TW340252B - Process of forming a via hole - Google Patents

Process of forming a via hole

Info

Publication number
TW340252B
TW340252B TW086108552A TW86108552A TW340252B TW 340252 B TW340252 B TW 340252B TW 086108552 A TW086108552 A TW 086108552A TW 86108552 A TW86108552 A TW 86108552A TW 340252 B TW340252 B TW 340252B
Authority
TW
Taiwan
Prior art keywords
dielectric layer
forming
via hole
hardmask
metal oxide
Prior art date
Application number
TW086108552A
Other languages
English (en)
Inventor
Jaw-Cherng Chen
Jenn-Hwa Yu
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Priority to TW086108552A priority Critical patent/TW340252B/zh
Application granted granted Critical
Publication of TW340252B publication Critical patent/TW340252B/zh

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW086108552A 1997-06-19 1997-06-19 Process of forming a via hole TW340252B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086108552A TW340252B (en) 1997-06-19 1997-06-19 Process of forming a via hole

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086108552A TW340252B (en) 1997-06-19 1997-06-19 Process of forming a via hole

Publications (1)

Publication Number Publication Date
TW340252B true TW340252B (en) 1998-09-11

Family

ID=58263427

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086108552A TW340252B (en) 1997-06-19 1997-06-19 Process of forming a via hole

Country Status (1)

Country Link
TW (1) TW340252B (zh)

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Legal Events

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