TW301792B - Tape automated bonding method and structure thereof - Google Patents

Abstract

A method of forming bonding structure comprises of: (1) preparing one integrated circuit component with conductive bonding bump;(2) preparing one anisotropic conductive film composed by insulating adhesive coated on protection layer and conductive particle distributed in insulating adhesive; (3) preparing one first dielectric made of first dielectric material; (4) preparing one lead array made of many conductive lead adhered to first dielectric, in which conductive lead of the lead array has inner lead terminal and outer lead terminal, and the inside perimeter of first dielectric has one void without first dielectric material, and inner lead across inside perimeter extends to void without first dielectric; (5) preparing one isolating film by adhering one supporting metal to second dielectric; (6) preparing one thermode to supply thermal energy via selected time, temperature and pressure; (7) placing one anisotropic conductive film on the above integrated circuit component, making many conductive particles within contact with conductive bonding bump; (8) with first step time transferring thermol energy of first step temperature and first step pressure to anisotropic conductive film via protection layer; (9) tearing the above protection film; (10) forming many bonding pairs, which are combined by one of the above inner lead and one of the above conductive bonding bump, and the above conductive particle places the above lead array on conductive particle distributed inside insulating adhesive, making conductive particle be positioned between one of the above inner leads and one the above conductive bonding bumps; (11) overlaying the above void with insulating film, and the above second dielectric material is between the above lead array and the above supporting metal layer; and (12) with second step time transferring thermol energy of second step temperature and second step pressure to the above isolating film, insulating dielectric and bonding pair, making the above each bonding pair form conductive bonding between the above conductive particle, the above inner lead terminal and the above conductive bump.

Description

The Ministry of Economic Affairs, Central Bureau of Accreditation and Employee Consumer Cooperative Yinzhen A7 B7 V. Description of the Invention (I) Background of the Invention The present invention relates to an anisotropy composed of conductive particles and insulating adhesives Conductive film (Anisotropic Conductive Film, ACF) 'Tape Automated Bonding (TAB) method is used to make the input / output end of the integrated circuit element and the metal pin array (Lead Array) form a conductive bond. Due to the use of anisotropic conductive films, the bonding process can provide a lower bonding temperature, pressure and reliable encapsulation (Encapsulation) structure. Conventional technology The traditional tape-and-reel die bonding method requires high temperature to form conductive bonding between the inner end pin of the metal pin array and the input / output end of the integrated circuit device. Due to the difference in the coefficient of thermal expansion (CTE) of the assembled components, the subsequent alignment bonding process of the external pins and the substrate becomes more difficult. The present invention uses an anisotropic conductive film and a tape-type crystal The use of particle bonding process provides a way to avoid this problem. The anisotropic conductive film is composed of conductive particles and insulating adhesive.

Tagosa et al.'S patent application (1) .5.? 3 〖.ru · 4,9 63,002) describes the joint structure using conductive particles and insulating adhesive, Fujimoto's patent application (3- 639 7, Japan) describes the method of composite conductive particles, adhesive layer and flip chip bonding (Flip Chip Bonding). The patent applied for by Tsukagoshi et al. (US Pat. No. 5,00 1,542) describes a substrate composed of glass, synthetic resin 'metal' ceramics or a mixture of these materials; the central part of the substrate is a hollow hole for The structure of the thin-layer carrier or TAB. Tsukagoshi et al. Used deformable conductive particles' hard conductive particles and adhesives to form a conductive bond. The scale of the paper used in the case of the present invention is applicable to the Chinese National Standard (CNS) A4 specification (210X2W public daughter) I n ^ i 1 --- I-I'- »—ϋ n ^ i-I-士-— ^ ϋ— — II ml ^ J.-0¾. I (Please read the precautions on the back before filling in this page) Printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 301792 A7 ___B7_ V. Description of the invention (>) The structure and process of die bonding is a different and more flexible metal pin array architecture. The anisotropic conductive film used in the present invention is composed of an adhesive and various types of conductive particles > This is different from the description of the patent applied by Tsukagoshi et al. The process of forming conductive joints is also different from the method proposed by Tsukagoshi et al. In his patent application. Tsukagoshi et al. Describe in their patent application (US Pat. No 4,470, 657) the use of anisotropic conductive films composed of conductive particles and adhesives of various sizes. The tape-bonded die bonding method is invented here It is not mentioned in the patent. Tsukagoshi et al.'S patent application (U.S. Pat_No 4,731,282) is a description of insulating adhesives. Brief description of the invention The structure of a traditional tape-and-reel die bond (TAB) is shown in FIG. 1, the pin array is composed of metal pins 22; this metal pin may be copper, and the metal pin is attached to the first dielectric Layer 23; This dielectric layer may be Polyimide, the inner end of the metal pin and the conductive bump 21; this conductive bump may be a gold (Au) bump. The gold bumps are plated on the aluminum oxide input / output terminals of the integrated circuit element 20 by electroplating. The thermal energy is transferred to the metal pins in the metal pin array with the set temperature, pressure and time parameters through the heating head (Thermode) 10, so that the inner end of the gold pin leads and the gold bumps form a conductive bond. High temperature is necessary in the traditional tape-and-reel die bonding process; usually between 450 and 550 ° C, so that the metal pins in the metal pin array and the gold bumps on the integrated circuit device Form a conductive bond. The difference in the coefficient of thermal expansion of the copper pin 22 and the dielectric layer 23 makes the subsequent external bonding process of the external pin and the substrate more difficult. The hardness of the metal bumps itself will transfer the force applied by the heating head to the integrated circuit components, causing the alumina pad to crack, to avoid this phenomenon 'control plus «I--ISI-I- I-— -I -士 又-I-I-I-! · ------- TW •, va (please read the precautions on the back before filling in this page) This paper size is applicable to China National Standard (CNS) A4 specification (210X2 $ Mm) 1 1-A7 B7 du printed by the Ministry of Economy, Central Standards Bureau, Tooling and Consumers Co., Ltd. 5. Description of invention (3) The flatness of the thermal head end face (Planarity) and the parallelism between the end face and the metal bump (Parallelism) change It is very important, which will make the manufacturing cost of the equipment more expensive. The traditional tape-and-reel die bonding process must be encapsulated (Ecapsulation) after the process to prevent moisture from corroding and damaging the contacts. The main purpose of the present invention is to provide a low-cost tape-and-die bonding process. The new process uses lower temperatures and pressures, and completes the protection of the sealant while the contacts are formed. A further object of the invention of the present invention is to provide a low-cost tape-and-reel die-bonding structure that utilizes a lower-cost tape-reel-to-die bonding process; it is formed at the junction with lower temperature and pressure At the same time complete the protection of sealant. These objectives are achieved through the use of an anisotropic conductive film, which is composed of conductive particles and an insulating adhesive. After the tape-die bonding process is completed, the conductive particles 31 in the anisotropic conductive film are interposed between the pin array by the metal pins 22 and the metal bumps on the integrated circuit element 2G; as shown in FIGS. 2A and 2B It is shown that the conductive particles have compensation for the parallelism variation of the gold bumps and the heating head, so the pressure used in the bonding process can be reduced, which is about 20 to 40 kg / cm2. When the conductive joint is formed, the insulating adhesive 32 wraps around the contact to form a sealant, which protects the contact from corrosion and mechanical damage caused by a large amount of moisture. The temperature required for the bonding process is between 15G and 18G ° C. After the adhesive is cured, the joint can maintain the joint state. The metal pin array may have a hole design as shown in FIG. 2C. The metal pin array is composed of metal pins 22; the metal pin may be copper, and the metal pin is attached to the dielectric layer 23; the dielectric layer may be Polyethyleneamide, a junction area 75 around the inner edge of the dielectric layer 73, this junction area has no dielectric layer, and the tail end 74 of the inner pin extends toward the area without the dielectric layer. This type of pin array needs to use an insulating layer composed of metal foil 27 and polyethylene 25, so that the heating head will not interact with the adhesive, and after completion of bonding — ^ 1----III-- HH m ^^ 1 ml 1 VV _, T (Please read the precautions on the back and fill in this page first) This paper size is applicable to the Chinese National Standard (CNS> A4 specification (210X297 mm) -5- Central Bureau of Standards, Ministry of Economic Affairs Employee Consumer Cooperative Seal A7 B7 Fifth, the structure of the invention (¥) is shown in Figure 2A. The metal pin array can also be in the form shown in Figure 2D, this form of metal pin array has no hole design, metal lead The pin 22 is attached to the entire dielectric layer 23. This type of metal pin array does not require an isolation layer in the bonding process, and the structure after bonding is shown in FIG. 2B. The anisotropic conductive film is used The insulating adhesive can be Thermoplastic, Thermosetting, or a mixture of the above two materials. The conductive particles can be metal particles, graphite fibers, or polymer spheres coated with a layer of metal Composite conductive particles Brief Description of the Drawings Figure 1 shows the conventional technology of the tape-and-reel die bonding structure. FIG. 2A shows the structure of the anisotropic conductive film and the metal pin array with hollow holes designed by the tape-reel and die bonding method. Cross-sectional view. FIG. 2B shows the cross-sectional view of the structure of the anisotropic conductive film and the metal pin array without void design formed by the tape-and-reel die bonding method. FIG. 2C shows the top view of the metal pin array with void design Figure 2D shows a top view of a metal pin array without holes. Figure 3A shows a cross-sectional view of an integrated circuit element with an anisotropic conductive film attached to a metal bump. Figure 3B shows a difference between the heating head and the paste Cross-sectional view of the contact of the integrated circuit element of the square conductive film. FIG. 3C shows a cross-sectional view of the integrated circuit element with the anisotropic conductive film attached to the surface after pre-bonding by the heating head. FIG. 3D shows The metal pin array with holes is placed on the surface of the integrated circuit element with an anisotropic conductive film and the alignment is completed. The anisotropic conductive film has been pre-pressed. The paper size is applicable to the Chinese National Standard (CNS) Λ4 specifications (210 X 297 mm) 1 ^ 1 —-— I----«--I.-— ^ N I 2-* Shijiao-= 'I. I In-0¾, v5 (please read the notes on the back first (Fill in this page) A7 B7 Printed by the National Bureau of Standards, Ministry of Economic Affairs Consumer Cooperative V. Description of invention (3r). Figure 3E shows the structure shown in Figure 3D, and then an insulation layer is placed on the metal pin array. Heating head Heating and pressing through the insulating layer. FIG. 4A shows a cross-sectional view of the anisotropic conductive film with a protective layer attached to a metal pin array with no holes. Fig. 4B shows a situation where the heating head is in contact with a metal pin array with no void design, and an anisotropic conductive film with a protective layer is attached to the surface of the metal pin array. Fig. 4C shows a cross-sectional view of the anisotropic conductive film attached to the metal pin array after pre-pressing and tearing off the surface protective layer. Fig. 4D shows a cross-sectional view of a tape-bonded die bonding structure heated on metal pins of a metal pin array with no holes. Fig. 4E shows a cross-sectional view of a tape-bonded die bonding structure heated on the surface of an integrated circuit element. The integrated circuit element is placed on a metal pin array with no void design. 5A shows a cross-sectional view of the structure of an anisotropic conductive film. Fig. 5B shows the shape of the graphite conductive fiber used in the anisotropic conductive film. FIG. 5C shows the shape of metal particles used in the anisotropic conductive film. Fig. 5D shows the shape of the composite conductive particles used in the anisotropic conductive film. The composite conductive particles are coated with a layer of conductive metal on the surface of a polymer sphere. Fig. 5E shows the shape of the multi-layer composite conductive particles used in the anisotropic conductive film. The multi-layer composite conductive particles have a structure in which another polymer is coated on the surface of the composite conductive particles. 6A shows a cross-sectional view of the structure of an anisotropic conductive film with upper and lower protective layers. 6B shows a cross-sectional view of the structure of an anisotropic conductive film with only a single protective layer. Fig. 7 shows an upper view of a metal pin array with no holes. 11_'n ^ i I-I i--II 1- ·--I —I-8 ± -1-1- 1.---VV, v * (Please read the precautions on the back before filling this page ) This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm)-Ί 一 301792 A7 Printed by the Ministry of Economic Affairs Central Standards Bureau Employee Consumer Cooperative B7 V. Invention description (G) Please refer to the description of the best window example 2A, 2C, 3A to 3E '5A to 5E, 6A and 6B' illustrate an embodiment of a bonding structure formed by using an anisotropic conductive film, a hole design metal pin array, and a tape and die bonding method. Fig. 3 shows a cross-sectional view of an integrated circuit element 20 having metal bumps 21; in this embodiment, the metal bumps are gold bumps. The anisotropic conductive film 3G of an appropriate length is taken and placed on the surface of the integrated circuit element 20, and the anisotropic conductive film is in contact with all the gold bumps 21. The anisotropic conductive film 3G is composed of an insulating adhesive 32 coated on the protective layer 51 and conductive particles 31 distributed in the insulating adhesive. Fig. 5A shows a cross-sectional view of the structure of an anisotropic conductive film 30 composed of conductive particles 31 and insulating adhesive 32 but no dielectric layer. Examples 5B to 5E illustrate some types of conductive particles. The conductive particles may be graphite conductive fibers 44 shown in FIG. 5B, metal particles 41 in FIG. 5C, and composite conductive particles in FIG. 5D. The composite conductive particles are coated with a layer of conductive metal 42 on the surface of a polymer sphere 41, or FIG. 5 The shape of the multi-layer composite conductive particles of E. The multi-layer composite conductive particles have a structure in which a layer of conductive metal is coated on the surface of the polymer sphere 41 and then another polymer 43 is coated. 6A and 6B illustrate some forms of anisotropic conductive films. As shown in FIG. 6A, the anisotropic conductive film 30 composed of the conductive particles 31 distributed within the insulating adhesive 32 may have protective layers 51, 52 covering both sides of the anisotropic conductive film. As shown in FIG. 6β, the anisotropic conductive film 30 composed of the conductive particles 3 distributed in the insulating adhesive 32 may have a protective layer 51 covering one side of the anisotropic conductive film. It can be seen from FIG. 5A that when pressure is applied in accordance with the direction of the arrow, only the direction of the arrow can conduct electricity, but the direction perpendicular to the arrow is still insulated. Refer to Fig. 3B 'Mouth Exposure® when the heating head is in contact with the anisotropic conductive film 30 having only one-sided protective layer 51. Add 丨 〇 ㈣ call for the strength of the medulla, the surface heat energy to the object contacting the heating head. Add cooked head to temperature ⑹ to ⑽. C, pressure ^ to ⑼

Degree ϋ China® home eNS: 297 male cane) One (? One: --II--I. _ I -1--• Shi You 'I HI ill 1 ...... n ^ i ^ ϋ »• US. Τ (please read the precautions on the back before filling in this page) __B7_ V. Description of the invention (7) kg / cm2 and 3 to 5 seconds to preheat the anisotropic conductive film. This preheating step insulates The adhesive flows slightly and completely covers the gold bumps 21, and then the protective layer 51 of the anisotropic conductive film is torn off, as shown in FIG. 3C. The next steps are shown in FIG. 3D, which shows that the metal The pin array of the conductive pins 22 is attached to the first dielectric layer 23 and is placed on the anisotropic conductive film 3G, and the inner ends of the metal conductive pins 22 are in the gold bump of the integrated circuit element 20 On block 21. In this embodiment, the gold-lead conductive pins 22 are copper and a dielectric layer 23 is polyethylene. The top view of the pin array is shown in Figure 2C and Figure 2C. Inside the dielectric layer The bonding area 75 around the edge 73, this bonding area has no dielectric layer, and the end of the inner pin 22 extends toward the area without the dielectric layer. The phenomenon that the tail end of the inner pin extends toward the area without the dielectric layer Found in 3D. The next step is shown in FIG. 3E. An insulating layer with a metal foil 27 is attached to the second dielectric layer. In this embodiment, the second dielectric layer 25 is polyvinyl amide The metal foil 27 is aluminum. This isolation layer is placed in the hole or the pin array area without the first type dielectric layer around the entire area of the pin array, close to the boundary of the hole, the second type of insulation layer The electrical layer 25 is in contact with the first dielectric layer 23, and the second dielectric layer 25 of the insulating layer separates the metal foil 27 from the pin array. Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the back side first (Notes are required to fill out this page) The next step is shown in Figure 3E. The heating head 10 is in contact with the metal foil 27 of the insulating layer. The heat energy is transferred to the insulation layer, pin array, gold bumps and integrated circuit components in 20 seconds as shown in Figure 3E, and the entire bonding structure of Figure 2A is completed. The temperature of the heating head will rise to 28Q to 3QG ° throughout the bonding process Between C. The complete joint structure formed in the foregoing embodiment is shown in FIG. 2A The gold bump 21 is longer than the aluminum oxide input / output end of the integrated circuit element 20 by electroplating. The inner ends of the copper pins 22 of the pin array are positioned so that the inner end of each pin and each gold bump When the assembly is subjected to pressure, there are many conductive particles 31 in the anisotropic conductive film between each joint pair of the inner end of the pin and the gold bump. The conductive particles are of paper size Applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) A7 A_ ___B7_ Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A5 ___B7_ Fifth, the invention description (β) sub 31 enables each joint of the inner end of the pin to the gold bump Conductive. The second dielectric layer 25 of the insulating layer is in contact with the insulating adhesive in the anisotropic conductive film and the first dielectric layer 23 around the hole. The insulating adhesive flows due to the heat and pressure transmitted by the heating head during the assembly process, so that the joint structure is sealed and the entire joint is kept in conductive contact due to the hardening of the adhesive. The insulating adhesive is epoxy (Epoxy), It can also be a thermoplastic type, a thermosetting type or a mixture of the above two materials. The insulating layer used in this embodiment is an aluminum foil 27 attached to the polymer layer 25, or Si icone Rubber may be attached to the polymer layer or other similar materials. Next, please refer to FIGS. 2B, 2D, 4A to 4E, 5A to 5E, 6A and 6B, to illustrate the bonding structure formed by using anisotropic conductive film, non-void design metal pin array and tape-and-reel die bonding method的 实施 例。 Examples. FIG. 4A shows a cross-sectional view β of an anisotropic conductive film 30 with a single-sided protective layer 51 attached to a pin array composed of the first dielectric layer 23 and the metal pin 22 without holes. 20 represents the top view of the metal pin array in this embodiment. The metal pin 22 is attached to the first type dielectric layer 23, and this dielectric layer has no void design. The inner end of the metal pin is attached to the first type dielectric layer 23. Fig. 5A shows a cross-sectional view of the structure of an anisotropic conductive film 30 composed of conductive particles 31 and an insulating adhesive 32 without a dielectric layer. Figure 58 Dong 5E illustrates some types of conductive particles. The conductive particles may be graphite conductive fibers 44 shown in FIG. 5B, metal particles 41 in FIG. 5C, and composite conductive particles in FIG. 5D. The composite conductive particles are coated with a layer of conductive metal 42 on the surface of a polymer sphere 41, or FIG. 5 The multi-layer composite conductive and particle shape of E. This multi-layer composite conductive particle is a structure in which the surface of the polymer sphere 41 is coated with a layer of conductive metal and then another polymer 43 is coated. 6A and 6B illustrate some forms of anisotropic conductive films. As shown in FIG. 6A, the anisotropic conductive film 30 composed of the conductive particles 3 1 distributed in the insulating adhesive 3 2 may have protective layers 5 1, 52 covering both sides of the anisotropic conductive film . As shown in FIG. 6B, the anisotropic conductive film 30 composed of the conductive particles 31 distributed in the insulating adhesive 32 may have a protective layer 512 covering one side of the anisotropic conductive film. It can be seen from FIG. 5A that when the square paper size according to arrow 75 is applicable to the Chinese standard (CNS) A4 specification (210X 297 mm) ~ ~~ " · " III--I- -II I- <---I--II-. Ding 0¾, τ (please read the precautions on the back before filling out this page) A7 ___B7 printed by the employee consumer cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of invention (7) Child 31 Each conductive pair of the inner end of the pin and the gold bump can be conductive. The second type dielectric layer 25 of the insulating layer is in contact with the insulating adhesive in the anisotropic conductive film and the first type dielectric layer 23 around the hole. The insulating adhesive flows due to the heat and pressure transmitted by the heating head during the assembly process, so that the joint structure is sealed and the entire joint is maintained in conductive contact due to the hardening of the adhesive. The insulating adhesive is epoxy (Epoxy), it can also be thermoplastic, thermosetting or a mixture of the above two materials. The insulating layer used in this embodiment is the aluminum foil 27 attached to the high On the molecular layer 25, it is also possible to apply Silicone Rubber to the polymer layer or other similar materials. Next, please refer to 2B, 2D, 4A to 4E, 5A to 5E, 6A and 6B, to illustrate the use of anisotropic conductive film, void-free design of gold tantalum pin array and taped die bonding method Example of structure. FIG. 4A shows a cross-sectional view of an anisotropic conductive film 30 with a single-sided protective layer 51 attached to a pin array designed by the first dielectric layer 23 and the metal pin 22 without holes. FIG. 2D shows the top view of the metal pin array in this embodiment. The metal pins 22 are attached to the first type dielectric layer 23, and the dielectric layer has no void design. The inner end of the metal pin is attached to the first type dielectric layer 23. Fig. 5A shows a cross-sectional view of the structure of an anisotropic conductive film 30 composed of conductive particles 31 and an insulating adhesive 32 without a dielectric layer. Figures 5B and 5E illustrate some types of conductive particles. The conductive particles may be graphite conductive fibers 44 shown in FIG. 5B, metal particles 41 in FIG. 5C, and composite conductive particles in FIG. 5D. The composite conductive particles are coated with a layer of conductive metal 42 on the surface of a polymer sphere 41, or FIG. 5 The shape of the multi-layer composite conductive particles of Ε is a structure in which a layer of conductive metal is shoveled on the surface of the polymer sphere 41 and then another polymer 43 is coated. 6A and 6B illustrate some forms of anisotropic conductive films. As shown in FIG. 6A, the anisotropic conductive film 30 composed of the conductive particles 31 distributed in the insulating adhesive 32 may have protective layers 51, 52 covering both sides of the anisotropic conductive film. As shown in FIG. 6B, the anisotropic conductive film 30 composed of the conductive particles 31 distributed within the insulating adhesive 32 may have a protective layer 512 covering one side of the anisotropic conductive film. It can be seen from Fig. 5Α that when I follow the arrow 75, I --------- ά ------, 玎 ------ ^ (Please read the precautions on the back before filling this page ) (CNS) Α4 specification (210X297mm) 1 // 1A7 _____B7 5. Description of invention (P) On the other side of the circuit element 2G, the gold bump 21 is longer than the aluminum oxide input of the integrated circuit element 20 by electroplating At the output end, the heating head heats this assembly at a temperature of 15 ° to i70 ° C, a pressure of 20 to 40 kg / cm 2 and a time of 5 to 20 seconds. The completed joint structure is shown in FIG. 2B. The complete bonding structure formed in the foregoing embodiment is shown in FIG. 2B. The gold bumps 21 are longer than the aluminum oxide input / output terminals of the integrated circuit element 20 by electroplating. The inner ends of the copper pins 22 of the pin array are positioned so that the inner ends of each pin form a bonding pair with each gold bump. When this type of assembly is subjected to pressure, there are many conductive particles 31 in the anisotropic conductive film between each joint pair of the inner end of the pin and the gold bump. The conductive particles 31 make each bonding pair of the inner end of the pin and the gold bump conductive. The insulating adhesive flows during the assembly process when the heating head transmits heat and pressure, so that the joint structure is sealed and the entire joint is maintained in conductive contact due to the hardening of the adhesive. The insulating adhesive is epoxy resin, which can also be thermoplastic, thermosetting or a mixture of the above two materials. In the method and structure of this embodiment, the inner ends of the pins of the pin array may be in a surface matrix manner as shown in FIG. 7. In the pin array, the inner end 74 of the pin 22 is attached to the first dielectric layer 23 without a hole design. In this example, the pin 22 and the inner end 74 of the pin are copper. Although the characteristics of the text are described in terms of ± _ 实 _ 丝 _, anyone familiar with this technique_ can understand that the modification of the form or the form may still fall within Ben Qing___, _ 本 之The face is improperly limited to the above real lung II, the lion is limited to the face-one _ .. 1 _? 〇7 / eight grids) This paper scale is applicable to China National Standard (CNS) A4 specifications (2 丨 (> 〆- (Please read the precautions on the back before filling out this page)-installed · -a Printed by the Employee Consumer Cooperative of the Central Standard Falcon Bureau of the Ministry of Economic Affairs

Claims (1)

301792 A8 B8 C8 D8 i Amendment I female this year g supplementary prevention. 8. tr), the scope of patent application The Central Ministry of Economic Affairs, the Ministry of Economic Affairs, the Employee Consumer Cooperative printed and applied for a patent to apply a method of forming a joint structure, which includes : Prepare an integrated circuit element with conductive bonding bumps; prepare an anisotropic conductive film composed of an insulating adhesive coated on the protective layer and conductive particles distributed in the insulating adhesive; Prepare a first dielectric layer made of the first dielectric material; prepare a pin array composed of many conductive pins attached to the first dielectric layer 'conductive pins of this pin array It has an inner pin end and an outer pin end, and there is a hole without the first dielectric layer material on the inner periphery of the first dielectric layer, while the inner pin end has no first dielectric layer across the inner periphery The hole of the layer material is extended; prepare an insulating film with a layer of supporting metal attached to the second dielectric layer; prepare a heating head that can provide a thermal chamber b through the selected time, temperature and pressure; place a piece of different Square conductive film On the aforementioned integrated circuit element, many of the conductive particles are brought into contact with the conductive bonding bumps; the aforementioned heating head transfers the heat energy of the first stage temperature and the first stage pressure through the protective layer at the time of the first stage To the anisotropic conductive film; tear off the aforementioned protective film layer; form many bonding pairs, which are composed of one of the inner leads and one of the conductive bonding bumps, and the aforementioned conductive particles are placed The aforementioned pin array is on the aforementioned conductive particles distributed in the insulating adhesive so that the conductive pin is located on one of the aforementioned inner pins at the end of the inner pin and on the conductive bonding bump Between one of the aforementioned conductive bonding bumps: place a prepared insulating film on the aforementioned pin array, so that the completed insulating film covers the aforementioned hole, and the aforementioned second dielectric material The layer is between the aforementioned pin array and the aforementioned supporting metal layer; and this paper scale is applicable to the Chinese National Standard (CNS) Λ4 present grid (210X297mm) -------- Pharmaceutical -------- V —----- ^ ( First read the notes on the back JS-¾ page) A8 B8 C8 D8 printed by the Zhengong Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 6. Scope of patent application The aforementioned heating head will be used for the second stage of the temperature and temperature The second stage of pressure transfers heat energy to the aforementioned insulating film, insulating dielectric layer and bonding pair, so that each bonding pair forms electrical conduction between the aforementioned conductive particles, the aforementioned inner pin ends and the aforementioned conductive bumps Joining "2. The method as described in item 1 of the patent application, wherein the first stage temperature is 60 to 1 GlTC, the first stage pressure is 5 to 1 G kg / cm2 and the first stage time is 3 to 5 seconds. 3. The method as described in item 1 of the patent application, wherein the second stage temperature is 150 to 180 ° C, the second stage pressure is 20 to 40 kg / cm2 and the second stage time is 5 to 20 seconds. 4. The method as described in item 1 of the patent application, wherein the conductive bonding bumps are gold. 5. The method as described in item 1 of the patent application, wherein the conductive pins are copper. 6. The method as described in item 1 of the patent application, wherein the conductive particles are metal. 7. The method as described in item 1 of the patent application, wherein the conductive particles are coated with a layer of conductive metal on the surface of a high molecular sphere. 8. The method as described in item 1 of the patent application, wherein the conductive particles are the first polymer sphere coated with a layer of conductive metal and then coated with a second polymer on the surface of the conductive metal. | 9. The method as described in item 1 of the patent application, wherein the conductive particles are graphite. 10. The method as described in item 1 of the patent application, wherein the supporting metal is aluminum and the second dielectric layer is polyvinyl amide. U. The method as described in item 1 of the scope of patent application, in which the first dielectric layer is composed of polyacetamide "(please also read the precautions on the back i, Ma page), 17 lines (CNS) A4 specification (210X297mm)-1 砵 一 A8 Β8 C8 D8 301792 π, patent application range 12 · a method of forming a bonding structure, which includes: preparing an integrated circuit element with conductive bonding bumps; preparing one The anisotropic conductive film is composed of an insulating adhesive coated on the protective layer and conductive particles distributed in the insulating adhesive; preparing a dielectric layer; preparing a plurality of conductive pins attached to the first A pin array composed of a dielectric layer. The conductive pins of the pin array have inner pin ends and outer pin ends; prepare a heating head, which can provide heat energy through the selected time, temperature and pressure; Place a piece of anisotropic conductive film on the aforementioned pin array, so that many of the conductive particles distributed in the insulating adhesive are in contact with the inner pin end: Put the aforementioned heating head at the first stage for the first stage temperature And the first-stage pressure transfers heat energy to the anisotropic conductive film through the protective layer; tears away the aforementioned protective film layer; forms many bonding pairs, which are formed by one of the inner leads and the conductive bonding bumps A method in which the aforementioned conductive particles are placed on the aforementioned pin array on the aforementioned conductive particles distributed in the insulating adhesive so that the inner pin ends are on the conductive bonding bumps , So that the conductive particles are between one of the aforementioned inner pins and one of the conductive bonding bumps; and the aforementioned heating head transfers the thermal energy to the temperature of the second stage and the pressure of the second stage to the second stage at the time of the second stage The aforementioned insulating film, insulating dielectric layer and bonding pair, forming a conductive bond between the aforementioned conductive particles, the aforementioned inner pin ends and the aforementioned conductive bumps of each aforementioned bonding pair 13. The method according to item 12, wherein the first-stage temperature is 60 to 100 ° C, the first-stage pressure is 5 to 10 kg / cm2, and the first-stage time is 3 to 5 seconds. 14. The method as described in item 12 of the scope of patent application, in which the second-stage temperature is based on the paper liquid standard and is applicable to the national sample standard (cns) a4 specification (mox 297 mm)-! Ζ- installed, 1Ti I line (Please read the precautions on the back before :, 舄 this page) Printed and printed by the employee consumer cooperative of the Central Falcon Bureau of the Ministry of Economic Affairs ABCD Printed by the Male Workers Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economics, patent application range 150 to 18 (3 ° C. The second stage pressure is 20 to 40 kg / cm2 and the second stage time is 5 to 20 seconds. 15. The method as described in item 12 of the patent application scope, in which the conductive bonding bumps are gold. 16. The method described in item 12 of the patent application, wherein the conductive pins are copper. 17. The method described in item 12 of the patent application, wherein the conductive particles are metal. 18. As stated in the item 12 of the patent application The method described, wherein the conductive particles are coated with a layer of conductive metal on the surface of a polymer sphere 19. The method described in item 12 of the patent application, wherein the conductive particles are coated with a layer of conductive on the surface of the first polymer sphere Jinyu then conductive The second polymer is coated on the surface of T. 20. The method as described in item 12 of the patent application, wherein the conductive particles are Shi fine ink. 21. The method as described in item 12 of the patent application, of which The dielectric layer is made of polyethylene gas. 22. A bonding structure consisting of: an integrated circuit element with many conductive bonding bumps; a first dielectric made of the first dielectric material Electrical layer; a pin array composed of many conductive pins attached to the first dielectric layer, the conductive pins of this pin array have inner pin ends and outer pin ends; many bonding pairs, these bonding The pair is composed of one of the inner leads and one of the conductive bonding bumps; an anisotropic conductive film composed of conductive particles distributed on the insulating adhesive, the conductive particles being arranged in each bonding pair Between the inner pin end and the conductive bonding bump; and many bonding pairs, where the inner pin end of each bonding pair and the guide of each bonding pair (CNS) A4 * see grid (210 X 297 mm) — 丨 t one ---------- ¾ ------玎 ------ ^ (Please read the precautions on the back first> /. Woo page) 301792 A8 B8 C8 D8 Patent pending electrical bonding bumps and pins within each of the aforementioned bonding pairs The conductive particles between the end and the conductive bonding bumps of each bonding pair form a conductive bond. 23. The bonding structure as described in item 22 of the patent application scope, in which each inner pin end is attached to the first Dielectric layer 24. The bonding structure as described in item 22 of the patent application scope, in which the first dielectric layer has voids without the first dielectric layer material on the inner periphery, and each inner pin end passes over the inner The periphery extends to this hole. The joint structure as described in item 24 of the patent application scope is further described as the insulating film formed by the supporting metal attached to the second dielectric material layer covering the aforementioned space Hole, the second dielectric material layer is in contact with the inner pin end, the second dielectric material layer is in contact with the first dielectric layer, and the second dielectric material layer allows the support metal layer to Conductive pins are insulated. 26. The joint structure as described in item 22 of the patent application, wherein the conductive pins are copper. 27. The bonding structure as described in item 22 of the patent application, wherein the conductive bonding bumps are gold. . School and Shufeng Seal 5 Printed by the Employee Consumer Cooperative of the Central Central Bureau of Economics of the Ministry of Economics 28. The joint structure as described in item 22 of the patent application, where the conductive particles are metal. 29. If the patent application is the 22nd The joint structure described in item 1, wherein the conductive particles are coated with a layer of conductive metal on the surface of a polymer sphere. 30. The joint structure as described in item 22 of the patent application, wherein the conductive particles are a layer of conductive metal on the surface of the first polymer sphere, and the second polymer is coated on the surface of the conductive metal. 31. The joint structure as described in item 22 of the patent application, wherein the conductive particles are graphite. 32. The joint structure as described in item 22 of the patent application scope, in which the supporting metal is binding, thread (please read the precautions on the back side first and then this page) This paper size is applicable to China National Standard (CNS) Λ4 Specifications (210X 297mm) ABCD VI. Patent application range aluminum and the second dielectric layer is polyacetamide "33. The bonding structure as described in item 22 of the patent application range, of which the first dielectric layer It is composed of polyethylene amide. -^ -------- ^ ------ ir ----- (Please read the precautions on the back first and then write 4) This paper is printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs The scale is applicable to the national standard (CNS) A4 specifications (210X 297 mm)