TW274162B - - Google Patents

Info

Publication number
TW274162B
TW274162B TW084101091A TW84101091A TW274162B TW 274162 B TW274162 B TW 274162B TW 084101091 A TW084101091 A TW 084101091A TW 84101091 A TW84101091 A TW 84101091A TW 274162 B TW274162 B TW 274162B
Authority
TW
Taiwan
Application number
TW084101091A
Other languages
Chinese (zh)
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Application granted granted Critical
Publication of TW274162B publication Critical patent/TW274162B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3164Partial encapsulation or coating the coating being a foil
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
TW084101091A 1994-03-10 1995-02-09 TW274162B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6040051A JPH07249877A (ja) 1994-03-10 1994-03-10 電子部品

Publications (1)

Publication Number Publication Date
TW274162B true TW274162B (xx) 1996-04-11

Family

ID=12570121

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084101091A TW274162B (xx) 1994-03-10 1995-02-09

Country Status (5)

Country Link
JP (1) JPH07249877A (xx)
KR (1) KR100294145B1 (xx)
CN (1) CN1096744C (xx)
DE (1) DE19507124A1 (xx)
TW (1) TW274162B (xx)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19548062A1 (de) * 1995-12-21 1997-06-26 Siemens Matsushita Components Elektrisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement - sowie ein Verfahren zu dessen Herstellung
EP0800338B1 (de) * 1996-04-04 2001-05-30 Gunter Langer Anordnung zur Reduzierung der elektromagnetischen Abstrahlung bei Leiterkarten und anderen Trägern elektronischer Schaltungen
DE19613587C2 (de) * 1996-04-04 2000-02-17 Langer Guenter Anordnung zur Blockierung der elektromagnetischen Abstrahlung bei Leiterkarten und integrierten Schaltkreisen
DE19818824B4 (de) * 1998-04-27 2008-07-31 Epcos Ag Elektronisches Bauelement und Verfahren zu dessen Herstellung
DE19820049C2 (de) * 1998-05-05 2001-04-12 Epcos Ag Thermomechanisches Verfahren zum Planarisieren einer fototechnisch strukturierbaren Schicht, insbesondere Verkapselung für elektronische Bauelemente
DE19854396C2 (de) * 1998-11-25 2002-02-07 Freudenberg Carl Kg Sensormodul
DE10049288B4 (de) 2000-10-04 2004-07-15 Infineon Technologies Ag Elektronische Bauteile und eine Folienband zum Verpacken von Bonddrahtverbindungen elektronischer Bauteile sowie deren Herstellungsverfahren
DE10125744A1 (de) * 2001-05-21 2002-12-05 Siemens Ag Verfahren zur Abschirmung einer auf einer Leiterplatte realisierten elektrischen Schaltung und eine entsprechende Kombination einer Leiterplatte mit einer Abschirmung
JP3770210B2 (ja) * 2002-06-20 2006-04-26 株式会社村田製作所 圧電部品の製造方法
JP5086835B2 (ja) * 2008-02-20 2012-11-28 パナソニック株式会社 電動工具

Also Published As

Publication number Publication date
CN1096744C (zh) 2002-12-18
KR950035554A (ko) 1995-12-30
DE19507124A1 (de) 1995-09-14
KR100294145B1 (ko) 2001-09-17
JPH07249877A (ja) 1995-09-26
CN1117666A (zh) 1996-02-28

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent