TW311328B - Connection sheet for interconnecting electrodes facing each other, and electrode connection structure and method using the connection sheet - Google Patents

Abstract

A connection sheet for firmly bonding electrodes together such that the electrodes face each other with the connection sheet therebetween comprises a first adhesive layer containing a first adhesive having an insulating property; and a second adhesive layer placed at least on one side of the first adhesive layer and containing a second adhesive having an insulating property and a conductive material, in which at the time of electrode connection, the second adhesive in a molten state has a viscosity equal to or lower than that of the first adhesive. With this structure, when the electrodes are connected, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, or part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, the region between adjacent protruding electrodes contains no air bubbles, ensuring connection reliability and excellent moisture resistance.

Description

-------- V. Description of the invention (i) The present invention is relative to the one used to vigorously combine the electrode to the circuit board to achieve the relationship between the two components: =

= The connection structure and the connection of LI: The most recent "miniaturization and thinning", used in the Bo Road with the increase in density and in the connection distance to achieve this Φ in the use of ^ technology street such as welding, It is not easy to detect the glue connector, etc., and it is a small electronic component to be thin enough to provide Jieshi 60. A has been widely used in recent years.丨 type and anisotropic conductive adhesive and film-like materials (even shaking, such as = the connecting sheet includes a binder, which has a specific amount of conductive material m particles. Because of the n 'between electronic components and electrodes or circuits When pressure or heat and pressure are applied to the connection piece, the two will be closely combined so that the corresponding electrodes of the two components can be electrically connected to each other, while providing insulation between the adjacent electrodes. The basic concept of high-resolution energy is achieved by the cooperation of Du Printing and I using this connection piece. The diameter of the conductive particles must be less than the length of the insulating area between the adjacent electrodes to ensure the insulation effect between the electrodes. In addition, the connection piece The conductive particles must be selected so that their density does not prevent the particles from coming into contact with each other, and the particles do not exist on the electrodes to be connected when the electrodes are connected, so that electrical conductivity can be achieved at the connection part. However, if The particle diameter of the conductive particles is too small, the conductive particles will be subjected to binding force, and due to the excessive increase in the surface area of the particles will be combined in a , Resulting in the inability to maintain the required insulating properties between adjacent electrodes. Conversely, if the content of conductive particles is reduced, the conductive particles on the electrical connection to be fast-connected are paper-sized Shicai ® ® Standard (CNS) A4 Specifications (210 X297 ^ 17 A7 V. Description of the invention (2) The number of grains will be reduced, and the result will reach the right due to contact_foot and shirt = :! Two: However, it is very difficult to achieve with connection 1 by traditional technology And at the same time maintain the long-term < connection reliability. In detail two: there is a demand for near-level decomposition energy, that is, there is a need to reduce the electrode area and the distance between adjacent electrodes. When applying pressure or simultaneous application during the connection process of Solatian Shi When heated and pressured to the connection piece, the conductive particles in the electrode will flow with the binder to the area located adjacent to the electrode, which hinders the use of the connection piece to achieve the decomposition energy. If the degree of binder is increased to suppress the external mud The conductive particles cannot be satisfactorily contacted with the electrodes, so that the electrical connection between the time-aligned electrodes cannot be achieved. Conversely, if the dryness of the mixture decreases, not only does the conductive particles tend to flow out, but also Bubbles can be easily contained in the < area between adjacent electrodes, reducing connection reliability, especially moisture resistance. In view of these shortcomings, for example, Japanese Patent Laid-Open Publication ν〇Μ — 95179 and No. 4-3 66630 disclose a multilayer Connection sheet, including-an insulating adhesive layer (first adhesive layer) and a second adhesive layer separated from the first adhesive layer and filled with conductive particles. The viscosity of the second adhesive layer is selected to be connected The competition layer has a lower dryness or binding force to reduce the flow of conductive particles and trap the conductive particles on the electrode. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs but based on the disclosed technology Because the conductive particles filled during the connection have a higher viscosity than the insulating adhesive layer, the conductive particles cannot fully contact the electrode, which increases the connection resistance and reduces the connection reliability. In order to reduce the connection resistance, a structure in which the conductive particles are first exposed to the surface where the particle filling layer contacts is used to facilitate contact with the electrode. In this case, the diameter of the 'conductive particles must be increased, so it is not easy to achieve high decomposition energy.

This paper scale is applicable to China's national specifications (210x gift FI

• Description of the invention (There are one kind of connection piece is proposed, this circuit, and can provide excellent purity, soil small electric-electric connection to be connected to the area. Although the button connection piece, 2 electric particles are concentrated to the electrode 'For example 'In the semiconductor crystal: the fine operation efficiency of the shape. It is possible to reduce the problem of connection, so the purpose of the present invention is to provide-two conductive particles * can be firmly trapped between the = electrode when connected Moreover, it can be easily contacted with the electrical connection, so in the electrical connection industry, good material can be achieved for long-term connection purity and operating efficiency. Features' The present invention provides a connecting piece to connect the two electrodes together to achieve electrical connection = Electricity. This connecting piece includes:-the first 丨 coated layer made of the electrically insulative compound; the second set of mortars placed on the celestial field, the second The dry layer includes-a second dry agent with electrically insulating properties and a conductive material. When the first and second dry agents are in a molten state, the second adhesive has the same or lower viscosity than the first adhesive 。 Printed by the member of the Central Bureau of the Ministry of Economy and Economy, cooperating with H Xiaot According to the i feature of the present invention, in the molten state: the viscosity of the second binder is equal to or lower than that of the first binder, so when the electrodes are connected: the conductive material contained in the second binder layer is buried Or fall into the first dry layer with higher melting viscosity. Therefore, the conductive material can be firmly held between the electrodes of each other. After that, when the thinner layer softens and flows, the conductive material becomes Contact with the protruding electrode to achieve continuity. Because the first adhesive layer has the same or higher viscosity than the second adhesive, it can be retained in the paper. The Chinese National Standard (CNS) Α4 ^ ΤΤΓϋ 297 Gongchu) A7 A7 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (4) Living conductive materials' By this way, no bubbles will be contained in the area between the adjacent protruding electrodes. 3. If the viscosity of the second adhesive containing conductive particles is higher than the i-th adhesive, <viscosity (the difference between $ 丨 adhesive minus $ i adhesive is negative), the second adhesive If the viscosity is too high, the conductive particles cannot be buried or caught in the first genus. Therefore, the conductive particles cannot fully contact the electrodes, and the electrical connection between the opposing electrodes cannot be achieved. Preferably, when the first and second adhesives are in a molten state, the viscosity of the first adhesive is lower than that of the first adhesive by 10,000 poise or less. _ °, if the dryness of ‘Bo 2 ’s mix is lower than the i’th mix, then the second mix ’s dryness is too low, and conductive particles will flow out. In addition, air bubbles are easily contained in the area between adjacent electrodes, which reduces the reliability of the connection ', especially the moisture resistance. * The second adhesive layer preferably has a melt viscosity of 500 poises or less. According to the experimental results made by the invention, when the 2nd dry layer = melt body horse 500 poises or less, a satisfactory result can be achieved due to its relationship with the 1st dry layer. &lt; Dryness production and production meeting 2 It is best to include the same material, because the strength of the combination ❹ the increase in the degree of combination of the interface in the first and second combination layers and the second combination and the i combination The eight reasons for the different compatibility are that the connection sheet can be separated with a lower adhesive matrix, which is beneficial to repair work. Degree &lt; Interface from ~ The second adhesive layer and / or the first adhesive layer preferably contains insulating particles. The size of this paper is two ------------installed ------ ordered ---- line! .. (please read the precautions before filling in this page) ^ • 1328 A7 Printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Invention Instructions (5) When electrodes are connected with insulating particles _ conductive particles The insulation between the electrodes can reach &lt; reliably. In some cases, the electrically conductive material includes electrically conductive particles or electrically conductive particles of demineralized material. W. The surface is coated with insulation. When the conductive particles are coated with insulating material, only the insulating coating of the conductive particles of the bit and field ... ^ Electrode contact area The relationship of the insulating coating is improved in the insulation performance. As for the other parts, since the 1st hybrid is better to include a separator, this separator covers one surface of the opposite side ... Heguang, and can be peeled off from the 7th hybrid. When the electrode is connected from the first point of view, that is, when it is used, the separator is peeled off, so the connector is connected before use. ^ Preventing dust and the like from collapsing to According to the second feature of the present invention, the present invention provides a connection structure in which the counter electrodes are joined-aligned so that the electrodes are electrically connected. This connection structure includes:-the first with electrical insulation properties! Withered Mixture ‘Made First! Drying; the second dry layer placed on the first dry wide, the second dry layer contains-with electrical insulating properties 2 dry agent and-conductive material, this U mixture is in the first and second The binder is in the molten state and has a dryness equal to or lower than that of the first binder; and a substrate is in contact with the first adhesive layer or the second binder skin, the substrate has a For the electrode on the electrode surface, the ratio (L / D) of the long side (L) to the short side (L) of this electrode surface is 20 or less. According to the second feature of the present invention, it is formed on a substrate such as a semiconductor (please read the precautions on the back before filling out this page) --1: ·, Line --------------- I— 1-— I · The paper size is toward the Chinese National Standard (CNS) A4 ^ TllOX297 ^ F7 Central Ministry of Economic Affairs Printed by the Bureau of Standards and Staff Consumer Cooperative A7 -------- B7 5. Description of invention (6) 'In the connection structure of the connection electrode on the chip, the long side (L) of the connection surface of each electrode on the substrate The ratio to the short side (L / D) is 20 or less. In this case, more conductive materials can be stably trapped in the small bump electrodes, so that the reliability of the connection can be improved and expensive conductive materials can be used more efficiently. By making the viscosity of the second binder in the molten state equal to or lower than that of the second binder, as described in the first feature of the present invention, when the electrodes are connected, the conductive conductivity included in the second binder The material will be buried in the second adhesive layer with a higher melting degree, or part of the conductive material will be trapped on the electrode to be connected. Therefore, the conductive material can be firmly maintained between the opposing electrodes. Preferably, when the first and second binders are in a molten state, as described in the first characteristic of the present invention, the second adhesive has a lower dryness of 1000 poise or less than the concentration of the first adhesive. According to a third feature of the present invention, the present invention provides a connection-combination structure of Qiqi electrodes to electrically connect the electrodes. The connection structure includes:-the first compound with electrical insulation properties Made the first! Drying layer;-a second bonding layer placed on the first bonding layer, this second bonding layer contains a second bonding agent with electrically insulating properties and a conductive material: the electrodes are arranged to face each other and arranged in it No. 1! And) the dry layer, s less one electrode row includes a protruding electrode protruding from a substrate, the convex ^ electricity = each has-close to the bottom of the substrate and facing the upper surface of the corresponding electrode, the first adhesive layer surrounds at least The bottom of each protruding electrode. According to the third feature of the present invention, it is regarded as the first of insulation insulation. This paper size is suitable for financial matters ----- _____ (please read the precautions on the back before filling out this page).丨 I —. I. Μ Β7 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of the invention (7) — ~ It is placed close to the electrode protruding from the substrate, so it can improve the insulation performance and decomposition energy between adjacent electrodes. Preferably, when the first and second adhesives are in a molten state, the viscosity of the second viscous alpha agent is 1,000 poises or less than that of the first adhesive. When the first adhesive layer as the insulating adhesive layer has a high melt viscosity, it is impossible for the connection pressure to act on the area between the adjacent electrodes, so the conductive material will flow to this area, thus changing the insulation performance between the adjacent electrodes And decomposition energy. Preferably, the conductive material of the second adhesive layer has a density that decreases from the upper surface of each protruding electrode toward the bottom of the substrate with distance. The higher the density of the conductive material on the upper surface of the electrode or the connection surface, the easier it is to achieve reliable electrical connection. On the other hand, for the bottom of the electrode, the lower the cut of the conductive material, the closer the electrode can be. # According to the fourth feature of the present invention, the present invention provides a method of combining the electrode together and combining the electrodes for electrical connection . This access method includes: will-include the first! The connecting piece of the genus and a second genus is placed between the pair of electrode rows to arrange the pair of electrode rows in pairs. The first bonding is made of electrically insulating and thermosetting properties. No! Made with withering agent ‘this second withering is placed first! It contains a wide range of compounds and contains-conductive materials and a second compound with electrical insulation and thermosetting properties; yes! And the second glaze is applied with a hot pressing step, and the heat or / and pressure applied to the second adhesive in the step of applying hot pressing is lower than the heat or / and pressure applied to the i-th bonding . ^ 10 The size of the paper is suitable for financial standards) A4 specification (2 丨 0 '_ &lt; 297 Gongqing_) — ml nn in II il il && nn n (please read the precautions before filling in this Page) Order-I —II · ml 11—.

• ----· 1 -1-I Printed A7 B7 by the Staff Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of the invention (8) According to the fourth feature of the present invention, it is applied to the second compounding agent containing conductive particles Or / and reduced pressure 'Therefore, when connected, the dryness of the second curing agent with thermosetting properties may be equal to or lower than that of the second curing agent with thermosetting properties. Therefore, the viscosity of the second adhesive in the molten state at the time of connection can be made as the viscosity of the first adhesive layer is low, as described above in the first feature of the present invention, and therefore the second adhesive The conductive material in is buried with high and dazzling dryness "No! In the dry layer, or a part of the conductive material is trapped on the electrode to be connected in contact. Therefore, the conductive material can be firmly and accurately guarded between the opposing electrodes. In addition, since the dryness of the second dry layer is higher than the dryness of the second dry layer, not only the conductive material can be trapped but also no bubbles are contained in the area between adjacent protruding electrodes. Preferably, in the application of the hot wish, the $ 1 and the second binder layer are heated under pressure so that the first and second binders are in the molten state. The viscosity of the binder is 1,000 poises or less than that of the first binder. In addition, at the time of applying the hot pressing step, the connecting sheet is preferably heated under pressure by a heat source installed near the first adhesive layer. If the heat source is installed close to the first! If the compounding type is used and thermosetting resins are used for each compounding type, then the degree of dryness of the second compounding agent farther from the heat source and farther from the heat source needs to be known * lower than that of the first compounding agent. According to the fifth feature of the present invention, the present invention provides a method of electrically connecting electrodes to a pair of Qisaki electrodes. The method includes: placing a connecting piece including a first genus and a second genus Between a pair of electrode arrays, and the arrangement of the pair of electrode arrays facing each other, the first 丨 adhesive layer is made of 11 pieces of paper-scale paper towel national-National Standard (CNS) A4 secret (210X297 ^^ 7 ( (Please read the precautions on the back before filling this page)

B7 5. Description of the invention (9) It is made of the first adhesive layer with electrical insulation and thermosetting properties. The second adhesive layer is placed on the first adhesive layer and contains a conductive material and has electrical insulation properties And a thermosetting second adhesive; when the first and second adhesives are heated under pressure in the melted state, the first and second adhesive layers are applied in the first hot pressing step to make the conductive material and The pairs of opposing electrodes are in contact, thereby electrically connecting the pairs of electrodes; the current supply inspection step for inspecting the electrical conductivity of the pairs of electrodes; and heating the second and second adhesive layers under pressure after the inspection step The second step of applying heat and pressure is to harden the adhesive. According to the fifth feature of the present invention, the step of applying the heat pressure is divided into two or more stages, so the current supply inspection step and the repairing step of the connected electrode can be performed between the stages as required, so that the operation efficiency and product quality can be improved. Preferably, the current supply check (iv) is performed when the coupling force of the first and / or second coupling agent is increased to such an extent that the electrical connection can be maintained. In this case, since the connection structure remains unchanged, the checking step can be performed easily and reliably. The adhesive force can be partially accelerated by heating to be printed by the A Standard Employee in the Ministry of Economic Affairs, so the hardening reaction of the current supply inspection can increase the temperature and increase the elasticity or can be made by connecting the part The temperature increases below the connectivity modulus. r,,, 喋 在 ^ Electricity saver is under pressure, so that the electrode connection can be maintained to achieve electrical connection. D In addition, in this case, the electric current is supplied. U for a check can be easily and reliably the second and the first with the best combination, in the first step of applying heat and pressure J2 This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (2 丨 〇X 297 take advantage of)

3 ^ · 1328 5th Ministry of Economic Affairs Central Standards Bureau employee consumer cooperative printed ΑΊ Β7, invention description (10) — ~~~ Heating under pressure to make the second sticky layer when the first and second adhesive layers are in a molten state The mixture has a viscosity equal to or lower than that of the binder. By making the second binder in the molten state have a viscosity equal to or lower than that of the first binder, as described in the first feature of the present invention, when the electrodes are connected, the second adhesive layer The conductive material in is buried in the i-th cladding layer with a higher melting dryness, or a part of the conductive material is trapped on the electrode to be connected and contacted. Due to &amp;, the conductive material can be reliably left on the electrode to be connected. Brief description of MA. FIG. 1 is a schematic cross-sectional view of a connecting piece according to the present invention;-FIG. Is another schematic cross-sectional view of a connecting piece according to the present invention; FIGS. 3A to 3G show various conductive adhesive layers used in the present invention Figure 1 is a cross-sectional view of a connection step according to the present invention according to the present invention: ^ he mill-money and quick connection temperature Γ 2 5: 2 according to one of the present invention; Figure horse-a schematic cross-sectional view showing the connection structure of the electrode Example; "The connection picture is-another example of the outline view of each field using the connection structure of the electrode, the piece and the electrode; &lt; a connection ... electric connection connection :::::::: use according to the invention- The electrical connection of the connecting piece: use the 13 μ's Zhang Chi Cai according to the invention® I ------- ^ --- pulling clothes ------ IT ------ ^ (please Read the precautions on the back before filling in this page) Connect A4 ^ fe · (210X297-^ #) A / A /

5. Description of the invention (11) Figure 10 is the second of a semiconductor a g 'pole on a substrate ... electrode side-electricity The invention will be explained below with reference to the drawings. Fig. 1 shows a cross-sectional view of the connecting piece 10 according to an embodiment of the present invention. The connecting sheet 10 of the present invention is a multi-layer 2 and a second adhesive layer. The "layer 1" is composed of the conductive material 3 and the second layer and has electrical conductivity in the pressure direction (thickness direction), and also anisotropic conductivity. The first adhesive layer 2 is formed in the grate 7 Du has electrical insulation properties. ㈣ 合 # 心 侧 'And as shown in Figure 2, the first ^ ^ with insulation f ^ can be on each side of the second adhesive layer. In addition, although not shown Layer 2 is connected with _ layer structure = into its properties, such as adhesive properties. · ^^^ The first series shows that the village will be made of-may _ &lt; points = the first and second dry layers as required The connecting piece &surface; to remove ^ The Ministry of Economy ’s central rate is printed by employees ’consumer cooperatives to prevent the ash layer and the like from joining. Although it is not shown in the figure: it is expected to be the second to see the first one instead of the first one. 1 Drying layer 2 or the connecting piece IG &lt; case, separator: the first insulating layer of the insulating nature is 2 contact, so, for example: when the piece is temporarily dried to the connecting piece with a flat electrode, this speed Connect: Connect the second dry layer on the flat electrode side with small unevenness! Phase dry surface 14 311328 A7 B7 Ministry of Economic Affairs Central Standard Falcon Bureau shellfish consumer cooperation Printing——, Five'Instructions for the invention (12 officials connect more quickly and improve the operation efficiency. The best separator is a quick-release adhesive tape / type. The connection steps can be performed continuously and automatically regardless of the method. 久 录 玉, Tubei does not have the conductivity of the second dry layer 1 in the grinding direction ^ this $ 2 dry wide 1 as described above is made of conductive material 3 2 adhesive 4. For conductive material 3, can Using conductive particles, fruit, stingray size and shape can be changed to various ways, the third 3A to 3G Figure ^-the best &lt; particle diameter is that the conductive material 3 can be formed perpendicular to a wither. Agent 4 <Single-particle in thickness direction Layer, that is, as shown in Figures 3C to 'E', the preferred particle diameter is approximately equal to the thickness of the second binder 4. The 'conductive material 3 can be easily trapped on the electrode, because = in the connection The material will not flow freely. When the particles of the conductive material 3 are almost equal to the thickness of the second compound 4, the electric conduction can be achieved by simply contacting the compound with the electrode. It is best to conduct The ratio of the material 3 to the second genus 4 is about 〇! To: body :: 'The more rape is 1 to 15V ° 1% to easily achieve each direction Sexual conductivity 2: The outer direction is easy to obtain the 'electricity' to achieve a high '&quot; layer' should preferably have the minimum thickness that can be obtained by the film forming method. The thickness of the second dry center is preferably 2, Or less, more preferably Ομιτι or less. The conductive material 3 is preferably included in the second dry layer} with various sizes &lt; spherical particles' as shown in Figures 3 to 3E, because such conductive particles 1 &quot;; &quot; can be made with strength and easy to obtain. As shown in FIG. 3F, this conductive material 3 can be-the conductor is laid flat on the inner peripheral surface of the through hole of the second mixture 4, or as The 3G picture shows a conductive wire, such as a wire, in the thickness of this paper standard is applicable to the Chinese national custody (please read the precautions on the back before filling in this page)-installed., 11 f line 15 A7 A7 Employee of Central Bureau of Standards, Ministry of Economic Affairs Printed by the consumer cooperative V. Description of the invention (13 '~-direction penetrates the second adhesive layer 4. The particles used as the conductive material include metal particles such as Au, Ag, Pt, Ni, Cu, W Sb 'Sn' solder, and carbon particles. In addition, these conductive particles or made of non-conductive materials such as glass, ceramic materials and plastic materials &lt; macromolecule particles are used as the core, and then coated with one of the aforementioned materials as a conductive layer. In addition to the use of insulating coating ~ particles with a conductive core coated with an insulating layer as the conductive material 3, the insulating particles of glass, ceramic material or plastic material can also be combined with the conductive particles (conductive material) 3 in the second Mix in binder 4. In this case, the second adhesive layer is used to enhance the decomposition performance. For the conductive material 3, more than one conductive particle is necessary, and it is preferable that the more particles are in contact with the fine electrode. In view of this, the particles 4 of the conductive particles are preferably 15 μ1Ώ or less, more preferably 1 μm to 7 μm including 17 μm. If the particle diameter is less than 1 μlτι, it is difficult to achieve contact with the electrode. The conductive particles of the conductive material 3 are preferably uniform in particle diameter. The uniform particle diameter reduces the outflow of conductive particles between the opposing electrodes when connected. As the conductive material 3, it is preferable to use particles of a macromolecular core coated with a plastic layer or conductive particles such as solder particles. This is because these materials are deformed when heat or pressure is applied, so the area in contact with the electrode will increase due to deformation during the connection step. Especially when using a macromolecular core, these particles will not have good fluidity before the start point is reached, and when it is solder, the softened state can advantageously be in a wide range of connection temperature. The paper size is suitable. Towel Country () A4 specification (2⑴KM? Gongqing) (Please read the notes on the back before filling this page) .I -----i I I --- I ---- ii ^^^ 1 T- 1 n &lt; I--ί = i In SU328 V. Description of the invention (] 4 Control, so it can overcome the uneven thickness and flatness of the electrode. = The best conductive materials include hard metal particles such as N &quot; w , Two = the surface has more protruding particles. This is because when this &quot; is poor in clay electrodes or metals (electrically light) and therefore there is a halberdide film or pollution layer, it can still achieve low connection resistance, thus improving its Reliability. The second adhesive 4 and the adhesive of the first adhesive layer 2 (the first) adhesive can be made of various materials such as "Reading or Guanghui Wei & discuss plastic". The material used is preferably High drying ability. Among the drying agents mentioned, hardening materials are better because they have excellent thermal resistance and Gas resistance. Epoxy binders containing latent hardeners are particularly good and can be hardened in a short time, thus improving the efficiency of the connection work, and because they have good adhesion to the molecular structure. Latent hardeners are relatively clear Activation point, where the activation point reaction will start due to heat and / or pressure, and it is better to use, because the present invention includes the application of heat and / or pressure. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs used in the present invention The hardener preferably has an activation temperature of 40 to .200. (: The activation temperature is lower than 40. Since the activation temperature and the room temperature are so small, it is necessary to keep the temperature low, on the contrary, if activated If the temperature exceeds 200 ° C, other connecting elements will be affected by heat. Therefore, the preferred activation temperature range is 50 to 丨 50 T. The activation temperature referred to in the present invention is a mixture sample of epoxy resin and hardener The peak temperature is measured with a DSC (differential scanning card meter) and the mixture is gradually heated at a rate of 10 t / min. The activation temperature is by considering hardening with a low activation temperature The agent is better in reactivity but has a poorer application period to determine. 17 This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (21〇 &lt; 297mm) A7 ------ V. Description of the invention (15 般 可 收 催 # Mixtures are those that contain macromolecular forms of cadaveric resins; solid epoxy resins and liquid epoxy resins; or urethane, ethyl acetate, acrylic acid rafters, vocational (iv) -Ding Erxian (rafter glue), second payment,

Please read ! I back the I side of the I Note ί Italian | Matter I item and then II page II I 2 dragon and other modified epoxy resin as the main component, these epoxy curing agent is, hardener, catalyst, coupling agent, Mixing of fillers, etc. 2nd beat Hetao 4 and ^ sticky watch 2nd! The binder, according to the invention, in their respective compositions of binders, it is preferable to include a common material of ι% or :, more preferably a common material of 5% or more. That's because I and 2 are together 2 and 2! The joint strength of the interface can be strengthened. Because the common material 'main component, hardeners, etc. can be used to increase performance. One of the characteristics of the present invention is that, during the connection step, when the second compound 4 is in a molten state, its dryness is lower than that of the second compound: dryness. This feature will be described later with reference to FIGS. 4 and 5. Du Printed by the Ministry of Economic Affairs, Central Bureau of Standards, and Consumer Cooperation. Figure 4 is a schematic diagram illustrating the relationship between the temperature and viscosity of the $ 2 mixture 4 and the first adhesive layer 2 during the heating step. According to the present invention, when the temperature of the electrode is connected (represented by a dotted line in the figure), the second compound * (represented by A in the figure) has the same or lower value than the second compound 2! The dryness is represented by B), and the difference in dryness, that is, b-eight is poise or below, preferably 1 to 200 poises. If the difference in dryness is too large, the conductive material 3 and the electrode will not be in sufficient contact. In addition, the dryness of the second binder * itself becomes so low 'that it causes outflow of conductive particles, and bubbles are easily contained in the area adjacent to the electrode, thereby reducing the possibility of connection, especially moisture resistance. If the dryness of the second dry mixture 4 is higher than the dryness of the first dry type 2 (the first 18 papers are suitable for the financial sector (CNS) A7 B7 V. Invention description (16) ~~~ ---- --- The difference between the degrees is -negative value), then the second mixture 4 pairs first! Phase 2 of the combination: the viscosity is too high, so that the conductive particles and the electrode will not be sufficient, and the child will not be able to connect to the opposing electrode. That is, in view of the balance between the connection of the electrode and the fluidity, the difference in viscosity is- The preferred range is to allow conductive particles to be trapped on the electrode, and to ensure effective contact between the particles and the electrode, as described below with reference to Figure 5. When making connections, in the second dry layer] The second dry agent: dryness, preferably 500 poise or less, and the dryness of the first dry layer 2 should be preferably 1000 poise or less. From a practical point of view, it is best to reach a temperature of about 50 Between 300 and 300. If the connection temperature is less than 50 ° C, the reaction rate of the Qing mixture is slow, which will reduce the efficiency of mass production; if the self-connection temperature is higher than · .C, all parts such as substrates are easily damaged by heat. Considering this point and the degree of incubation of the hardener used to determine the connection temperature. One of the preferred range of connection temperature is about 70 to 250 .. Figure 5 shows the connection method using the connection piece 10 according to the present invention. The embodiment of the figure shows-the connection structure, where A protruding electrode (bump) 12 of a semiconductor substrate 11 and a flat electrode of a substrate Ha. Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. It is connected. During the contact process that the 5A does not 12 is pressed to the surface of the first adhesive layer 2 with insulating properties, so that the conductive material 3 becomes buried or part of it is trapped by the first adhesive layer 2 with a high viscosity in the molten state, so the conductive material 3 The position is fixed. Then, during the flow shown in Figure 5B, when the first insulating adhesive layer 2 is softened, the conductive material 3 and the protrusion 19 are in accordance with the Chinese National Standard (CNS) Λ4 regulations 3ϋ3 ^ 3 A7 B7 Fifth, the description of invention (π) &quot; please | first I read I read back i and I 5 &gt; Wang! Italian! 事 u 项 ί # | fill in the book, the electrode 12 contacts, so The electrical conduction between the protruding electrode 12 and the flat electrode 13 of the substrate 11a is completed, and the conductive material 3 is also in contact with the flat electrode 13 of the substrate 113. In this state, the first adhesive layer 2 is used to maintain the conductive material 3, And also connect the adjacent protruding electrodes to each other, and there will be no bubbles included In the area adjacent to the protruding electrode. Preferably, in this case, the connection sheet 10 is placed so that the first adhesive layer 2 faces the protruding electrode 12 to promote softening of the] adhesive layer 2. In addition, this connection The sheet is preferably heated under pressure with a heat source installed on the side of the first adhesive layer so that the viscosity of the second adhesive layer 4 is lower than the dryness of the second adhesive layer 2. It is best to apply heat and pressure The steps are divided into two or more phases, so that the current supply inspection step and / or the repairing step can be performed between the separate phases of the hot pressing step as needed. By dividing the hot pressing application step into two or more phases, It can control the viscosity in the process. The process body follows the hardening reaction of the thermosetting adhesive, so that a satisfactory connection without bubbles can be achieved. In addition, the repairability, which is related to the hardening compound, can be given by this compound. The I-line of the Ministry of Economic Affairs Central Standards Bureau Employee Consumer Cooperative printed this current supply check step 10, which can be maintained in position by increasing the adhesive force of the connection piece to the connected electrode or by applying pressure to the electrode connection part. To do it. The cohesive force of the connecting piece can be increased by increasing the curing reaction of the cohesive agent, or by increasing the modulus of elasticity, for example, by making the temperature of the connecting part lower than the connecting temperature. The current supply inspection step can be performed by removing the leads from the individual electrodes 12 and! 3 Extend, and then measure the connection resistance or perform a performance test to perform it. In the current supply inspection step, conductive materials can also be separately or altogether 20 (210x297 mm) A7 ~~-_____ B7__ printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (18) ~ ~ '— 3 and Visual inspection procedure for the contact state between the electrodes 12 and 13. Repairability refers to the property of removing the excess adhesive by using a solvent or the like to make it reconnectable to the electrode and allowing the adhesive to be removed. Generally speaking, after the hardened adhesive is hardened, a cross-linked structure is generated so that the adhesive cannot be melted by heating or is insoluble in the solvent. These problems make it difficult to clean. Therefore, at the first stage of applying the heat pressure, the corresponding electrodes are checked for current supply and the connection piece is in a state where the conductive material 3 is in contact with the protruding electrode, and thus can be conducted between the protruding electrode 12 and the flat electrode 13, for example . However, if a bad electrode connection is found at this time, the connection part can be repaired immediately and then connected again. When the first stage is completed, both adhesives 2 and 4 are in an unhardened or underhardened state, so the electrode can be easily peeled off, and the adhesive can be easily immersed in a solvent, and Conducive to repair work. The method of measuring the melt viscosity is not particularly limited, as long as the viscosities of the second adhesive 4 and the first adhesive layer (first adhesive) 2 can be compared with each other. However, it is preferable to use the same method, and for example, a general rotary viscometer can be used, which can be measured at the temperature. For example, if a heat-curing composition is used and its reaction is carried out and the viscosity is changed during the measurement, a model composition with a hardener removed can be used to measure its value. Generally, the method used to obtain the second adhesive 4 and the first adhesive layer 2 at the time of connection is a method in which the difference in melt viscosity includes properly combining the intrinsic viscosity (mtmisic viscosity) by entanglement of the molecular weight or molecules of the material, as appropriate Choose filler as thickener and control the difference of reaction rate of hardener system. In order to produce the connecting sheet according to the present invention, the second adhesive layer 1 and the first! The adhesive paste 2 can be laminated together or, for example, one of them can be continuously applied to the other 21 paper-scale tissue preparation standards (CNS) M specifications (210 ^ 7 ^^ · -------; II batch of clothes I — (please read the precautions before filling in the “quote” page) Order -----. '线 .I---1 -—, I -I ..... · Central Bureau of Standards, Ministry of Economic Affairs Employee consumption cooperation du printing 5. Invent the description sheet &lt; to get a laminate. And the production, the legal text, clearly <the other electrode connection structure of the quick connection sheet 1G, in order to refer to the following figure 6_8 For illustration. The figure illustrates a structure, in which a chip is formed on the base: pole] 2, which is connected to the substrate by the connection sheet 10 of the present invention at a speed of ⑴: 千. In detail, in this connection structure at least- Pairs of opposite electrodes ΛΛ-protruding come 'the conductive material 3 is placed in the protruding electrode η and the pair: you and the conductive material 3 is distributed in the second combination of 1, see the protruding electrode 12 and the corresponding flat electrode 13 The density of the area is higher than the density of the area around the protruding electrode &lt; area (15). This m-bonding belongs to at least the periphery of the base of each protruding electrode 12 protruding at least from the wafer substrate It can be used as an insulating layer. This can improve the insulation performance of the adjacent protruding electrodes 12, 12. In addition, the density of the conductive particles is preferably added at the connection between each protruding electric drag 12 and the corresponding flat electrode 13, In order to reach the protruding electrode! 2 and the reliable connection between the flat electrode 13. The surface of the flat electrode 13 and the wafer substrate 11a are flush (equal height) or there is only a small difference in the height of the wafer substrate, such as a few microns or less. Such electrodes are generally It is formed by an additive method or a thin film forming method. FIG. 7 illustrates the case where the bump electrode P formed on a wafer substrate is connected to the corresponding bump electrode 12a formed on another wafer substrate 13. The connecting sheet 10 of this connecting structure includes a second adhesive layer 1 and two first adhesive layers 2 and 2a laminated to both sides of the second adhesive layer 1, as shown in FIG. The first adhesive layers 2 and 2a surround the surrounding parts of the bases of the protruding electrodes 12 and 12a, and protrude from the electrodes 12 and 12a. 22 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) I -1 H1--1------------ I i II __ ί Please read the precautions on the back before filling in this f)-= 0 line 23 A7 B7 5. Description of the invention (20 out of The surfaces of the wafer substrates 11 and 11a are in contact. The first verification example can also ensure the reliable insulation performance of the adjacent electrodes. As shown in the figure, in the embodiment shown in FIG. 8, the substrate 11 with the connection structure is provided with concave electrodes. 6, and the other-day and day 9 tablets X-π_ 山 + &amp; day and day film substrate Π a is provided with another-protruding electrode 12. In this connection structure, the concave electrode μ can be used as described in Figure 6 The flat electrode is replaced by π. An example of the recessed electrode 10 is that Ming Yu et al. 1 was formed before the semiconductor wafer, etc., and the two convex, the electrode edge W is insulated. Wei Si, Si Hua Si, and poly ^ ^ The water of the temple is usually 'thickness of about a few microns. In addition to the aforementioned stop point Xi Bu

Mm ® so the connection structure has the advantage of reducing costs <because it does not have to form a bump electrode on the wafer. = 6 to 8 in the embodiment shown in the figure, the second dry layer and the first! Mouth 2 &lt; has a clear boundary, but it can also be mixed between them. In addition, the 'as shown in Fig. 9' conductive α 3 included in the first adhesive layer 2 may have 1 degree from the top 17 of each protruding electrode 12 toward the Ministry of Economy—quasi-bureau i-elimination— Zuosheyin = bottom i9 of soil quality η gradually decreases with distance. In this case, the higher the density of the conductive material on the surface of the electrode connection, the higher the electrical connection. In addition, the lower the density at the bottom 19, the closer to the electrode 19, the higher the energy. In the embodiments shown in FIGS. 6 to 8, the wafer substrate I may include Miao, GaAs, Ammonium Phosphide, Ge, etc. m gemstone, stone stone, ferrite magnet paper ruler 23 A7 —_ _ ___B7 V. Description of the invention (21) — ~~ Substrate 丨 丨 a can use films such as inorganic materials such as polyimide polyester, etc., Glass fiber-epoxy composite materials, silicon semiconductors, glass, ceramic materials, etc. Please I first I read I read I back j side I note I notice 1 item i then fill in I The protruding electrodes 12 and 12a to be connected can also include grain circuits and connectors besides the protruding parts ( termillds). In addition, the various electrodes shown in Figs. 6 to 8 can also be appropriately connected as desired. The electrode surface of the protruding electrodes 12, 12a on the wafer substrate 11 will be described below. The protruding electrodes 12, 12a provided on the wafer substrate 11, the ratio (L / D) of the length of the long side to the short side of the connection surface of each electrode on the semiconductor wafer is preferably 20 or less. This is because when the following experimental results of the present invention show that the L / D ratio is within the above range, the conductive particles can be satisfactorily trapped on the electrode after using the connection sheet 10 according to the present invention. As clearly shown in Fig. 10, the L / D ratio represents the ratio of the length L of the long side to the short side D of the connection surface of the electrode on a semiconductor wafer. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs ^ Although the L / D ratio of the connection surface of the electrode on the semiconductor wafer is small, it can ensure high connection reliability because many tiny conductive particles It is defined above each micro-protruding electrode 12, and because expensive conductive materials are effectively used, resources can be saved. The reason why the multilayer connection sheet structure and the L / D ratio of the electrical connection surface is closely related to the catchability of the conductive particles 3 on the electrodes facing each other after the connection step is not clear, but it can be assumed that The trapping properties are affected by the flow direction and heat transfer properties of the adhesive. In addition, in this case, during the connecting step, the second adhesive 4 paper ruler Pocai ® CNS) Α4 »(210Χ297 ^? Τ ~~~ — Printed by the Ministry of Economic Affairs Bureau of Central Standards Employee Consumer Cooperative Five 'ίίϊ ^ 722 ~) ~ '---- y Λ melt viscosity is lower than the first insulating adhesive layer 2 about 1 000 poise or less. According to the present invention, the conductive material 3 can be reliably trapped on the protruding electrode 12 'thereby enhancing the reliability of the conductivity and continuity test. This',】 tried when the mixture is in an unhardened or underhardened state, which is conducive to repair work. . In the various embodiments described above, the connection sheet is placed at the position where the first adhesive layer 2 can face the protruding electrode 丨 2, so that the insulation performance and decomposition performance between the protruding electrode 12 and 丨 2 can be improved. In addition, when the first adhesive layer 2 has a direction of reversal and melting, the conductive material is less likely to flow to the area adjacent to the electrode because the second adhesive layer is not pressurized during connection. In addition, the conductive material 3 of the second adhesive layer can be evenly distributed on the second adhesive layer along the surface. Therefore, the conductive particles do not need to be accurately positioned relative to the electrode, which can improve the operation efficiency. In addition, the 'first dry layer 2 and the second adhesive layer 1 can be properly combined to obtain the desired adhesion for the purpose of fusing, for example, to match the material of the electrode substrate used, so that the selective use of the material can be increased and connected Reliability also increases because air bubbles at the connection part etc. will decrease. One of the adhesive layers may have solubility or swelling characteristics to a solvent or the two adhesive layers may have different thermal resistances, which may give repairability in any case, so that the connection sheet can be easily peeled off from the surface of the substrate. Reconnectable. In addition, the adhesive layer can be properly combined to match the material of the electrode matrix used to facilitate contact between each electrode and the conductive particles and simplify the production process. In addition, part of the adhesive layer that is pressed out of the connecting part can be used as a sealing material to provide reinforcement and moisture resistance. This paper scale is applicable to the Chinese national standard (CNS> Α4 specification (2〇〇297 meals) -------, π ----- i ----- ί (please read the back 1 &amp; Note Matters fill in this page) A7 A7 Printed by the Employees ’Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (23) Implement you [Various embodiments according to the invention are described in detail below, but it should be noted that the invention is not limited to these Example. ~ Implement 1_J__ (Preparation of 2nd Adhesive Layer 1) Mix a phenoxy resin (polymerized epoxy resin, PKHA of Union Carbon) and a liquid containing microcapsule latent hardener at a ratio of 30/70. NOVACUREMX-3921, Asahi Chemical Industry Co., Ltd., epoxy equivalent: 185, activation temperature: n8t :) A solution containing 30% ethyl acetate was obtained. To this solution was added 8 Vol% conductive particles. The conductive particles were borrowed By

Nl / Au is coated with polystyrene particles (GELPACK, Hitachi Chemical Co., Ltd.) 0 2 / 002jum with a diameter of 4 ± 0, and the conductive particles are mixed and dispersed. Apply the dispersion with a roller applicator β this: off-chip (silicone-treated vinyl terephthalate, thick household · earth knife. Yu Hei · 4〇μηι>, dry the coating at 110 C Separate pieces with dispersion liquid for 20 minutes to obtain the second adhesive layer with a thickness of 5'um. Use the patterned material with the hardener removed to the digital viscometer HV-8 (manufactured by RheSCa) sound port 'Use; Libo compound layer lack of degree, 80 poise at 150 ° C. (2) Preparation of the first adhesive layer and connecting sheet] 〇 The production will be the same as the preparation of the same second phenoxy resin layer 2 (Polyp resin and liquid epoxy resin containing microcapsule latent hardener in-Yi oxygen 185) Mix at a ratio of 40/60, but do not add conductive particles 3 Use: Adhesive layer 1 in the same way to make 15μπι Thick piece. 'In the second, the second adhesive layer 1 and the pan-hanging 1 adhesive layer 26 produced in the above-mentioned manner. This paper size is applicable to the Chinese National Standard (CNS> Α4 specification (21〇Χ297 mm)-installed- ----- 、 玎 ------ Line (please read the precautions on the back before filling in this page) 2 Printed A7 by the Consumer Consumption Cooperative of the Central Standard Falcon Bureau of the Ministry of Economic Affairs -_ ______B7 V. Description of the invention (24 ^ ~ '' --- Rolled between the rubber rollers and laminated on their adhesive surface-aligned. The result is as shown in Figure 1 thickness 20_ including two layers According to the method described in (1), the dryness of the i-th bonding bond 2 is tested at 280 poise. Therefore, the bonding of conductive materials includes the first bonding layer 2 with insulating properties between 15 ( The difference in viscosity of rc is 200 poises. (3) Connection to the electrode This connecting piece is used to connect an IC chip and a flat electrode for evaluation. The 1C chip is a 2 X 12mm second substrate with a height of 0.5 mm and It has J branches with a diameter of 50μηι and a height of 20μιη formed on the gold electrodes near the two long sides of the substrate, and the flat electrode is located on a 1.1mm thick glass substrate with a 0.20um thick IT0 (indium-tin oxide The surface resistance of the thin film circuit is 20Ω. In detail, the ITO electrode on the glass substrate is made to correspond to the size of the protrusion electrode of the 1C wafer, and there are leads extending out of the substrate for measurement. The connection piece 10 is cut into a size of 2.5 X 14mm to be slightly larger than the size of the IC chip With the second bonding calendar i facing the flat electrode 13, temporarily bond to the substrate (see Figure 5A). When the connection sheet 10 is temporarily connected to the substrate, it can be more easily bonded and the separation sheet is subsequently peeled off It can be easily performed because of the relationship between the smoothness of the substrate 11a and the viscosity of the connection sheet 10. Then, in the case where the 1c wafer protrusion electrode (protrusion) is accurately aligned with the flat electrode, the entire structure is 3 °. Under the pressure of kgf / mm2, it is necessary to add 15 seconds at 丨 50 to obtain the connector (refer to figure 5B). At this time, the insulating layer of this structure is located near the heat source of the connection device, and the second adhesive paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) n I ---- I ----士 κ --- II n T nn _ I.!., V. Issue (please read the precautions first and then fill in &quot; this page>). Policy printed by the Staff Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7 V. Description of invention (25) ~ '~~ ---- Layer 1 faces the flat electrode. (4) Evaluation * Polish the cut surface of the connecting body obtained in the above-mentioned manner, and use a microscope to paint it. It has a connecting structure as shown in FIG. 6. It is particularly noticed that the area between the near electrodes does not contain air bubbles, and the particles in this area are not between the protruding electrodes and the corresponding flat electrodes 13 and the particles have been pressed. It is deformed and maintained between and in contact with the upper surface of the protruding electrode 丨 2 and the flat electrode 丨 3. 4. Estimate the connection resistance between the protruding electrode 丨 2 and the flat electrode 13 facing each other. Estimate the insulation resistance between adjacent protruding electrodes. As a result of the test, the connection resistance is Ω or less and the insulation resistance is 101 ϋΩ or more, and it is 85. After the coffee hour high-temperature humidity test of 85% RH and 85% RH, these values are maintained the same, and it is clear that it has satisfactory long-term reliability. In this example, the distribution is connected to the electrode (diameter 50 ^ m = 1962 "the average number of effective particles is 20 (maximum 23, minimum 18 particles). Here, only those when using a microscope (100 times) When the connection surface is observed on the glass side, the contact with the electrode is smooth, and it is regarded as the administrative particles distributed to this connection. The L / D ratio is i 〇, because the diameter is 5〇ρΏ. According to the embodiment], protruding at each The particles on the electrode 12 have been compressed and deformed, and are maintained between and in contact with the corresponding upper and lower electrode pairs. Any bubbles of heat are contained between the adjacent protruding electrodes, 2, 12, and satisfactory results can be achieved Long-term reliability. The degree of deformation of conductive particles 3 varies according to the distance between the protruding electrodes facing each other and the flat electrode pairs, and some particles are dried on the protruding electrodes. For all paper sizes Applicable in mmn ------ seed coat ----- I, 1T_ _____ (please read the precautions on the back before filling in this page) 28 Printed by the Central Bureau of Standards of the Ministry of Economic Affairs, printed by 3il323 A7 ~ ^ _______ B7 5. Description of the invention (26)-' Very satisfactory connection can be achieved. The following Table 1 does not show the viscosity of the second adhesive 丨 in the molten state relative to silk! The dryness of the binder is poor (the second binder is less than the binder! Is a small difference) and the average number of particles distributed on the electrode that are electrically connected to the electrode. J7 compares to Example 1 In this Comparative Example 1, it is equipped with a first insulating layer, and / or A conventional single-layer connection including a second adhesive layer containing conductive particles. In detail, by mixing a 30/70 ratio of phenoxy resin (polymerized epoxy resin) (PKHA of Union Carbon) and containing microcapsules Latent hardener liquid epoxy resin (novacure 3921 of Asahi Kasei Industries Co., Ltd.) epoxy equivalent 185; activation temperature: 118 t :) A solution containing ethyl acetate in Sichuan was obtained. 8v〇1% of conductive particles were added to this solution. The conductive particles were coated with Ni / Au polystyrene (Hitachi Chemical Co., Ltd. GELPACK, particle diameter 410.2 drop) 0.2 / 0.02_ thickness ^ Then, the conductive particles are mixed and dispersed. This dispersion liquid is applied to a separator (a silicone-treated polyethylene terephthalate with a thickness of 40 μΓη) by a roller coating ^, and the separator applied with the dispersion liquid is dried at 110 1 to The second adhesive layer with a thickness of 20 μm. That is, the connecting sheet of Comparative Example 1 includes only a 20 m thick adhesive layer. ~ Next ', under the conditions used in the first embodiment 1, the 1C chip and the thin film flat electrode connecting piece are connected to each other in order to obtain 29 paper scales applicable to the Chinese National Standard (CNS) A4 specification (210X297mm) ------------- sling ------ order ------- line ------ J§ fill in this page five A7 B7 description of invention (27) to a connector. Use the same evaluation method as above, use a microscope to observe the reality: the cut surface of the connector obtained in Example 1, and measure the connection resistance and insulation electricity It was found that on the upper surface of the protruding electrode connected to the flat electrode 丨 3 (the number of particles passing through 50 · _ is at most 13 and at least 0, that is, some flat electrodes_ 2 there are no effective particles between the pair of electrodes The electrical connection of the two electrical connections is therefore very different from the maximum and minimum number of effective particles of Example 1 L. In addition, a short circuit occurs when measuring the insulation resistance of the connection body. This may be in the connection step _ Caused by the flow of electrically conductive particles on the upper surface &lt; therefore, the insulating properties cannot be maintained between adjacent electrodes. FExample 2 ' κ 例〗 The same &lt; way to obtain a connecting piece, but here it is implemented ::, according to the same method as used in Example 1, at another D of the second dry layer-the first dry wide. That is to say- As shown in Figure 2, including I one layer and multiple layers of connection sheet 10. = Outer 'uses dual-type FPC (flexible printed circuit board), which has a -18_ thick copper circuit on the poly board, instead of implementing Example ^ The flat electrode used above. According to the same procedure used in Example 1, these electrodes were connected to obtain a connection body with the structure shown in Figure 7. :: Example i Evaluation obtained according to Example 2. The connection quality is the same as that obtained in Example 1. In detail, the connection resistance is 1 Ω or less, and the insulation resistance is ι〇1〇ω or more, and this 30 ---- ^ ---- 丨 installed- ----- Subscribe ----- Line (please read the precautions on the back before filling in this page) Printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Invention Instructions (28) Some values are at 85 ° C and 85RH The lack of Ληη, remains unchanged after + hours of high temperature and humidity testing, which proves to have satisfactory long-term reliability. In this embodiment, + is assigned to this connection The electrode (diameter 30μηι = 1962.5μπι2), τ t.,】 Government load <almost the average number is 丨 6 (the largest particle, the smallest I 〇 particles). ㈤ ratio is [〇 'because the electrode The diameter is 50-. The evaluation of Example 2 &lt; the results are also shown in the table]. In Bess Example 2, more than 10 particles can be trapped on each electrode, regardless of whether the particles are easy to flow in this structure Because the protruding electrodes are connected to each other. Example 3-5 η Example 3 In soil 5 'According to the same procedure as used in Example 1, two phenoxy resins were obtained, but the first and second compounds were 2 and 1. And the mixing ratio of the body% milk resin was changed to change the difference in dryness between the two layers at 1501. Specifically, in Example 3, the second dry layer has a viscosity of 200 and the viscosity difference is 0. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 1 In Example 4, the second dry layer has a dryness and the dryness difference is 1. As shown in Table 1, the average number of effective particles in Example 3 is 13 (H to 15), and Example ι4 is ι9 (ι7 to 22). Therefore, according to these examples, many effective particles can be trapped on the electrode with relatively small changes. As in Example 1, as shown in Table 1, satisfactory connection characteristics can be seen. Aberdeen 31 Shi's Zhang scale is applicable to the second specification of the Chinese factory (210Χ297mm · τ printed by the employee consumer cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7 V. Description of the invention (29) Health comparison examples 2 and 3 1 ------- --- In Comparative Examples 2 and 3, a connection sheet having a double-wide structure as in Example 1 is prepared; however, the mixing ratio of the phenoxy resin and liquid epoxy resin of the first and second adhesive layers 2 and 丨Change to change the difference in viscosity of the two layers at 50 °. In particular, in the comparative example, the second adhesive layer has a porosity of 80 ° and a viscosity difference of 10,000. 〇Poise. In Comparative Example 3, the second adhesive layer has a viscosity of 200 poise and the viscosity difference is -120. For example, the viscosity difference of _120 is shown in Comparative Example 3 $, the second adhesive layer containing a conductive material The viscosity of the second binder is 120 poises higher than the viscosity of the i-layer dry layer. In addition, in Comparative Examples 2 and 3, the ratio of L / D is κ and the electrode diameter is 50μιη. The average number of particles shown is 0 (Comparative implementation is small (Comparative Example 3). One non-hanging> In Comparative Example 2, since the difference in dryness is very large, the circuit丨 Adhesive layer and no effective particles on the electrode, all the connecting pieces according to Comparative Example 3 have a double-thickness structure of the conventional technology, but have a completely opposite viscosity distribution from the example 丨 &quot; ~ effective particles The average cloth is 0. Therefore, there is no effective particles between the outer layer and the M. In this comparison of Example 1, the effective particles are the largest and the largest gap. 』Number &lt; There are 32 paper rulers _ I shed Threading (please read the opposite first: &x; then fill in this Fc A7 B7 V. Description of the invention (30) Table 1 viscosity of adhesive (poise)

Example 200 Example 4 The average number of effective particles on the electrode (particles / 1962 5 | am2, 13 (1 to 15)

Examples 6 to 9 f Please read the notes on the back first and then write this page j. Installed in Examples 6 to 9, use the connection piece made in the same way as the example, but the power to be connected桠 has different shapes. In detail, the L / D ratio of the long side to the short side varies in the range of 1 to 20 by changing the shape of each protruding electrode on the connection surface of a 1C chip. In Example 6, the long side 1 and the short side of the protruding electrode were 50 μl Ώ each, so the L / D ratio value was 1.41. In Example 7, the long side 1 and the short side of the protruding electrode are 20 μm and 100 μm, so the L / D value is 5.0. In Example 8, the long side L and the short side D of the protruding electrode are 20 μm and 200 μm, respectively, so the L / D value is 10.0. In Example 9, the long side L and the short side D of the protruding electrode are 10 μm and 200 μm respectively, and thus the L / D value is 20.0. 33 This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 male cage),-° Line Printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs B7 B7 —----- V. Description of the invention (3 1) The long side L of the protruding electrode is perpendicular to the center line N of the 1C wafer as shown in FIG. The test results are shown in Table 2 below. As shown in Table 2, in these examples, 〇 varies between i and 20, many effective particles can be trapped on the electrode and the change is very small, and as in «Example 丨, a satisfactory connection can be obtained characteristic. Comparative Examples In Comparative Examples 4 and 5, the Fpc boards used in Example i were interconnected to form parallel electrode connections (electrode width D = 5—; connection width L = 1500 ′; l / D = 30) . In Comparative Example 4, the connection piece made in the same manner as in Example 1 was used to connect 'but the average number of effective particles on the electrode was 1962.5_2 9_ to 16), which is better than in Example 丨The average number obtained is 1/2. In Comparative Example 5, 'use the same preparation as in Comparative Example 3 <connecting sheet (the second compound's dryness is 2n, the dryness difference is _, the average number of effective particles is 18 (14 to 24) It is greater than the average number of the comparison example 3. The above experiment &lt; the best connection will be due to whether the connecting piece = to the line electrode connection with a large L / D ratio (such as on the circuit board: conductor _On-chip &lt; electrode) is different. The reason is not known. _ 是 可 广 During the connection step, the heat transfer properties and the flow of ## are affected by the L / D shadow 1— I 11----- U »--I ....... I (Please read the notes on the back before filling this page)

, 1T --- line ---- The central standard of the Ministry of Economic Affairs is printed by the negative labor union. 1 I I · 34 3ϋ328 5 'Instructions for the invention (32 Α7 Β7 Central Business Administration of the Ministry of Economic Affairs Consumer Cooperative

162 (141 to 1 82) 245 (228 to 253) According to the example in the example of the use of jade ~-a __ on the electrode of the effective particle of the flat mesh (particle / 1962 5μηι2) 24 (22 to 27) 121 (112 to 138 , 9 (0 to 16) mn---- 1 κ- II ϋ m I (please read the precautions on the back before filling out this page) is not formed on the IC chip = sequence =: connection sheet 'but two ^ The semiconductor wafer with the structure shown in Fig. 8, in which the required part is at the required line of the M line, and the surface of the received wafer has a barrier thickness &lt; insulation layer (New Zealand implementation is _ layer) ), = Into :: electrode. This connecting piece is temporarily bonded to the semiconductor and its second adhesive layer faces the wafer. In Example 10, the connection resistance is lower than the gate + ^ 疋 IQi ^, insulation resistance Therefore, even if these values are at 85. 0, 85. The fine-grained small-to-temperature temperature test remains almost unchanged. The effective particles used to connect the electrical phase &lt; the average number is 25 (maximum H minimum · Zen / 1962 ». In addition, from an economic point of view, the embodiment is preferred because it does not need to form a bump on a wafer. Example 11 35 This paper size is applicable State ⑺0X297 mm)

I ί!--I— I--II line ------------ 1 ^ 1 H—, • I — ——- I. Printed by the Ministry of Economic Affairs, Central Falcon Bureau Employee Consumer Cooperative 3. Early A7 II --------- B7 V. Description of the invention (33) Use a connection sheet with the same structure as in Example 2, but the particle diameter of the conductive particles is 7μιτι and the thickness of the second adhesive Also 7μιη. No. 1 on one side of the connection piece! The adhesive layer 2 has a thickness of 25 µm, and the other first adhesive layer on the other side of the connection sheet has a thickness of 50 µm. The electrode to be connected is a guide wire of a QFp type IC (thickness Ηθμοί; pitch: 30μΙΏ, electrode width: 35〇um, connection width: J〇〇〇'um; L / D = 8.6), and these electrodes are It was connected to a 3 5 μιτι thick copper terminal formed on a glass substrate. The connection structure obtained according to Example 11 is similar to that shown in Figure 7, but there is no substrate on one side, that is, no substrate on the 1C guide wire side. As the embodiment has the effect similar to that which can be achieved in the embodiment, and regardless of the connection between the electrodes having a large temperature, satisfactory connection characteristics can be exhibited without causing displacement of the electrodes. Although the conductive material in the conductive sheet is not shown, these particles have been compressed and deformed and remain between the upper and lower electrodes in contact with each other. In addition, bubbles are not included between the areas adjacent to the electrodes, and satisfactory long-term reliability can be achieved. In this embodiment, the adhesive layer is also formed in the area where no substrate exists to be at the same height as the guide wire, so that the guide wire can be positioned. 10 or more effective particles can be trapped on each electrode. Embodiments 12 and 13 In Embodiments 12 and 13, a connection sheet made in the same manner as in Embodiment 1 was used; however, the electrode was heated in two stages under pressure. In detail, in Example 12, a glass substrate capable of mounting 5 IC wafers is used instead of the substrate used in Example 1, and the paper size of the hot-pressed paper is applicable to the Chinese National Standard (CNS) A4 specification (2丨 〇χ297mm) I binding ---- line (please read the precautions on the back before filling in this page) 311328 A7 Five ^ Instructions for printing inventions by the Ministry of Economy Central Standards Bureau Negative Consumers Cooperative (34) Step two In stages. First, heat the structure at 150 ° C at 20 kgf / cm2, and then stop for 2 seconds, keeping the structure under pressure. Measure the connection resistance of each connection point with a multimeter. Only Example I 3 had the same structure as Example 1-2, but after starting the hot pressing step at [50 ° C, 20 kgf / cm 2 for 3 seconds, the structure was removed from the j step. Due to the application of heat and pressure, the compounding power of the compounding agent is increased immediately, so individual IC wafers can be temporarily fixed on the glass substrate, so without using the structural pressure as in Example 丨 2 using a three-meter test Connection resistance at each connection point. In both embodiments, the chip fails. Therefore, the failed wafer is peeled off and a new wafer is positioned to perform the above-mentioned connection step. As such, no failure was found in the examples. According to these embodiments, the wafers that failed during the repairing step are stripped and new wafers are quickly attached. The binder is in the state of = fully cured 'so the wafers can be stripped very easily and then cleaned with acetone This step is very easy, making repairs easy to proceed. After this inspection step and repair step are performed as described above] 5. (: As a result of the second stage under 20kgfW, both examples showed satisfactory connection characteristics II; = = the number of effective particles attached was 9 or more. In Example ^ on the protruding electrode <effective It can be said that the average number of particles can be increased, and the particle outflow of the electrode can be reduced. In addition, this comparison can be further improved because the hot pressing step is divided into two steps and one <Keep Example 14 set.- -Install-- (Please read the precautions on the back before filling in this page). —1 '1τ- In κ---I- I.

• I. 1 I ann 37 paper ruler New Zealand @ (CNS) -1 ---. A7 B7 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of Invention (35) &quot; ~ Only Example 14 and Implementation Example 1 differs in that different materials are used as the first and second adhesives. In detail, unlike the connection sheet of Example 1, nickel carbonyl particles having an uneven surface (average particle diameter: 3 μm) are added as conductive particles at an amount of 4 vol%, and the second adhesive layer has 5 μm The thickness. In addition, for the first adhesive layer, a liquid epoxy resin containing a microcapsule latent hardener such as (epoxy equivalent: 185) and a carboxyl modified SEBS (styrene-ethylene_butene-styrene intercalation polymer to Mix at a ratio of 20/80 to obtain a sheet with a thickness of 15 μm according to the same procedure as described above, and then laminate the obtained sheet with the second adhesive layer. The result of the measurement of the viscosity of the adhesive layer by the aforementioned method Ma 100 poises (丨 50.〇, so the viscosity difference between the i and the second adhesive layer is 20 poises. &Amp; Two Example 14 were evaluated in the same manner as Example 1; as a result, the conductive particles were slightly adhered to There are 100 or more effective particles that can be trapped on the electrode. In addition, Example 丨 4 shows satisfactory connection resistance, insulation resistance and long-term reliability. ^ In Example I4, use Different polymer materials are used as the first and second adhesives of the first and second adhesive layers; therefore, the adhesive a ~ days can be cleanly peeled from the surface of the first adhesive layer. This means that Conducive to the final repair work. According to TMA (thermomechanical analysis) test the first and second adhesive layer Tension and its Tg (glass transfer point) are 丨 25. (: and 11 〇. Shi &amp; this is an effective feature for the repair work when peeling is carried out at a high temperature, between the large / adhesive layer The difference of the thermoelectric power can be used to accelerate this peeling and ^ = for the sake of easier provision of a close difference. *, Gong 38 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (please first Read the notes on the back and fill out this page).

'1T line / Printed by the Ministry of Economic Affairs Central Standards Bureau Negative Consumers Cooperative A7 B7 V. Description of the invention (36) Examples 15 ~ 17 In Examples 15-17, the connecting piece is also produced in the same way as Example 1, However, insulating particles are also added. In Example 15, 1 vol% of polystyrene particles, which are used as the core of the conductive particles of Example 1, are mixed and dispersed in the second compound as insulating particles to obtain a similar example 1's connection piece. In Example 16, 1 vol% of polystyrene particles, which are used as the core of the conductive particles of Example 1, are mixed and dispersed in the first compound as insulating particles to obtain a similar example 1's connection piece. In Example 17, 1 vol% of polystyrene particles, which are used as the core of the conductive particles of Example 1, are mixed and dispersed in each of the first and second adhesive genus to serve as insulation The particles are similar to the connecting sheet of Example 1. Examples I5 to 17 were evaluated in the same manner as in Example i, and they proved to be extremely excellent in connection resistance (1 Ω or less), insulation resistance (10 η) ω or more, and long-term reliability. Since the insulating particles were only added in small amounts, no effect of insulating particles on fluidity was observed in the examples. In particular, in Example 5, the insulating particles dispersed in the conductive particles are effective in improving the electrolytic energy of the second mixed m-anisotropic conductivity. Embodiment 16 can effectively retain the insulating properties of the first compound and Embodiment π has the advantages of both Embodiment 15 &amp; 16. In Examples 15 and 7, the insulating material is ❹ 彡 and connected between the electrodes like a conductive female. = Example 18 In this example, it is the same as in Example 丨, η, &amp; Examples <Conductive particles are coated 39 ----------.-Seed coat ----- -Order -----, line (please read the precautions on the back of the stain before filling in this page) This paper size it uses China CNS) ~

Printed by 3US2S Employee Consumer Cooperative of Central Bureau of Standards, Ministry of Economic Affairs

A7 V. Description of the invention (37)-Insulating material to obtain a connecting piece similar to that of Embodiment 1. In detail, the surface of the conductive particles having an average particle diameter of 4 μm is coated with a nylon resin film having a thickness of about 0.2 μm and a glass breaking point of 127 t, and the amount of conductive particles added is increased to 15 ν〇ι %. &quot; This example was evaluated in the same manner as in Example 1 and was shown to have satisfactory connection characteristics (connection resistance: 10 or less; insulation resistance: 10 = Ω or more). In this embodiment, the average number of particles on the electrode increases significantly. In the connection part of the electrode, the conductive particles between the electrodes are kept red. The coating is dazzled by heat and pressure during connection, so that the electrical connection can be achieved due to the softening of the first insulation. Conductive. On the other hand, because the surface of the conductive particles in the area between the adjacent electrodes is still coated with the insulating film, because of the small heat and pressure, it can ensure a satisfactory performance, so: <effective particles protruding from the electrode The number is% or above. With the connection sheet structure according to Example 18, A, and A, the concentration of the conductive material in the first adhesive can be increased. The present invention is not limited to the above-mentioned embodiments and various changes can be made without departing from the spirit and scope of the present invention. For example, instead of directly placing the first insulating dry layer on the second adhesive layer containing the conductive material &lt; the second adhesive layer, another layer may also be placed, for example, a third layer with a different substance = quality: viscosity, adhesion, etc. The insulating adhesive layer is placed between the first and second views. In this case, similar advantages can be obtained. The viscosity of the first and second adhesive layers does not necessarily need to be very uniform, and the thickness direction of the first &quot; changes. However, in this case, when the first and dry layers are in the hot state, the dryness of the second dry mixture must be equal to or less than 40 Α4_ (2 丨 〇Χ297 公 節 --- 1 I I ---- i—x ± 衣 __ (Please read the precautions on the back before filling in this page) Order A7 B7 V. Description of invention (38) The viscosity of the first adhesive m-15- »· II-m ^ 9 .....-UK---If- It- Yi V --- 1 * ^ v ^ · US, V5 (please read the notes on the back first and fill in this page) Employee consumption of the Central Bureau of Standards of the Ministry of Economic Affairs The size of the paper printed by the cooperative is applicable to the Chinese National Standard (CNS) Α4 specification (210Χ297mm)

Claims (1)

2 1 .—A kind of quick-connecting piece, placed between the electrodes facing each other to connect the electrodes together as an electrical connection between electric poles, including: Patent application scope 86 / 03¾] ^ The first adhesive layer, the first adhesive layer is made of an electrically insulating adhesive 1; "Please read the back \ note of the person-the second adhesive layer is placed On the first adhesive layer, the second adhesive screen has a second compound of electrical insulation and a conductive material, the second compound has a value equal to: less than the first bond Viscosity of the agent.-If the connection piece of the patent scope item I is declared, it is from the π to the smelting state. The viscosity is less than 2,000; the viscosity is less than 1,000 poises or less. Indica "agent &lt; No. 2 and No. 1 Among them No. 2 and No. 1 Among them, the first bonding belongs to the conductive material. 3. If the U-degree of the connecting sheet of item 1 of the patent application scope is 500 poise or less. With the patent application scope No. 1 The connection piece of the item contains-the same material. With the ^ patent application, the connection piece of the first item ° agent has * with the same combination properties. 6 If the patent application range $ and, or the second combination layer contains insulation Particles, the connecting piece includes conductive: the connecting piece surrounding item 1, in which 8. Such as &quot;: coated with insulating material on both sides Electric particles. Wide including-points: slice 3 = surface of Heguang, and let:: the second side of the second layer of the dry layer should be the first dry layer 9.-recording, heart knife blade can be peeled from the first dry genus The electrical connection between the two, including the Ϊ structure is used to make the electric connection to the electric core of the Qi of the 42 pieces of paper. The size of the paper is A4 specifications (21 〇 297 mm). Cut 323 π, apply for the patent scope-1st bonding Layer, the i-th sticky layer is made of the electrically insulating younger brother 1 compound; contains—and: the mouth layer is placed on the first compound skin, the second compound Layer 丨 and Xia ,, insulating properties &lt; 2nd binder and-conductive material 'when the first mixture is in a molten state, the second binder has a viscosity equal to that of the first binder; and ^ matrix In contact with the first dry layer or the second dry layer, the food has a covered electrode. This electrode has an electrode surface to be in contact with the conductive material. The long side (L) and short side (D) of this electrode surface The ratio (㈣ is 20 or less. 1 〇. Such as the connection structure of the fourth patent application ϋ 9th item, wherein, when the i and the second binder are in the molten state, the second binder The dryness is lower than the viscosity of the first dry mixture by 1000 poise or less. U. A connection structure is used to connect the opposing electrodes together as an electrical connection between the electrodes, including the first adhesive layer, the first adhesive The laminate is made of a first adhesive with electrical insulation properties;-a second adhesive layer is placed on the first adhesive layer, the second adhesive layer contains a second with electrical insulation properties An adhesive and a conductive material; and—a pair of electrode rows that are opposed to each other and have a first and a second adhesive layer disposed therein. At least one of the pair of electrode rows includes a protruding electrode protruding from a substrate The protruding electrodes each have a bottom close to the substrate and an upper surface facing the corresponding electrode, and the first adhesive surrounds at least the bottom of each protruding electrode. 12 For example, the connection structure of item 11 of the scope of patent application, including the first 1 43 (please read the precautions on the back and then fill out this page) Printed by the Employee Consumer Cooperative of the Ministry of Economy and Economy, -nn rv nni " *** a ^ MM mV I ^^ — Bv ^ ¾. 、 v6. · &quot; · shirts and hates the national standard (CNS) of State A (CNS) Ministry of Economics Central Bureau of Accreditation Employee Consumer Cooperative Printed Bag A8 B8 C8- ---------- D8 6. Scope of patent application ~~~~ · --- and the viscosity of the second binder when the second binder is in the molten state is 1000 poise or less than that of the first binder Α ν13. The connection structure as claimed in item 11, wherein the conductive material of the second adhesive layer has a decreasing density with the distance from the upper surface of each protruding electrode to the bottom. I4 · — A connection method for connecting opposing electrodes together for electrical connection between the electrodes, including: placing a connecting piece including a first adhesive layer and a second adhesive layer between the pair of electrode rows The pair of electrodes are arranged in a confrontation arrangement step. The first adhesive layer is composed of the first adhesive layer having electrical insulating properties and thermosetting properties Made, the second adhesive layer is placed on the first! Adhesive layer and contains a conductive material and a second adhesive with electrical insulation properties and thermosetting properties; and the second and second adhesives are heated under pressure The heat and pressure application step of the layer, the heat or / and pressure applied to the second adhesive during the heat and pressure application step is lower than the heat or / and pressure applied to the first adhesive. Item's connection method, in which the step of applying heat is desired; the ith and second genus are heated under pressure, so the viscosity of the second adhesive when the first and second adhesives are in the molten state It is 1000 poise or less than that of No. ^ Mixture. 16. The connection method as described in item 14 of the patent application, wherein in the step of applying hot pressing, the connecting piece is pressurized with a heat source located near the first genus Under the heater. 17—A connection method is used to connect the electrodes of the confrontation to make the electrical connection between the electrodes, including: 44 The paper standard is applicable to the national standard (CNS) 84 specifications (2 丨 0x297 public ban ( Please read the precautions on the back before filling in this page} -Crack -------- One Order -----》 --------------- ^ ί1328 Β8 C8 D8 、 Please apply for the scope of patent | first I read the back of the room I! Face | No.1 Item of the lookout and then 4 ί The page of the horse The step of arranging a contact including a first dry layer and a second dry wide layer between a pair of electrode rows to make the pair of parallel rows of electrodes, the first dry layer is electrically insulated Properties and thermosetting properties U! The second dry layer made of the dry layer is placed on the first dry layer and contains a conductive material and a second dry agent with electrical insulation and thermosetting properties; heated under pressure No. 2 and No. 1] The first step of bonding is to apply a hot pressing step so that when the first and second binders are in a shock state, the conductive material * each other = the opposing electrodes are in contact, so that the electrode materials are electrically connected ; 'Check each electrode pair &lt; electric conductivity current supply inspection step; and after the current supply inspection step, reheat the second and i-th adhesive layer second heating and pressing step. 8. If applying for a patent | The connection method of item 17 of the stipulation The supply inspection (iv) includes repairing an electrode connection when the-electrode connection is found to be defective due to electrical inspection. 19. For the connection method of item 丨 7 of the patent application scope, the supply inspection step is performed when the connection force of the first and / or second binder is increased to the connection of the electrode can be maintained. The Ministry of Economic Affairs, Central Bureau of Standards, Employee Consumer Cooperatives printed and supplied 2 inspection method of patent system No. 17, where the current-once step is when each pair of electrodes is under pressure so that the connection of the electrodes can be maintained for electricity Do it when you connect.土 '21. For example, the connection method of claim II of the patent scope, in which the 2nd and 1st compounds are heated under pressure during the step of adding, so that when the 1st and 2nd compounds are in a molten state, 2 The binder has the same or two viscosities as the first binder. ， 45 炣 炣 I 丨 Zhang scale suitable peach> August 4 specifications (210 father 297 mm)