JP3960076B2 - Electronic component mounting method - Google Patents

Electronic component mounting method Download PDF

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Publication number
JP3960076B2
JP3960076B2 JP2002050975A JP2002050975A JP3960076B2 JP 3960076 B2 JP3960076 B2 JP 3960076B2 JP 2002050975 A JP2002050975 A JP 2002050975A JP 2002050975 A JP2002050975 A JP 2002050975A JP 3960076 B2 JP3960076 B2 JP 3960076B2
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JP
Japan
Prior art keywords
electronic component
resin substrate
resin
metal
bonding
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2002050975A
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Japanese (ja)
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JP2003258030A (en
Inventor
誠 岡崎
省二 酒見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2002050975A priority Critical patent/JP3960076B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品を樹脂基板に実装する電子部品実装方法に関するものである。
【０００２】
【従来の技術】
フリップチップなど半導体素子に接続用電極である金属バンプが設けられた電子部品の実装方法として、金属バンプを樹脂基板の電極に超音波接合などによって金属接合する方法が用いられている。この実装方法において、金属バンプと樹脂基板との金属接合部を補強する目的で電子部品と樹脂基板との間に補強樹脂部を設けることが行われる。
【０００３】
この補強樹脂部の形成の方法として、電子部品の搭載に先立って実装位置に予め液状の補強用樹脂を塗布する方法が用いられている。この方法は、樹脂基板上に塗布された補強樹脂の上から電子部品を搭載し、金属バンプと電極との金属接合を行った後に、補強樹脂を熱硬化させるものである。この方法によれば、電子部品を樹脂基板に搭載した後に電子部品と樹脂基板との隙間に補強用樹脂を注入する方法と比較して、工程の簡略化が図れコスト低減ができるという利点がある。
【０００４】
【発明が解決しようとする課題】
しかしながら、上記補強用樹脂を予め塗布する方法では、金属接合後に補強樹脂を熱硬化させる過程において、硬化温度から常温に戻るまでの熱収縮によって補強樹脂と樹脂基板との間に熱応力が発生する。そしてこの熱応力は金属バンプと電極との金属接合部に集中的に作用することから、金属接合部の破断の原因となる場合がある。このように、補強樹脂を予め塗布した後に電子部品を搭載する従来の電子部品実装方法では、接合不良を生じやすく製品歩留まりを低下させるとともに、信頼性を確保することが困難であるという問題点があった。
【０００５】
そこで本発明は、電子部品の接続用電極と樹脂基板の電極との金属接合において、接合不良を低減することができる電子部品実装方法を提供することを目的とする。
【０００６】
【課題を解決するための手段】
請求項１記載の電子部品実装方法は、電子部品に設けられた金属バンプを樹脂基板に設けられた電極に金属接合することにより電子部品を樹脂基板に実装する電子部品実装方法であって、前記樹脂基板の上面に補強樹脂を供給する樹脂供給工程と、この補強樹脂に対して前記電子部品を下降させ前記金属バンプを補強樹脂を介して樹脂基板の電極に着地させる部品搭載工程と、前記金属バンプと前記樹脂基板の電極との接触面における金属拡散によって接合を行うことにより前記金属バンプと前記樹脂基板の電極とを金属接合する接合工程と、接合工程後の樹脂基板を加熱することにより前記補強樹脂を熱硬化させる熱硬化工程とを含み、前記接合工程における金属接合が超音波接合によって行われ、前記熱硬化工程において前記樹脂基板の材質のガラス転移温度以下で加熱するものであり、且つ前記熱硬化工程において、加熱手段を備えた圧着ツールを当接させることによって前記電子部品を樹脂基板に対して加圧しながら加熱を行う。
【０００８】
本発明によれば、接続用電極と樹脂基板の電極とを金属接合する接合工程後の樹脂基板を加熱して補強樹脂を熱硬化させる加熱工程において、樹脂基板の材質のガラス転移温度以下で加熱することにより、金属接合部に生じる熱応力を低下させて金属接合部の破断による接合不良を低減することができる。
【０００９】
【発明の実施の形態】
次に本発明の実施の形態を図面を参照して説明する。図１、図２は本発明の一実施の形態の電子部品実装方法の工程説明図、図３は本発明の一実施の形態の電子部品実装方法の対象となる樹脂基板の熱膨張係数を示すグラフである。
【００１０】
まず図１、図２を参照して、電子部品実装方法について説明する。この電子部品実装方法は、電子部品に設けられた接続用電極である金属バンプを樹脂基板の電極に超音波接合によって金属接合することにより、この電子部品を樹脂基板に実装するものである。
【００１１】
図１（ａ）において、樹脂基板１の上面には電極２が形成されている。樹脂基板１の上面には、補強樹脂４が供給され、図１（ｂ）に示すように、樹脂基板１の上面にディスペンサ３によって補強樹脂４が電極２を覆って全面に塗布される（樹脂供給工程）。補強樹脂４は、エポキシ樹脂などの熱硬化性樹脂を主成分とする基剤に、微細な固体粒子であるフィラー成分を含有させたものである。これにより図１（ｃ）に示すように、樹脂基板１の上面には、補強樹脂４の樹脂層が形成される。
【００１２】
次に樹脂基板１には電子部品が搭載される。図２（ａ）に示すように、下面に接続用電極である金属バンプ６が形成された電子部品５を超音波ツール７に保持させ、この超音波ツール７を補強樹脂４の樹脂層が形成された樹脂基板１上に移動させ、金属バンプ６を電極２に位置合わせする。そして、補強樹脂４に対して電子部品５を下降させ、金属バンプ６を補強樹脂４を介して樹脂基板１の電極２に着地させる（部品搭載工程）。
【００１３】
次いで図２（ｂ）に示すように、超音波ツール７によって電子部品５に押圧荷重を作用させるとともに超音波振動を印加する。これにより、金属バンプ６の下端面を電極２の表面に金属接合する（接合工程）。このように、金属接合は超音波接合によって行う。
【００１４】
この後、電子部品５が超音波による金属接合により仮圧着された樹脂基板１は、加熱工程に送られる（図２（ｃ）参照）。すなわち、加熱工程は部品搭載工程または接合工程を行う設備とは別の設備で行われる。これにより、複数の電子部品５を一括して加熱することができ、比較的長時間を要する加熱工程を効率よく行うことができる。ここでは、樹脂基板１は加熱手段を備えた加熱ステージ９上に載置される。次いで樹脂基板１に仮圧着された状態の電子部品５の上面に、加熱手段を備えた圧着ツール８を当接させる。そして電子部品５を樹脂基板１に対して所定の押圧荷重Ｆで加圧するとともに圧着ツール８によって電子部品５を加熱し、補強樹脂４を熱硬化させる（熱硬化工程）。
【００１５】
この熱硬化工程においては、加熱ステージ９の設定温度は、樹脂基板１の材質のガラス転移温度以下に設定する。例えば、ガラスエポキシ樹脂を材質とする樹脂基板の場合であれば、約１２０℃の加熱温度に設定する。また、圧着ツール８の加熱温度は、熱の伝達ロスを考慮して約２００℃程度に設定する。このような加熱温度設定とすることにより、以下に説明するような優れた効果を得る。
【００１６】
樹脂基板に用いられるエポキシやポリイミドなどの樹脂材質の熱膨張係数は、ガラス転移温度を境にして大きく変化するという特性がある（図３参照）。図３において、グラフの縦軸は熱膨張係数、横軸は温度である。図３に示すように、ガラス転移温度Ｔｇよりも低い温度範囲では熱膨張係数は比較的低く（α１参照）、ガラス転移温度Ｔｇを超えると熱膨張係数が急増する（α２参照）。このため、熱硬化工程における加熱温度をガラス転移温度Ｔｇよりも低く設定することにより、樹脂基板の熱硬化工程における熱膨張量を極力小さく抑制することができる。
【００１７】
したがって、熱硬化温度から常温まで冷却する過程における熱収縮量も小さくなり、熱収縮過程において金属バンプ６と電極２との金属接合部に作用する熱応力を低く抑えることができ、熱応力に起因して金属接合部に発生する破断などの不具合を減少させることができる。
【００１８】
なお、熱硬化工程においては電子部品５を樹脂基板１に対して加圧することにより、補強樹脂４の上下方向の伸びを抑制しながら熱硬化させることができることから、本実施の形態に示すように加圧下で熱硬化を行うことが望ましい。加圧の方法としては、本実施の形態に示すように圧着ツール８によって機械的に押圧荷重Ｆを作用させてもよく、また加圧用のウエイトを電子部品５の上面に載置した状態で加熱を行うようにしてもよい。
【００１９】
【発明の効果】
本発明によれば、接続用電極と樹脂基板の電極とを金属接合する接合工程後の樹脂基板を加熱して補強樹脂を熱硬化させる加熱工程において、樹脂基板の材質のガラス転移温度以下で加熱するようにしたので、金属接合部に生じる熱応力を低下させて金属接合部の破断による接合不良を低減することができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態の電子部品実装方法の工程説明図
【図２】本発明の一実施の形態の電子部品実装方法の工程説明図
【図３】本発明の一実施の形態の電子部品実装方法の対象となる樹脂基板の熱膨張係数を示すグラフ
【符号の説明】
１ 樹脂基板
２ 電極
４ 補強樹脂
５ 電子部品
６ 金属バンプ
８ 圧着ツール
９ 加熱ステージ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method for mounting an electronic component on a resin substrate.
[0002]
[Prior art]
As a mounting method of an electronic component in which a metal bump as a connection electrode is provided on a semiconductor element such as a flip chip, a method of metal bonding a metal bump to an electrode of a resin substrate by ultrasonic bonding or the like is used. In this mounting method, a reinforcing resin portion is provided between the electronic component and the resin substrate for the purpose of reinforcing the metal joint portion between the metal bump and the resin substrate.
[0003]
As a method of forming the reinforcing resin portion, a method of applying a liquid reinforcing resin in advance to the mounting position prior to mounting of the electronic component is used. In this method, an electronic component is mounted on the reinforcing resin applied on the resin substrate, and after the metal bumps and the electrodes are joined to each other, the reinforcing resin is thermally cured. According to this method, there is an advantage that the process can be simplified and the cost can be reduced as compared with the method of injecting the reinforcing resin into the gap between the electronic component and the resin substrate after the electronic component is mounted on the resin substrate. .
[0004]
[Problems to be solved by the invention]
However, in the method of applying the reinforcing resin in advance, in the process of thermosetting the reinforcing resin after metal bonding, thermal stress is generated between the reinforcing resin and the resin substrate due to thermal contraction from the curing temperature to the normal temperature. . And since this thermal stress acts on the metal joint part of a metal bump and an electrode intensively, it may cause a fracture | rupture of a metal joint part. As described above, in the conventional electronic component mounting method in which the electronic component is mounted after pre-applying the reinforcing resin, there is a problem in that it is easy to cause a bonding failure and the product yield is lowered and it is difficult to ensure reliability. there were.
[0005]
Accordingly, an object of the present invention is to provide an electronic component mounting method that can reduce bonding defects in metal bonding between a connection electrode of an electronic component and an electrode of a resin substrate.
[0006]
[Means for Solving the Problems]
The electronic component mounting method according to claim 1 is an electronic component mounting method for mounting an electronic component on a resin substrate by metal bonding a metal bump provided on the electronic component to an electrode provided on the resin substrate, A resin supplying step of supplying a reinforcing resin to the upper surface of the resin substrate, a component mounting step of lowering the electronic component with respect to the reinforcing resin and landing the metal bump on the electrode of the resin substrate via the reinforcing resin, and the metal A bonding step of performing metal bonding between the metal bump and the electrode of the resin substrate by bonding by metal diffusion at a contact surface between the bump and the electrode of the resin substrate, and heating the resin substrate after the bonding step the reinforcing resin and a thermosetting step of heat curing, metal bonding in the joining step is performed by ultrasonic bonding, of the resin substrate in the thermosetting step Is intended to heat below the glass transition temperature of quality, and in the heat curing step, heat while pressurizing the electronic component against the resin substrate by contact with the crimping tool with a heating means.
[0008]
According to the present invention, in the heating step of heating the resin substrate after the bonding step for metal bonding of the connecting electrode and the electrode of the resin substrate to thermally cure the reinforcing resin, heating is performed at a temperature equal to or lower than the glass transition temperature of the resin substrate material. By doing so, the thermal stress which arises in a metal joint part can be reduced, and the joining failure by the fracture | rupture of a metal joint part can be reduced.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 and FIG. 2 are process explanatory views of an electronic component mounting method according to an embodiment of the present invention, and FIG. 3 shows a thermal expansion coefficient of a resin substrate that is an object of the electronic component mounting method according to an embodiment of the present invention. It is a graph.
[0010]
First, an electronic component mounting method will be described with reference to FIGS. In this electronic component mounting method, a metal bump, which is a connection electrode provided on an electronic component, is metal-bonded to an electrode of a resin substrate by ultrasonic bonding, thereby mounting the electronic component on a resin substrate.
[0011]
In FIG. 1A, an electrode 2 is formed on the upper surface of the resin substrate 1. Reinforcing resin 4 is supplied to the upper surface of resin substrate 1, and as shown in FIG. 1 (b), reinforcing resin 4 is applied to the entire upper surface of resin substrate 1 with dispenser 3 covering electrode 2 (resin Supply process). The reinforcing resin 4 is obtained by adding a filler component which is fine solid particles to a base mainly composed of a thermosetting resin such as an epoxy resin. Thereby, as shown in FIG. 1C, a resin layer of the reinforcing resin 4 is formed on the upper surface of the resin substrate 1.
[0012]
Next, electronic components are mounted on the resin substrate 1. As shown in FIG. 2A, the electronic component 5 having the metal bumps 6 as connection electrodes formed on the lower surface is held by the ultrasonic tool 7 and the ultrasonic tool 7 is formed with a resin layer of the reinforcing resin 4. The metal bumps 6 are aligned with the electrodes 2 by being moved onto the resin substrate 1. Then, the electronic component 5 is lowered with respect to the reinforcing resin 4, and the metal bump 6 is landed on the electrode 2 of the resin substrate 1 through the reinforcing resin 4 (component mounting process).
[0013]
Next, as shown in FIG. 2B, a pressing load is applied to the electronic component 5 by the ultrasonic tool 7 and ultrasonic vibration is applied. Thereby, the lower end surface of the metal bump 6 is metal-bonded to the surface of the electrode 2 (bonding process). Thus, the metal junction is intends line by ultrasonic bonding.
[0014]
Thereafter, the resin substrate 1 on which the electronic component 5 is temporarily bonded by ultrasonic metal bonding is sent to a heating step (see FIG. 2C). That is, the heating process is performed in a facility different from the facility for performing the component mounting process or the joining process. Thereby, the several electronic component 5 can be heated collectively, and the heating process which requires a comparatively long time can be performed efficiently. Here, the resin substrate 1 is placed on a heating stage 9 provided with heating means. Next, a crimping tool 8 provided with heating means is brought into contact with the upper surface of the electronic component 5 that is temporarily crimped to the resin substrate 1. The electronic component 5 is pressed against the resin substrate 1 with a predetermined pressing load F, and the electronic component 5 is heated by the crimping tool 8 to thermally cure the reinforcing resin 4 (thermosetting step).
[0015]
In this thermosetting process, the set temperature of the heating stage 9 is set to be equal to or lower than the glass transition temperature of the material of the resin substrate 1. For example, in the case of a resin substrate made of glass epoxy resin, the heating temperature is set to about 120 ° C. The heating temperature of the crimping tool 8 is set to about 200 ° C. in consideration of heat transfer loss. By setting such a heating temperature, an excellent effect as described below is obtained.
[0016]
The thermal expansion coefficient of a resin material such as epoxy or polyimide used for the resin substrate has a characteristic that it greatly changes with the glass transition temperature as a boundary (see FIG. 3). In FIG. 3, the vertical axis of the graph is the thermal expansion coefficient, and the horizontal axis is the temperature. As shown in FIG. 3, the thermal expansion coefficient is relatively low in the temperature range lower than the glass transition temperature Tg (see α1), and when the glass transition temperature Tg is exceeded, the thermal expansion coefficient increases rapidly (see α2). For this reason, by setting the heating temperature in the thermosetting step to be lower than the glass transition temperature Tg, the amount of thermal expansion in the thermosetting step of the resin substrate can be suppressed as small as possible.
[0017]
Therefore, the amount of heat shrinkage in the process of cooling from the thermosetting temperature to room temperature is also reduced, and the thermal stress acting on the metal joint between the metal bump 6 and the electrode 2 in the heat shrinkage process can be kept low. Thus, it is possible to reduce problems such as breakage occurring in the metal joint.
[0018]
In the thermosetting process, the electronic component 5 is pressurized against the resin substrate 1 and can be cured while suppressing the vertical expansion of the reinforcing resin 4, as shown in the present embodiment. It is desirable to perform thermosetting under pressure. As a pressing method, a pressing load F may be mechanically applied by the crimping tool 8 as shown in the present embodiment, and heating is performed in a state where a pressing weight is placed on the upper surface of the electronic component 5. May be performed.
[0019]
【The invention's effect】
According to the present invention, in the heating step of heating the resin substrate after the bonding step for metal bonding of the connecting electrode and the electrode of the resin substrate to thermally cure the reinforcing resin, heating is performed at a temperature equal to or lower than the glass transition temperature of the resin substrate material. Since it was made to do, the thermal stress which arises in a metal junction part can be reduced, and the joining defect by the fracture | rupture of a metal junction part can be reduced.
[Brief description of the drawings]
FIG. 1 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention. FIG. 2 is an explanatory diagram of a process of an electronic component mounting method according to an embodiment of the present invention. Showing thermal expansion coefficient of resin substrate subject to electronic component mounting method
DESCRIPTION OF SYMBOLS 1 Resin board 2 Electrode 4 Reinforcement resin 5 Electronic component 6 Metal bump 8 Crimping tool 9 Heating stage

Claims (1)

電子部品に設けられた金属バンプを樹脂基板に設けられた電極に金属接合することにより電子部品を樹脂基板に実装する電子部品実装方法であって、前記樹脂基板の上面に補強樹脂を供給する樹脂供給工程と、この補強樹脂に対して前記電子部品を下降させ前記金属バンプを補強樹脂を介して樹脂基板の電極に着地させる部品搭載工程と、前記金属バンプと前記樹脂基板の電極との接触面における金属拡散によって接合を行うことにより前記金属バンプと前記樹脂基板の電極とを金属接合する接合工程と、接合工程後の樹脂基板を加熱することにより前記補強樹脂を熱硬化させる熱硬化工程とを含み、前記接合工程における金属接合が超音波接合によって行われ、前記熱硬化工程において前記樹脂基板の材質のガラス転移温度以下で加熱するものであり、且つ前記熱硬化工程において、加熱手段を備えた圧着ツールを当接させることによって前記電子部品を樹脂基板に対して加圧しながら加熱を行うことを特徴とする電子部品実装方法。An electronic component mounting method for mounting an electronic component on a resin substrate by metal-bonding metal bumps provided on the electronic component to electrodes provided on the resin substrate, the resin supplying reinforcing resin to the upper surface of the resin substrate A component mounting step of lowering the electronic component with respect to the reinforcing resin and landing the metal bump on the electrode of the resin substrate via the reinforcing resin; and a contact surface between the metal bump and the electrode of the resin substrate A bonding step of bonding the metal bumps and the electrodes of the resin substrate by metal bonding by metal diffusion in a step, and a thermosetting step of thermosetting the reinforcing resin by heating the resin substrate after the bonding step. wherein, metal bonding in the joining step is performed by ultrasonic bonding, heat in the heat curing step below the resin substrate of a material of the glass transition temperature And than, and in the heat curing step, the electronic component mounting method characterized by performing the heating while pressurizing the electronic component against the resin substrate by contact with the crimping tool with a heating means.
JP2002050975A 2002-02-27 2002-02-27 Electronic component mounting method Expired - Lifetime JP3960076B2 (en)

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