integrate a double gate oxide, with a mixed-mode capacitor

Info

Publication number
TW344115B
TW344115B TW086114898A TW86114898A TW344115B TW 344115 B TW344115 B TW 344115B TW 086114898 A TW086114898 A TW 086114898A TW 86114898 A TW86114898 A TW 86114898A TW 344115 B TW344115 B TW 344115B
Authority
TW
Taiwan
Prior art keywords
gate oxide
forming
active region
integrate
mixed
Prior art date
Application number
TW086114898A
Other languages
Chinese (zh)
Inventor
Jenn-Ming Hwang
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Priority to TW086114898A priority Critical patent/TW344115B/en
Application granted granted Critical
Publication of TW344115B publication Critical patent/TW344115B/en

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  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

A process to integrate a double gate oxide, with a mixed-mode capacitor, which comprises the following steps: (a) forming a plurality of field oxides on a semiconductor substrate thereby segregating a first active region and a second active region; (b) forming a first gate oxide and a second gate oxide of equal thickness on the first active region and the second active region; (c) forming a first polysilicon layer on the surfaces of the field oxide and the first and second gate oxides; (d) selectively etching the first polysilicon layer thereby forming a first polysilicon block on the first active region, and forming the lower electrode of the capacitor, and exposing the second gate oxide; (e) removing the second gate oxide for exposing the semiconductor substrate of the second active region; (f) forming a third gate oxide with a thickness larger than that of the first gate oxide on the second active region, and forming a dielectric layer on the first polysilicon block and the surface of the lower electrode and sidewalls; (g) depositing a second polysilicon layer; (h) selectively etching the second polysilicon layer thereby forming a second polysilicon block on the surface of the third gate oxide, and forming an upper electrode above the surface formed with the lower electrode of the dielectric layer.
TW086114898A 1997-10-09 1997-10-09 Process to integrate a double gate oxide, with a mixed-mode capacitor TW344115B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086114898A TW344115B (en) 1997-10-09 1997-10-09 Process to integrate a double gate oxide, with a mixed-mode capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086114898A TW344115B (en) 1997-10-09 1997-10-09 Process to integrate a double gate oxide, with a mixed-mode capacitor

Publications (1)

Publication Number Publication Date
TW344115B true TW344115B (en) 1998-11-01

Family

ID=58263704

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086114898A TW344115B (en) 1997-10-09 1997-10-09 Process to integrate a double gate oxide, with a mixed-mode capacitor

Country Status (1)

Country Link
TW (1) TW344115B (en)

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