TW288162B - The chemical mechanical polishing planarization technology of IC - Google Patents
The chemical mechanical polishing planarization technology of ICInfo
- Publication number
- TW288162B TW288162B TW84113801A TW84113801A TW288162B TW 288162 B TW288162 B TW 288162B TW 84113801 A TW84113801 A TW 84113801A TW 84113801 A TW84113801 A TW 84113801A TW 288162 B TW288162 B TW 288162B
- Authority
- TW
- Taiwan
- Prior art keywords
- insulator
- teos oxide
- mechanical polishing
- chemical mechanical
- line region
- Prior art date
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The planarization method of IC includes: - Form 1st insulator on semiconductor substrate; - Form holes on 1st insulator and lie in between conductors; - Form metal layer which strikes over the holes, and etch the metal by photolithography and etching then form metal interconnection, which divides into dense and sparse metal line region; - Form 2nd insulator; - Form the photoresist pattern by photolithography and cover the sparse metal line region; - Proceed surface treatment on 2nd insulator of dense metal line region by idling gas plasma; - Form a O3-TEOS oxide; - Form a TEOS oxide; - Proceed chemical mechanical polishing treatment on TEOS oxide & O3-TEOS oxide by CMP, and planarize TEOS & O3-TEOS oxide.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW84113801A TW288162B (en) | 1995-12-23 | 1995-12-23 | The chemical mechanical polishing planarization technology of IC |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW84113801A TW288162B (en) | 1995-12-23 | 1995-12-23 | The chemical mechanical polishing planarization technology of IC |
Publications (1)
Publication Number | Publication Date |
---|---|
TW288162B true TW288162B (en) | 1996-10-11 |
Family
ID=51398100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW84113801A TW288162B (en) | 1995-12-23 | 1995-12-23 | The chemical mechanical polishing planarization technology of IC |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW288162B (en) |
-
1995
- 1995-12-23 TW TW84113801A patent/TW288162B/en not_active IP Right Cessation
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Legal Events
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MK4A | Expiration of patent term of an invention patent |