TW287230B - - Google Patents

Info

Publication number
TW287230B
TW287230B TW083100922A TW83100922A TW287230B TW 287230 B TW287230 B TW 287230B TW 083100922 A TW083100922 A TW 083100922A TW 83100922 A TW83100922 A TW 83100922A TW 287230 B TW287230 B TW 287230B
Authority
TW
Taiwan
Application number
TW083100922A
Other languages
Chinese (zh)
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW287230B publication Critical patent/TW287230B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K15/00—Testing or calibrating of thermometers
    • G01K15/005—Calibration
    • H10P74/00—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/52—Radiation pyrometry, e.g. infrared or optical thermometry using comparison with reference sources, e.g. disappearing-filament pyrometer
    • G01J5/53—Reference sources, e.g. standard lamps; Black bodies
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/80—Calibration

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Radiation Pyrometers (AREA)
TW083100922A 1992-08-11 1994-02-04 TW287230B (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/928,564 US5265957A (en) 1992-08-11 1992-08-11 Wireless temperature calibration device and method

Publications (1)

Publication Number Publication Date
TW287230B true TW287230B (OSRAM) 1996-10-01

Family

ID=25456433

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083100922A TW287230B (OSRAM) 1992-08-11 1994-02-04

Country Status (6)

Country Link
US (2) US5265957A (OSRAM)
EP (1) EP0583007B1 (OSRAM)
JP (1) JP3461868B2 (OSRAM)
KR (1) KR100276412B1 (OSRAM)
DE (1) DE69314876T2 (OSRAM)
TW (1) TW287230B (OSRAM)

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LU87933A1 (fr) * 1991-05-02 1992-12-15 Europ Communities Procede et dispositif d'etalonnage d'un pyrometre optique et plaquettes etalons correspondantes
US5265957A (en) * 1992-08-11 1993-11-30 Texas Instruments Incorporated Wireless temperature calibration device and method
US5830277A (en) * 1995-05-26 1998-11-03 Mattson Technology, Inc. Thermal processing system with supplemental resistive heater and shielded optical pyrometry
WO1997003342A1 (en) * 1995-07-10 1997-01-30 Cvc Products, Inc. Automated calibration of temperature sensors in rapid thermal processing
US5762419A (en) * 1995-07-26 1998-06-09 Applied Materials, Inc. Method and apparatus for infrared pyrometer calibration in a thermal processing system
US5820261A (en) * 1995-07-26 1998-10-13 Applied Materials, Inc. Method and apparatus for infrared pyrometer calibration in a rapid thermal processing system
US6179465B1 (en) 1996-03-28 2001-01-30 Applied Materials, Inc. Method and apparatus for infrared pyrometer calibration in a thermal processing system using multiple light sources
US5938335A (en) * 1996-04-08 1999-08-17 Applied Materials, Inc. Self-calibrating temperature probe
US6536944B1 (en) * 1996-10-09 2003-03-25 Symyx Technologies, Inc. Parallel screen for rapid thermal characterization of materials
US5902044A (en) * 1997-06-27 1999-05-11 International Business Machines Corporation Integrated hot spot detector for design, analysis, and control
US6169271B1 (en) 1998-07-13 2001-01-02 Mattson Technology, Inc. Model based method for wafer temperature control in a thermal processing system for semiconductor manufacturing
DE19934299C2 (de) * 1998-07-28 2003-04-03 Steag Ast Elektronik Gmbh Verfahren und Vorrichtung zum Kalibrieren von emissivitätsunabhängigen Temperaturmessungen
JP2002521686A (ja) * 1998-07-28 2002-07-16 シュテアク エルテーペー システムズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 放射率に無関係な温度測定をキャリブレーションする方法及び装置
JP4056148B2 (ja) * 1998-10-09 2008-03-05 東京エレクトロン株式会社 放射温度計を用いた温度測定方法
US6200023B1 (en) * 1999-03-15 2001-03-13 Steag Rtp Systems, Inc. Method for determining the temperature in a thermal processing chamber
US6293696B1 (en) * 1999-05-03 2001-09-25 Steag Rtp Systems, Inc. System and process for calibrating pyrometers in thermal processing chambers
US6616332B1 (en) 1999-11-18 2003-09-09 Sensarray Corporation Optical techniques for measuring parameters such as temperature across a surface
US7234862B2 (en) * 2000-10-13 2007-06-26 Tokyo Electron Limited Apparatus for measuring temperatures of a wafer using specular reflection spectroscopy
US6666577B2 (en) * 2000-11-02 2003-12-23 Matsushita Electric Industrial Co., Ltd. Method for predicting temperature, test wafer for use in temperature prediction, and method for evaluating lamp heating system
US6517235B2 (en) 2001-05-31 2003-02-11 Chartered Semiconductor Manufacturing Ltd. Using refractory metal silicidation phase transition temperature points to control and/or calibrate RTP low temperature operation
US20050233770A1 (en) * 2002-02-06 2005-10-20 Ramsey Craig C Wireless substrate-like sensor
US20050224902A1 (en) * 2002-02-06 2005-10-13 Ramsey Craig C Wireless substrate-like sensor
US7289230B2 (en) * 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
DE10325602B3 (de) * 2003-06-05 2004-09-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur temperaturgeregelten Prozessierung von Substraten
FR2874285B1 (fr) * 2004-08-13 2006-10-13 Commissariat Energie Atomique Procede de realisation d'empilements d'ilots de materiau semi-conducteur encapsules dans un autre materiau semi-conducteur
US7406397B2 (en) * 2004-09-02 2008-07-29 International Business Machines Corporation Self heating monitor for SiGe and SOI CMOS devices
DE102004051409B4 (de) * 2004-10-21 2010-01-07 Ivoclar Vivadent Ag Brennofen
US8547521B1 (en) * 2004-12-01 2013-10-01 Advanced Micro Devices, Inc. Systems and methods that control liquid temperature in immersion lithography to maintain temperature gradient to reduce turbulence
US7275861B2 (en) * 2005-01-31 2007-10-02 Veeco Instruments Inc. Calibration wafer and method of calibrating in situ temperatures
US7380982B2 (en) * 2005-04-01 2008-06-03 Lam Research Corporation Accurate temperature measurement for semiconductor applications
DE102005049477A1 (de) * 2005-10-13 2007-04-19 Freiberger Compound Materials Gmbh Verfahren und Vorrichtung zur Kristallzüchtung mittels kombinierter Heizerregelung
US7893697B2 (en) 2006-02-21 2011-02-22 Cyberoptics Semiconductor, Inc. Capacitive distance sensing in semiconductor processing tools
CN101410690B (zh) * 2006-02-21 2011-11-23 赛博光学半导体公司 半导体加工工具中的电容性距离感测
US8823933B2 (en) * 2006-09-29 2014-09-02 Cyberoptics Corporation Substrate-like particle sensor
US7778793B2 (en) * 2007-03-12 2010-08-17 Cyberoptics Semiconductor, Inc. Wireless sensor for semiconductor processing systems
JP4991390B2 (ja) * 2007-05-21 2012-08-01 株式会社日立ハイテクノロジーズ マイクロサンプル加熱用試料台
US8047706B2 (en) * 2007-12-07 2011-11-01 Asm America, Inc. Calibration of temperature control system for semiconductor processing chamber
US8523427B2 (en) * 2008-02-27 2013-09-03 Analog Devices, Inc. Sensor device with improved sensitivity to temperature variation in a semiconductor substrate
US9109961B2 (en) * 2010-08-31 2015-08-18 Canon U.S. Life Sciences, Inc. Compound calibrator for thermal sensors
US8749629B2 (en) 2011-02-09 2014-06-10 Siemens Energy, Inc. Apparatus and method for temperature mapping a turbine component in a high temperature combustion environment
DE102015106805A1 (de) 2015-04-30 2016-11-03 Anton Paar Optotec Gmbh Temperaturkalibration für Messgerät
KR102616595B1 (ko) * 2022-11-02 2023-12-28 한국표준과학연구원 서모커플 웨이퍼 교정 시스템 및 이를 이용한 교정방법
WO2024130209A1 (en) * 2022-12-16 2024-06-20 Lam Research Corporation Reference wafer for high fidelity in-situ temperature metrology calibration
CN117109776B (zh) * 2023-10-24 2024-01-19 成都明夷电子科技有限公司 一种光模块单点温度校准方法

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US3077539A (en) * 1961-08-28 1963-02-12 Little Inc A Radiation reference standard
US4309901A (en) * 1979-12-18 1982-01-12 The United States Of America As Represented By The Secretary Of The Air Force Heat transfer calibration plate
US4387301A (en) * 1981-04-20 1983-06-07 Hughes Aircraft Company Target for calibrating and testing infrared detection devices
US4627740A (en) * 1984-04-06 1986-12-09 Digital Dynamics, Inc. Self-calibrating temperature probe apparatus and method for use thereof
FR2570825B1 (fr) * 1984-09-26 1987-02-06 Commissariat Energie Atomique Appareil de mesure thermique de la texture d'un corps poreux
US4761539A (en) * 1987-04-13 1988-08-02 The Tappan Company Oven calibration system having variable stored calibration value
US5258602A (en) * 1988-02-17 1993-11-02 Itt Corporation Technique for precision temperature measurements of a semiconductor layer or wafer, based on its optical properties at selected wavelengths
US4956538A (en) * 1988-09-09 1990-09-11 Texas Instruments, Incorporated Method and apparatus for real-time wafer temperature measurement using infrared pyrometry in advanced lamp-heated rapid thermal processors
US4984902A (en) * 1989-04-13 1991-01-15 Peak Systems, Inc. Apparatus and method for compensating for errors in temperature measurement of semiconductor wafers during rapid thermal processing
US5092674A (en) * 1989-07-10 1992-03-03 General Atomics Micropipette adaptor for spectrophotometers with temperature control
US5092679A (en) * 1990-12-14 1992-03-03 Brotz Gregory R Melting point determination apparatus and method
US5102231A (en) * 1991-01-29 1992-04-07 Texas Instruments Incorporated Semiconductor wafer temperature measurement system and method
US5156461A (en) * 1991-05-17 1992-10-20 Texas Instruments Incorporated Multi-point pyrometry with real-time surface emissivity compensation
US5221142A (en) * 1991-05-20 1993-06-22 Peak Systems, Inc. Method and apparatus for temperature measurement using thermal expansion
US5265957A (en) * 1992-08-11 1993-11-30 Texas Instruments Incorporated Wireless temperature calibration device and method

Also Published As

Publication number Publication date
US5326170A (en) 1994-07-05
US5265957A (en) 1993-11-30
DE69314876D1 (de) 1997-12-04
DE69314876T2 (de) 1998-03-12
EP0583007A1 (en) 1994-02-16
JP3461868B2 (ja) 2003-10-27
KR100276412B1 (ko) 2001-01-15
EP0583007B1 (en) 1997-10-29
JPH06224206A (ja) 1994-08-12
KR940006239A (ko) 1994-03-23

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees