TW288161B - - Google Patents

Info

Publication number
TW288161B
TW288161B TW084113749A TW84113749A TW288161B TW 288161 B TW288161 B TW 288161B TW 084113749 A TW084113749 A TW 084113749A TW 84113749 A TW84113749 A TW 84113749A TW 288161 B TW288161 B TW 288161B
Authority
TW
Taiwan
Application number
TW084113749A
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of TW288161B publication Critical patent/TW288161B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • H01L21/31055—Planarisation of the insulating layers involving a dielectric removal step the removal being a chemical etching step, e.g. dry etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Formation Of Insulating Films (AREA)
  • Weting (AREA)
TW084113749A 1994-12-22 1995-12-22 TW288161B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/362,399 US5663107A (en) 1994-12-22 1994-12-22 Global planarization using self aligned polishing or spacer technique and isotropic etch process

Publications (1)

Publication Number Publication Date
TW288161B true TW288161B (zh) 1996-10-11

Family

ID=23425974

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084113749A TW288161B (zh) 1994-12-22 1995-12-22

Country Status (5)

Country Link
US (1) US5663107A (zh)
EP (1) EP0718874A3 (zh)
JP (1) JPH08236526A (zh)
KR (1) KR960026306A (zh)
TW (1) TW288161B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103854966A (zh) * 2012-11-30 2014-06-11 中国科学院微电子研究所 平坦化处理方法

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WO1998007189A1 (en) * 1996-08-13 1998-02-19 Advanced Micro Devices, Inc. Semiconductor trench isolation structure having improved upper surface planarity
US6395620B1 (en) * 1996-10-08 2002-05-28 Micron Technology, Inc. Method for forming a planar surface over low density field areas on a semiconductor wafer
US5928960A (en) * 1996-10-24 1999-07-27 International Business Machines Corporation Process for reducing pattern factor effects in CMP planarization
US5721172A (en) * 1996-12-02 1998-02-24 Taiwan Semiconductor Manufacturing Company, Ltd. Self-aligned polish stop layer hard masking method for forming planarized aperture fill layers
US6103592A (en) * 1997-05-01 2000-08-15 International Business Machines Corp. Manufacturing self-aligned polysilicon fet devices isolated with maskless shallow trench isolation and gate conductor fill technology with active devices and dummy doped regions formed in mesas
US6114219A (en) * 1997-09-15 2000-09-05 Advanced Micro Devices, Inc. Method of manufacturing an isolation region in a semiconductor device using a flowable oxide-generating material
WO1999046081A1 (en) * 1998-03-11 1999-09-16 Strasbaugh Multi-step chemical mechanical polishing process and device
TW417236B (en) * 1998-09-01 2001-01-01 Mosel Vitelic Inc A global planarization process
US6284560B1 (en) 1998-12-18 2001-09-04 Eastman Kodak Company Method for producing co-planar surface structures
US6242352B1 (en) * 1999-02-08 2001-06-05 United Microelectronics Corp. Method of preventing micro-scratches on the surface of a semiconductor wafer when performing a CMP process
JP3443358B2 (ja) * 1999-03-24 2003-09-02 シャープ株式会社 半導体装置の製造方法
US6180489B1 (en) 1999-04-12 2001-01-30 Vanguard International Semiconductor Corporation Formation of finely controlled shallow trench isolation for ULSI process
US6197660B1 (en) 1999-04-29 2001-03-06 Taiwan Semiconductor Manufacturing Company Integration of CMP and wet or dry etching for STI
JP3099002B1 (ja) * 1999-06-25 2000-10-16 茂徳科技股▲ふん▼有限公司 ２段階化学機械研磨方法
US6448629B2 (en) 1999-07-29 2002-09-10 International Business Machines Corporation Semiconductor device and method of making same
US6271138B1 (en) * 1999-09-27 2001-08-07 Taiwan Semiconductor Manufacturing Company Chemical mechanical polish (CMP) planarizing method with enhanced chemical mechanical polish (CMP) planarized layer planarity
KR100363093B1 (ko) * 2000-07-28 2002-12-05 삼성전자 주식회사 반도체 소자의 층간 절연막 평탄화 방법
US6576507B1 (en) 2000-11-14 2003-06-10 International Business Machines Corporation Selectively removable filler layer for BiCMOS process
US6350692B1 (en) 2000-12-14 2002-02-26 Infineon Technologies Ag Increased polish removal rate of dielectric layers using fixed abrasive pads
US6884729B2 (en) * 2002-02-11 2005-04-26 Cabot Microelectronics Corporation Global planarization method
DE102006030265B4 (de) * 2006-06-30 2014-01-30 Globalfoundries Inc. Verfahren zum Verbessern der Planarität einer Oberflächentopographie in einer Mikrostruktur
US8673788B2 (en) * 2010-07-28 2014-03-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming a layer on a semiconductor substrate having a plurality of trenches
US20140097539A1 (en) * 2012-10-08 2014-04-10 Stmicroelectronics, Inc. Technique for uniform cmp
US20150179469A1 (en) * 2013-12-20 2015-06-25 Sridhar Govindaraju Method and system to control polish rate variation introduced by device density differences

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JPS5914889B2 (ja) * 1979-08-17 1984-04-06 松下電器産業株式会社 半導体装置の製造方法
US4671970A (en) * 1986-02-05 1987-06-09 Ncr Corporation Trench filling and planarization process
US4836885A (en) * 1988-05-03 1989-06-06 International Business Machines Corporation Planarization process for wide trench isolation
US4962064A (en) * 1988-05-12 1990-10-09 Advanced Micro Devices, Inc. Method of planarization of topologies in integrated circuit structures
US4954459A (en) * 1988-05-12 1990-09-04 Advanced Micro Devices, Inc. Method of planarization of topologies in integrated circuit structures
JPH0297951A (ja) * 1988-10-04 1990-04-10 Mitsubishi Electric Corp 微細パターン形成方法
US4965221A (en) * 1989-03-15 1990-10-23 Micron Technology, Inc. Spacer isolation method for minimizing parasitic sidewall capacitance and creating fully recessed field oxide regions
DE58908781D1 (de) * 1989-09-08 1995-01-26 Siemens Ag Verfahren zur globalen Planarisierung von Oberflächen für integrierte Halbleiterschaltungen.
US5173439A (en) * 1989-10-25 1992-12-22 International Business Machines Corporation Forming wide dielectric-filled isolation trenches in semi-conductors
US5077234A (en) * 1990-06-29 1991-12-31 Digital Equipment Corporation Planarization process utilizing three resist layers
US5055158A (en) * 1990-09-25 1991-10-08 International Business Machines Corporation Planarization of Josephson integrated circuit
JPH04186657A (ja) * 1990-11-16 1992-07-03 Sharp Corp コンタクト配線の作製方法
US5139967A (en) * 1991-02-20 1992-08-18 Micron Technology, Inc. Process for planarizing insulating dielectric material
US5084407A (en) * 1991-06-03 1992-01-28 Motorola, Inc. Method for planarizing isolated regions
US5225358A (en) * 1991-06-06 1993-07-06 Lsi Logic Corporation Method of forming late isolation with polishing
US5175122A (en) * 1991-06-28 1992-12-29 Digital Equipment Corporation Planarization process for trench isolation in integrated circuit manufacture
US5169491A (en) * 1991-07-29 1992-12-08 Micron Technology, Inc. Method of etching SiO2 dielectric layers using chemical mechanical polishing techniques
US5223734A (en) * 1991-12-18 1993-06-29 Micron Technology, Inc. Semiconductor gettering process using backside chemical mechanical planarization (CMP) and dopant diffusion
US5229331A (en) * 1992-02-14 1993-07-20 Micron Technology, Inc. Method to form self-aligned gate structures around cold cathode emitter tips using chemical mechanical polishing technology
US5270241A (en) * 1992-03-13 1993-12-14 Micron Technology, Inc. Optimized container stacked capacitor DRAM cell utilizing sacrificial oxide deposition and chemical mechanical polishing
US5162248A (en) * 1992-03-13 1992-11-10 Micron Technology, Inc. Optimized container stacked capacitor DRAM cell utilizing sacrificial oxide deposition and chemical mechanical polishing
US5314843A (en) * 1992-03-27 1994-05-24 Micron Technology, Inc. Integrated circuit polishing method
US5302551A (en) * 1992-05-11 1994-04-12 National Semiconductor Corporation Method for planarizing the surface of an integrated circuit over a metal interconnect layer
US5312512A (en) * 1992-10-23 1994-05-17 Ncr Corporation Global planarization using SOG and CMP
US5272117A (en) * 1992-12-07 1993-12-21 Motorola, Inc. Method for planarizing a layer of material
US5302233A (en) * 1993-03-19 1994-04-12 Micron Semiconductor, Inc. Method for shaping features of a semiconductor structure using chemical mechanical planarization (CMP)
US5532191A (en) * 1993-03-26 1996-07-02 Kawasaki Steel Corporation Method of chemical mechanical polishing planarization of an insulating film using an etching stop
JPH06318583A (ja) * 1993-04-30 1994-11-15 Oki Electric Ind Co Ltd ウエハ表面の平坦化方法及びその方法に用いる化学的機械研磨装置
EP0637062B1 (de) * 1993-07-27 1997-06-04 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Halbleiterschichtaufbaus mit planarisierter Oberfläche und dessen Verwendung bei der Herstellung eines Bipolartransistors sowie eines DRAM
US5294562A (en) * 1993-09-27 1994-03-15 United Microelectronics Corporation Trench isolation with global planarization using flood exposure
US5395801A (en) * 1993-09-29 1995-03-07 Micron Semiconductor, Inc. Chemical-mechanical polishing processes of planarizing insulating layers

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103854966A (zh) * 2012-11-30 2014-06-11 中国科学院微电子研究所 平坦化处理方法
US9406549B2 (en) 2012-11-30 2016-08-02 Institute of Microelectronics, Chinese Academy of Sciences Planarization process
CN103854966B (zh) * 2012-11-30 2016-08-24 中国科学院微电子研究所 平坦化处理方法

Also Published As

Publication number Publication date
US5663107A (en) 1997-09-02
JPH08236526A (ja) 1996-09-13
EP0718874A2 (en) 1996-06-26
KR960026306A (ko) 1996-07-22
EP0718874A3 (en) 1997-02-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees