JP2000299411A - Chip-mounting body and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip-mounting body, which is inexpensive and highly reliable, and a method to manufacture the chip-mounting body efficiently. SOLUTION: An original thermosetting resin film 10 for a sealing resin 4 is adhered to a pad part 2b of a circuit board 3 (a). Next, a bump 5 is formed counterposed to the pad part 2b with the thermosetting resin film 10 interposed, and the bump 5 is allowed to face the thermosetting resin film 10 and an IC chip 1 is set on the thermosetting resin film 10 (b). Then, the IC chip 1 is pressed to the side of the circuit board 3 to penetrate the thermosetting resin film 10, and the bump 5 is brought into direct contact with the prescribed pad part 2b, thereby connecting them electrically with each other (c). Finally, while the IC chip is still pressed to the side of the circuit board 3, the thermosetting resin film 10 is heated to be cured, and the IC chip 1 and the circuit board 3 are resin encapsulated (d).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a chip mounted body mounted on an information carrier such as a non-contact type IC card and a method of manufacturing the same.

[0002]

2. Description of the Related Art Non-contact information carriers such as non-contact IC cards are being considered for use as substitutes for commuter passes, driver's licenses, telephone cards, cash cards, etc., and are expected to be used in large quantities. However, how to simplify the manufacturing process and reduce the unit price is one of the most important technical issues.

Conventionally, one of the non-contact type information carriers of this type has been disclosed.
One is to use a chip mounted body on which an IC chip is mounted on a circuit board on which a required circuit pattern including an antenna coil and a pad portion for setting an IC chip is formed, and to provide a required cover sheet on both front and back surfaces of the chip mounted body The thing which adheres is proposed. The non-contact information carrier of this configuration is
Since the antenna coil can be formed at the same time as the circuit pattern, the antenna coil is easily manufactured and has excellent mass productivity.

[0004] By the way, as a chip mounting body used for manufacturing the non-contact type information carrier, a connection method between a circuit pattern and an IC chip and a sealing method of the IC chip are as follows.
The following two types have conventionally been proposed.

[0005] First, as shown in FIG.
Circuit pattern 200 and IC chip 300 formed at zero
The conductive particles 50 mixed in the conductive polymer adhesive (ACF) 500 with the bumps 400 formed on the input / output terminals
0a, and at the same time, the circuit board 100 and the IC chip 300 are sealed with an ACF 500. As shown in FIG. 10, the circuit board 100 and the IC chip 300 are connected to a circuit pattern 200 formed on the circuit board 100. The bumps 400 formed on the input / output terminals of the IC chip 300 and the conductive paste 6
The circuit board 100 and the IC chip 300 are sealed with a sealant 700 made of a thermosetting resin or the like after the connection through the conductive particles 600a mixed in the resin.

A bump 400 used for this type of connection
In order to increase the contact area with the circuit pattern 200 and secure the electrical connection, a columnar shape having a flat top is generally used.

As the circuit board 100, a plastic film substrate made of polyimide resin, polyethylene terephthalate (PET) resin or the like is used.
The circuit pattern 200 may be formed by etching a conductive layer such as a copper foil or an aluminum foil provided on the surface of the plastic film substrate to form a pattern of a predetermined shape, or a conductive paste may be formed on the surface of the plastic film substrate. Printed patterns of a predetermined shape are used.

[0008]

Among the above two types of chip mounting bodies, the former uses the expensive ACF500 to perform necessary electrical connection and resin sealing, and is therefore a chip mounting body and eventually a final product. The manufacturing cost of the non-contact type information carrier increases, and the circuit pattern 200 and the IC chip 300 are connected using the conductive particles 500a mixed in the ACF 500. Circuit pattern 200 and IC chip 3
When the pressing force is too small, it is difficult to adjust the pressing force of the ACF when the circuit pattern 200 is formed of a metal material such as aluminum which is likely to form an insulating oxide film on the surface. Particle 500
a cannot penetrate the insulating film formed on the surface of the circuit pattern 200, and connection failure is likely to occur. The circuit pattern 200 is formed of a relatively soft metal material such as copper or aluminum, and the bump 40
When 0 is formed of a hard metal material such as nickel and the pressing force is excessive, the conductive particles 500a in the ACF are completely embedded in the circuit pattern 200, and the circuit pattern 200 and the IC chip 300 are separated from each other. The contact between the input and output terminals formed on the IC chip 300 and the test terminals is likely to be short-circuited, and the occurrence rate of defective products is increased.

On the other hand, the latter is not inconvenient as described above because the amount of the conductive paste 600 used is small and the application range of the conductive paste 600 is limited. Chip 30
Since the circuit board 100 and the IC chip 300 have to be sealed with the sealing agent 700 after connecting the input / output terminals of No. 0, the manufacturing process becomes complicated, and after all,
There is a problem in that the manufacturing cost of the chip mounted body and, consequently, the non-contact type information carrier as the final product becomes expensive.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and an object of the present invention is to provide an inexpensive and highly reliable chip mounting body, and to provide such a chip mounting body with high efficiency. To provide a manufacturing method.

[0011]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a chip mounting body, in which a circuit board on which a circuit pattern is formed and an input / output terminal are electrically connected to the circuit pattern. In the chip mounting body composed of the IC chip, the bump formed on the input / output terminal of the IC chip and the circuit pattern are in direct contact and electrically connected, and the IC chip and the circuit board are thermoset. The configuration is such that it is sealed with resin.

As the circuit substrate, a plastic film substrate made of polyimide resin, PET resin, or the like can be used. As the circuit pattern, a non-contact transmission pattern formed by etching or printing on the surface of the plastic film substrate can be used. An antenna coil can be used.

As described above, when the bumps formed on the input / output terminals of the IC chip and the circuit pattern are electrically connected to each other by making direct contact, the input / output terminals of the IC chip are connected to each other as in the case of using an ACF or the like. Since the test terminals and the test terminals of the IC chip and the circuit patterns formed on the circuit board cannot be short-circuited, the connection reliability can be improved. In addition, when the IC chip and the circuit board are sealed with a thermosetting resin, the cost of the sealing material can be reduced as compared with the case where the ACF is used, and the electrical connection between the bump and the circuit pattern and the resin sealing of the IC chip can be achieved. Can be performed in a single step, and the sealing step is not complicated as in the case of using a conductive paste, so that the manufacturing cost of the chip mounted body can be reduced.

In the chip mounting body having the above structure, the insulating film formed on the surface of the circuit pattern is easily broken, and the electric connection between the IC chip and the circuit pattern is more reliably performed. It is preferable that the tip of the bump is formed in a non-planar shape, for example, a spherical shape, a needle shape, or a rough surface shape. In addition, the electric connection between the IC chip and the circuit pattern can be made more reliably, and
Even when the pressing force of the C chip is high, the circuit pattern and IC
In order to prevent contact with the chip and short-circuit between the terminals, it is particularly preferable that the shape of the bump is formed in a conical shape whose diameter or width decreases from the bottom to the top. With this configuration, a chip mounting body is formed in which a depression corresponding to the tip of a bump is formed in a pad portion of a circuit pattern and a gap filled with a thermosetting resin is provided between the circuit pattern and the IC chip. can get.

On the other hand, regarding the method of manufacturing the chip mounted body, first, a step of providing an uncured thermosetting resin layer on the circuit pattern forming surface of the circuit board, and forming a bump on the thermosetting resin layer side Positioning the IC chip at a predetermined position on the thermosetting resin layer, and pressing the IC chip toward the circuit board to pierce the thermosetting resin layer, thereby forming the bump and the circuit pattern. A step of directly contacting and electrically connecting a predetermined pad portion formed on the substrate, and a step of heating and curing the thermosetting resin layer to seal the IC chip and the circuit board with the thermosetting resin. It was configured to include a process.

Secondly, a step of providing an uncured thermosetting resin layer on the surface of the plastic film substrate on which the antenna coil is formed, and a step of directing the IC chip with the bumps facing the thermosetting resin layer side. A step of positioning the IC chip at a predetermined position on the thermosetting resin layer, and a step of pressing the IC chip against the plastic film substrate side to directly contact the pad portion of the antenna coil and the bump to electrically connect them. And a step of bonding a cover sheet made of a plastic film to an IC chip mounting surface of the plastic film substrate via an adhesive layer.

The method of providing an uncured thermosetting resin layer on the circuit pattern forming surface of the circuit board includes a method of attaching a thermosetting resin film formed in advance, and a method of applying or printing a thermosetting resin paste. And a method in which a thermosetting resin solution is dropped from a dispenser and dried.

According to the above structure, the IC chip is pressed against the circuit board or the plastic film substrate to form a circuit between the bump formed on the IC chip and the circuit pattern formed on the circuit board or the antenna coil formed on the plastic film substrate. Since the IC chip and the circuit board can be resin-sealed only by heating and curing the thermosetting resin layer while maintaining the electrical connection, the bumps and the circuit formed on the IC chip using a conductive paste can be used. The process of connecting the IC chip to the circuit pattern or the antenna coil and the process of connecting the IC to the circuit pattern or the antenna coil are compared with the case where a thermosetting resin is applied to a predetermined portion and then heated and cured, after electrically connecting the circuit pattern formed on the substrate. The process of sealing the chip and the circuit board or plastic film substrate can be made extremely efficient, and the production of chip mounted It can be made easy Te.

In each of the above manufacturing methods, the IC
It is particularly preferable that the tip of the bump is fitted into the pad by adjusting the pressing force applied to the chip, and that a gap is provided between the pad and the IC chip.

In this way, the insulating film formed on the surface of the circuit pattern or the antenna coil can be broken by the pressing force of the IC chip, so that the connection between the circuit pattern or the antenna coil and the bump can be reliably performed. In addition, since the IC chip and the circuit pattern or the antenna coil are kept out of contact with each other, a short circuit between terminals can be prevented.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a chip mounting body according to the present invention will be described below with reference to FIGS.
FIG. 1 is a plan view of a chip mounting body according to the present embodiment, and FIG. 2 is a cross-sectional view taken along the line AA of FIG.

As shown in FIGS. 1 and 2, the chip mounting body according to the present embodiment has a required circuit including an IC chip 1, an antenna coil 2a for non-contact communication and a pad portion 2b for connecting the IC chip on the surface. A circuit board 3 on which a pattern 2 is formed;
A sealing resin (underfill) 4 made of a thermosetting resin for sealing the IC chip 1 to the circuit board 3.

As the IC chip 1, as shown in FIG. 2, any one can be used as long as the bump 5 made of metal such as gold or aluminum is formed on the input / output terminal 1a. For those applied to a non-contact information carrier such as a contact IC card, a bare chip having no resin mold is used in order to reduce the thickness of the non-contact information carrier as a final product. Further, in order to further reduce the thickness of the non-contact type information carrier, a bare chip thinned by chemical polishing, mechanical polishing, or a combination thereof may be used.

The circuit board 3 has a required circuit pattern 2 including at least the antenna coil 2a and the pad 2b on the surface of an insulating substrate 3a made of, for example, glass epoxy, ceramics, polyimide resin, PET resin, vinyl chloride resin, or the like. Do it. The circuit pattern 2 can be formed by etching a metal layer formed on the surface of the insulating substrate 3a, or can be formed by printing a conductive paste such as a silver paste. The method of forming a metal layer on the surface of the insulating substrate 3a includes a method of bonding a metal foil to the surface of the insulating substrate 3a, and a method of forming a metal layer on the surface of the insulating substrate 3a.
There is a method of chemically or physically forming a metal film on the surface of a.

The IC chip 1 is in direct contact with and electrically connected to the circuit pattern 2 by pressing the bump 5 against the pad portion 2b. Further, the IC chip 1 is resin-sealed with a sealing resin 4 and is firmly mounted on the circuit board 3. Pad portion 2b of circuit pattern 2
By pressing the bump 5, a depression 6 corresponding to the shape of the tip of the bump 5 is formed, whereby the bump 5 and the circuit pattern 2 are securely connected.

As described above, the chip mounted body of this embodiment is an IC
Since the bumps 5 formed on the input / output terminals of the chip 1 and the pad portions 2b formed on the circuit pattern 2 are electrically connected to each other by direct contact, the input of the IC chip 1 is performed as in the case of using the ACF. Since the output terminal and other terminals such as a test terminal, or the test terminal or the like of the IC chip 1 and the circuit pattern 2 formed on the circuit board 3 cannot be short-circuited, connection reliability is improved. be able to. Further, since the IC chip 1 and the circuit board 3 are sealed with the sealing resin 4 made of a thermosetting resin, the cost of the sealing material can be reduced as compared with the case where the ACF or the conductive paste is used. Electrical connection between the IC chip 1 and the circuit board 3 and resin sealing between the IC chip 1 and the circuit board 3 can be performed in one step, so that the sealing step becomes complicated as in the case of using a conductive paste. For these reasons, the manufacturing cost of the chip mounted body can be reduced.

Hereinafter, a method of manufacturing a chip mounted body according to this embodiment will be described with reference to FIG.

First, as shown in FIG. 3A, the sealing resin 4 is formed on the pad 2a on the circuit pattern forming surface of the circuit board 3.
Is adhered.

Next, as shown in FIG. 3B, the IC chip 1 and the circuit board 3 are positioned so that the bumps 5 and the pad portions 2b face each other via the thermosetting resin film 10. The IC chip 1 is set on the thermosetting resin film 10 with the bumps 5 facing the thermosetting resin film 10.

Next, as shown in FIG. 3C, the IC chip 1 is pressed against the circuit board 3 and the thermosetting resin film 1 is pressed.
0, and the bumps 5 and the predetermined pad portions 2b formed on the circuit pattern 2 are brought into direct contact with each other to electrically connect them. At this time, the pressing force of the IC chip 1 is such that the tip of the bump 5 is fitted into the circuit pattern 2 and the IC chip 1 is
Is adjusted so that it does not come into contact with

Finally, as shown in FIG. 3 (d), the IC chip 1 is pressed against the circuit board 3 while maintaining the pressing force.
The combined body of the chip 1 and the circuit board 3 is heated to a predetermined temperature to heat and cure the thermosetting resin film 10, and the IC chip 1 and the circuit board 3 are resin-sealed.

In the above embodiment, the thermosetting resin film 10 which is the base of the sealing resin 4 is adhered on the pad portion 2a on the circuit pattern forming surface, but the gist of the present invention is not limited to this. Instead, the thermosetting resin layer which is the base of the sealing resin 4 can be formed by applying or printing a thermosetting resin paste on a predetermined portion of the circuit pattern forming surface, and forming the circuit pattern. A thermosetting resin layer serving as a base of the sealing resin 4 can be formed by dropping a solution of the thermosetting resin from a dispenser on a predetermined portion of the surface and drying the solution.

In the method of manufacturing a chip mounted body according to this embodiment, the IC chip 1 is pressed toward the circuit board 3 to electrically connect the bumps 5 formed on the IC chip 1 to the circuit patterns 2 formed on the circuit board 3. While holding the thermosetting resin film 10
Since the IC chip 1 can be resin-sealed only by heat-curing, the bumps 5 formed on the IC chip 1 and the circuit patterns 2 formed on the circuit board 3 are electrically connected using a conductive paste. After that, compared with a case where a thermosetting resin is applied to a predetermined portion and then cured by heating, a step of connecting the IC chip 1 and the circuit pattern 2 and a step of sealing the resin between the IC chip 1 and the circuit board 3 are extremely performed. The efficiency can be improved, and the manufacture of the chip mounted body can be made extremely easy. Further, since the IC chip 1 is resin-sealed using the thermosetting resin film 10, the chip mounted body can be manufactured at a lower cost than when an expensive ACF is used.

A non-contact information carrier such as a non-contact IC card can be manufactured by using the chip mounted body thus manufactured. FIG. 4 is a cross-sectional view showing a first example of a non-contact IC card using the chip mounted body according to the present invention, in which a cover sheet 23 is covered on both front and back surfaces of a chip mounted body 21 with an adhesive layer 22 interposed therebetween. Wear it. FIGS. 5 and 6 show a non-contact IC using the chip mounted body according to the present invention.
FIG. 6 is a cross-sectional view illustrating a second example of the card, and illustrates a chip mounted body 2;
1, that is, the cover sheet 23 is adhered to the IC chip mounting surface of the circuit board 3 via the adhesive layer 22.

Thus, these non-contact IC cards are:
Cover sheet 2 on both sides or one side of chip mounting body 21
3 can be obtained simply by being applied, so that it is easy to manufacture, has excellent mass productivity, and can be provided at low cost.

It should be noted that, in the above-described embodiment, the bump 5 having a columnar or prismatic shape and having a flat end portion is formed.
Was used, but in order to make the electrical connection between the IC chip 1 and the circuit pattern 2 more reliably,
As shown in FIGS. 7A, 7B, and 7C, an IC chip 1 having a bump 5 having a non-planar tip can be used. FIG. 7A shows an example in which the bump 5 is formed in a two-step shape and the tip end portion is formed in a spherical shape.
7B shows an example in which the tip of the bump 5 is formed in a needle shape, FIG.
(C) is an example in which a large number of spherical or needle-like projections are provided on the tip end surface of the bump 5 to make it rough. Bump 5 in FIG.
Can be formed by pressing a mold against a metal layer formed on the input / output terminal of the IC chip 1 and plastically deforming the metal layer. The bump 5 shown in FIG. 7B is formed by pressing one end of a molten metal wire to the input / output terminal of the IC chip 1 and electrically connecting the metal wire, and then applying a printing tension to the metal wire to tear it off. Can be formed. The bump 5 in FIG. 7C can be formed by a printing method, a plating method, or the like.
As described above, when the tip of the bump 5 is formed in a non-planar shape,
When the bump 5 is pressed against the circuit pattern 2, the surface pressure acting on the circuit pattern 2 increases and the circuit pattern 2
Is more easily deformed, so that the electrical connection between the IC chip 1 and the circuit pattern 2 can be made more reliably.

As another example, as shown in FIG. 7D, the bump 5 can be formed in a conical shape whose diameter or width decreases from the bottom to the top. The top of the bump of the present example can be made flat or rough. Since the bump 5 in FIG. 7D is formed in a conical shape whose diameter or width decreases from the bottom to the top, the insulating film formed on the surface of the circuit pattern 2 is easily broken, and the IC chip 1 The electrical connection with the circuit pattern 2 can be reliably performed, and the resistance to the pressing force increases rapidly as the amount of fitting into the circuit pattern 2 increases. Is large, contact between the IC chip 1 and the circuit pattern 2 can be prevented, and a short circuit between the terminals can be effectively prevented.

[0038]

<First Embodiment> An antenna coil 2 having a pad portion 2a for connecting an IC chip shown in FIG. 8 by etching a 30 .mu.m thick aluminum foil on a PET substrate 3 having a thickness of 50 .mu.m and etching the same. Was formed. The DC resistance between the pads 2a of the antenna coil 2 is about 0.2Ω
Met.

At the same time, gold bumps 5 having the shape shown in FIG. 7B were formed on the input / output terminals of the IC chip 1 polished to a thickness of 100 μm. The diameter of the input / output terminal was 80 μm, the height of the bump 5 was about 90 μm, and the diameter of the bottom was about 80 μm.

Next, the pad portion 2a formed on the PET substrate 3 and the bump 5 formed on the IC chip (flip chip) 1 were electrically connected via an ACF to obtain a chip mounted body. The connection conditions were as follows: the pressing force of the IC chip 1 was 50 gr, the pressing head temperature was 210 ° C., and the pressing time was 5 seconds.

Lastly, the chip mounting surface of the chip mounting body manufactured in this manner is provided with an adhesive layer 22 on one side.
50 μm thick PE coated to a thickness of μm
The sheet was covered with a T sheet 23 and thermocompressed at 120 ° C. for 3 minutes to obtain a non-contact IC card having a total thickness of 250 μm.

<Second Embodiment> The bump shape of the IC chip (flip chip) 1 was changed to the shape shown in FIG.
The bumps 5 are formed on the input / output terminals of the IC chip 1 by
After forming a pointed gold bump having a height of about 90 μm and a bottom diameter of about 60 μm, a flat plate was pressed on the top of the gold bump with a pressing force of about 50 gr to flatten the top. The dimensions of the bumps 6 after molding were about 90 μm in height, about 60 μm in diameter at the bottom, and about 20 μm in diameter at the top. Other conditions were the same as in the first embodiment.

When the operation of the non-contact IC card according to each of the above-described embodiments was checked for 50 non-contact IC cards, no abnormality was found in any of the non-contact IC cards. It was confirmed that the connection state with No. 3 was good.

[0044]

According to the first aspect of the present invention, the ACF is electrically connected by directly contacting the bump formed on the input / output terminal of the IC chip with the circuit pattern formed on the circuit board. Inadvertent short-circuit accidents do not occur as in the case of using the device, and the reliability of the connection can be improved. Also, since the IC chip and the circuit board are sealed with a sealing resin made of a thermosetting resin, the ACF
In addition, the cost of the sealing material can be reduced as compared with the case where a conductive paste is used, and the electrical connection between the bump and the circuit pattern and the resin sealing between the IC chip and the circuit board can be performed in one step. The sealing step is not complicated as in the case of using the paste, and the manufacturing cost of the chip mounted body can be reduced from these facts.

According to the second aspect of the present invention, since the tip of the bump formed on the input / output terminal of the IC chip is formed in a non-planar shape, when the bump is pressed against the circuit pattern,
The surface pressure acting on the circuit pattern is increased, so that the circuit pattern is more easily deformed, and the electric connection between the IC chip and the circuit pattern can be more reliably performed.

According to the third aspect of the present invention, the bump formed on the input / output terminal of the IC chip is formed in a conical shape whose diameter or width decreases from the bottom to the top. Electrical connection with the IC chip can be made more reliably, the contact between the device surface of the IC chip and the circuit pattern can be easily avoided, and the short circuit between the terminals can be prevented.

According to a fourth aspect of the present invention, an IC is used until the bump connection portion of the circuit pattern is recessed into the shape of the tip of the bump.
Since the chip is pressed against the circuit board, connection reliability can be further improved.

According to a fifth aspect of the present invention, since the circuit board is a plastic film substrate and the circuit pattern is an antenna coil for non-contact transmission formed by etching or printing, a thin non-contact IC card is used. Can be created.

According to the present invention, since a gap filled with the thermosetting resin is provided between the circuit pattern and the IC chip, contact between the device surface of the IC chip and the circuit pattern is avoided. Thus, a short circuit between the terminals can be prevented.

According to the seventh and ninth aspects of the present invention, the IC chip is pressed toward the circuit board to maintain the electrical connection between the bump formed on the IC chip and the circuit pattern formed on the circuit board. Since the IC chip and the circuit board are resin-sealed by heating and curing the thermosetting resin layer, the bumps formed on the IC chip and the circuit pattern formed on the circuit board are electrically connected using a conductive paste. The process of connecting an IC chip to a circuit pattern and the process of sealing a resin between an IC chip and a circuit board are made much more efficient than when a thermosetting resin is applied to a predetermined portion and then cured by heating. Therefore, the manufacture of the chip mounted body can be made extremely easy. In addition, using thermosetting resin
Since the chip is sealed with a resin, a chip mounted body can be manufactured at a lower cost than when an expensive ACF is used.

The inventions described in claims 8 and 9 are related to claim 7
In addition to the effects similar to those of the inventions described in (9) and (9), since a cover sheet made of a plastic film is bonded to an IC chip mounting surface of a plastic film substrate via an adhesive layer, a thin non-contact IC card is produced. be able to.

According to a tenth aspect of the present invention, when electrically connecting the pad portion and the bump, the tip of the bump is fitted into the pad portion by a pressing force applied to the IC chip, and the pad portion is connected to the bump portion. Since a gap is provided between the IC chip and the pad, the pad portion and the bump can be reliably connected, and a short circuit between the terminals can be reliably prevented.

[Brief description of the drawings]

FIG. 1 is a plan view of a chip mounted body according to an embodiment.

FIG. 2 is an enlarged sectional view taken along line AA of FIG.

FIG. 3 is an explanatory diagram of a manufacturing process of the chip mounted body according to the embodiment.

FIG. 4 is a cross-sectional view of a non-contact IC card using the chip mounted body according to the embodiment.

FIG. 5 is a cross-sectional view showing another example of a non-contact IC card using the chip mounted body according to the embodiment.

FIG. 6 is an enlarged view of a portion A in FIG. 5;

FIG. 7 is a side view showing another example of an IC chip applied to the present invention.

FIG. 8 is a partially broken plan view of a non-contact IC card using the chip mounted body according to the embodiment.

FIG. 9 is a sectional view of a main part showing a first example of a chip mounted body according to a conventional example.

FIG. 10 is a sectional view of a main part showing a second example of a chip mounting body according to a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC chip 1a I / O terminal 2 Circuit pattern 2a Antenna coil 2b Pad part 3 Circuit board 3a Insulating substrate 4 Sealing resin 5 Bump 6 Depression 10 Thermosetting resin film 21 Chip mounting body 22 Adhesive layer 23 Cover sheet

Claims (10)

[Claims] A circuit board on which a circuit pattern is formed;
An input / output terminal electrically connected to the circuit pattern;
In a chip mounting body composed of a C chip, a bump formed on an input / output terminal of the IC chip and the circuit pattern are in direct contact and electrically connected to each other, and the IC chip and the circuit board are thermoset resin. A chip mounted body, characterized by being sealed with: 2. The chip mounted body according to claim 1, wherein a tip of a bump formed on an input / output terminal of said IC chip is formed in a non-planar shape. 3. The chip package according to claim 1, wherein the bump formed on the input / output terminal of the IC chip is formed in a conical shape whose diameter or width decreases from the bottom to the top. Characterized chip mounting body. 4. The chip mounting body according to claim 1, wherein a pad portion of the circuit pattern is recessed into a shape of a tip portion of the bump. 5. The chip package according to claim 1, wherein the circuit board is a plastic film board.
A chip mounting body, wherein the circuit pattern is an antenna coil for non-contact transmission of data and / or power supply formed on the surface of the plastic film substrate. 6. The chip mounting body according to claim 1, wherein a gap filled with the thermosetting resin is provided between the circuit pattern and the IC chip. body. 7. A step of providing an uncured thermosetting resin layer on a circuit pattern forming surface of a circuit board, with a bump facing the thermosetting resin layer, and placing an IC chip on the thermosetting resin layer. And positioning the IC chip against the circuit board side to break through the thermosetting resin layer and directly contact the bump with a predetermined pad portion formed on the circuit pattern. Electrically connecting and thermosetting the thermosetting resin layer to seal the IC chip and the circuit board with thermosetting resin. . 8. A step of providing an uncured thermosetting resin layer on the surface of the plastic film substrate on which the antenna coil is formed;
Positioning the chip at a predetermined position on the thermosetting resin layer, and pressing the IC chip against the plastic film substrate to bring the pad portion of the antenna coil into direct contact with the bump for electrical connection. And a step of bonding a cover sheet made of a plastic film to an IC chip mounting surface of the plastic film substrate via an adhesive layer. 9. The method for manufacturing a chip mounted body according to claim 7, wherein the step of providing the uncured thermosetting resin layer includes attaching a preformed thermosetting resin film. A method of applying or printing a thermosetting resin paste, or a step of dripping a thermosetting resin solution from a dispenser and drying the chip mounting body, a method for manufacturing a chip mounted body. 10. The method for manufacturing a chip mounted body according to claim 7, wherein said pad portion and said bump are electrically connected to each other by a pressing force applied to said IC chip. A method of manufacturing a chip mounted body, comprising: fitting a tip of a bump into the pad portion; and providing a gap between the pad portion and the IC chip.