TW309654B - - Google Patents

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Publication number
TW309654B
TW309654B TW085102238A TW85102238A TW309654B TW 309654 B TW309654 B TW 309654B TW 085102238 A TW085102238 A TW 085102238A TW 85102238 A TW85102238 A TW 85102238A TW 309654 B TW309654 B TW 309654B
Authority
TW
Taiwan
Prior art keywords
item
circuit path
patent application
majority
component
Prior art date
Application number
TW085102238A
Other languages
English (en)
Chinese (zh)
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Application granted granted Critical
Publication of TW309654B publication Critical patent/TW309654B/zh

Links

Classifications

    • H10W70/635—
    • H10W40/22—
    • H10W40/70—
    • H10W70/68—
    • H10W76/157—
    • H10W76/47—
    • H10W76/60—
    • H10W90/00—
    • H10W90/701—
    • H10W70/655—
    • H10W70/682—
    • H10W72/07251—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/20—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/877—
    • H10W72/884—
    • H10W74/15—
    • H10W90/288—
    • H10W90/291—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
TW085102238A 1995-03-29 1996-02-27 TW309654B (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US41314995A 1995-03-29 1995-03-29

Publications (1)

Publication Number Publication Date
TW309654B true TW309654B (OSRAM) 1997-07-01

Family

ID=23636049

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085102238A TW309654B (OSRAM) 1995-03-29 1996-02-27

Country Status (4)

Country Link
JP (1) JPH11503565A (OSRAM)
AU (1) AU5360496A (OSRAM)
TW (1) TW309654B (OSRAM)
WO (1) WO1996030942A1 (OSRAM)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005002335A (ja) * 2003-05-21 2005-01-06 Japan Gore Tex Inc 接着フィルムおよびこれを使った半導体装置
US6946728B2 (en) 2004-02-19 2005-09-20 Hewlett-Packard Development Company, L.P. System and methods for hermetic sealing of post media-filled MEMS package
JP4387269B2 (ja) * 2004-08-23 2009-12-16 株式会社テクニスコ ビアが形成されたガラス基板及びビアの形成方法
US7886437B2 (en) * 2007-05-25 2011-02-15 Electro Scientific Industries, Inc. Process for forming an isolated electrically conductive contact through a metal package
JP2010245337A (ja) * 2009-04-07 2010-10-28 Elpida Memory Inc 半導体装置及びその製造方法
KR101381438B1 (ko) * 2010-04-30 2014-04-04 유보틱 인텔릭츄얼 프라퍼티 컴퍼니 리미티드 인쇄회로기판에 전기적으로 결합되도록 구성된 에어 캐비티 패키지 및 상기 에어 캐비티 패키지의 제공 방법
JP5987222B2 (ja) * 2011-09-30 2016-09-07 住友電工デバイス・イノベーション株式会社 半導体装置
US9930793B2 (en) * 2014-03-27 2018-03-27 Intel Corporation Electric circuit on flexible substrate
US9392713B2 (en) * 2014-10-17 2016-07-12 Rsm Electron Power, Inc. Low cost high strength surface mount package
US11444048B2 (en) 2017-10-05 2022-09-13 Texas Instruments Incorporated Shaped interconnect bumps in semiconductor devices

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136348A (ja) * 1983-12-26 1985-07-19 Hitachi Ltd 半導体装置
JPS6298737A (ja) * 1985-10-25 1987-05-08 Sharp Corp 半導体装置の交換方法
US4888449A (en) * 1988-01-04 1989-12-19 Olin Corporation Semiconductor package
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
JPH0260149A (ja) * 1988-08-26 1990-02-28 Matsushita Electric Works Ltd 半導体パッケージ
US4939316A (en) * 1988-10-05 1990-07-03 Olin Corporation Aluminum alloy semiconductor packages
US4968552A (en) * 1989-10-13 1990-11-06 International Business Machines Corp. Versatile reactive ion etch barriers from polyamic acid salts
JPH04216655A (ja) * 1990-12-18 1992-08-06 Nec Kyushu Ltd 半導体装置
US5352926A (en) * 1993-01-04 1994-10-04 Motorola, Inc. Flip chip package and method of making

Also Published As

Publication number Publication date
WO1996030942A1 (en) 1996-10-03
JPH11503565A (ja) 1999-03-26
AU5360496A (en) 1996-10-16

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