JP2004034128A - Treatment method and treatment apparatus for lead wire - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance production efficiency by automatically and mechanically forming an annular junction at the front end of a lead wire. <P>SOLUTION: The method for treating the lead wire by bending the portion of a conductor exposed from the front end of the lead wire and forming the annular junction at this portion is provided with a coating removing step of exposing the conductor by removing the coating from the front end of the lead wire, a solder film forming step of forming a solder film on the exposed surface of the conductor, a detecting step of detecting whether the length of the conductor formed with the solder film exists within a permissible range or not and expelling the conductor off the permissible range, and a bending step of forming the annular junction by bending the portion of the coating of the lead wire undergoing the detecting step by means of a bending tool 14. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method and an apparatus for treating a lead wire, and more particularly, to a method for treating a lead wire which is effective for bending a portion of a conductive wire exposed from a leading end portion of the lead wire and forming an annular joint at the portion. And a processing device.
[0002]
[Prior art]
Generally, to connect a lead wire to the electronic circuit of an electronic device, remove the coating from the tip of the lead wire using a tool to expose the conductor, and then manually expose the exposed conductor using a special tool. The connection terminal on the electronic circuit side is inserted into the portion of the conductor formed in the shape of a ring, and the connection terminal and the annular portion of the conductor are joined together by soldering, so that the lead wire is Connected to circuit side.
[0003]
[Problems to be solved by the invention]
However, when the lead wire at the distal end of the lead wire is manually formed into an annular shape having a predetermined size, the work is troublesome and the production efficiency is low. In addition, since the operation requires skill, inexperienced workers have a high defect rate.
[0004]
SUMMARY OF THE INVENTION The present invention has been made in view of the above-described conventional problems, and can easily form a lead wire at a tip end portion of a lead wire into a ring of a predetermined size, thereby significantly increasing production efficiency. It is an object of the present invention to provide a method and an apparatus for processing lead wires, which can be formed into a ring of a certain quality without generating defective products even by inexperienced workers.
[0005]
[Means for Solving the Problems]
The present invention employs the following means in order to solve the above problems. That is, the invention according to claim 1 is a method for treating a lead wire in which a portion of the conductor exposed from the tip of the lead is bent to form an annular joint at the portion, and the lead is covered from the tip of the lead. Removing the coating to expose the conductor, forming a solder coating on the surface of the exposed conductor, and determining whether the length of the conductor with the solder coating is within an allowable range. It is characterized by comprising a detecting step of detecting and excluding an object that is out of an allowable range, and a bending step of bending a lead portion of the lead wire after the detecting step to form an annular joint.
According to the method for treating a lead wire according to the present invention, in the coating removing step, the coating of a predetermined length is removed from the tip to expose a conductive wire of a predetermined length, and in the solder coating forming step, A solder film is formed on the surface of the exposed conductor, and in the detection step, it is detected whether or not the length of the conductor having the solder film formed on the surface is within an allowable range, and those outside the allowable range are excluded. Only those within the permissible range are sent to the next bending step, where they are bent to form an annular joint.
[0006]
The invention according to claim 2 is the lead wire processing method according to claim 1, wherein the detecting step includes a detecting jig having an insertion hole into which a lead wire is inserted, and the detecting jig is provided on the detecting jig. And a detecting means comprising a sensor for detecting whether the outer diameter and the length of the conducting wire inserted into the insertion hole are within an allowable range.
According to the method of processing a lead wire according to the present invention, in the detection step, the lead wire is inserted into the insertion of the detection jig of the detection means in the insertion hole, and in this insertion hole, a signal from the sensor is used. It is detected whether or not the outer diameter and the length of the conductor are within a predetermined range.
[0007]
The invention according to claim 3 is the method of processing a lead wire according to claim 1 or 2, wherein the bending step includes: a vertical guide for sandwiching the lead wire from above and below; a core rod; It is characterized in that the bending is performed by a bending means which is provided so as to be capable of contacting and separating, and which comprises a bending jig for bending a portion of the lead wire in cooperation with the core rod. According to the lead wire processing method of the present invention, the lead wire is sandwiched from above and below by the up and down guides of the bending means in the bending step, and the warp in the vertical direction is regulated. The joint is bent to form an annular joint.
[0008]
The invention according to claim 4 is the method for treating a lead wire according to claim 3, wherein the bending jig is provided around the core bar, and is capable of being separated from and attached to the core bar. It is characterized in that a bent plate is provided, and each of the bent plates is sequentially brought close to the core bar, whereby the lead wire is bent so as to be wound around the core bar to form an annular joint.
According to the lead wire processing method of the present invention, in the bending step, the lead wire is bent so as to be wound around the core rod by sequentially approaching each bending plate of the bending jig to the core rod of the bending means. As a result, an annular joint is formed.
[0009]
The invention according to claim 5 is a method for processing a lead wire, wherein the portion of the conductive wire exposed from the tip of the lead wire is bent to form an annular joint at the portion, comprising a vertical guide for sandwiching the lead wire from above and below. A bending jig, which is provided so as to be capable of coming into contact with and separating from the core rod, and bending a lead wire portion in cooperation with the core rod. The jig is provided around the core rod and has a plurality of bent plates that can be brought into contact with and separated from the core rod. It is characterized in that it is bent so as to be wound around the rod and formed into an annular joint.
According to the lead wire processing method of the present invention, in the bending step, the bending jig is fixed to the core rod in a state where the lead wire is sandwiched from above and below by the vertical guide of the bending means and the distortion in the vertical direction is regulated. When the bending plates are sequentially approached, the bending plate is bent so as to be wound around the core bar, and an annular joint is formed.
[0010]
The invention according to claim 6 is a lead wire processing device that bends a portion of a conductive wire exposed from the tip of a lead wire and forms an annular joint at that portion, comprising a vertical guide that sandwiches the lead wire from above and below. A bending jig, which is provided so as to be capable of coming into contact with and separating from the core rod, and bending a lead wire portion in cooperation with the core rod. The jig is provided around the core rod and has a plurality of bent plates that can be brought into contact with and separated from the core rod. It is characterized in that it is bent so as to be wound around the rod and formed into an annular joint.
According to the lead wire processing apparatus of the present invention, similarly to the invention according to claim 5, the lead wire is bent so as to be wound around the periphery, and an annular joint is formed.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described.
The lead wire processing method and apparatus according to the present invention can be effectively applied when connecting a lead wire to a connection terminal of an electronic circuit or the like of an electronic device. As shown in FIG. The portion of the conductive wire 3 exposed from the tip of the wire 1 is formed on the annular joint 4.
[0012]
That is, the lead wire processing method according to the present invention automatically performs “cutting step”, “coating removing step”, “flux applying step”, “soldering step”, “length detecting step”, and “bending step” by a machine. This is configured to be performed in an automated manner. Hereinafter, each step will be described in detail.
[0013]
▲ 1 ▼ “Cutting process”
In the cutting step, a series of lead wires wound around a reel (not shown) is pulled out from the reel, guided to a cutting portion of a cutting device (not shown), and the cutting device is operated to a predetermined length. Then, a predetermined number of lead wires (see FIG. 1) of a predetermined length are formed.
[0014]
(2) “Coating removal process”
In the coating removing step, a predetermined length of a lead wire is supplied to a coating removing device (not shown), and the coating removing device is operated to cause a predetermined length of lead wire from one end portion and the other end portion of the lead wire. The coating is removed to expose a predetermined length of conductor from one end and the other end. A crimp terminal is crimped to the conductor at the other end by an appropriate means.
[0015]
▲ 3 ▼ “Flux coating process”
In the flux application step, a flux is applied to the surface of the lead wire at one end of the lead wire to remove oxides adhering to the surface of the lead wire, thereby facilitating the formation of a solder coating in the next soldering step.
[0016]
▲ 4 ▼ “Soldering process”
In the soldering step, the conductor at one end of the lead wire from which the oxide has been removed in the flux application step is immersed in molten solder of a solder bath (not shown), and a solder film having a predetermined thickness is coated on the surface of the conductor. Form.
[0017]
▲ 5 ▼ “Length detection process”
In the length detection step, it is detected whether or not the conductor having a solder coating formed on the surface is formed to a predetermined outer diameter and length. Into the bending process.
[0018]
In the length detecting step, a detecting means 5 as shown in FIG. 2 is used. That is, the detecting means 5 includes a detecting jig 6 having an insertion hole 7 into which the conductor 3 of the lead wire 1 is inserted, a detecting hole 8 penetrating the insertion hole 7 from a direction perpendicular to the axis, and a detecting jig. 6 is provided with a sensor 9 for detecting the length of the conducting wire 3 of the lead wire 1 inserted into the insertion hole 7 by passing an optical signal through the detection hole 8.
[0019]
The sensor 9 is capable of pulse counting. When the sensor 9 moves integrally with the detection jig 6 toward the conductor 3 of the lead 1 at a predetermined speed for a predetermined length, the sensor 9 inserts the conductor 3 of the lead 1. Is detected, and the number of pulses from the time when the lead wire 3 reaches the preset movement limit position is counted, thereby detecting whether or not the length of the lead wire 1 is within an allowable range. Also, in this length detection step, even when the sensor 9 and the detection jig 6 move back to the initial position on the opposite side of the conductor 3, the insertion of the conductor 3 can be detected by the sensor 9 from the movement limit position. The number of pulses until the pulse runs out is counted, and it is also detected whether or not the length of the lead wire of the lead wire 1 is within an allowable range. That is, the length of the conducting wire 3 of the lead wire 1 is detected twice. Further, the detecting means 5 detects whether or not the outer diameter of the conductive wire 3 of the lead wire 1 is equal to or less than a predetermined value depending on whether or not the conductive wire 3 of the lead wire 1 can be inserted into the insertion hole 7 of the detecting jig 6. .
[0020]
As for the lead wire 1 whose length of the conductive wire 3 has been detected, those whose outer diameter and length of the conductive wire 3 are out of the permissible range are excluded, and those that fall within the permissible range are sent to the next bending step. Is subjected to bending.
[0021]
▲ 6 ▼ “Bending process”
In the bending step, the lead wire 1 at the tip of the lead wire 1 is bent using the bending means 10 shown in FIGS. 3 to 7 to form an annular joint 4 as shown in FIG. Here, the bending means 10 is provided with a lower guide 11, a core rod 12 provided to be able to protrude and retract from the lower guide 11, and a movable upper and lower part above the lower guide 11, and a lower guide when moving downward. An upper guide 13 for supporting the core rod 12 by inserting an upper end of the core rod 12 protruding from the core rod 11 and a bending jig 14 provided around the core rod 12 so as to surround the core rod 12 are provided.
[0022]
As shown in FIGS. 4 to 7, the bending jig 14 includes a first bending plate 15, a second bending plate 16, and a third bending plate provided at intervals of 90 ° in the circumferential direction around the core rod 12. The plate 17 has three bent plates, and each of the bent plates 15, 16, and 17 can be independently moved toward and away from the core rod 12 from the horizontal direction. A predetermined radius surface 15a, 16a, 17a is provided on a surface of each of the bending plates 15, 16, 17 facing the core rod 12, respectively, when the bending plates 15, 16, 17 are brought closer to the core rod 12. The conductor 3 of the lead wire 1 is pressed against the surface of the core rod 12 by the rounded surfaces 15 a, 16 a, 17 a, so that the conductor 3 is bent so as to be wound around the peripheral surface of the core rod 12.
[0023]
The lead wire 1 is gripped from above and below by a gripping member 18 connected to the core rod 12 when the lead wire 3 is bent, and the lead wire 3 is held on the lower guide 11 by the holding rod 18 and the bending jig 14. It is held so as to reach a predetermined position between them.
[0024]
Then, the lead wire 1 is gripped by the gripping member 18, and in this state, the conductive wire 3 of the lead wire 1 is inserted between the bending jig 14 and the core rod 12 as shown in FIG. In this state, the conductor 3 is sandwiched between the lower guide 11 and the upper and lower portions, and in this state, the first bending plate 15 is moved in the direction of the core rod 12 as shown in FIG. As shown in FIG. 6, the second bent plate 16 is moved in the direction of the core rod 12, and the conductive wire 3 is pressed against the surface of the core rod 12 at the round surface 16 a, as shown in FIG. As shown, the third bent plate 17 is moved in the direction of the core rod 12, and the conductor 3 is pressed against the surface of the core rod 12 by the rounded surface 17 a, so that the conductor 3 is wound around the peripheral surface of the core rod 12. And the annular joint 4 is formed.
[0025]
After the bending of the conductive wire 3 is completed, the bending plates 15, 16, and 17 are separated from the core rod 12, the core rod 12 is immersed in the lower guide 11, and the gripping state of the lead wire 1 by the gripping member 18. Is released, the lead wire 1 having the annular joint portion 4 formed at the distal end of the conductive wire 3 can be obtained.
[0026]
In the lead wire processing apparatus according to this embodiment configured as described above, the annular joint 4 can be automatically formed at the portion of the lead wire 3 of the lead wire 1 using a machine. The operation of forming the joint is facilitated, and the production efficiency can be increased. In addition, since no skill is required for the operation, even an inexperienced operator can form the annular joint portion 4 of a constant quality and accuracy with almost no defects.
[0027]
【The invention's effect】
As described above, according to the lead wire processing method according to claim 1 of the present invention, the lead wire is subjected to the “coating removing step”, the “solder film forming step”, the “detecting step”, and the “bending step”. Through the series of steps described above, the lead wire at the distal end is formed at the annular joint. Therefore, the working efficiency can be greatly increased.
[0028]
Further, according to the lead wire processing method of the present invention, in the detection step, the conductor whose length is out of the allowable range is excluded, and only the conductor whose length is within the allowable range is sent to the next bending step. Therefore, a wire whose length is out of the allowable range is not sent to the bending step, and the loop of the wire is not formed out of the allowable range. Therefore, a defective product hardly occurs due to a defect in the length of the conductive wire, and a product having a predetermined quality can be stably produced.
[0029]
Furthermore, according to the lead wire processing method of the present invention, the lead wire is warped in the vertical direction by approaching the bending jig to the core rod while being sandwiched from above and below by the vertical guide. Is bent and the ring is formed. Therefore, it is possible to perform a bending operation with a constant quality even for an inexperienced worker without any skill in bending the conductor.
[0030]
Further, according to the lead wire processing method of the present invention, by sequentially bringing each bending plate of the bending jig closer to the core rod, the lead wire is wound around the core rod. It will be bent and formed in an annular shape. Therefore, it is possible to perform a bending operation with a constant quality even for an inexperienced worker without any skill in bending the conductor.
[0031]
Further, according to the lead wire processing method or the processing apparatus according to the fifth and sixth aspects, each bending plate of the bending jig is sequentially approached to the core rod while being sandwiched from above and below by the vertical guide. The lead wire is bent so as to be wound around the core bar while the warp in the vertical direction is being regulated, and is formed in an annular shape. Therefore, it is possible to perform a bending operation with a constant quality even for an inexperienced worker without any skill in bending the conductor.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing a lead wire processed by a lead wire processing method and a processing apparatus according to the present invention.
FIG. 2 is an explanatory diagram showing a detection step of the lead wire processing method according to the present invention.
FIG. 3 is an explanatory view showing a bending step of the lead wire processing method according to the present invention, and is an explanatory view showing a relationship among a vertical guide, a core rod, and a gripping member.
FIG. 4 is an explanatory view showing a bending step and a processing apparatus of the lead wire processing method according to the present invention, showing an inserted state of a lead wire between a bending jig and a core rod. It is.
FIG. 5 is an explanatory view showing a state in which a first bending plate of a bending jig is brought close to a core rod and a conductive wire is pressed against the core rod.
FIG. 6 is an explanatory view showing a state in which a second bending plate of a bending jig is brought close to a core rod and a conductive wire is pressed against the core rod.
FIG. 7 is an explanatory view showing a state in which the third bending plate of the bending jig is brought close to the core rod, and the conductor is pressed against the core rod.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 lead wire 2 coating 3 conductive wire 4 joint 5 detecting means 6 detecting jig 7 insertion hole 9 sensor 10 bending means 11 lower guide 12 core rod 13 upper guide 14 bending jig

Claims (6)

A method of treating a lead wire in which a portion of the conductive wire exposed from the tip of the lead wire is bent and an annular joint is formed at the bent portion, wherein the coating is removed from the tip of the lead wire to expose the conductive wire. Process, a solder coating forming step of forming a solder coating on the exposed conductor surface, and detecting whether the length of the conductor with the solder coating is within the allowable range and excluding those that fall outside the allowable range And a bending step of bending a lead portion of the lead wire after the detection step to form an annular joint. The method of processing a lead wire according to claim 1, wherein the detecting step includes: a detecting jig having an insertion hole into which a lead wire is inserted; and a detecting jig provided in the detecting jig. A method of processing a lead wire, wherein the method is performed by a detecting means including a sensor for detecting whether an outer diameter and a length of an inserted conductive wire are within an allowable range. 3. The method of processing a lead wire according to claim 1, wherein the bending step is provided so as to be capable of coming and going with respect to the core rod, an upper and lower guide that sandwiches the lead wire from above and below, and a core rod. 4. And a bending jig for bending a portion of the lead wire in cooperation with the core rod. 4. The method of processing a lead wire according to claim 3, wherein the bending jig includes a plurality of bending plates provided around the core rod and capable of coming in contact with and separating from the core rod. 5. A method for treating a lead wire, comprising: bringing a lead wire into a ring-shaped joint by folding a lead wire around the core rod by sequentially bringing the plate closer to the core rod. A lead wire processing method of bending a portion of a conductive wire exposed from the tip of a lead wire and forming an annular joint at the portion,
An upper / lower guide for sandwiching the lead wire from above and below, a core rod, and a bending jig that is provided so as to be able to approach and separate from the core rod and that bends a portion of the lead wire in cooperation with the core rod. Equipped with bending means,
The bending jig is provided around the core bar and has a plurality of bending plates that can be brought into contact with and separated from the core bar. A lead wire is bent so as to be wound around a core rod to form an annular joint. A lead wire processing device that bends a portion of the conductive wire exposed from the tip of the lead wire and forms an annular joint at the portion,
An upper / lower guide for sandwiching the lead wire from above and below, a core rod, and a bending jig that is provided so as to be able to approach and separate from the core rod and that bends a portion of the lead wire in cooperation with the core rod. Equipped with bending means,
The bending jig is provided around the core bar and has a plurality of bending plates that can be brought into contact with and separated from the core bar. A lead wire processing device characterized in that a lead wire is bent so as to be wound around a core rod to form an annular joint.

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