TW271489B - - Google Patents

Info

Publication number
TW271489B
TW271489B TW084106241A TW84106241A TW271489B TW 271489 B TW271489 B TW 271489B TW 084106241 A TW084106241 A TW 084106241A TW 84106241 A TW84106241 A TW 84106241A TW 271489 B TW271489 B TW 271489B
Authority
TW
Taiwan
Application number
TW084106241A
Original Assignee
Empak Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Empak Inc filed Critical Empak Inc
Application granted granted Critical
Publication of TW271489B publication Critical patent/TW271489B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
TW084106241A 1994-05-23 1995-06-17 TW271489B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/247,887 US5476176A (en) 1994-05-23 1994-05-23 Reinforced semiconductor wafer holder

Publications (1)

Publication Number Publication Date
TW271489B true TW271489B (zh) 1996-03-01

Family

ID=22936797

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084106241A TW271489B (zh) 1994-05-23 1995-06-17

Country Status (7)

Country Link
US (1) US5476176A (zh)
EP (1) EP0760794A4 (zh)
JP (1) JPH09512960A (zh)
CN (2) CN1068289C (zh)
MY (1) MY112149A (zh)
TW (1) TW271489B (zh)
WO (1) WO1995032132A1 (zh)

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KR100234359B1 (ko) * 1995-07-20 1999-12-15 윤종용 박스기능을 갖는 웨이퍼 카세트
US5733024A (en) * 1995-09-13 1998-03-31 Silicon Valley Group, Inc. Modular system
USD378873S (en) * 1995-10-13 1997-04-22 Empak, Inc. 300 mm microenvironment pod with door on side
USD387903S (en) * 1995-10-13 1997-12-23 Empak, Inc. Shipping container
US5944194A (en) 1995-10-13 1999-08-31 Empak, Inc. 300 mm microenvironment pod with door on side
USD383898S (en) * 1995-10-13 1997-09-23 Empak, Inc. Combination shipping and transport cassette
US5873468A (en) * 1995-11-16 1999-02-23 Sumitomo Sitix Corporation Thin-plate supporting container with filter means
TW358472U (en) * 1995-11-27 1999-05-11 Samsung Electronics Co Ltd Wafer carrier with an anti-slip surface
US6286688B1 (en) * 1996-04-03 2001-09-11 Scp Global Technologies, Inc. Compliant silicon wafer handling system
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US6776289B1 (en) 1996-07-12 2004-08-17 Entegris, Inc. Wafer container with minimal contact
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
US6068668A (en) * 1997-03-31 2000-05-30 Motorola, Inc. Process for forming a semiconductor device
JPH11154699A (ja) * 1997-11-21 1999-06-08 Shin Etsu Polymer Co Ltd 容器の封止構造
JP3656701B2 (ja) * 1998-03-23 2005-06-08 東京エレクトロン株式会社 処理装置
US6216874B1 (en) * 1998-07-10 2001-04-17 Fluoroware, Inc. Wafer carrier having a low tolerance build-up
US6520191B1 (en) 1998-10-19 2003-02-18 Memc Electronic Materials, Inc. Carrier for cleaning silicon wafers
JP3556519B2 (ja) * 1999-04-30 2004-08-18 信越ポリマー株式会社 基板収納容器の識別構造及び基板収納容器の識別方法
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TW522448B (en) * 2001-10-22 2003-03-01 Advanced Semiconductor Eng Semiconductor wafer carrying apparatus
CN1298595C (zh) * 2001-11-14 2007-02-07 诚实公司 晶片封闭件密封结构、密封部件以及晶片密封件
CN100374358C (zh) * 2001-11-27 2008-03-12 诚实公司 通过门形成接地线路的前开口式晶片容器
US7789241B2 (en) * 2002-03-12 2010-09-07 Seagate Technology Llc Ergonomic substrate container
US7175026B2 (en) 2002-05-03 2007-02-13 Maxtor Corporation Memory disk shipping container with improved contaminant control
US7052739B2 (en) * 2002-05-09 2006-05-30 Maxtor Corporation Method of lubricating multiple magnetic storage disks in close proximity
US7180709B2 (en) 2002-05-09 2007-02-20 Maxtor Corporation Information-storage media with dissimilar outer diameter and/or inner diameter chamfer designs on two sides
US7600359B2 (en) * 2002-05-09 2009-10-13 Seagate Technology Llc Method of merging two disks concentrically without gap between disks
TWI229324B (en) * 2002-05-09 2005-03-11 Maxtor Corp Method of simultaneous two-disk processing of single-sided magnetic recording disks
US7367773B2 (en) * 2002-05-09 2008-05-06 Maxtor Corporation Apparatus for combining or separating disk pairs simultaneously
US7628895B2 (en) 2002-05-09 2009-12-08 Seagate Technology Llc W-patterned tools for transporting/handling pairs of disks
US7083871B2 (en) 2002-05-09 2006-08-01 Maxtor Corporation Single-sided sputtered magnetic recording disks
US6988620B2 (en) * 2002-09-06 2006-01-24 E.Pak International, Inc. Container with an adjustable inside dimension that restricts movement of items within the container
US7168153B2 (en) * 2002-10-10 2007-01-30 Maxtor Corporation Method for manufacturing single-sided hard memory disks
KR100675627B1 (ko) * 2002-10-10 2007-02-01 엘지.필립스 엘시디 주식회사 기판 수납용 카세트
US7083376B2 (en) 2002-10-10 2006-08-01 Maxtor Corporation Automated merge nest for pairs of magnetic storage disks
TWI337160B (en) * 2003-10-09 2011-02-11 Entegris Inc Shipper with tooth design for improved loading
JP4667769B2 (ja) * 2004-06-11 2011-04-13 信越ポリマー株式会社 基板収納容器
US7882616B1 (en) 2004-09-02 2011-02-08 Seagate Technology Llc Manufacturing single-sided storage media
GB0620196D0 (en) * 2006-10-11 2006-11-22 Metryx Ltd Measuring apparatus
EP2255384B1 (en) * 2008-02-21 2019-11-20 Saint-Gobain Ceramics & Plastics, Inc. Ceramic paddle
US20100020440A1 (en) * 2008-07-25 2010-01-28 Seagate Technology Llc Low profile substrate shipper
US8453841B1 (en) 2009-04-23 2013-06-04 Western Digital Technologies, Inc. Disk placement and storage assembly with disk cassette and disk slotter
WO2012079597A1 (de) * 2010-12-14 2012-06-21 Ev Group E. Thallner Gmbh Aufnahmeeinrichtung zur aufnahme und halterung eines wafers
JP5759324B2 (ja) * 2011-09-22 2015-08-05 矢崎総業株式会社 コネクタ及び一体成形品
CN104443848B (zh) * 2014-10-20 2017-02-15 深圳市华星光电技术有限公司 一种液晶玻璃包装箱及防潮包装结构

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Also Published As

Publication number Publication date
EP0760794A1 (en) 1997-03-12
JPH09512960A (ja) 1997-12-22
CN1165982C (zh) 2004-09-08
WO1995032132A1 (en) 1995-11-30
CN1282101A (zh) 2001-01-31
US5476176A (en) 1995-12-19
MY112149A (en) 2001-04-30
EP0760794A4 (en) 1998-08-12
CN1068289C (zh) 2001-07-11
CN1149279A (zh) 1997-05-07

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent