TW266320B - Process for CMOS wafer - Google Patents

Process for CMOS wafer

Info

Publication number
TW266320B
TW266320B TW84104214A TW84104214A TW266320B TW 266320 B TW266320 B TW 266320B TW 84104214 A TW84104214 A TW 84104214A TW 84104214 A TW84104214 A TW 84104214A TW 266320 B TW266320 B TW 266320B
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
mask
cmos wafer
etching
heavily doped
Prior art date
Application number
TW84104214A
Other languages
Chinese (zh)
Inventor
ming-xi Liu
Original Assignee
Winbond Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Winbond Electronics Corp filed Critical Winbond Electronics Corp
Priority to TW84104214A priority Critical patent/TW266320B/en
Application granted granted Critical
Publication of TW266320B publication Critical patent/TW266320B/en

Links

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)

Abstract

A new process of CMOS wafer comprises the steps of: coating mask-1 on semiconductor wafer for defining contact window of heavily doped area-1 on the semiconductor wafer; etching the semiconductor wafer; implanting ion-1; removing mask-1; coating mask-2 on semiconductor wafer for defining heavily doped area-2 and polysilicon contact window on the semiconductor wafer; etching the semiconductor wafer; implanting ion-2; removing mask-2.
TW84104214A 1995-04-28 1995-04-28 Process for CMOS wafer TW266320B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW84104214A TW266320B (en) 1995-04-28 1995-04-28 Process for CMOS wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW84104214A TW266320B (en) 1995-04-28 1995-04-28 Process for CMOS wafer

Publications (1)

Publication Number Publication Date
TW266320B true TW266320B (en) 1995-12-21

Family

ID=51402192

Family Applications (1)

Application Number Title Priority Date Filing Date
TW84104214A TW266320B (en) 1995-04-28 1995-04-28 Process for CMOS wafer

Country Status (1)

Country Link
TW (1) TW266320B (en)

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