TW324836B - The manufacturing process of self-aligned silicide, CMP, self-aligned silicide semiconductor - Google Patents

The manufacturing process of self-aligned silicide, CMP, self-aligned silicide semiconductor

Info

Publication number
TW324836B
TW324836B TW086101353A TW86101353A TW324836B TW 324836 B TW324836 B TW 324836B TW 086101353 A TW086101353 A TW 086101353A TW 86101353 A TW86101353 A TW 86101353A TW 324836 B TW324836 B TW 324836B
Authority
TW
Taiwan
Prior art keywords
self
silicide
aligned silicide
cmp
proceed
Prior art date
Application number
TW086101353A
Other languages
English (en)
Inventor
Sy-Miin Lin
Original Assignee
Winbond Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Winbond Electronics Corp filed Critical Winbond Electronics Corp
Priority to TW086101353A priority Critical patent/TW324836B/zh
Priority to US08/805,419 priority patent/US5904533A/en
Application granted granted Critical
Publication of TW324836B publication Critical patent/TW324836B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/28035—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
    • H01L21/28044—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer
    • H01L21/28052—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer the conductor comprising a silicide layer formed by the silicidation reaction of silicon with a metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW086101353A 1997-02-04 1997-02-04 The manufacturing process of self-aligned silicide, CMP, self-aligned silicide semiconductor TW324836B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW086101353A TW324836B (en) 1997-02-04 1997-02-04 The manufacturing process of self-aligned silicide, CMP, self-aligned silicide semiconductor
US08/805,419 US5904533A (en) 1997-02-04 1997-02-25 Metal salicide-CMP-metal salicide semiconductor process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086101353A TW324836B (en) 1997-02-04 1997-02-04 The manufacturing process of self-aligned silicide, CMP, self-aligned silicide semiconductor

Publications (1)

Publication Number Publication Date
TW324836B true TW324836B (en) 1998-01-11

Family

ID=21626364

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086101353A TW324836B (en) 1997-02-04 1997-02-04 The manufacturing process of self-aligned silicide, CMP, self-aligned silicide semiconductor

Country Status (2)

Country Link
US (1) US5904533A (zh)
TW (1) TW324836B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6001721A (en) * 1998-02-19 1999-12-14 Taiwan Semiconductor Manufacturing Company, Ltd. Silicide and salicide on the same chip
TW428237B (en) * 1999-09-16 2001-04-01 United Microelectronics Corp Self-aligned silicide process by using chemical mechanical polishing to prevent bridge connection between gate and source/drain
US6261935B1 (en) * 1999-12-13 2001-07-17 Chartered Semiconductor Manufacturing Ltd. Method of forming contact to polysilicon gate for MOS devices
US6451693B1 (en) * 2000-10-05 2002-09-17 Advanced Micro Device, Inc. Double silicide formation in polysicon gate without silicide in source/drain extensions

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5766997A (en) * 1909-11-30 1998-06-16 Nkk Corporation Method of forming floating gate type non-volatile semiconductor memory device having silicided source and drain regions
US4954214A (en) * 1989-01-05 1990-09-04 Northern Telecom Limited Method for making interconnect structures for VLSI devices
US5834368A (en) * 1992-02-13 1998-11-10 Nec Corporation Integrated circuit with a metal silicide film uniformly formed
JP2630290B2 (ja) * 1995-01-30 1997-07-16 日本電気株式会社 半導体装置の製造方法
US5682055A (en) * 1995-06-07 1997-10-28 Sgs-Thomson Microelectronics, Inc. Method of forming planarized structures in an integrated circuit
US5804506A (en) * 1995-08-17 1998-09-08 Micron Technology, Inc. Acceleration of etch selectivity for self-aligned contact
US5668024A (en) * 1996-07-17 1997-09-16 Taiwan Semiconductor Manufacturing Company CMOS device structure with reduced risk of salicide bridging and reduced resistance via use of a ultra shallow, junction extension, ion implantation process
US5759882A (en) * 1996-10-16 1998-06-02 National Semiconductor Corporation Method of fabricating self-aligned contacts and local interconnects in CMOS and BICMOS processes using chemical mechanical polishing (CMP)
US5731239A (en) * 1997-01-22 1998-03-24 Chartered Semiconductor Manufacturing Pte Ltd. Method of making self-aligned silicide narrow gate electrodes for field effect transistors having low sheet resistance

Also Published As

Publication number Publication date
US5904533A (en) 1999-05-18

Similar Documents

Publication Publication Date Title
TW344897B (en) A process for forming gate oxides possessing different thicknesses on a semiconductor substrate
EP1069605A3 (en) Method for fabricating a semiconductor structure including a metal oxide interface with silicon
EP0905753A3 (en) Method for fabricating a conducting electrode for semiconductor device
EP0782182A3 (en) MOS transistor and manufacturing method of the same
TW374227B (en) Method for manufacturing a metal-oxide semiconductor transistor of a metal gate
TW367565B (en) Integrated circuit with self-aligned isolation
TW324836B (en) The manufacturing process of self-aligned silicide, CMP, self-aligned silicide semiconductor
TW375771B (en) Process for fabricating metal-silicide-containing semiconductor element
TW365062B (en) Manufacturing method for semiconductor apparatus and the semiconductor apparatus thereof
TW353206B (en) Process for producing self-aligned salicide having high temperature stability
TW428237B (en) Self-aligned silicide process by using chemical mechanical polishing to prevent bridge connection between gate and source/drain
KR970003838B1 (en) Fabrication method of ldd mosfet
JPS5764927A (en) Manufacture of semiconductor device
KR970005681B1 (en) Global planar method in semiconductor device
TW231373B (en) Fabricating method for EEPROM IC with MONOS/MNOS structrue
TW336344B (en) Trench isolation area and process for forming the same
TW355841B (en) Manufacturing method for semiconductor formed of titanium/tangsten silicon
TW428325B (en) Method of forming metal oxide semiconductor field effect transistor
TW429440B (en) Method of making a self-aligned silicide
TW327704B (en) The 3 layers polysilicon contact of IC and its manufacturing method
TW287299B (en) The manufacturing method for IC contacting structure
TW326101B (en) Method of fabricating salicide-structure semiconductor device
TW328636B (en) The manufacturing method for capacitor dielectric of IC
TW365027B (en) Forming method of gate-drain overlapped semiconductor component of self-aligned silicide contact
TW359010B (en) Method of producing a semiconductor body

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees