TW297153B - - Google Patents

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Publication number
TW297153B
TW297153B TW085100720A TW85100720A TW297153B TW 297153 B TW297153 B TW 297153B TW 085100720 A TW085100720 A TW 085100720A TW 85100720 A TW85100720 A TW 85100720A TW 297153 B TW297153 B TW 297153B
Authority
TW
Taiwan
Prior art keywords
film
reflow
etching process
wiring
manufacturing
Prior art date
Application number
TW085100720A
Other languages
English (en)
Chinese (zh)
Original Assignee
Toshiba Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Co Ltd filed Critical Toshiba Co Ltd
Application granted granted Critical
Publication of TW297153B publication Critical patent/TW297153B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Drying Of Semiconductors (AREA)
TW085100720A 1995-01-19 1996-01-22 TW297153B (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7006342A JPH08195439A (ja) 1995-01-19 1995-01-19 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
TW297153B true TW297153B (fr) 1997-02-01

Family

ID=11635702

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085100720A TW297153B (fr) 1995-01-19 1996-01-22

Country Status (3)

Country Link
JP (1) JPH08195439A (fr)
KR (1) KR100201721B1 (fr)
TW (1) TW297153B (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0951035A (ja) * 1995-08-07 1997-02-18 Mitsubishi Electric Corp 層間絶縁膜の形成方法
JP6964515B2 (ja) * 2017-12-27 2021-11-10 東京エレクトロン株式会社 サセプターのクリーニング方法

Also Published As

Publication number Publication date
KR960030381A (ko) 1996-08-17
KR100201721B1 (ko) 1999-06-15
JPH08195439A (ja) 1996-07-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees