TW303510B - The new tape automated bonding method with compound bump and its structure - Google Patents

Abstract

A bonding structure forming method includes: An IC device with compound bump pad; An ACF consists of insulation adhesive and conductive particle; A 1st dielectric layer; A lead array; An isolated film; A heating head; Put an ACF on IC device; Press heating head passing on protection layer; Remove the protection film; Form several bonding pairs; Put isolating film on lead array; Press heating head passing for forming conductive bonding among the conductive particle, inner lead and compound bump pad.

Description

3〇asi〇A7 ____B7_ V. Description of the invention (/) Background of the invention The present invention relates to an anisotropic conductive film (Anisotropic Conductive Film, composed of conductive particles (Inductive Particle) and insulating adhesive (Insulation Adhesive), ACF), through tape-on-die bonding (Tape Automated Bonding, TAB) method, the integrated circuit element with composite bump input / output pads and the lead array (Lead Array) form a conductive bond. Due to the use of anisotropic conductive film, the bonding process can provide a lower bonding temperature, pressure and a reliable Encapsulation structure. Due to the composite bump input / output pads on the integrated circuit components, the contacts can be completed with lower pressure. Conventional technology The traditional tape-and-reel die bonding method must use high temperature to form conductive bonds between the inner pin ends of the metal pin array and the metal bumps of the integrated circuit device. Due to the difference in the coefficient of thermal expansion (CTE) of the assembled components, the subsequent process becomes more difficult; for example, the external pins are bonded to the substrate in alignment. The present invention provides a method for avoiding this problem by using the combined tape-and-die bonding process and the composite bump input / output pads on the integrated circuit device by employing Mitsubishi. The anisotropic conductive film is composed of conductive particles and an insulating adhesive. Printed by the Staff Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling this page)

Tagosa et al. In its patent application (US Pat. No. 4,963,002) describe the use of conductive particles and insulating adhesive bonding structure, Fujimoto in its patent application (3-6397, Japan) describes the relevant Composite conductive particles, adhesive layer and flip chip bonding method.

The patent applied by Tsukagoshi et al. (US Pat. No. 5,001,542) describes that the paper standard of glass, synthetic resin, metal, ceramic or these materials is applicable to China National Standards (CNS) A4 specification (210'〆29 ^ ^ 嫠) S〇35l〇A7 ___5Z_ V. Description of the invention (>) (Please read the precautions on the back before filling this page). Tsukagoshi et al. Used a material composed of deformable conductive particles, hard conductive particles and adhesive to form a conductive bond. The conductive particles are metals such as nickel, silver and gold. The patent application for the invention of this case is to use an anisotropic conductive film of f composite convex p in insulating adhesive. The composite bump has a polymer body, and the surface is coated with a layer of metal.

In his patent application (U.S. Pat. No 4,470,657), Tsukagoshi et al. Describe the use of an anisotropic conductive film composed of conductive particles and adhesives of various sizes.

Tsukagoshi et al.'S patent application (U. S. Pat. No 4,731,282) is a description of insulating adhesives. Brief description of the invention The structure of a traditional tape-and-reel die bond (TAB) is shown in FIG. 1, the pin array has metal pins 22; this metal pin may be copper, and the metal pin is attached to the first dielectric Layer 23; the dielectric layer may be Polyimide (Polyimide), the inner end of the metal pin and the metal bump 21; the metal bump may be a gold bump (Au

Bump). The gold bumps are plated on the oxide input / output pads of the integrated circuit element 20 by electroplating. Heat energy is transferred to the metal pins in the pin array with the set temperature, pressure and time parameters through the heating head (Thermode) 10, so that the metal leads to the inner end 22 of the printed foot of the employee consumer cooperative of the Central Bureau of Standards and the metal The bump 21 forms a conductive bond. In the traditional tape-and-reel die bonding process, high temperature is necessary; usually between 450 and 550 ° C, so that the metal pins in the pin array and the metal bumps on the integrated circuit device are formed Conductive bonding. The difference in thermal expansion coefficient between the copper pin and the dielectric layer 23 makes the subsequent external pin-to-substrate bonding process more convenient. The hardness of the metal bumps will transfer the force exerted by the heating head to the integrated circuit components, causing the aluminum oxide pad to crack. To avoid this phenomenon, the paper size of the control plus the paper is applicable to the Chinese National Standard (CNS) Α4 specifications (210Χ297mm) -4- A7 B7 printed by the Employees ’Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Invention description (3) The flatness (Planarity) of the end face of the thermal head and the flatness (ParaUelTTin) of the end face and the metal bump change It is very important, which will make the manufacturing cost of the equipment more fman. The traditional tape-and-reel die bonding process must be encapsulated (Ecapsulation) after the process to prevent moisture from corroding and damaging the contacts. The main objective of the present invention is to provide a low-cost tape-die bonding process. The new process uses lower temperature and pressure, and completes the protection of the sealant at the same time as the contact is formed. A further object of the invention of the present invention is to provide a low-cost tape-and-reel die-bonding structure, which uses a lower-cost tape-reel-to-die bonding process; At the time of the dot-shaped seat, the sealant is completed to protect the gjM. These objectives are achieved through the use of composite bumps on integrated circuit devices and the use of anisotropic conductive films in the manufacturing process. The anisotropic conductive film is composed of conductive particles and insulating adhesive, and the composite bump has a polymer body, and the surface is coated with a layer of metal. After the tape-on die bonding process is completed, the conductive particles 31 in the anisotropic conductive film are interposed between the metal pins 22 of the pin array and the conductive metal plating 46; as shown in FIGS. 2A and 2B. The composite bump has a polymer body 47 and a conductive metal coating 46 and is longer than the alumina input / output pads of the integrated circuit element. The conductive particles and composite bumps compensate for the variation in parallelism between the gold bumps and the heating head, so the pressure used in the bonding process can be reduced to approximately 20 to 40 kg / cm2. When the conductive joint is formed, the insulating adhesive 32 is wrapped around the contact to form a sealant 'to protect the contact from corrosion and mechanical damage caused by a large amount of moisture. The temperature required for the bonding process is between 150 and 1 ° C (the temperature to which the adhesive bears). After the adhesive is cured, the contact can be maintained in the contact state. The metal pin array may have a hole design as shown in FIG. 2C. The pin array has metal pins 22; the metal pin may be copper, and the metal pin is attached to the dielectric layer 23; the dielectric layer may be a poly Acetamide, there is a bonding area 75 around the inner edge of the dielectric layer 73, this connection is --1 HI 1 ^ 1 —I— 1 ^ 1 ^^ 1.!-«1. (Please read the precautions on the back and fill in Benyu) set

Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 --------- B7 V. Description of the invention (f) The combined area has no dielectric layer 'The tail end 74 of the internal pin extends to the area without the dielectric layer. In this form of pin array, an insulating layer consisting of metal foil 27 and polyethylene ammonia 25 is used to prevent the heating head from interacting with the adhesive. The completed structure is shown in Figure 2A. The pin array can also be in the form shown in FIG. 2D. This type of pin array has no void design. The metal pins 22 are attached to the entire dielectric layer 23. This type of metal pin array does not require Use an insulating layer in the bonding process. The completed structure is shown in Figure 2B. The insulating adhesive used for the anisotropic conductive film may be a thermoplastic type, a thermosetting type, or a mixture of the above two materials. The conductive particles can be metal particles, graphite fibers or a polymer body, and the surface is coated with a layer of metal composite conductive particles. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows a conventional technique of tape-and-reel die bonding structure. Fig. 2A shows a cross-sectional view of a structure formed by a composite bump, an anisotropic conductive film, a metal pin array with a hole design, and a tape wound die bonding method. 2B shows a cross-sectional view of a structure formed by a composite bump, an anisotropic conductive film, a metal pin array with no void design, and a tape-and-reel die bonding method. 2C shows an upper view of a metal pin array with a hole design. FIG. 2D shows the top view of the metal pin array without holes. Fig. 3A shows a cross-sectional view of an anisotropic conductive film attached to an integrated circuit element having composite bumps. Fig. 3B shows a cross-sectional view of the contact between the heating head and the anisotropic conductive film attached to the composite bump integrated circuit element. Figure 3C shows the composite bump integrated circuit element with anisotropic conductive film attached to the surface. The size of the paper is applied to the Chinese National Standard (CNS) A4 specification (2 丨 〇X 297mm) ------- --- ·-(Please read the notes on the back before filling this page)

* 1T A7 B7 V. Description of the invention (5 *) The cross-sectional view after the pre-bonding of the thermal head. Fig. 3D shows that the metal pin array with holes is placed on the surface of the composite bump integrated circuit element with an anisotropic conductive film and the alignment is completed. The anisotropic conductive film has been pre-laminated. FIG. 3E shows that another insulating layer is placed on the metal pin array in the structure of FIG. 3D, and the heating head is heated and pressed through the insulating layer. Fig. 4A shows a cross-sectional view of an anisotropic conductive film with a protective layer attached to a metal pin array with no holes. Fig. 4B shows a situation where the heating head is in contact with a metal pin array with no void design, and an anisotropic conductive film with a protective layer is attached to the surface of the metal pin array. Fig. 4C shows a cross-sectional view of the anisotropic conductive film attached to the metal pin array after pre-pressing and tearing off the surface protective layer. FIG. 4D shows a cross-sectional view of a tape-bonded die bonding structure using a composite bump integrated circuit device, a metal pin array without voids, and heating on the metal pins. Fig. 4E shows a cross-sectional view of a taped die bonding structure using a composite bump integrated circuit element, a metal pin array without voids, and heating on the integrated circuit element. 5A shows a cross-sectional view of the structure of an anisotropic conductive film. Fig. 5B shows the shape of the graphite conductive fiber used in the anisotropic conductive film. FIG. 5C shows the shape of metal particles used in the anisotropic conductive film. Printed by the Staff Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). Figure 5D shows the shape of the composite conductive particles used in the anisotropic conductive film. The composite conductive particles are inside a polymer body , The surface is coated with a layer of conductive metal. Fig. 5E shows the shape of the multi-layer composite conductive particles used in the anisotropic conductive film. The multi-layer composite conductive particles have a structure in which another polymer is coated on the surface of the composite conductive particles. 6A shows a cross-sectional view of the structure of an anisotropic conductive film with upper and lower protective layers. 6B shows a cross-sectional view of the structure of an anisotropic conductive film with only a single protective layer. Fig. 7 shows an upper view of a metal pin array with no holes. This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) —tr — Α7 θ〇35 ^ 〇Β7 5. Description of the invention (G) Please refer to FIGS. 2A, 2C, 3A for description of the best embodiment To 3E, 5A to 5E, 6A and 6B, to illustrate the implementation of the bonding structure formed by the composite bump integrated circuit element, the anisotropic conductive film, the design of the metal pin array with holes, and the tape-and-reel die bonding method example. Fig. 3A shows a cross-sectional view of an integrated circuit element 20 having composite bumps 46, 47 and 48. Figs. The composite bump is composed of a polymer body 47; such as polyamic acid polyimide, which is coated with a layer of metal 46; such as chromium and gold or nickel and gold. In this embodiment, the composite bumps are grown on the underlying metal pad 46; such as aluminum, however, the underlying metal pad may not be used. The structure and manufacturing method of the compound bumps are described in US Patent No. 5,393,697 to Zhang et al., Obtained on February 28, 1995, and listed in the reference materials. Anisotropic conductive film 30 of appropriate length is taken and placed on an integrated circuit element On the surface of 20, the anisotropic conductive film is in contact with the metal plating layer 46 on the composite bump. The anisotropic conductive film 30 is composed of an insulating adhesive 32 coated on the protective layer 51 and conductive particles 31 distributed in the insulating adhesive. In this embodiment, the protective layer 51 is made of polyester material. Fig. 5A shows a cross-sectional view of the structure of an anisotropic conductive film 30 composed of conductive particles 31 and an insulating adhesive 32 without a dielectric layer. 5B to 5E illustrate some types of conductive particles. The conductive particles may be graphite conductive fibers 44 shown in FIG. 5B, metal particles 41 in FIG. 5C, and composite conductive particles in FIG. 5D. The composite conductive particles are coated with a layer of conductive metal 42 'on the surface of a polymer sphere 41 or FIG. 5 The shape of the multi-layer composite conductive particles of E. The multi-layer composite conductive particles have a structure in which a layer of conductive metal is coated on the surface of the polymer sphere 41 and then another polymer 43 is coated. 6A and 6B illustrate some forms of anisotropic conductive films. As shown in FIG. 6A, the anisotropic conductive film 30 composed of the conductive particles 31 distributed in the insulating adhesive 32 may have protective layers 51, 52 covering both sides of the anisotropic conductive film. As shown in FIG. 6B, the anisotropic conductive film 30 composed of conductive particles 31 distributed in the insulating adhesive 32 may have a protective layer. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 public daughter) 〉 (Please read the precautions on the back before filling in this page)-Packing. Order the Ministry of Economy Central Standard Falcon Bureau Employee Consumer Cooperative to print the Ministry of Economy Central Standard Bureau Employee Consumer Cooperative Printed Bag A7 ___ B7____ V. Invention Instructions (7) 51 Covered on one side of the anisotropic conductive film. It can be seen from Figure 5々 that when pressure is applied in the direction of arrow 75, only the direction along the arrow can conduct electricity, but the direction perpendicular to the arrow is still insulated. See Figure 3B ' A cross-sectional view of the heating head in contact with the anisotropic conductive film 30 with only a single-side protective layer η. The heating head 10 can transfer thermal energy to an object in contact with the heating head at the set temperature and pressure. l〇〇 ° C, pressure 5 to 10 kg / cm2 and 3 to 5 seconds to preheat the anisotropic conductive film. This preheating step makes the insulating adhesive slightly flow and the composite bumps 46, 47 and 48 complete coverage, and then guide the heterosexuality The protective layer 51 of the film is torn off, as shown in FIG. 3C. The next steps are shown in FIG. 3D, which shows that the pin array with metal conductive pins 22 is attached to the first type dielectric layer 23 and placed There is an anisotropic conductive film 30, and the inner ends of the metal conductive pins 22 are on the composite bumps 46, 47, and 48 of the integrated circuit element 20. The metal conductive pins 22 in this embodiment are copper The dielectric layer 23 is made of polyethylene. The top view of the pin array is shown in FIG. 2C. The first dielectric layer 23 has a bonding area 75 around the inner edge 73. This bonding area has no dielectric layer. The tail end of the pin 22 extends toward the area without the dielectric layer. The phenomenon that the tail end of the inner pin extends toward the area without the dielectric layer can still be found in FIG. 3D. The next step is shown in FIG. 3E. The insulating layer of the sheet 27 is attached to the second dielectric layer 25. In this embodiment, the second dielectric layer 25 is polyvinyl acetate, and its thickness is between 70 and 75 microns, while the metal foil 27 is aluminum, and its thickness is about 30 to 35 microns. This isolation layer is placed in the hole or the pin array area without the first dielectric layer, in Around the inner area of the entire pin array, near the hole boundary, the second dielectric layer 25 of the insulating layer is in contact with the first dielectric layer 23, and the second dielectric layer 25 of the insulating layer connects the metal foil 27 and the lead The foot array is separated. As shown in FIG. 3E, the heating head 10 is in contact with the metal foil 27 of the insulating layer. The heating head transfers thermal energy to the insulating layer at a temperature of 250 to 30 (TC, pressure of 20 to 40 kg / cm2 and time of 5 to 2G seconds) 'Assembly of pin arrays, composite bumps and integrated circuit components is shown in Figure 3E. The paper size is applicable to the Chinese National Standard Falcon (CNS) A4 specification (21〇 < 297mm). 11 (Please read the back first Please pay attention to this page and then fill out this page)-Binding · Binding A7 B7 Printed by the Employees Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Invention Instructions (8) So far, the entire joint structure of Figure 2A is completed. When this assembly is subjected to pressure, there are many conductive particles 31 in the anisotropic conductive film between each joint pair of the inner end of the arch foot and the composite bump. The guide member 31 makes the inner end of the pin of each bonding pair and the metal gas mouse on the composite bump. The metal plating layer 46 of the composite bump and the polymer body 47 are deformed by the force when the contact is formed. The complete bonding structure formed in the foregoing embodiment is shown in FIG. 2A. The composite bumps 46, 47, and 48 are longer than the aluminum oxide input / output pads of the integrated circuit element 20. The composite bumps have been described above. The inner ends of the copper pins 22 of the pin array are positioned so that the inner ends of each pin cover the metal plating 4 6 of each composite bump 4 6, 4 7 and 48 and form a bonding pair. When this type of assembly is subjected to pressure, there are many conductive particles 31 in the anisotropic conductive film between each pair of the inner end of the pin and the composite bump metal plating layer 46. The conductive particles 31 make the inner end of the lead of each bonding pair conductive to the metal plating layer 46 on the composite bump. The metal plating layer 46 of the re-bump and the polymer body 47 are deformed by the force when the contact is formed. The second dielectric layer 25 of the insulating layer is in contact with the insulating adhesive in the anisotropic conductive film and the first dielectric layer 23 around the hole. The insulating adhesive flows due to the heat and pressure transmitted by the heating head during the assembly process, so that the joint structure is sealed and the entire joint is maintained in conductive contact due to the hardening of the adhesive. Insulating adhesives such as etiy1ene-viny1 acetate copolymer, polyethylene 'ethylene-propylene copolymer, acrylic rubber or other similar materials. These polymers may be used alone or in combination. Insulating adhesive can be thermoplastic, thermosetting or a mixture of the above two materials. The insulating layer used in this embodiment is an aluminum foil 27 with a thickness of approximately 30 to 35 microns attached to the polymer layer 25 with a thickness of approximately 70 to 75 microns, or a Silicone Rubber attached to On the polymer layer or other similar materials. Next, please refer to Figures 2B, 2D, 4A to 4E, 5A to 5E, 6A and 6B to illustrate the use of anisotropic conductive films, void-free design of metal pin arrays, and composite bumps. National Standard (CNS) A4 specification (210X 297mm) I [D — (please read the precautions on the back before filling in this page). Packed. Printed A7 B7______ printed by the employee consumer cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of invention ( 7) An embodiment of a bonding structure formed by a bulk circuit component and a tape-on die bonding method. FIG. 4A shows a cross-sectional view of an anisotropic conductive film with a single-sided protective layer 51 attached to a pin array formed by the first type dielectric layer 23 and the metal pin 22 without holes. FIG. 2D shows a top view of the metal pin array in this embodiment. The metal pin 22 is attached to the first dielectric layer 23, and the dielectric layer has no void design. The inner end 74 of the metal pin is attached to the first type dielectric layer 23. Fig. 5A shows a cross-sectional view of the structure of an anisotropic conductive film 30 composed of conductive particles 31 and an insulating adhesive 32 without a dielectric layer. 5B to 5E illustrate some types of conductive particles. The conductive particles may be graphite conductive fibers 44 shown in FIG. 5B, metal particles 41 in FIG. 5C, and composite conductive particles in FIG. 5D. The composite conductive particles are coated with a layer of conductive metal 42 on the surface of a polymer sphere 41, or FIG. 5 The shape of the multi-layer composite conductive particles of E is a structure in which a layer of conductive metal is coated on the surface of the polymer sphere 41 and then another polymer 43 is coated. 6A and 6B illustrate some forms of anisotropic conductive films. As shown in FIG. 6A, the anisotropic conductive film 30 composed of the conductive particles 31 distributed within the insulating adhesive 32 may have protective layers 51'52 covering both sides of the anisotropic conductive film. As shown in FIG. 6B, the anisotropic conductive film 30 composed of the conductive particles 31 distributed within the insulating adhesive 32 may have a protective layer 51 covering one side of the anisotropic conductive film. It can be seen from Fig. 5A that when pressure is applied in the direction of arrow 75, only the direction of the arrow can conduct electricity 'but the direction perpendicular to the arrow is still insulated. Returning to Fig. 4A, the anisotropic conductive film 30 of appropriate length is taken and placed on the surface of the pin array. An anisotropic conductive film with a protective layer 51 is placed on the surface of the pin array so that the insulating adhesive contacts and covers the inner ends of the pins of the pin array. The pin array with metal conductive pins 22 is attached to the first dielectric layer 23. In this embodiment, the metal conductive pins 22 are copper, the first dielectric layer 23 is polyethylene, and the protective layer material of the anisotropic conductive film is polyester. The insulating adhesive can be thermoplastic, thermosetting, or a mixture of the above two materials. &Quot; This paper size is applicable to the Chinese National Falcon (CNS) A4 specification (210X297 mm) 1) Bu (please read first (Notes on the back and then fill out this page) Packed and ordered A7 B7_ printed by the Employees ’Consumer Cooperative of the Central Standardization Bureau of the Ministry of Economic Affairs V. Description of the invention (㈧) Referring to FIG. 4B, the heating head is in contact with the anisotropic conductive film with a protective layer, This assembly preheats the anisotropic conductive film at a temperature of 90 to litre, a pressure of 5 to 10 kg / cm2, and a time of 3 to 5 seconds. As shown in FIG. 4C, this preheating step makes the insulating adhesive stick to the inner end of the pin array, and then tears off the protective layer of the anisotropic conductive film. The next steps are shown in Figure 4D. Assemble the pin array and the anisotropic conductive film as shown in Figure 4C. Place on the body circuit element and complete the positioning so that the inner end of each pin covers each compound bump 46, 47 and 48 are formed on the metal plating layer 46 and form a bonding pair. When this type of assembly is subjected to pressure, there are many conductive particles 31 in the anisotropic conductive film between each bonding pair of the inner end of the pin and the composite bump metal plating layer 46. The conductive particles 31 make the inner end of the lead of each bonding pair and the metal plating layer 46 on the composite bump conductive. As shown in FIG. 4D, the heating head 10 is in contact with the first type dielectric layer 23 of the pin array. The heating head heats this assembly at a temperature of 250 to 300 ° C, a pressure of 20 to 40 kg / cm2, and a time of 5 to 20 seconds. After the completion of the joint structure shown in Figure 2B. The metal plating layer 46 of the composite bump and the polymer body 47 are deformed by the force when the contact is formed. Another bonding method is shown in FIG. 4E, and then the pin array and the anisotropic conductive film are assembled as shown in FIG. 4C, placed on the body circuit component and positioned, so that the inner end of each pin covers each compound The bumps 46, 47, and 48 are formed on the metal plating layer 46 and form a bonding pair. When such an assembly is subjected to pressure, there are many conductive particles 31 in the anisotropic conductive film between each pair of the inner end of the pin and the composite bump metal plating layer 46. The conductive particles 31 make the inner end of the lead of each bonding pair conductive to the metal plating layer 46 on the composite bump. In the method of FIG. 4E, the heating head 10 is in contact with the back surface of the body circuit element 20, and on the other surface of the circuit element 20, the compound bumps 46, 47, and 48 are longer than the alumina input / output pads of the integrated circuit element 20. The heating head heats this assembly at a temperature of 250 to 3GG ° C, a pressure of 20 to 40kg / cm2, and a time of 5 to 20 seconds. The completed joint structure is shown in H2B. The metal plating layer 46 of the composite bump and the polymer body 47 are deformed by force when the contact is formed. The complete joint structure formed in the foregoing embodiment is shown in FIG. 2B, and the composite convex paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm) —11 1 .--------- { • Installation-(Please read the precautions on the back before filling in this page) Order A7 B7 5. Description of the invention ((丨) Blocks 46, 47 and 48 are longer than the aluminum oxide input / output pads of the integrated circuit element 20. Lead The inner ends of the copper pins 22 of the foot array are positioned so that the inner ends of each pin cover the metal plating 46 of each composite bump 46, 47 and 48 and form a bonding pair. When this type of assembly is subjected to pressure Then, there are many conductive particles 31 in the anisotropic conductive film between the inner end of the lead and each bonding pair of the composite bump metal plating layer 46. The conductive particles 31 make the inner end of the lead of each bonding pair and the composite convex The metal sulfide layer 46 on the block can conduct electricity. The metal plating layer 46 of the composite bump and the polymer body 47 are deformed by the force when the contact is formed. The insulating adhesive flows due to the heat and pressure transmitted by the heating head during the assembly process , To make the joint structure sealant and harden the adhesive so that the whole joint can be kept conductive Touching state. The insulating adhesive is epoxy resin (Epoxy), which can also be thermoplastic, thermosetting or a mixture of the above two materials. In the method and structure of this embodiment, the pin array The inner end of the pin can be in a surface matrix mode as shown in Figure 7. In the pin array, the inner end 74 of the pin 22 is attached to the first dielectric layer 23 without a hole design. Here In the example, the pin 22 and the inner end 74 of the pin are copper. Although the above description describes the features of the present invention in the preferred embodiment, anyone skilled in the art can understand that there are many modifications in details or forms , May still fall within the spirit and scope of the present invention '. Therefore, the scope of the present invention is inappropriately limited to the above embodiments, and should be limited to the following patent application scope. (Please read the precautions on the back before filling this page ) Installed.

, 1T Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) 1 / j 1

Claims (1)

A8 B8 C8 D8 Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 6. The scope of the patent application is from the patent scope 1. A method of forming a joint structure includes: preparing an integrated circuit component with composite bump pads; preparing An anisotropic conductive film is composed of an insulating adhesive coated on the protective layer and conductive particles distributed within the insulating adhesive; preparing a first dielectric made of the first dielectric material Electrical layer; prepare a pin array composed of many conductive pins attached to the first dielectric layer, the conductive pins of this pin array have inner pin ends and outer pin ends, and the first ~ There is a hole without the first dielectric layer material around the inner part of the electrical layer, and the inner pin end extends beyond the inner periphery to the hole without the first dielectric layer material; a layer of supporting metal is prepared to be attached to The second kind of insulating film of the dielectric layer; prepare a heating head, which can provide ripe energy through the selected time 'temperature and pressure; place an anisotropic conductive film on the aforementioned integrated circuit element, so that many of them guide The particles are in contact with the composite bump pad; the aforementioned heating head transfers the heat energy of the first stage temperature and the first stage pressure to the anisotropic conductive film through the protective layer at the time of the first stage; tear off the aforementioned protective film Layer; forming a number of bonding pairs, these bonding pairs are composed of one of the inner leads and one of the conductive bonding bumps, and the conductive particles are placed on the pin array in the aforementioned distribution of the insulating adhesive On the conductive particles in the agent, so that the ends of the inner pins and the conductive bonding bumps are so that the conductive particles are between one of the inner pins and one of the compound bump pads; A prepared insulation film is placed on the aforementioned pin array, so that the completed insulation film covers the aforementioned hole, and the aforementioned second dielectric material layer is interposed between the aforementioned pin array and the aforementioned supporting metal layer Between; and apply the aforementioned heating head at the time of the second stage to apply the temperature of the second stage and the second stage of the paper to the Chinese national standard (CNS> A4 specification (2 丨 0X297mm) (please Xian Hong (Notes on the back and then fill out this page)-Installation ·-Order., Quan A8 B8 C8 D8 S〇35l〇 The pressure range of the patent application section transfers heat energy to the aforementioned insulating film, insulating dielectric layer and bonding pair, so that the aforementioned Each bonding pair forms a conductive bond between the aforementioned conductive particles, the aforementioned inner pin ends, and the aforementioned composite bump pads. Please read the notes on the back page again. If. This page 2. If applying for a patent The method described in item 1 of the scope, wherein the first stage temperature is 90 to 11 (TC, the first stage pressure is 5 to 10 kg / cni2 and the first stage time is 3 to 5 seconds. 3. If the patent is applied for The method of item 1, wherein the second stage temperature is 250 to 30 G ° C, the second stage pressure is 20 to 40 kg / cm2, and the second stage time is 5 to 20 seconds. 4. The method as described in item 1 of the patent application, in which the composite bump solder pad is made of the first polymer body and the surface is coated with the first conductive metal. 5. The method as described in item 1 of the patent application, wherein the conductive pins are copper. Order 6. The method as described in item 1 of the patent application, in which the conductive particles are metal. 7. The method as described in item 1 of the patent application, in which the conductive particles are second high molecular spheres, and the surface is coated with a second conductive metal. 8. The method as described in item 1 of the patent application, in which the conductive particles are the third polymer spheres, a third layer of conductive metal is plated on the surface, and the fourth polymer is coated on the surface of the conductive metal. 9. The method as described in item 1 of the patent application, wherein the conductive particles are graphite. Printed by the Employees ’Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 10. The method described in item 1 of the patent application, in which the supporting metal is aluminum, the thickness of which is between 30 and 35 microns, and the second dielectric layer It is polyvinyl amide, and its thickness is between 70 and 75 microns. "_ 11. The method as described in item 1 of the patent application, wherein the first dielectric layer is made of polyvinyl amide, and its thickness About 7G to 125 microns. 12. A method of forming a bonding structure, which includes: preparing an integrated circuit element with a compound bump pad; preparing an anisotropic conductive film made of an insulating adhesive coated on the protective layer and the paper The standard adopts the Chinese National Standard (CNS) A4 specification (2! 〇X297mm) printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Αδ Β8 C8 _ D8 々, apply for the patented conductive particles distributed within the insulating adhesive Composed of; prepare a dielectric layer; prepare a pin array composed of many conductive pins attached to the first dielectric layer, the conductive pins of this pin array have inner pin ends and outer pin ends ; Prepare a heating head, which can provide heat energy through the selected time, temperature and pressure; place an anisotropic conductive film on the aforementioned pin array, so that many of them are distributed in the conductive particles of the insulating adhesive and the inner lead Foot contact; the aforementioned heating head will transfer the heat energy of the first stage and the pressure of the first stage to the anisotropic conductive film through the protective layer at the time of the first stage; before tearing off The protective film layer described; forming a plurality of bonding pairs, these bonding pairs are composed of one of the inner leads and one of the composite bump pads, and the conductive particles are used to place the pin array in the distribution On the conductive particles in the insulating adhesive, so that the method of making the conductive particles on one of the inner pins and one of the compound bump pads is at the end of the inner pin and on the compound bump pad And the aforementioned heating head transfers the heat energy of the second stage temperature and the second stage pressure to the aforementioned insulating film 'insulating dielectric layer and bonding pair at the second stage time, so that each of the aforementioned bonding pairs The aforementioned conductive particles' form a conductive bond between the aforementioned inner pin end and the aforementioned composite bump solder pad ° 13. The method as described in item 12 of the patent application scope ’wherein the first stage temperature is 90 to 11ITC’ The first stage pressure is 5 to 10 kg / cm2 and the first stage time is 3 to 5 seconds. -一 14. The method as described in item 12 of the patent application, wherein the second stage temperature is 250 to 300 ° C, the second stage pressure is 40 kg / cm2 and the second stage time is 5 to 20 seconds. 15. The method described in item 2 of the scope of patent application 'where the composite bump welded plastic is applied to the Chinese national standard (CNS) A4 present format (210x297mm) from this paper scale C Please read the precautions on the back first (Fill in this page)-Pack. Order 8 8 88 ABCD The Ministry of Economic Affairs Central Standards Bureau employee consumer cooperative printed and patented the first polymer sphere, and the surface is coated with the first conductive metal ° 16. If the patent scope is applied The method described in item 12, wherein the conductive cell 1 is copper ° Π. The method described in item 12 of the patent application scope, wherein the conductive particles are metal. 18. The method as described in item 12 of the patent application, wherein the conductive particles are first polymer spheres, and a second conductive metal is plated on the surface. 19. The method as described in item 12 of the patent application range, in which the conductive particles are coated with a third conductive metal on the surface of the second polymer body and then coated with a fourth polymer on the surface of the conductive metal. 20. The method as described in item 丨 of the patent application scope, wherein the conductive particles are 5 cm ink. 21. The method as described in item 丨 of the patent application scope, wherein the first dielectric layer is made of polyacetamide, and its thickness is between 70 and 125 microns. 22. A bonding structure, which includes ; An integrated circuit element with many compound bump pads: a first dielectric layer made of the first dielectric material; a combination of many conductive pins attached to the first dielectric layer Pin array, the conductive pins of this pin array have inner pin ends and outer pin ends; many bonding pairs, these bonding pairs are composed of one of the aforementioned inner leads and one of the aforementioned compound bump pads ; An anisotropic conductive film composed of conductive particles distributed in an insulating adhesive, these conductive particles are arranged between each pin pair and the terminal of the composite bump pad; and many bonding pairs, Conductive particles are formed between the inner pin end of each bonding pair, the composite bump pad of each bonding pair, and the inner pin end of each bonding pair and the composite bump pad of each bonding pair Conductive bonding. This paper wave scale is applicable to the Chinese National Standard (CNS) A4 specification (2 丨 〇χ297 public director) (__Please read the precautions on the back and then fill out this page)-Install. Order A8 B8 C8 _ D8 VI. Apply for a patent park 23. The bonding structure as described in item 22 of the patent application scope, wherein each inner pin end is attached to the first dielectric layer. 24. The bonding structure as described in item 22 of the patent application scope, in which the first dielectric layer has voids on the inner periphery without the first dielectric layer material, and each inner pin end passes over the inner periphery to the void Hole extension. 25. The bonding structure as described in item 24 of the patent application scope is further described as the insulating film formed by the support metal attached to the second dielectric material layer covers the aforementioned hole, the aforementioned second The electrical material layer is in contact with the inner pin end, the second dielectric material layer is in contact with the first dielectric layer, and the second dielectric material layer insulates the support metal layer from the conductive pin. 26. The joint structure as described in item 22 of the patent application, wherein the conductive pins are copper. 27. The joint structure as described in item 22 of the patent application, in which the composite bump pads are made of the first polymer body, and the surface is coated with the first conductive metal. 28. The joint structure as described in item 22 of the patent application, wherein the conductive particles are metal. 29. The bonding structure as described in item 22 of the patent application, wherein the conductive particles are second polymer spheres, and a second conductive metal is plated on the surface. 30. The joint structure as described in item 22 of the patent application, in which the conductive particles are the third polymer spheres, the surface is coated with a third conductive metal and the fourth polymer is coated on the conductive metal surface. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling in this page) 31. For the joint structure described in item 22 of the patent application, the conductive particles are graphite. ― 一 32. The joint structure as described in item 22 of the patent application range, in which the supporting metal is aluminum with a thickness of about 30 to 35 microns, and the second dielectric layer is polyethylene amide with a thickness About 70 to 75 microns. This paper ¥ scale is applicable to the Chinese National Standard (0 milk) 8.4 specifications (21 (^ 297 mm) ο J 5 3ο 5 ABCD Printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 6. Scope of patent application 33. The bonding structure described in item 1, the first dielectric layer is made of polyethylene amide, and its thickness is between 70 and 125 microns. (-Please read the precautions on the back before filling this page) This The standard of paper is applicable to the standard of CNS A4 (210 X 297 mm)