TW315490B - - Google Patents

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Publication number
TW315490B
TW315490B TW85109959A TW85109959A TW315490B TW 315490 B TW315490 B TW 315490B TW 85109959 A TW85109959 A TW 85109959A TW 85109959 A TW85109959 A TW 85109959A TW 315490 B TW315490 B TW 315490B
Authority
TW
Taiwan
Prior art keywords
face
heater
substrate
heating
semi
Prior art date
Application number
TW85109959A
Other languages
English (en)
Chinese (zh)
Original Assignee
Nat Denki Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Denki Kk filed Critical Nat Denki Kk
Application granted granted Critical
Publication of TW315490B publication Critical patent/TW315490B/zh

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  • Resistance Heating (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
TW85109959A 1995-02-17 1996-08-15 TW315490B (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5337395 1995-02-17
JP8053787A JPH08288296A (ja) 1995-02-17 1996-02-16 半導体製造装置の基板加熱装置

Publications (1)

Publication Number Publication Date
TW315490B true TW315490B (enrdf_load_stackoverflow) 1997-09-11

Family

ID=26394083

Family Applications (1)

Application Number Title Priority Date Filing Date
TW85109959A TW315490B (enrdf_load_stackoverflow) 1995-02-17 1996-08-15

Country Status (2)

Country Link
JP (1) JPH08288296A (enrdf_load_stackoverflow)
TW (1) TW315490B (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11288943A (ja) * 1998-04-02 1999-10-19 Kokusai Electric Co Ltd 基板加熱装置
JP2000031070A (ja) * 1998-07-16 2000-01-28 Ulvac Corp ａ−Ｓｉ薄膜形成装置
KR100572304B1 (ko) * 1998-09-22 2006-08-30 삼성전자주식회사 반도체장치 제조용 증착설비
US6310328B1 (en) 1998-12-10 2001-10-30 Mattson Technologies, Inc. Rapid thermal processing chamber for processing multiple wafers
JP4149620B2 (ja) * 1999-08-25 2008-09-10 株式会社荏原製作所 基板銅めっき処理方法
US6897411B2 (en) * 2002-02-11 2005-05-24 Applied Materials, Inc. Heated substrate support
JP5998925B2 (ja) * 2012-12-28 2016-09-28 株式会社島津製作所 加熱装置
KR102743405B1 (ko) * 2022-03-08 2024-12-17 한화모멘텀 주식회사 기판과 히터를 거치할 수 있는 일체형 지지대 및 이를 포함하는 기판용 열처리장치
KR102435555B1 (ko) * 2022-04-07 2022-08-23 주식회사 세미노바 웨이퍼 pvd 공정용 디가스 장치

Also Published As

Publication number Publication date
JPH08288296A (ja) 1996-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees