TW290728B - - Google Patents
Info
- Publication number
- TW290728B TW290728B TW085102461A TW85102461A TW290728B TW 290728 B TW290728 B TW 290728B TW 085102461 A TW085102461 A TW 085102461A TW 85102461 A TW85102461 A TW 85102461A TW 290728 B TW290728 B TW 290728B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/330,029 US5636745A (en) | 1994-10-27 | 1994-10-27 | Tray for a component and an apparatus for accurately placing a component within the tray |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW290728B true TW290728B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1996-11-11 |
Family
ID=23288001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW085102461A TW290728B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1994-10-27 | 1996-03-01 |
Country Status (8)
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5890599A (en) * | 1990-09-25 | 1999-04-06 | R.H. Murphy Company | Tray for integrated circuits |
| US6527998B1 (en) * | 1994-02-25 | 2003-03-04 | Xilinx, Inc. | Method of fabricating integrated circuit pack trays using modules |
| DE19635082C1 (de) * | 1996-08-30 | 1998-03-05 | Mci Computer Gmbh | Stapelbarer Träger (Tray) für elektronische Bausteine, insbesondere IC-Bausteine |
| US5794783A (en) * | 1996-12-31 | 1998-08-18 | Intel Corporation | Die-level burn-in and test flipping tray |
| DE19741350A1 (de) * | 1997-09-19 | 1999-03-25 | Mci Computer Gmbh | Tray für IC-Bauelemente |
| US5848703A (en) * | 1997-10-20 | 1998-12-15 | R. H. Murphy Co., Inc. | Tray for integrated circuits |
| US6029427A (en) * | 1999-04-05 | 2000-02-29 | Lucent Technologies, Inc. | Method and apparatus for handling semiconductor chips |
| US6021904A (en) * | 1999-06-08 | 2000-02-08 | International Business Machines Corporation | Chip carrier processing and shipping array and method of manufacture thereof |
| US6474475B1 (en) | 2000-02-22 | 2002-11-05 | Micron Technology, Inc. | Apparatus for handling stacked integrated circuit devices |
| US6476629B1 (en) * | 2000-02-23 | 2002-11-05 | Micron Technology, Inc. | In-tray burn-in board for testing integrated circuit devices in situ on processing trays |
| US6713854B1 (en) | 2000-10-16 | 2004-03-30 | Legacy Electronics, Inc | Electronic circuit module with a carrier having a mounting pad array |
| US7102892B2 (en) | 2000-03-13 | 2006-09-05 | Legacy Electronics, Inc. | Modular integrated circuit chip carrier |
| US7337522B2 (en) | 2000-10-16 | 2008-03-04 | Legacy Electronics, Inc. | Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
| AU2002250437A1 (en) | 2001-03-14 | 2002-09-24 | Legacy Electronics, Inc. | A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
| US6474477B1 (en) * | 2001-05-02 | 2002-11-05 | Ching T. Chang | Carrier assembly for semiconductor IC (integrated circuit) packages |
| KR100447394B1 (ko) * | 2001-11-02 | 2004-09-04 | 엘지전자 주식회사 | 통신시스템의 메시지처리방법 |
| KR100566821B1 (ko) * | 2002-11-20 | 2006-04-03 | 미래산업 주식회사 | 트레이 이송장치 |
| DE102004052339B4 (de) * | 2004-10-27 | 2006-12-07 | Zlb Behring Gmbh | Verfahren zur Herstellung einer Stapelhilfe für kastenförmige Behälter |
| WO2006076381A2 (en) | 2005-01-12 | 2006-07-20 | Legacy Electronics, Inc. | Radial circuit board, system, and methods |
| JP4716928B2 (ja) * | 2006-06-07 | 2011-07-06 | 信越ポリマー株式会社 | ウェーハ収納容器 |
| US10601216B2 (en) * | 2016-12-15 | 2020-03-24 | International Business Machines Corporation | Distributed environment analog multiplexor with high-voltage protection |
| JP6847729B2 (ja) * | 2017-03-28 | 2021-03-24 | 株式会社ディスコ | 切削装置 |
| CN111776379A (zh) * | 2020-06-23 | 2020-10-16 | 安徽三优光电科技有限公司 | 一种自动剥料机及其工作方法 |
| CN113066773B (zh) * | 2021-03-19 | 2022-04-01 | 深圳群芯微电子有限责任公司 | 一种集成电路的多芯片封装定位装置及其工作方法 |
| CN114884478A (zh) * | 2022-07-01 | 2022-08-09 | 成都泰美克晶体技术有限公司 | 一种光刻石英晶片及其电极的设计方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2944722A (en) * | 1958-06-09 | 1960-07-12 | Keystone Steel & Wire Co | Crate stacker |
| US3549018A (en) * | 1968-11-08 | 1970-12-22 | Banner Metals Inc | Plastic tray |
| US3623634A (en) * | 1969-11-03 | 1971-11-30 | Johanness Norgard | Modular container |
| US3907111A (en) * | 1973-06-14 | 1975-09-23 | Rockwell International Corp | Self-cleaning stackable container |
| US3946864A (en) * | 1974-07-01 | 1976-03-30 | Hutson Jearld L | Semiconductor chip package |
| US4483441A (en) * | 1981-03-26 | 1984-11-20 | Tokyo Shibaura Denki Kabushiki Kaisha | Flat-type semiconductor device and packing thereof |
| US4379505A (en) * | 1981-10-20 | 1983-04-12 | Gibson-Egan Company | Integrated circuit carrier |
| US4444309A (en) * | 1982-02-19 | 1984-04-24 | Bourns, Inc. | Carrier for a leadless integrated circuit chip |
| JPS61278159A (ja) * | 1985-06-03 | 1986-12-09 | Yamaichi Electric Mfg Co Ltd | Ｉｃパツケ−ジ用キヤリア |
| US5103976A (en) * | 1990-09-25 | 1992-04-14 | R. H. Murphy Company, Inc. | Tray for integrated circuits with supporting ribs |
| GB2264696B (en) * | 1992-02-28 | 1995-10-04 | Murphy R H Co Inc | Tray for integrated circuits |
| US5203452A (en) * | 1992-03-13 | 1993-04-20 | Illinois Tool Works, Inc. | Shipping tray |
| US5186479A (en) * | 1992-03-20 | 1993-02-16 | Flowers Henry C | Multi-function cart |
| US5413224A (en) * | 1993-07-23 | 1995-05-09 | Ply Mar Inc. | Stackable pallet packaging |
| US5400904C1 (en) * | 1993-10-15 | 2001-01-16 | Murphy R H Co Inc | Tray for ball terminal integrated circuits |
| US5492223A (en) * | 1994-02-04 | 1996-02-20 | Motorola, Inc. | Interlocking and invertible semiconductor device tray and test contactor mating thereto |
| US5450959A (en) * | 1994-08-30 | 1995-09-19 | Paragon Electric Company, Inc. | Apparatus for use in separating parts from a panel array of parts |
-
1994
- 1994-10-27 US US08/330,029 patent/US5636745A/en not_active Expired - Fee Related
-
1995
- 1995-09-29 CA CA002159560A patent/CA2159560C/en not_active Expired - Fee Related
- 1995-10-20 EP EP95307485A patent/EP0714231A3/en not_active Ceased
- 1995-10-20 JP JP27302295A patent/JPH08236607A/ja active Pending
- 1995-10-21 SG SG1995001620A patent/SG65535A1/en unknown
- 1995-10-24 KR KR1019950036710A patent/KR0184913B1/ko not_active Expired - Fee Related
- 1995-10-26 CN CN95117664A patent/CN1038491C/zh not_active Expired - Fee Related
-
1996
- 1996-03-01 TW TW085102461A patent/TW290728B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| CA2159560C (en) | 1999-06-15 |
| KR960015862A (ko) | 1996-05-22 |
| KR0184913B1 (ko) | 1999-03-20 |
| CN1038491C (zh) | 1998-05-27 |
| EP0714231A3 (en) | 1996-07-17 |
| CN1126688A (zh) | 1996-07-17 |
| JPH08236607A (ja) | 1996-09-13 |
| US5636745A (en) | 1997-06-10 |
| CA2159560A1 (en) | 1996-04-28 |
| SG65535A1 (en) | 1999-06-22 |
| EP0714231A2 (en) | 1996-05-29 |