TW309695B - - Google Patents

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Publication number
TW309695B
TW309695B TW84105079A TW84105079A TW309695B TW 309695 B TW309695 B TW 309695B TW 84105079 A TW84105079 A TW 84105079A TW 84105079 A TW84105079 A TW 84105079A TW 309695 B TW309695 B TW 309695B
Authority
TW
Taiwan
Prior art keywords
layer
film
plating
original
conductive
Prior art date
Application number
TW84105079A
Other languages
English (en)
Chinese (zh)
Original Assignee
Shipure Ento Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipure Ento Kk filed Critical Shipure Ento Kk
Application granted granted Critical
Publication of TW309695B publication Critical patent/TW309695B/zh

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  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Optical Filters (AREA)
TW84105079A 1994-08-23 1995-05-22 TW309695B (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19846694 1994-08-23

Publications (1)

Publication Number Publication Date
TW309695B true TW309695B (ko) 1997-07-01

Family

ID=16391582

Family Applications (1)

Application Number Title Priority Date Filing Date
TW84105079A TW309695B (ko) 1994-08-23 1995-05-22

Country Status (3)

Country Link
KR (1) KR100343592B1 (ko)
CN (1) CN1148470C (ko)
TW (1) TW309695B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI758802B (zh) * 2019-09-18 2022-03-21 日商豐田自動車股份有限公司 配線基板之製造方法及配線基板

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020124620A1 (zh) * 2018-12-19 2020-06-25 江南大学 一种微生物导电陶瓷及其制备方法和应用
CN113825321B (zh) * 2021-09-03 2022-04-29 深圳市顺华智显技术有限公司 电路板及其制作方法和应用

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI758802B (zh) * 2019-09-18 2022-03-21 日商豐田自動車股份有限公司 配線基板之製造方法及配線基板

Also Published As

Publication number Publication date
KR100343592B1 (ko) 2002-11-02
CN1122383A (zh) 1996-05-15
CN1148470C (zh) 2004-05-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees
MM4A Annulment or lapse of patent due to non-payment of fees