TWI270897B - Method and device for treatment of lead wire - Google Patents

Method and device for treatment of lead wire Download PDF

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Publication number
TWI270897B
TWI270897B TW91117528A TW91117528A TWI270897B TW I270897 B TWI270897 B TW I270897B TW 91117528 A TW91117528 A TW 91117528A TW 91117528 A TW91117528 A TW 91117528A TW I270897 B TWI270897 B TW I270897B
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Taiwan
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wire
center
bending
center bar
curved
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TW91117528A
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Chinese (zh)
Inventor
Takashi Shiga
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Osawa Engineering Co Ltd
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Publication of TWI270897B publication Critical patent/TWI270897B/en

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Abstract

The present invention is related to a method and device for treatment of lead wire, which is particularly pointed to enhance production efficiency by utilizing mechanical treatment to automatically form an annular junction at the front end of the lead wire. The method for treating the lead wire by bending the portion of a conductor exposed from the front end of the lead wire and forming the annular junction at this portion is characterized in providing with a coating removing step of exposing the conductor by removing the coating from the front end of the lead wire, a solder film forming step of forming a solder film on the exposed surface of the conductor, a detecting step of detecting whether the length of the conductor formed with the solder film exists within a permissible range or not and expelling the conductor off the permissible range, and a bending step of forming the annular junction by bending the portion of the coating of the lead wire undergoing the detecting step by means of a bending tool.

Description

1270897 A7 ---------------B7________ 五、發明說明(/ ) 發明所屬之技術領域 本發明係關於一種導接線之處理方法及處理装置,尤 其係指一種將由導接線的前端所外露的導線部分彎折,以 將該部分形成為環狀的接合部以利電子電路傳導用之導接 線處理方法及處理裝置。 習用的技術 一般在電子機器的電子電路之導接線連接方法上,多 半疋利用工具將導接線前端之披覆外皮加以去除而讓導線 外露出,外露出之導線則利用工具以手工作業將之彎曲成 為環狀結構,而形成為環狀結構之導線部分處則可插設在 電子電路側之連接端子,該連接端子與導線的環狀部分藉 由焊料結合成一體,以使得導接線可以連接在電子電路上 Ο 本發明所欲解決之問題 但是,將導接線前端部分之導線利用手工作業以形成 預定大小之環狀結構時,該作業需耗費時間,且生產效率 亦不佳。又,該項作業需要操作之熟練度。經驗較淺的操 作者所產生不良率的機率便會提高。 本發明有鑑於上述之習用問題,乃以提供一種可以將 導接線前端部分之導線容易的形成所預定大小之環狀結構 、可使生產效率大幅的提昇、即使經驗較淺的操作者也幾 乎不會有不良品發生、可以形成有一定品質之環狀結構的 導接線處理方法及處理裝置為本發明之目的。 為解決問題所使用之方法 ___2________ 本紙張尺度細+關家標準(CNS)A4規格(21G X 297公釐) "'-- (請先閱讀背面之注意事項再填寫本頁) Φ ------ί —訂 Γ ¥ — I!·線. A7 1270897 -------- 五、發明說明(>) 本發明為了解決上述之問題,乃採用以下之技術手段 。也就是說,本發明申請專利範圍第1項的導接線之處理 方法,其乃是將由導接線的前端所外露出的導線部分彎折 ,以將該部分形成為環狀的接合部之處理方法,其特徵在 於··該處理方法具備有將導接線前端之披覆外皮加以去除 ,而讓導線外露出之披覆外皮去除工程、於露出之導線表 面形成有焊料皮膜之焊料皮膜形成工程、檢測已形成皮膜 之導線長度是否在所定之範圍内,並將在所定範圍外之料 品加以排除之檢測工程、將已通過檢測工程之導接線的導 線部分加以彎曲以形成環狀之接合部的彎曲工程。 藉由本發明的導接線之處理方法,導接線可以在披覆 外皮去除工程時,由前端部位去除預定長度之披覆外皮, 以使得預定長度之導線露出;在焊料皮膜形成工程時,可 以在所露出之導線表面形成有焊料之皮膜;在檢測工程時 ,可以檢測出在表面形成有焊料皮膜之導線長度是否在所 預疋之範圍内,並將在所定範圍外之料品加以排除,僅容 許再所預疋範圍内之料品送往下一個弯曲工程;藉由資曲 工程將已通過檢測工程之導線部分加以彎曲以形成環狀之 接合部。 本發明之申請專利範圍第2項,乃是就申請專利範圍 第1項所述的導接線之處理方法其中之檢測工程乃是由具 有可供導接線的導線插設之插入孔的檢測器具、設置於該 檢測器具上,可檢測出插設於插入孔中之導線外徑大小以 及長度是否在所定範圍之中的感應器所構成檢測方法。 本紙張尺度刺中關家鮮(CNS)A4規格⑵G X 2974公釐) -----1270897 A7 ---------------B7________ V. TECHNICAL FIELD OF THE INVENTION The present invention relates to a method and a processing apparatus for a conductive wire, and more particularly to a guide The exposed portion of the wire at the front end of the wire is bent to form the portion into a ring-shaped joint portion for the wire bonding processing method and processing device for electronic circuit conduction. The conventional technology generally uses the tool to remove the covering skin of the leading end of the guiding wire to expose the wire outside the guiding method of the electronic circuit of the electronic device, and the exposed wire is bent by a manual operation by a tool. A ring structure is formed, and a wire portion formed into a ring structure can be inserted into a connection terminal on the electronic circuit side, and the connection terminal and the annular portion of the wire are integrally integrated by solder so that the wire can be connected On the electronic circuit, the problem to be solved by the present invention is that, when the wire of the leading end portion of the wire guide is manually operated to form a ring-shaped structure of a predetermined size, the operation takes time and the production efficiency is also poor. Also, the job requires proficiency in operation. The chances of a poorly experienced operator will increase. The present invention has been made in view of the above-mentioned conventional problems, and it is possible to provide an annular structure of a predetermined size by easily forming a lead wire at a leading end portion of a lead wire, which can greatly improve production efficiency, and even an operator with less experience is hardly A wire bonding method and a processing device which have a defective structure and can form a ring structure having a certain quality are the objects of the present invention. The method used to solve the problem ___2________ This paper scale fine + Guanshang Standard (CNS) A4 specification (21G X 297 mm) "'-- (Please read the back note before filling this page) Φ -- ---- — — Γ Γ ¥ — I!· 线. A7 1270897 -------- V. INSTRUCTIONS (>) In order to solve the above problems, the present invention employs the following technical means. That is, the method of processing the guide wire according to the first aspect of the present invention is a method of processing a portion of the wire exposed by the front end of the wire to bend the joint portion to form the ring portion. The method is characterized in that the processing method includes a coating for removing the coating of the leading end of the wire, and a coating for removing the outer surface of the wire, and forming a solder film on the surface of the exposed wire. Whether the length of the wire on which the film has been formed is within a predetermined range, and the inspection of the item outside the specified range is excluded, and the portion of the wire that has passed the test wiring of the inspection project is bent to form a bend of the annular joint portion. engineering. According to the processing method of the guiding wire of the present invention, the guiding wire can remove the covering skin of a predetermined length from the front end portion when the covering skin is removed, so that the wire of a predetermined length is exposed; when the solder film is formed, it can be A surface of the exposed wire is formed with a solder film; during the inspection process, it can be detected whether the length of the wire on which the solder film is formed on the surface is within the range expected, and the items outside the specified range are excluded, and only the allowable The item within the pre-prepared range is sent to the next bending project; the portion of the wire that has passed the inspection project is bent by the qualification project to form an annular joint. The second aspect of the patent application scope of the present invention is the processing method of the guide wire according to claim 1, wherein the detecting process is a detecting device having an insertion hole into which a wire for guiding a wire is inserted, The detecting device is disposed on the detecting device to detect whether the outer diameter of the wire inserted in the insertion hole and the length of the wire are within a predetermined range. This paper scale stabbed Zhongjia Xian (CNS) A4 specifications (2) G X 2974 mm) -----

(請先閱讀背面之注意事項再填寫本頁) 訂* 1270897 A7 I ---——-__ ___ 五、發明說明(>) 藉由本發明的導接線之處理方法中的檢測工程,導接 線的前端部位可以插設入檢測方法之檢測器具上的插入孔 中,藉由設在插入孔中之感應器的信號,來檢測出導線的 外徑以及長度是否在所預定的範圍之中。 本發明之申請專利範圍第3項,乃是就申請專利範圍 |第1或2項所述的導接線之處理方法其中之彎曲工程由可 上下挾持導接線的上下導塊、中心棒、相對於中心棒可進 行接觸及分離,並與中心棒一同連動使得導接線之導線可 以進行彎曲的彎曲器具所構成之彎曲方法。 藉由本發明的導接線之處理方法中的彎曲工程,導接 線可藉由彎曲方法之上下導塊,以上下挾持之方式導正上 下方向之偏移,並在該狀態下藉由中心棒與彎曲器具之作 動將導線彎折以形成環狀之接合部。 本發明之申請專利範圍第4項,乃是就申請專利範圍 第3項所述的導接線之處理方法其中之彎曲器具乃設置在 上述中心棒之周圍,並具有相對於中心棒,可進行接觸及 分離之複數個彎曲板,藉由各彎曲板依序接近中心棒,使 得導接線之導線朝中心棒之周圍彎折,以形成環狀之接合 部。 藉由本發明的導接線之處理方法中的彎曲工程,導接 線可藉由彎曲器具之各彎曲板依序朝彎曲方法之中心棒接 近而彎曲在中心棒的周圍,以形成環狀之接合部。 本發明之申請專利範圍第5項的導接線之處理方法, 其乃是將由導接線的前端所外露的導線部分彎折,以將該 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)(Please read the precautions on the back and fill out this page) Order* 1270897 A7 I ---——-__ ___ V. Description of the invention (>) Inspection engineering in the treatment method of the guide wire of the present invention, the guide wire The front end portion can be inserted into the insertion hole of the detecting device of the detecting method, and the signal of the inductor provided in the insertion hole detects whether the outer diameter and the length of the wire are within a predetermined range. The third aspect of the patent application scope of the present invention is the processing method of the guide wire according to the scope of claim 1 or 2, wherein the bending process consists of upper and lower guide blocks, center bars, and relative to the upper and lower guide wires The central rod can be contacted and separated, and is coupled with the center rod so that the wire of the wire can be bent by a curved bending device. By the bending process in the processing method of the guide wire of the present invention, the guide wire can be deflected in the up and down direction by the upper and lower guiding blocks by the bending method, and in this state, the center bar and the bending are performed. Actuation of the appliance bends the wire to form an annular joint. The fourth aspect of the invention is the method of processing the wire according to claim 3, wherein the bending device is disposed around the center bar and has contact with respect to the center bar. And separating the plurality of curved plates, the respective curved plates are sequentially approached to the center bar, so that the wires of the conductive wires are bent toward the periphery of the center bar to form an annular joint portion. With the bending process in the method of treating a wire of the present invention, the wire can be bent around the center bar by sequentially bending the curved plates of the bending device toward the center bar of the bending method to form an annular joint. The method for processing the guide wire of the fifth application of the present invention is to bend the portion of the wire exposed by the front end of the wire to apply the paper size to the Chinese National Standard (CNS) A4 specification (210 X). 297 mm)

1.!%1 (請先閱讀背面之注意事項再填寫本頁) K丨訂* --線· 1270897 A7 B7 五、發明說明) 狀的接合部之處理方法,其特徵在於:該處 理方法具備有可上下挾持導接線的上下導塊、中心棒、相 對於中心棒可進行接觸及分離,並與中心棒一同連動使得 導接線之導線可以進行弯曲的彎曲器具所構成之弯曲方法 ,其中該f曲器具乃設置在上述中心棒之㈣,並具有相 對於中心棒,可進行接觸及分離之複數個彎曲板,藉由各 f曲板依序接近中心棒,使得導接線之導線朝中^之周 圍彎折,以形成環狀之接合部。 藉由本發明的導接線之處理方法中的彎曲工程, 線可精由膏曲方法之上下導塊,以上下挟持之方式導正上 下方向之偏移,並在該狀態下藉由彎曲器具上之各彎曲板 依序接近中心棒,使得導接線之導線朝中心棒之周圍彎折 ,以形成環狀之接合部。 本务月之申β月專利範圍第6項的導接線之處理裝置, 其乃是將由導接線的前端所外露出的導線部分彎折,以將 该部分形成為環狀的接合部之處理裝置,其特徵在於··該 處理裝置具備有可上下挾持導接線的上下導塊、中心棒了 相對於中心棒可進行接觸及分離,並與中心棒一同連動使 得導接線之導線可以進行彎曲的,彎曲器具所構成;其中該 彎曲器具乃設置在上述中心棒之周圍,並具有相對於中心 棒,可進行接觸及分離之複數個彎曲板,藉由各彎曲板依 序接近中心棒,使得導接線之導線朝中心棒之周圍彎折, 以形成環狀之接合部。 本發明之實施的型態 紙張尺度週財關家標準(CNS)A4規格(210 X 297公麓 — — — — — ·11111111. (請先閱讀背面之注意事項再填寫本頁) A7 1270897 五、發明說明(() 為了使貴審查委員能夠更加了解本發明之實施型態 及其他發明理念,茲附以圖式說明並詳細說明於後·· 圖式說明 第一圖為藉由本發明導接線之處理方法及處理裝置所 處理之導線示意圖。 第二圖為本發明導接線之處理方法中之檢測工程結構 不意圖。 第二圖為本發明導接線之處理方法中之彎曲工程結構 示思圖,其中可見其上下導塊、中心棒與挾持元件間之相 互關係。 第四圖為本發明導接線之處理方法中之彎曲工程及處 理裝置結構示意圖,其顯示在彎曲器具及中心棒之間插設 有導線之狀態。 第五圖為本發明彎曲器具之第一彎曲板朝中心棒接近 ’並同時將導接線之導線朝中心棒緊壓狀態之示意圖。 第六圖為本發明彎曲器具之第二彎曲板朝中心棒接近 ’並同時將導接線之導線朝中心棒緊壓狀態之示意圖。 第七圖為本發明彎曲器具之第三彎曲板朝中心棒接近 ’並同時將導接線之導線朝中心棒緊壓狀態之示意圖。 圖號說明 (1) 導接線 (2) 披覆外皮 (3 )導線 (4 )接合部 7 资紙張尺度適用中國國豕標準(CNS)A4規格(21〇 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 坏:---.-----. 1270897 A7 五、發明說明( (5 )檢測方法 (6) 檢測器具 (請先閱讀背面之注意事項再填寫本頁) (7) 插入孔 (9 )感應器 (1 〇)彎曲方法 (1 1 )下導塊 (12) 中心棒 (13) 上導塊 (1 4)彎曲器具 以下,便就本發明之實施型態加以說明。本發明之導 接線處理方去及處理裝置乃是適用於電子機器之電子電路 上的連接端子處,用以有效的連接導接線之發明。請參看 第圖所示其乃是將導接線(1 )的前端所外露出的導 線(3 )部分彎折,以將該部分形成為環狀的接合部(4 )。 也就是說,本發明之導接線處理方法具有藉由機械自 動化進打之所構成的「切斷工程」、「披覆外皮去除工程 」、「助焊劑塗佈工程」、「焊料附著工程」、「長度檢 測工程」及「彎曲工程」。以下便就各項工程加以詳細的 進行說明。 一、「切斷工程」 切斷工程乃是將圍繞於滾線材(圖中未示)周圍之導 接線由滾線材拉出,引導至切斷裝置(圖中未示)之切斷 :产紙張尺度適用中國國家標準(CNS)A4規格(21〇 X 297公釐) A7 1270897 —----------- - B7____ 五、發明說明(y ) 部’藉由切斷裝置之作動連續的切割出預定長度的導接線 (請參看第一圖所示)以達預定之導接線數目。 二、 「披覆外皮去除工程」 披覆外皮去除工程乃是將預定長度的導接線供給至披 覆外皮去除裝置(圖中未示)處,啟動彼覆外皮去除裝置 將導接線前端至預定長度處之披覆外皮加以去除,使得導 接線前端至預定長度之導線得以外露而出。在露出導線處 ’將按壓端子以適當之方式組設。 三、 「助焊劑塗佈工程」 助焊劑塗佈工程乃是將導接線一端之前端部位導線的 表面塗佈有助焊劑,用以去除附著於導線表面之氧化物, 使得進行下面的焊料附著工程時,焊料披覆膜可以容易形 成。 四、 「焊料附著工程」 焊料附著工程乃是將在上述助焊劑塗佈工程中,已去 除氧化物之導接線前端部位之導線浸潰於焊料槽内之溶融 焊料中,使得導線的表面形成有預定厚度之焊料皮膜。 五、 「長度檢測工程」 長度檢測工程乃是檢測表面上已形成有焊料披覆膜之 導線是否具有預定之外徑大小以及長度,並將容許範圍外 之料品加以排除,僅允許在容許範圍内之料品送往下一個 彎曲工程。 就長度檢測工程而言,乃是使用如第二圖所示之檢測 方法(5 )。也就是說,該檢測方法(5 )乃具備有可供 9 :t紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁)1.!%1 (Please read the precautions on the back and fill out this page.) K丨订* --Line · 1270897 A7 B7 V. Inventive Note) The method of processing the joint is characterized in that the processing method is a bending method comprising a top and bottom guide block capable of holding up and guiding a wire, a center bar, a contact and a separation with respect to the center bar, and a bending device capable of bending the wire of the wire with the center bar, wherein the f The curved tool is disposed on the (4) of the center rod, and has a plurality of curved plates that can be contacted and separated with respect to the center bar, and the f-plates are sequentially approached to the center bar, so that the wires of the conductive wires are directed toward the center The periphery is bent to form an annular joint. By the bending process in the processing method of the guide wire of the present invention, the wire can be refined by the upper and lower guide blocks of the squeezing method, and the upper and lower directions are guided by the upper and lower holding manners, and in this state, by bending the device Each of the curved plates is sequentially adjacent to the center bar such that the wires of the wire are bent toward the periphery of the center bar to form an annular joint. The processing device for the guide wire of the sixth paragraph of the patent application of the present invention is a processing device for bending a portion of the wire exposed outside the front end of the wire to form the portion into a ring-shaped joint portion. The utility model is characterized in that: the processing device is provided with upper and lower guide blocks capable of holding up and down the guide wires, and the central rod can be contacted and separated with respect to the central rod, and is connected with the central rod so that the wires of the guide wires can be bent. The bending device is configured; wherein the bending device is disposed around the central rod, and has a plurality of curved plates that can be contacted and separated with respect to the center bar, and the bending wires are sequentially adjacent to the center bar, so that the guiding wires are The wires are bent around the center rod to form an annular joint. The type of paper scale of the invention is implemented by the CNS A4 specification (210 X 297 麓 - — — — · 11111111. (Please read the note on the back and fill out this page) A7 1270897 V. BRIEF DESCRIPTION OF THE DRAWINGS (() In order to enable the reviewing committee to better understand the embodiments of the present invention and other inventive concepts, the drawings are illustrated and described in detail later. The first figure is the guide wire of the present invention. The processing method and the schematic diagram of the wire processed by the processing device. The second figure is not intended to detect the engineering structure in the processing method of the guiding wire of the invention. The second figure is a schematic diagram of the bending engineering structure in the processing method of the guiding wire of the invention. The relationship between the upper and lower guide blocks, the center bar and the holding member can be seen. The fourth figure is a schematic view of the bending engineering and processing device in the processing method of the guiding wire of the present invention, which shows the insertion between the bending device and the center bar. The state of the wire is the fifth figure. The fifth figure of the bending device of the present invention approaches the center bar and simultaneously presses the wire of the wire guide toward the center bar. Fig. 6 is a schematic view showing the second curved plate of the bending device of the present invention approaching the center bar and simultaneously pressing the wire of the wire guide toward the center bar. The seventh figure is the third curved plate of the bending device of the present invention. The center rod is close to 'and at the same time, the wire of the guide wire is pressed toward the center bar. Figure No. (1) Guide wire (2) Covering skin (3) Wire (4) Joint 7 Paper size applicable to China豕Standard (CNS) A4 specification (21〇X 297 mm) (Please read the note on the back and fill out this page) Bad:---.-----. 1270897 A7 V. Invention description (5) Test method (6) Test instrument (please read the note on the back and then fill out this page) (7) Insert hole (9) sensor (1 〇) bending method (1 1) Lower guide block (12) Center bar (13 The upper guide block (14) bending device is described below, and the embodiment of the present invention is described. The wire bonding processing and processing device of the present invention is applied to a connection terminal on an electronic circuit of an electronic device. Invented with an effective connection wire. Please refer to the figure to indicate that it will be guided The wire (3) exposed outside the front end of (1) is partially bent to form the portion into a ring-shaped joint portion (4). That is, the wire bonding processing method of the present invention has a mechanical automation The "cutting works", "coating skin removal works", "flux coating engineering", "solder adhesion engineering", "length testing project" and "bending engineering" which are formed by the following. 1. Detailed description of the "cutting work" The cutting work is to pull the wire around the rolling wire (not shown) from the rolling wire and guide it to the cutting device (not shown). Cut off: The paper size is applicable to the Chinese National Standard (CNS) A4 specification (21〇X 297 mm) A7 1270897 —----------- - B7____ V. Inventions (y) The operation of the cutting device continuously cuts a predetermined length of the wire (shown in the first figure) to reach the predetermined number of wires. Second, the "coating skin removal project" The cover skin removal project is to supply a predetermined length of the guide wire to the cover skin removal device (not shown), and activate the cover skin removal device to extend the front end of the wire to a predetermined length. The cover is removed to remove the wires from the front end of the guide wire to a predetermined length. The pressing terminals are assembled in an appropriate manner at the exposed conductors. Third, "flux coating engineering" Flux coating engineering is to apply a flux to the surface of the wire at the front end of one end of the wire to remove the oxide attached to the surface of the wire, so that the following solder adhesion process When the solder coating film is formed, it can be easily formed. 4. Solder Adhesion Engineering The solder adhesion process is to melt the wire at the front end of the lead wire of the removed oxide in the molten solder in the solder bath, so that the surface of the wire is formed. A solder film of a predetermined thickness. V. "Length Inspection Engineering" The length inspection project is to detect whether the wire on which the solder coating film has been formed has a predetermined outer diameter and length, and to exclude the items outside the allowable range, and only allow the allowable range. The contents are sent to the next bending project. For the length inspection project, the detection method (5) as shown in the second figure is used. That is to say, the detection method (5) is available for the 9:t paper scale applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the back note and fill out this page)

A7 1270897 五、發明說明(β (請先閱讀背面之注意事項再填寫本頁) 導接線(1 )之導線(3 )插入之插入孔(7 )以及與插 入孔(7)軸線垂直相交並貫通之檢測孔(8)的檢測器 具(6 )、藉由將光訊號通過檢測器具(6 )的檢測孔( 8)以檢測出插入插入孔(7)中導接線(1 )之導線( 3)長度的感應器(9)。 其中’感應器(9 )可以為脈衝計算器,該感應器( 9 )與檢測器具(6 )乃一體設置,當導接線(1 )之導 線(3 )以一定的速度在預定的長度内移動時,藉由感應 器(9 )計算導接線(1 )之導線(3 )插入後至導線( 3 )移動至已定之移動極限位置的脈衝數,依此以檢測出 導接線(1 )之導線(3 )長度是否在容許範圍之内。又 ,該長度檢測工程,其感應器(9 )及檢測器具(6 )在 導線(3 )以相反側朝初期位置移動時,利用感應器(9 )計算移動極限位置至導線(3 )初始位置以致於無法檢 測時之脈衝數,同樣的可以計算出導接線(1 )之導線( 3 )長度是否在容許範圍之内。也就是說,導接線(工) 之導線(3 )長度可以藉由雙重之檢測方式檢測。再者, 該檢測方法(5 )藉由導接線(丄)之導線(3 )是否可 以插設置入檢測器具(6 )之插入孔(7)來檢測判斷導 接線(1 )之導線(3)外徑是否在預定數值之下。 因此,已檢測出導線(3)長度之導接線(1),便 已經將導線(3)外徑及長度在容許範圍外之料品加以排 除,而將容許範圍之内之料品送往下一個彎曲工程,以進 行導線(3)部分之彎曲加工。 夸紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公t ) A7 1270897 五、發明說明(f ) 六、「彎曲工程」 (請先閱讀背面之注意事項再填寫本頁) 彎曲工程乃是使用如第三圖至第七圖所示之彎曲方法 (1 0 )進行,以使得導接線(i )之導線(3 )彎折成 為如第一圖所示之環狀接合部(4)。其中,該彎曲方法 (1 0 )乃具備有下導塊(1 1 )、可由下導塊(丄工) 處自由突出與縮回之中心棒(12)、以可自由上下移動 之方式設置在下導塊(1 1 )上方,朝下方移動時,可以 供由下導塊(1 1 )處突出之中心棒(丄2 )上端部位插 設並固定支撐中心棒2)之上導塊(13)、以及設 置在中心棒(1 2 )周圍並圍繞中心棒(1 2 )之、彎曲器 具(1 4 )。 其中,該彎曲器具(1 4 )則是如第四圖至第七圖所 示一般,在中心棒(i 2 )周圍,分別以9 〇度的間隔依 序設置有第一彎曲板(1 5 )、第二彎曲板(丄6 )以及 第二彎曲板(1 7)等三枚彎曲板,各彎曲板(1 5 )、 (1 6 ) 、( 1 7)則可以相對於中心棒(1 2 )由水平 方向各自獨立的接近與分離。各彎曲板(15) 、(16 )、(1 7)朝向中心棒(1 2 )之相對面分別的設置有 預定之弧面(15a)、(16a)、(17a),在各 彎曲板(1 5 ) ( 1 6 ) ( 1 7)朝中心棒(1 2 )接近 時,可藉由該弧面(工5 a )、(工6 a )、(工7 a ) 將導接線(1 )之導線(3 )朝中心棒(1 2 )的表面推 壓,使得導線(3 )可以如中心棒(丄2 )之外周圍面般 捲曲彎折。 11 f紙張尺度剌+ S國家標準(CNS)A4規格(210 X 297公餐) A7 1270897 五、發明說明(/。 導接線(1 )在導線(3 )彎折時,乃是藉由設置於 中心棒(1 2 )處之挾持元件(1 8 )由上下方向加以挾 持’使付導線(3 )保持於下導塊(1 1 )上的中心棒( 1 2)與彎曲器具(1 4)間之預定位置處。 如第四圖所示,藉由挾持元件(1 8)挾持固定導接 線(1 ),使得導接線(1 )之導線(3 )可插設置入彎 曲器具(1 4)及中心棒(1 2)之間,同時藉由上導塊 (1 3 )之下降將導線(3 )以上下挾持之方式挾持於上 導塊(1 3 )與下導塊(1 1 )之間。該狀態如第五圖所 示,第一彎曲板(1 5)朝中心棒(1 2)的方向移動, 其弧面(1 5 a )則將導線(3 )朝中心棒(1 2 )的表 面推壓,其次再如第六圖所示,第二彎曲板(i 6 )朝中 心棒(1 2 )的方向移動,其弧面(丄6 a )則將導線( 3 )朝中心棒(1 2 )的表面推壓,最後如第七圖所示, 第三彎曲板(1 7)朝中心棒(1 2 )的方向移動,其弧 面(1 7 a )則將導線(3 )朝中心棒(1 2 )的表面推 壓,如此一來,便使得導線(3 )如同中心棒(i 2 )之 外周圍面般捲曲彎折,而形成環狀之接合部。 在導線(3 )彎折捲曲完畢之後,各彎曲板(丄5 ) 、(1 6 ) 、( 1 7)便由中心棒(工2 )處離開,同時 中〜棒(1 2 )縮入下導塊(丄丄)内,而挾持元件(工 8 )則解除導接線(1 )之挾持狀態,最後便可得到在導 線(3 )的前端部位形成有環狀之接合部(4)的導接線 (1)。 __ —_ 12 身紙張尺度剌標準(CNS)A4成_2w㈣公髮)-------- (請先閱讀背面之注意事項再填寫本頁) -------tr-p--------. A7 1270897 五、發明說明(/ / ) 藉由上述實施型態結構配置之導接線處理裝置由於可 以使用機械自動化動作以將導接線(1 )的導線(3 )部 分形成為環狀之接合部(4 ),使得接合部(4 )的形成 作業可以更加的容易,故可以提高生產的效率。又,此項 操作作業不需要熟練度,即使是經驗較淺的作業者,亦幾 乎不會發生操作不良的情形,可以維持形成一定品質及精 密度之環狀的接合部(4)。 1 發明的效果 藉由以上的說明,本發明申請專利範圍第i項所記載 之導接線之處理方法,其導接線乃是經由「披覆外皮;除 工程」、「焊料附著工程」、「長度檢測工程」及「彎曲 等-連串之工程步驟,使得前端部位之導線形成為 環狀之接合部。因此,可以大幅提高生產作業之效率。 X,中請專利範圍第2項所記載之導線之處理方法, 其中之檢測工程乃將導線長度在容許範圍外之料品加以排 除’僅纟許在容許範圍内之料品送往下一個f曲工程,故 不會有導線長度在容許範圍外之料品被送至f曲工程,而 形成在容許範圍外之導線的環狀接合部情事發生。因此, 幾乎沒有因為導線長度之不良而發生不良品的問題,故可 以穩定的生產所需品質之料品。 #再者’中請專利範圍第3項所記載之導線之處理方法 藉由上下導塊由上下挾持之狀態’並利用料器具朝中 心棒加以接近之動作,導接線之導線可在導正上下方向之 歪斜並同時筆曲成為環狀結構。因此,導線之弯曲作業不 1 __ __. 紙張尺度適用中_家標準(cns)A4 ----A7 1270897 V. INSTRUCTIONS (β (Please read the back note first and then fill in this page) The lead wire (3) of the guide wire (1) is inserted into the insertion hole (7) and perpendicularly intersects with the axis of the insertion hole (7). The detecting device (6) of the detecting hole (8) passes the detecting hole (8) of the detecting device (6) to detect the wire (3) of the wire (1) inserted into the insertion hole (7). The length of the sensor (9). The 'inductor (9) can be a pulse calculator, the sensor (9) and the detecting device (6) are integrated, when the wire (3) of the wire (1) is fixed When the speed of the movement is within a predetermined length, the number of pulses after the wire (3) of the wire (1) is inserted and the wire (3) is moved to the predetermined movement limit position is calculated by the inductor (9), thereby detecting Whether the length of the wire (3) of the outgoing wiring (1) is within the allowable range. Moreover, the length detecting project, the inductor (9) and the detecting device (6) move toward the initial position on the opposite side of the wire (3) At the time, the sensor (9) is used to calculate the moving limit position to the initial position of the wire (3). In the case of the number of pulses that cannot be detected, it is also possible to calculate whether the length of the wire (3) of the wire (1) is within the allowable range. That is, the length of the wire (3) of the wire (work) can be double The detection method is detected. Further, the detection method (5) detects whether the guide wire (1) is inserted into the insertion hole (7) of the detecting device (6) by the wire (3) of the wire (丄). Whether the outer diameter of the wire (3) is below a predetermined value. Therefore, the wire (3) has been detected for the length of the wire (3), and the outer diameter of the wire (3) and the length of the wire are outside the allowable range. Exclude, and send the items within the allowable range to the next bending project to bend the wire (3). The paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 metric tons) A7 1270897 V. INSTRUCTIONS (f) VI. “Bending Engineering” (Please read the notes on the back and fill out this page) The bending process is carried out using the bending method (10) as shown in Figures 3 to 7. To bend the wire (3) of the wire (i) The annular joint portion (4) is as shown in the first figure. The bending method (10) is provided with a lower guide block (1 1 ), and can be freely protruded and retracted from the lower guide block (completed). The center rod (12) is disposed above the lower guide block (1 1 ) so as to be freely movable up and down, and when moving downward, can be provided at the upper end portion of the center rod (丄2) protruding from the lower guide block (1 1 ) A guide block (13) for supporting the center rod 2) and a bending tool (14) disposed around the center rod (12) and surrounding the center rod (12) are interposed and fixed. Wherein, the bending device (1 4 ) is generally arranged as shown in the fourth to seventh figures, and the first curved plate is arranged in sequence around the center bar (i 2 ) at intervals of 9 degrees (1 5 ), the second curved plate (丄6) and the second curved plate (17) and other three curved plates, each of the curved plates (1 5 ), (1 6 ), (17) can be relative to the center bar (1) 2) Independent and separate separation from the horizontal direction. Each of the curved plates (15), (16), and (17) is disposed with a predetermined curved surface (15a), (16a), and (17a) facing the center bar (1 2 ), respectively, in each curved plate ( 1 5 ) ( 1 6 ) ( 1 7) When approaching the center rod (1 2 ), the guide wire (1) can be made by the arc surface (work 5 a ), (work 6 a ), (work 7 a ) The wire (3) is urged toward the surface of the center bar (12) so that the wire (3) can be crimped and bent like the outer surface of the center bar (丄2). 11 f paper size 剌 + S national standard (CNS) A4 specification (210 X 297 public) A7 1270897 V. Invention description (/. Guide wire (1) when the wire (3) is bent, is set by The holding member (18) at the center bar (12) is held by the up-and-down direction to hold the center bar (12) and the bending device (1) of the wire (3) on the lower guide block (1 1 ) At the predetermined position, as shown in the fourth figure, the fixing wire (1) is held by the holding member (18), so that the wire (3) of the wire (1) can be inserted into the bending device (1 4). And between the center bar (1 2), while holding the wire (3) above and below by the lowering of the upper guiding block (1 3 ), holding the upper guiding block (1 3 ) and the lower guiding block (1 1 ) The state is as shown in the fifth figure, the first curved plate (15) moves toward the center bar (12), and the curved surface (15a) directs the wire (3) toward the center bar (1 2 The surface is pushed, and then as shown in the sixth figure, the second curved plate (i 6 ) moves toward the center bar (1 2 ), and the curved surface (丄 6 a ) turns the wire ( 3 ) toward the center. Surface push of the rod (1 2 ) Finally, as shown in the seventh figure, the third curved plate (17) moves toward the center rod (1 2 ), and the curved surface (1 7 a ) points the wire (3) toward the center rod (1 2 ). The surface is pressed, so that the wire (3) is crimped and bent like the peripheral surface of the center bar (i 2 ) to form an annular joint. After the wire (3) is crimped and crimped, each The curved plates (丄5), (1 6 ), (17) are separated from the center bar (Work 2), while the middle ~ bar (12) is retracted into the lower guide block (丄丄), while the holding element ( 8), the holding state of the wire (1) is released, and finally, the wire (1) having the annular joint portion (4) formed at the front end portion of the wire (3) is obtained. ____ 12 body paper size剌Standard (CNS) A4 into _2w (four) public hair) --- (Please read the note on the back and then fill out this page) -------tr-p------- - A7 1270897 V. INSTRUCTION DESCRIPTION (/ / ) The wire bonding processing device configured by the above-described embodiment configuration can use mechanical automatic action to form the wire (3) portion of the wire (1) into a ring-shaped joint. Department (4) So that the joint portion (4) forming the work can be more easily, thereby improving the production efficiency. Moreover, this operation operation does not require proficiency, and even a less experienced operator does not have a problem of malfunction, and it is possible to maintain a ring-shaped joint portion (4) of a certain quality and precision. Advantages of the Invention According to the above description, the method of processing the guide wire described in the item i of the present invention is based on "coating the outer skin; removing the work", "solder adhesion engineering", and "length". "Testing" and "bending, etc. - a series of engineering steps, so that the wires at the front end are formed into a ring-shaped joint. Therefore, the efficiency of the production operation can be greatly improved. X, the wire described in the second item of the patent scope The processing method, in which the inspection project excludes the items whose wire length is outside the allowable range, 'only the items within the allowable range are sent to the next f-curve project, so there is no wire length outside the allowable range. The item is sent to the f-curve project, and the annular joint portion of the wire outside the allowable range occurs. Therefore, there is almost no problem of defective product due to the defect of the wire length, so that the quality required for stable production can be achieved. In the case of the #再者', please refer to the method of handling the wire described in item 3 of the patent scope by the upper and lower guide blocks being held up and down by the upper and lower guide blocks. When the rod is close to the action, the wire of the guiding wire can be skewed in the up-and-down direction and bent into a ring structure at the same time. Therefore, the bending work of the wire is not 1 __ __. The paper size is applicable _ home standard (cns) A4 - ---

--------#----一-----. (請先閱讀背面之注音?事項再填寫本頁) 1270897 A7 ' ---—~;__B7_— _ 五、發明說明(/)) —" -一^ 、操作上的熟練度,即使是經驗較淺的作業員,亦可以 進行具有一定品質之彎曲作業操作。 —再者,申請專利範圍帛4項所記載之導線之處理方法 藉由彎曲器具之各f曲板依序朝中心棒接近使得導接線 之導線可以朝中心棒之周圍捲曲·彎折而形成環狀之結構。 、再者,申請專利範圍第5及6項所記載之導線之處理 方,或處理裝置,藉由上下導塊由上下挾持之狀態,並利 用背曲器具之各彎曲板朝中心棒加以接近之動作,導接線 之導線可在導正上下方向之歪斜並同時朝中心棒之外周圍 捲曲彎折,而彎曲成為環狀結構。因此,導線之彎曲作業 不需要操作上的熟練度,即使是經驗較淺的作業員,亦可 以進行具有一定品質之彎曲作業操作。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁} ---I------------#----一-----. (Please read the phonetic on the back? Please fill out this page again) 1270897 A7 ' ----~;__B7_- _ V. Invention Description (/)) —" - One^, operational proficiency, even for less experienced operators, can also perform bending operations with a certain quality. - Furthermore, the method of processing the wire described in the scope of the patent application 帛 4 is obtained by sequentially approaching the center bar of the bending device so that the wire of the wire can be curled and bent around the center bar to form a ring. Shape structure. Furthermore, the processing party of the wire described in Items 5 and 6 of the patent application, or the processing device, is held up and down by the upper and lower guide blocks, and is approached by the curved plates of the back bending device toward the center bar. The wire of the guide wire can be bent in the vertical direction of the guide and curled and bent toward the periphery of the center bar, and bent into a ring structure. Therefore, the bending operation of the wire does not require operational proficiency, and even a less experienced operator can perform a bending operation with a certain quality. This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the notes on the back and fill out this page again) ---I----

Claims (1)

1270897 申請專利範圍 端所二…種導接線之處理方法,其乃是將由導接線的前 出的導線部分弯折,以將該部分形成為環狀的接 ^之處理μ,其特徵在於具備有: 藉由將導接線前端所露出之表面形成焊料皮膜之導線 下挾持之上下導塊、中心、棒、相對於中轉可進行接觸 ,刀離]並與中心棒一同連動使得導接線之導線可以進行 ^曲的曲器具所構成之彎曲方法來將導線部分彎曲,使 得該部分形成環狀之接合部的彎曲工程; 、—該彎曲器具具備有可相對於中心棒進行接觸及分離的 複數個彎曲板,其具有將導線朝中心棒壓付彎曲的曲面, 該曲面係以相對於前述中心棒之狀態設置在中心棒之周圍 將配置在導線根部側之最初的彎曲板朝前述中心棒接 近,讓導線朝中心棒壓付,再由該最初的彎曲板周圍鄰設 的兩個彎曲板依序的將導線朝中心棒壓付,使得導線沿中 心棒之外圍形成接合部。 2、如申請專利範圍第1項所述的導接線之處理方法 ,其尚具備有檢測工程,其乃是由具有可供導接線的導線 插設之插入孔的檢測器具、設置於該檢測器具上,可檢測 出插設於插入孔中之導線外徑大小以及長度是否在所定範 圍之中的感應器所構成檢測方法; 該檢測工程係在導線插入插入孔至移動限界位置止, 以及由該移動限界位置起至感應器無法檢測之位置移動前 述的導線’藉由感應器檢測該導線長度是否在容許範圍。 15 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) .........................•裝...............訂----------------線 (請先間讀背面之注意事項再填寫本頁) 1270897 §___ 六、申請專利範圍 3、一種導接線之處理裝置,其乃是將由導接線的前 端所外露出的導線部分彎折,以將該部分形成為環狀的接 合部之處理裝置,其特徵在於··該處理裝置具備有將導接 線刖端所露出之表面形成焊料皮膜之導線上下挾持的上下 導塊、中心棒、相對於中心棒可進行接觸及分離,並與中 〜杯门連動使彳于導接線之導線可以進行彎曲的彎曲器具 所構成, 该考曲15具具備有可相對於中心棒進行接觸及分離的 複數個彎曲板,其具有將導線朝中心棒壓付彎曲的曲面, 該曲面係以相對於前述中心棒之狀態設置在中心棒之周圍 將配置在導線根部狀最初的料板朝前述中心棒接 近讓導線朝中〜棒壓付,再由該最初的寶曲板周圍鄰設 的兩個彎曲板依序的將導線朝中心棒壓付,使得導線沿中 心棒之外圍形成接合部。 (請先閲讀背面之注意事項再塡寫本頁) :裝 、1T: 線 161270897 The method for processing the wire of the second end of the patent application is to bend the wire portion of the lead wire to form a ring-shaped process, which is characterized by : The upper guide block, the center, the rod, and the middle rotation can be contacted by the wire forming the solder film on the surface exposed by the front end of the lead wire, and the knife is separated from the center rod so that the wire of the conductive wire can be Performing a bending method of the curved piece to bend the wire portion so that the portion forms a bending process of the annular joint portion; the bending device is provided with a plurality of bends capable of contacting and separating with respect to the center rod a plate having a curved surface that is bent toward the center bar, the curved surface being disposed around the center bar with respect to the center bar, and the first curved plate disposed on the root side of the wire is approached toward the center bar, The wire is pressed toward the center bar, and then the two curved plates adjacent to the original curved plate are sequentially pressed toward the center bar, so that the wire The periphery of the mandrel to form a joint. 2. The method for processing a guide wire according to the first aspect of the patent application, which is further provided with a test project, which is a test device having an insertion hole into which a wire for a guide wire is inserted, and is disposed on the test device The detection method for detecting whether the outer diameter of the wire and the length of the wire inserted in the insertion hole are within a predetermined range; the detection engineering is performed when the wire is inserted into the insertion hole to the movement limit position, and Moving the aforementioned wire from the position where the limit is undetectable to the position where the sensor cannot detect is detected by the sensor whether the length of the wire is within an allowable range. 15 This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm).........................•Installation... ............Book---------------- Line (please read the back of the note first and then fill out this page) 1270897 §___ VI. Application Patent Document 3, a processing device for a conductive wire, which is a processing device for bending a portion of a wire exposed outside a leading end of a wire to form the portion into an annular joint portion, characterized in that the treatment is The device is provided with an upper and lower guide block for holding the wire on which the solder film is exposed on the surface of the conductive terminal, and a central rod, which can be contacted and separated with respect to the central rod, and is connected with the middle-cup door so as to be connected to the guide wire. The wire can be formed by a curved bending device, the test piece 15 having a plurality of curved plates that can be contacted and separated from the center bar, and having a curved surface that presses the wire toward the center bar, the curved surface being opposite The state of the center rod is set around the center rod, and the first material plate disposed at the root of the wire is approached toward the center rod. The wire is pressed toward the center-bar, and the two curved plates adjacent to the original slab are sequentially pressed toward the center bar so that the wire forms a joint along the periphery of the center bar. (Please read the notes on the back and write this page again): Install, 1T: Line 16
TW91117528A 2002-07-05 2002-08-05 Method and device for treatment of lead wire TWI270897B (en)

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JP2002197905A JP3808809B2 (en) 2002-07-05 2002-07-05 Lead wire processing method and processing apparatus

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JP2007105778A (en) * 2005-10-14 2007-04-26 Japan Automat Mach Co Ltd Lead wire terminal processor
KR101521187B1 (en) * 2013-11-28 2015-05-18 김봉길 Apparatus for forming a ring of swivel for fishing gear and a ring manufactured by the same
KR20210097315A (en) * 2020-01-30 2021-08-09 주식회사 엘지에너지솔루션 Battery Cell of Improved Weldability, and Processing Device Thereof
KR102414242B1 (en) * 2020-11-17 2022-06-28 김봉길 Apparatus for forming ring swivel
CN113369349A (en) * 2021-04-19 2021-09-10 国网山东省电力公司莱州市供电公司 Manual grounding round steel bending tool and bending method thereof

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