TW274162B - - Google Patents

Info

Publication number
TW274162B
TW274162B TW084101091A TW84101091A TW274162B TW 274162 B TW274162 B TW 274162B TW 084101091 A TW084101091 A TW 084101091A TW 84101091 A TW84101091 A TW 84101091A TW 274162 B TW274162 B TW 274162B
Authority
TW
Taiwan
Application number
TW084101091A
Other languages
Chinese (zh)
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Application granted granted Critical
Publication of TW274162B publication Critical patent/TW274162B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0438Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/144Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations comprising foils
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
TW084101091A 1994-03-10 1995-02-09 TW274162B (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6040051A JPH07249877A (ja) 1994-03-10 1994-03-10 電子部品

Publications (1)

Publication Number Publication Date
TW274162B true TW274162B (2) 1996-04-11

Family

ID=12570121

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084101091A TW274162B (2) 1994-03-10 1995-02-09

Country Status (5)

Country Link
JP (1) JPH07249877A (2)
KR (1) KR100294145B1 (2)
CN (1) CN1096744C (2)
DE (1) DE19507124A1 (2)
TW (1) TW274162B (2)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19548062A1 (de) * 1995-12-21 1997-06-26 Siemens Matsushita Components Elektrisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement - sowie ein Verfahren zu dessen Herstellung
DE19613587C2 (de) * 1996-04-04 2000-02-17 Langer Guenter Anordnung zur Blockierung der elektromagnetischen Abstrahlung bei Leiterkarten und integrierten Schaltkreisen
EP0800338B1 (de) * 1996-04-04 2001-05-30 Gunter Langer Anordnung zur Reduzierung der elektromagnetischen Abstrahlung bei Leiterkarten und anderen Trägern elektronischer Schaltungen
DE19818824B4 (de) * 1998-04-27 2008-07-31 Epcos Ag Elektronisches Bauelement und Verfahren zu dessen Herstellung
DE19820049C2 (de) * 1998-05-05 2001-04-12 Epcos Ag Thermomechanisches Verfahren zum Planarisieren einer fototechnisch strukturierbaren Schicht, insbesondere Verkapselung für elektronische Bauelemente
DE19854396C2 (de) * 1998-11-25 2002-02-07 Freudenberg Carl Kg Sensormodul
DE10049288B4 (de) * 2000-10-04 2004-07-15 Infineon Technologies Ag Elektronische Bauteile und eine Folienband zum Verpacken von Bonddrahtverbindungen elektronischer Bauteile sowie deren Herstellungsverfahren
DE10125744A1 (de) * 2001-05-21 2002-12-05 Siemens Ag Verfahren zur Abschirmung einer auf einer Leiterplatte realisierten elektrischen Schaltung und eine entsprechende Kombination einer Leiterplatte mit einer Abschirmung
JP3770210B2 (ja) * 2002-06-20 2006-04-26 株式会社村田製作所 圧電部品の製造方法
JP5086835B2 (ja) * 2008-02-20 2012-11-28 パナソニック株式会社 電動工具

Also Published As

Publication number Publication date
KR950035554A (ko) 1995-12-30
KR100294145B1 (ko) 2001-09-17
CN1096744C (zh) 2002-12-18
CN1117666A (zh) 1996-02-28
DE19507124A1 (de) 1995-09-14
JPH07249877A (ja) 1995-09-26

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent