TW344102B - Additive metallization process and structure - Google Patents

Additive metallization process and structure

Info

Publication number
TW344102B
TW344102B TW085105956A TW85105956A TW344102B TW 344102 B TW344102 B TW 344102B TW 085105956 A TW085105956 A TW 085105956A TW 85105956 A TW85105956 A TW 85105956A TW 344102 B TW344102 B TW 344102B
Authority
TW
Taiwan
Prior art keywords
layer
photosensitive polymer
polymer layer
metallization process
additive
Prior art date
Application number
TW085105956A
Other languages
Chinese (zh)
Inventor
Liang-Jiuh Shiah
Dong-Long Jang
Original Assignee
Mos Electronics Taiwan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mos Electronics Taiwan Inc filed Critical Mos Electronics Taiwan Inc
Priority to TW085105956A priority Critical patent/TW344102B/en
Application granted granted Critical
Publication of TW344102B publication Critical patent/TW344102B/en

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Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

An additive metallization process comprising the following steps: (a) forming a photosensitive polymer layer having a window on a silicon substrate having a dielectric layer and a device; (b) reserving the photosensitive polymer layer as a mask layer, and etching an exposed portion of the dielectric layer, thereby forming a contact hole in the additive structure consisted of the photosensitive polymer layer and the dielectric layer; (c) depositing a metal layer in the contact hole and on the surface of the photosensitive polymer layer; and (d) removing any excessive metal and sequentially carrying out a planarization process thereby obtaining a metal region.
TW085105956A 1996-05-20 1996-05-20 Additive metallization process and structure TW344102B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW085105956A TW344102B (en) 1996-05-20 1996-05-20 Additive metallization process and structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW085105956A TW344102B (en) 1996-05-20 1996-05-20 Additive metallization process and structure

Publications (1)

Publication Number Publication Date
TW344102B true TW344102B (en) 1998-11-01

Family

ID=58263697

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085105956A TW344102B (en) 1996-05-20 1996-05-20 Additive metallization process and structure

Country Status (1)

Country Link
TW (1) TW344102B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6495451B2 (en) 2000-01-06 2002-12-17 Matsushita Electric Industrial Co., Ltd. Method of forming interconnect

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6495451B2 (en) 2000-01-06 2002-12-17 Matsushita Electric Industrial Co., Ltd. Method of forming interconnect

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees