TW307877B - - Google Patents
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- TW307877B TW307877B TW085104450A TW85104450A TW307877B TW 307877 B TW307877 B TW 307877B TW 085104450 A TW085104450 A TW 085104450A TW 85104450 A TW85104450 A TW 85104450A TW 307877 B TW307877 B TW 307877B
- Authority
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- Taiwan
- Prior art keywords
- capillary
- ball
- ball head
- coating
- junction
- Prior art date
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- 238000000576 coating method Methods 0.000 claims description 62
- 239000011248 coating agent Substances 0.000 claims description 60
- 230000015572 biosynthetic process Effects 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 230000002079 cooperative effect Effects 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 241000239290 Araneae Species 0.000 claims 1
- 241001506766 Xanthium Species 0.000 claims 1
- ZFXYFBGIUFBOJW-UHFFFAOYSA-N theophylline Chemical compound O=C1N(C)C(=O)N(C)C2=C1NC=N2 ZFXYFBGIUFBOJW-UHFFFAOYSA-N 0.000 claims 1
- 229960000278 theophylline Drugs 0.000 claims 1
- 239000010408 film Substances 0.000 description 31
- 239000013039 cover film Substances 0.000 description 3
- 238000010422 painting Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000009916 joint effect Effects 0.000 description 2
- 241000218033 Hibiscus Species 0.000 description 1
- 235000005206 Hibiscus Nutrition 0.000 description 1
- 235000007185 Hibiscus lunariifolius Nutrition 0.000 description 1
- 102100021749 LIM and senescent cell antigen-like-containing domain protein 3 Human genes 0.000 description 1
- 101710104347 LIM and senescent cell antigen-like-containing domain protein 3 Proteins 0.000 description 1
- 244000273256 Phragmites communis Species 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009956 embroidering Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- SYHGEUNFJIGTRX-UHFFFAOYSA-N methylenedioxypyrovalerone Chemical compound C=1C=C2OCOC2=CC=1C(=O)C(CCC)N1CCCC1 SYHGEUNFJIGTRX-UHFFFAOYSA-N 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/78268—Discharge electrode
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- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
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- H01L2224/85009—Pre-treatment of the connector or the bonding area
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- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
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- H01L2224/852—Applying energy for connecting
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Description
經濟部中央橾率局貝工消费合作社印製 307877 A7 B7 五、發明説明(f ) <發明之詳细說明> <發明所靨之技術範晴> 本發明係有闢一種被覆線之媒接合装置及其方法。 <習知之技術> 在被覆媒之線接合方法中,例如特關平2 — 2 i 3 1 4 6號公報所遢示者,其包括有預先除去被覆線上之第2 接合及球頭形成用之預定部位之被覆膜,而使之靄出線S 之被覆臢除去工程,及在除去被覆臢之線之前罐形成球頭 之球頭形成工程。此等被覆膜除去工程及球頭形成工程係 以放«電極實行之。 第二圔所示者為習知之被«媒之線接合用霣極,而第 四所示者為習知之被覆線之壤接合方法。如第四酾所示 ,被覆線1係由作為辱霣艚之線芯1 a、包覆其周_之具 有絕緣性之高分子樹脂所構成之被覆腰1 b所構成。被覆 線1係由圈未示之線袖所提供,而經由線保持用第2夾持 器2、線切斷用第1夾持器3,插通至毛细管4。又,插 通於毛细管4之被覆媒1被接續於半導體片狀元件5之® 極及引線框架6之引線6 a。 如第二国所示,一對之放««極7、8 ·係具有作為 放霣襯子之霣磁片71、81,電磁片71、81之上下 面被絕緣性之絕緣片72、8 2所夾持。在此,一方之放 «霣極7係為除去被覆臢1 b之專用®櫳,而另方之放電 霄極8則為除去被覆膜1 b及形成球頭用之兩用電極。在 -4 - 本紙張尺度適用中國國家揉率(CNS > A4规格(210X297公釐_) 裝 訂 务 (請先閱讀背面之注意事項再填窵本頁) A7 B7 經濟部中央標芈局負工消费合作社印装 五、發明説明( ^/) 此,放霣霣極8之上面係為®出放電面之樽造,而其a出 部份係具有作為球頭形成用霣極面8 a之懺能。 其次,依第四說明被覆線之線接合方法。第四画( a)為在被覆線1之前鳙形成球頭lc ,及第1夾捋器3 與第2夾持器2為打開之狀態。又,被覆繡1之前纗起隔 K-定距雛之部份,依後述方法形成有除去部份(露出部 Id)。自第四画(a)起,如第四_ (b)所示,毛细 管4下降,而將球頭1 c作第1次接合而接合於半導應片 狀元件5之罨極及第1接合黏。其次毛细管4上昇,移動 至引線框架6之引媒6a上方並下降,如第四漏(c)所 示,將露出部1 d作第2次接合而接合於引嬢6 a之第2 接合點。 其次,如第四圖(d)所示,毛细管4自引鐮6a之 表面起,上昇L1 。此L1如前述特開平2—21314 6號公報所記載,除以第1及第2接合部位有關之情報及 裝置之初期設定條件等所算出。毛细菅4上昇L1後*第 1夾持器3閉合而夾持被覆線1 。接蕃,在第1夾捋器3 為閉合之狀態下,與毛细管4 —同上昇,而如第四圈(e )所示,被覆線1被自前述第2接合點之根部所切腑,其 结果,被覆線1成為自毛细管4之前纗突出前述L1之長 度之狀態。又,被覆媒1之前嫌殘留有露出部1 d之一部 份。 其次,如第四圓(f )所示,一對之放霄霄極7、8 (請先閱讀背面之注意事項再填寫本頁) .裝.
*1T 線 本紙法尺度逋用中國®家樣率(CNS ) A4规格(210 X297公釐) 經濟部中央標準局負工消費合作杜印製 A7 B7 五、發明説明(j) 自被覆線1之兩側Μ非接觸之方式,將之夾入。接著放S 電極7、8被施以霄壓,而在介設有被覆鑲1之狀態下, 在霄磁片71 、81與繡芯la間,被施以放霉。此時* 以放«之能1[,如第四翻(g)所示•將被覆繡1之既定 部位上之被覆膜lb之一部份除去。即,如第四画(h) 所示*形成露出部1 d。其次鄕第四疆(h)所示,放電 電極7、8向離開被覆線1之方向退避。 接著如第四圈(i)所示,第2夾持器2閉合,而第 1夾持器3打開。其後,毛细管4自第四_ (h)之狀態 起,相對下降L2 。此時,被爾線1被第2夾捋器2所保 持(拘束),故被覆媒1被拉入毛细管4内鄯L2之距離 ,而在毛细管4之前端,被覆線1之前嫌成為突出一尾巴 長為L3之狀態。此場合,被覆線1之前端之尾巴長L3 成為前述露出部1 d之一部份,而為除去被覆膜1 b之狀 態0 此狀態如第四_ (j)所示’第1夾持器3閉合而第 2夾持器2打開,且毛细管4上昇至形成球顗之位階。接 著如第四圖(k)所示,放霉電極8移動使球頭形成用霄 極面8a位於被覆線1之前鳙之正下方。之後’如第四_ (1)所示,放電《槿8與被«線i被施Μ高霄懕’而形 成球頭lc。接著如第四圈(m)所示,放電電極8回到 原位置。之後,第1夾持器3打關,毛细管4位於下一接 合點上方(參照第四圈(a))。以後,里覆觭述第四围 -6 ** 本紙張尺度適用中1國家揉隼(CNS ) A4规格(210X297公* ) (請先閱该背面之注意事項再填寫本頁) -裝. 線 A7 B7 五、發明説明(义) (a)〜(m)之一連串動作。 <發明欲解決之課题> 上述習知技術,為形成球醭lc ,如第四 (<i)所 示,毛细管4上昇至球顗形成位階後*如第四_ (k)( 1) (m)所示,須要脔將放罐爾極8移勘至被覆繍1前 端正下方之動作 > 放電所主持之球頭形成動作及放電«極 8回到原處之動作。 本發明之課鼴即為提供一種可將被覆臟除去動作後所 實行之球頭形成動作予Μ藺化,及將接合動作快速化*及 達到提高生產量之目的之被覆線之線接合裝置及其方法者 0 <解決課題之手段> 為解決上述課題,本發明為:一種被覆線之線接合装 置,其係使用被插通於毛细管,在由導霣性金靨所構成之 媒芯周圍,被覆絕緣性被覆膜所成之被覆線,而以放電« 極除去被覆線之第2接合預定部位之被覆膜 > 及於被覆線 前端形成球頭,而將形成於被耰壤前端部之球頭接合於第 1接合點,而將自毛细管所露出之被覆膜除去部接合於第 2接合點,藉此,將第1接合點與第2接合點間予Μ辱電 性接績者;其特徽在於: 其放霣霣極係包括Μ絕緣片及夾持作為放«端子之S 磁片之上下面所成之一對被覆鼷除去用放霣霉極,反與此 一對之被覆膜除去用放«電極之一方被設成可一起移動之 本紙張尺度適用中國國家樣準(CNS ) A4規格(210X 297公釐) (請先閱讀背面之注意事項再填寫本頁)
.tT 線 容07877 B7 植济邦中央慄苹馬負工消费合作社印装 五、發明説明( r) 1 i I 球 頭 形 成 用 放 霜 電 極 前 述 —^ 對 之 被 覆 膜 P入 除 去 rrt 用 放 霄 霉 極 1 1 1 $ 於 除 去 第 2 接 合 預 定 部 位 之 被 覆 臢 時 被 位 成 Μ 非 接 1 1 觸 之 狀 態 包 夾 被 覆 線 之 第 2 接 含 預 定 部 位 之 側 面 之 周 醒 » 請 先 閱 1 I 而 前 述 球 頭 形 成 用 放 轚 極 在與 該 球 頭 形 成 用 放 電 電 極 讀 背 1 1 面 I — 起 移 都 動 之 被 覆 膜 除 去 用 放 « 爾 極 打 關 時 儒 位 於 被 覆 之 注 1 1 媒 之 側 方 當 毛 细 管 上 昇 至 球 頭 形 成 位 階 時 被 覆 線 之 前 事 項 1 I 再 1 1 端 則 位 於 球 頭 形 成 用 放 電 霣 極 之 俩 方 0 填 1 本 ά 為 解 決 上 述 課 題 本 發 明 為 種 被 覆 線 之 線 接 合 方 頁 I 1 法 其 係 使 用 被 插 通 於 毛 细 管 在 由 導 霣 性 金 屬 所 構 成 之 1 1 媒 芯 周 園 被 覆 絕 掾 性 被 覆 m 所 成 之 被 覆 線 在 將 形 成 於 1 1 此 被 覆 線 前 端 部 之 球 頭 接 合 於 第 1 接 合 點 並 將 毛 细 管 1 訂 1 I 所 露 出 之 被 覆 膜 除 去 部 接 合 於 第 2 接 合 黏 藉 此 將 第 1 接 合 點 與 第 2 接 合 點 間 予 以 m η 性 m 讀 有 其 特 微 在 於 * • 1 1 在 將 第 2 接 合 預 定 都 位 之 被 覆 膜 預 先 Μ 一 對 之 被 覆 1 i 膜 除 去 用 放 當 電 極 之 放 邐 » 予 除 去 後 在 前 遽 —* 對 之 被 覆 1 線 1 I 膜 除 去 用 放 霣 霣 極 鐮 開 被 覆 鑲 時 球 頭 形 成 用 放 m 霉 極 偽 位 於 被 覆 線 之 側 方 其 次 將 被 覆 媒 拉 入 毛 细 管 内 部 使 被 1 1 覆 線 之 前 端 百 毛 细 管 前 鑭 突 出 —* 尾 巴 長 接: 蕃 毛 綑 管 上 昇 1 1 至 球 頭 形 成 位 階 使 被 覆 線 前 纗 位 於 前 述 球 頭 形 成 用 放 霣 1 1 霣 極 之 側 方 在 此 狀 m 下 藉 由 球 頭 形 成 用 放 電 霣 極 之 放 1 I 霣 於 被 覆 線 之 前 端 形成 球 頭 番 0 1 1 1 < 發 明 之 實 施 形 想 > 1 1 被 覆 線 之 線 接 合 装 置 所 使 用 之 放 霣 電 極 如 第 画 所 1 1 - 8 - 1 1 本紙乐又度適用中國國家標準(CNS ) A4規格(210X 297公釐_〉 經濟部中央樣準局貝工消费合作社印装 A7 _B7_ 五、發明说明(‘) 示,係包括以絕緣片1 3、1 3及23、23夾持作為放 «纗子之«磁片1 2及2 2之上下面所成之一對被覆膜除 去用放霣霣極1 0、20,及與一方之被覆膜除去用放電 電極20被設成可一起移動之球頭肜成用放霉電極31。 又*被覆膜除去用放電霣極10、20*如第三_ (f) (g)所示,於除去第2接含預定部位之被覆膜lb時, 被定位成K非接觴之狀態包夾被覆線1之第2接合預定部 位之側面之周醒,而藉由被覆膜除去甩放電S極1 0、2 0之放霣,形成露出部Id。 球頭形成用放電電極3 1摑第一匾(b)所示,在被 覆膜除去用放霣電極1 0、20打闋時,如第一_ (a) 所示,係與一方之被覆膜除去用放電電極2 0 —起移動而 位於被覆線1之側方。因此,如後述之第三_ (j)所示 ,毛细管4上昇至球頭形成位随,而被覆線1之前鏞位於 球頭形成用放電電極31側方,而K球頭形成用放電霣極 3 1之放霣,形成球頭1 c。亦即,不必為形成球頭1 c 而使球頭形成用1極3 1移動。 被覆線之線接合方法,如第三躕(s )所示,係以一 對之被覆膜除去用放鼋霣極1 ◦ 、2〇之放®,預先將第 2接合預定部位之被覆膜1b予Μ除去而形成露出部1d ,一對之被覆膜除去用放霄電極10、20如第三圖(h )所示,在離開被覆線1時,如第三_ (_3 )所示,球頭 形成用放電轚極3 1傜位於被覆線1之側方。其次,如第 -9- 本紙張尺度適用中國國家揉準(CNS ) A4規格(2丨0_犬297公釐> (請先閱讀背面之注意事項再填寫本頁) ,裝. 訂 Μ濟部中央標华局ec工消费合作社印製 A7 _ B7 五、發明説明(7) 三臞(i)所示*在第1夾持薄3為打開之狀鏍下,第2 夾持器2閉合,而藉由使毛细管4下降,被覆鎳1之前端 將自毛细管4之前蟠,突出尾巴長L3 。 接著如第三11 (j)所示*毛钿管4上昇,而使披覆 線1前端位於球頭形成位階。此壜合,如舫述,因球頭形 成用放霣霣極3 1位於被覆線1之側方,故被覆線1之前 端位於球頭形成位階時,球頭形成用放電電播3 1則位於 被覆線1前端之側方。此狀態如第三讕(k)所示*K球 頭形成用放電«極3 1之放電,在被覆線1之前纗形成球 顗1 c。亦即,不必要為形成球頭1 c而移動球頭形成用 放霄電極3 1 。 <實施例> Μ第一醒及第三匾說明本發明之實腌例。又,與第二 匪及第四匾為相同或枏當之元件,附Κ同一符作說明。第 一圔所示者為被覆線之鑲接合裝置所使用之放鬣霣極。一 對之放電«極1 0、20,係分別固定於電極寶1 1 、2 1上,而以圏未示之驅動手段,驅動於接近被覆線1或雛 開被覆線1之方向上。放電霣極1 0、20具有作為放霣 端子之電磁片1 2、2 2 ,®磁片1 2、2 2之上下面被 絕緣性之絕緣片1 3、1 3及23、23所夾捋。Μ往, 如第二鼴所示,一方之放霣電極8上面,形成有露出放罨 面之球頭形成用«極面8 a ,但在本*施例之放霣霉極1 0、2 0上*並未形成有該球頭形成用霣檯面S a。亦即 -10- 本紙張尺度適用中國國家梯準(CNS ) A4规格(2ί〇Χ 297公釐〉 (请先閲讀背面之注意事項再填寫本頁) 裝 訂 線 經濟部中央橾準局貝工消费合作社印製 A7 B7 五、發明説明(^ ) ,一對之放霄電極1 0、20將成為除去被覆膜l b用之 專用霄極。Μ下,將放霉電極1 0、20稱為被覆鼷除去 用放霣霣極。 前述一方之霣極«2 1上,掘定有電極臂3 0 ·電極 臂30之前纗部上,固定有球顗形成用放電«檯3 1。球 頭形成用放霄鼋極31係被設成在被覆膜除去用放電電極 1 0、2 ◦自被覆嬢1難開一定距離時,係位於被覆線1 之側方者。例如毛细管4之半徑為0 ·◦ 8 mm時,則位 於離被覆線中心約0·9mm之位置。 其次依第三屬說明被覆媒之線接合方法。又,因第三 B (a)至第三圔(e)傜與第四 (a)至第四圔(e )相同,故省略其說明。又,第三® (f)至第三圔(i )亦與第四圖(f )至第四麵(i )相Μ >但仍稍作說明 。如第三鼷(e)所示,被覆線1在第2接合部位(霉出 部Id)被切蹶後,如第三匾(f)所示,一對之被覆膜 除去用放電霣極1 0、20自被覆線1之兩側,Μ非接觸 之狀態,作夾持,而如第三画(g)所示,被覆膜除去用 放霣霣極1 0、20被嫌加《臛,輿習知者同,被覆線1 之既定部位上之被覆膜1 b之一部份被除去。 其次如第三画(h)所示,被覆膜除去甩放霣«極1 〇、20自被覆線1向離開方向退避,而回到原位置。被 覆膜除去用放霣霣極1 0、20掘到原位置後,球頭形成 用放電電極3 1 ,與被覆膜除去用放霣霣極1 0、20 — -11- 本紙張尺度適用中國國家橾率(CNS ) A4洗格(2!〇Χ 297公釐) — — — — — — 裝 _ I n ^ 線 (請先閲讀背面之注意事項再填寫本頁) .¾濟部中央橾隼扃貝工消费合作社印裝 A7 £7___ 五、發明説明(7 ) 起移動,而如第一 _ (a)所示,其係位於被覆鑲1之側 方。接著如第三 (i)所示,第2夾持器2閉合,而第 1夾持器3打開後,毛细管4自第三漏(h)之狀籲相對 地下降L2 。藉此,被覆鑲1被拉人毛细管4内部L2之 長度,而自毛细管4前纗,被覆镍1之前钃突出尾巴長 L 3 〇 此狀態如第三匾(j)所示*第1夾持器閉合而第2 夾持器2打開,接蕃毛细管4上昇至球頭形成位階。K往 ,如第四鼷(j)所示,被覆線1之前纗係自放霄«極8 之球頭形成用電極面8 a移»至上方。本實應例則使被覆 線1之前端移動至位於球頭成形用放電電極3 1之側方。 接著如第三圖(k)所示,球頭形成用放霉霄極3 1與被 覆線1被施Μ高電壓,而形成球頭1 c 。其次第1夾持器 3打開,毛细管4則位於次一接合點之上方(參照第三鼴 (a ))。以後,重複前述第三圖(a)〜(k)之一埋 串動作。 如此,第三画(j)對應於第四騸(j),而第三麵 (k )則對應於第四臞(1 )。亦即,本實施例中’不須 要如第四圔(k)及第四醒(m)所示之使放霉電極8移 動至被覆線1前斓下方及自被播線1之前端回到原位置之 兩動作。因此,可將球頭形成動作藺化,並使接合動作快 速化,及達到提高生產性之目的者° <發明之效果> -1 2 - 本纸伕尺度適用中國國家揉準(CNS ) A4規格(210 X297公釐) ---------1------1T------.^ (請先閲讀背面之注意事項再填寫本頁) 307877 A7 B7 五、發明説明(/ 〇 ) 專利 動作 的者 <騙 第一 之一 第二 (a asst —* 第二 說明 第四 <符 1 本發明之被覆媒之鐮接合裝置及其方法•係包括申請 範疆第1項及第2項所記述之手段,故可將球頭形成 藺化,並使接合動作快速化,及達到提高生產性之目 經濟部中央揉準局員工消费合作社 4 5 5 6 6 0 示之籣 画為本 實施例 匾為習 )為上 _為本 画。 圈為習 號之說 被覆 線芯 被覆 球頭 毛细 半導 電極 引線 引線 、2 0 簞說明> 發明之被覆線之鑲接合裝置所使用之放«電極 ,(a )為上視疆,(b )為正視。 知之被覆線之線接合裝置所使用之放霄霉極, 視_ * ( b )為正襬_。 發明之被覆饑之線播合方法之一實施例之動作 知之被覆媒之媒接合方法之動作說明圔。 明> 線 膜 管 體片狀元件 框架 被覆臢除去用放電霉極 13 (請先閱讀背面之注意事項再填寫本頁) 訂 線 \ 用中國國家樣準(CNS ) A4規格(210X297公釐 \
"V A7 __B7 五、發明説明(/ I ) 1 1、2 1 轚極臂 3 0 電極臂 31 球頭形成用放«電極 (請先閲讀背面之注意事項再填寫本1) -裝·
.1T 經濟部中央標準局負工消费合作社印製 -14- 本紙張尺度適用中國國家梯準(CNS ) Α4規格(2丨0 X 297公釐)
Claims (1)
- Α8 BS C8 D8 經濟部中夫#準局負工消费合作社印装 六、申請專利範圍 1 · 一種被覆嬝之鑲接合裝置,其係使用被插通於毛细管 ,在由導霣性金屬所溝成之繡芯周·,被覆絕嫌性被覆膜 所成之被覆媒,而以放霣«檯除去被覆線之第2接含預定 部位之被覆膜,及於被覆線前鳙形成球頭,而將形成於被 覆镍前端部之球頭接合於第1捿合點,而將自毛细管所露 出之被覆膜除去部接合於第2捿合點,藉此,將第1接合 點與第2接合點間予Μ導霜性接鑛者;其特擻在於: 其放霄«極係包括Μ絕嫌片及夾持作為放霉皤子之霣 磁片之上下面所成之一對被覆臢除去用放霣電極,及與此 一對之被覆膜除去用放霞霉極之一方被設成可一起移動之 球頭形成用放««樋;鲔述一對之被覆膘除去用放電霉極 ,於除去第2接合預定部位之被覆鎮時,被定位成Μ非接 觸之狀態包夾破覆線之第2接合預定部位之測面之周鼸, 而前述球頭形成用放霣電極,在與該球頭形成用放電轚搔 一起移動之被覆膜除去用放電霪極打開時,像位於被覆線 之側方,當毛细管上昇至球顗形成位階時,被覆鎳之前端 則位於球頭形成用放霣«極之輒方。 2 · —種被覆線之線接合方法,其係使用被插通於毛细管 •在由導霣性金屬所構成之繡芯周圃,被覆鱺緣性被覆膜 所成之被覆線,將形成於此被覆鐮前纗部之球醺接合於第 1接合點*並將自毛细管所露出之被覆膜除去部接合於第 2接合點,蕹此,將第1接合黏與第2接合點閬予Μ導電 -1 - (請先閲讀背面之注意事項再填寫本頁) 装· 訂 λ ^紙法尺度速用中國®家橾準(CNS Μ4洗格(2丨0X 297公釐) 307877 AS B8 C8 D8 六、申請丰利範困 性接纊者;其特激在於: 在將第2接合預定部位之被覆膜,預先M —對之被覆 膜除去用放電電極之放«,予除去後,在前述一對之被覆 膜除去用放霣霄極鐮開被覆繡畤,球顗形成用放電爾極偽 位於被覆媒之側方,其次將披覆線拉入毛细管内部,使被 覆線之前端自毛细管前鳙突出一尾巴長,接蕃毛细管上昇 至球頭形成位階,使被覆線前鵰位於前述球頭形成用放β 霣極之側方,在此狀態下,藉由球頭形成用放霉霣極之放 霣,於被覆線之前端形成球頭者。 --------#装------訂------(蛛 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標率局属工消费合作社印製 本纸張尺度適用t國國家標率(CNS ) A4洗格(210X297公* )
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP07329523A JP3077101B2 (ja) | 1995-11-24 | 1995-11-24 | 被覆ワイヤのワイヤボンディング装置及びその方法 |
Publications (1)
Publication Number | Publication Date |
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TW307877B true TW307877B (zh) | 1997-06-11 |
Family
ID=18222328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085104450A TW307877B (zh) | 1995-11-24 | 1996-04-13 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5797388A (zh) |
JP (1) | JP3077101B2 (zh) |
KR (1) | KR100214165B1 (zh) |
TW (1) | TW307877B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7124927B2 (en) * | 1999-02-25 | 2006-10-24 | Reiber Steven F | Flip chip bonding tool and ball placement capillary |
US20070131661A1 (en) * | 1999-02-25 | 2007-06-14 | Reiber Steven F | Solder ball placement system |
US7032802B2 (en) * | 1999-02-25 | 2006-04-25 | Reiber Steven F | Bonding tool with resistance |
US20060261132A1 (en) * | 1999-02-25 | 2006-11-23 | Reiber Steven F | Low range bonding tool |
US7389905B2 (en) | 1999-02-25 | 2008-06-24 | Reiber Steven F | Flip chip bonding tool tip |
US20060071050A1 (en) * | 1999-02-25 | 2006-04-06 | Reiber Steven F | Multi-head tab bonding tool |
US6651864B2 (en) | 1999-02-25 | 2003-11-25 | Steven Frederick Reiber | Dissipative ceramic bonding tool tip |
US6354479B1 (en) | 1999-02-25 | 2002-03-12 | Sjm Technologies | Dissipative ceramic bonding tip |
US20080197172A1 (en) * | 1999-02-25 | 2008-08-21 | Reiber Steven F | Bonding Tool |
US7360675B2 (en) * | 2002-11-20 | 2008-04-22 | Microbonds, Inc. | Wire bonder for ball bonding insulated wire and method of using same |
US20070085085A1 (en) * | 2005-08-08 | 2007-04-19 | Reiber Steven F | Dissipative pick and place tools for light wire and LED displays |
US8234906B2 (en) | 2006-10-19 | 2012-08-07 | Societe de Chimie Inorganique et Organique en abrege “Sochinor” | Sensor for gases emitted by combustion |
JP4467631B1 (ja) * | 2009-01-07 | 2010-05-26 | 株式会社新川 | ワイヤボンディング方法 |
CN105895543B (zh) * | 2014-12-01 | 2019-09-13 | 恩智浦美国有限公司 | 接合引线进给系统及其方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2723280B2 (ja) * | 1989-02-13 | 1998-03-09 | 株式会社日立製作所 | ワイヤボンディング方法および装置 |
US5176310A (en) * | 1988-11-28 | 1993-01-05 | Hitachi, Ltd. | Method and apparatus for wire bond |
JP2541645B2 (ja) * | 1988-11-28 | 1996-10-09 | 株式会社日立製作所 | ワイヤボンディング方法および装置 |
JPH0645409A (ja) * | 1992-07-22 | 1994-02-18 | Rohm Co Ltd | ワイヤーボンディング方法及びその装置 |
-
1995
- 1995-11-24 JP JP07329523A patent/JP3077101B2/ja not_active Expired - Fee Related
-
1996
- 1996-04-13 TW TW085104450A patent/TW307877B/zh active
- 1996-11-23 KR KR1019960056847A patent/KR100214165B1/ko not_active IP Right Cessation
- 1996-11-25 US US08/755,784 patent/US5797388A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100214165B1 (ko) | 1999-08-02 |
JP3077101B2 (ja) | 2000-08-14 |
KR19980038021A (ko) | 1998-08-05 |
JPH09148360A (ja) | 1997-06-06 |
US5797388A (en) | 1998-08-25 |
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