TW260811B - - Google Patents

Info

Publication number
TW260811B
TW260811B TW084101425A TW84101425A TW260811B TW 260811 B TW260811 B TW 260811B TW 084101425 A TW084101425 A TW 084101425A TW 84101425 A TW84101425 A TW 84101425A TW 260811 B TW260811 B TW 260811B
Authority
TW
Taiwan
Application number
TW084101425A
Other languages
Chinese (zh)
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Application granted granted Critical
Publication of TW260811B publication Critical patent/TW260811B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW084101425A 1981-09-04 1995-02-16 TW260811B (US20020095090A1-20020718-M00002.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/299,378 US4450652A (en) 1981-09-04 1981-09-04 Temperature control for wafer polishing

Publications (1)

Publication Number Publication Date
TW260811B true TW260811B (US20020095090A1-20020718-M00002.png) 1995-10-21

Family

ID=23154526

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084101425A TW260811B (US20020095090A1-20020718-M00002.png) 1981-09-04 1995-02-16

Country Status (7)

Country Link
US (1) US4450652A (US20020095090A1-20020718-M00002.png)
JP (1) JPS5874040A (US20020095090A1-20020718-M00002.png)
KR (1) KR860000506B1 (US20020095090A1-20020718-M00002.png)
DE (1) DE3232814A1 (US20020095090A1-20020718-M00002.png)
GB (1) GB2104809B (US20020095090A1-20020718-M00002.png)
IT (1) IT1152529B (US20020095090A1-20020718-M00002.png)
TW (1) TW260811B (US20020095090A1-20020718-M00002.png)

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US10861702B2 (en) * 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10857647B2 (en) * 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
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TW202110575A (zh) 2019-05-29 2021-03-16 美商應用材料股份有限公司 用於化學機械研磨系統的蒸氣處置站
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CN115066316A (zh) 2020-06-29 2022-09-16 应用材料公司 控制化学机械抛光的蒸汽产生
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Also Published As

Publication number Publication date
DE3232814A1 (de) 1983-03-24
JPS5874040A (ja) 1983-05-04
KR840001774A (ko) 1984-05-16
KR860000506B1 (ko) 1986-05-02
GB2104809B (en) 1985-08-07
IT8223122A0 (it) 1982-09-03
US4450652A (en) 1984-05-29
IT1152529B (it) 1987-01-07
GB2104809A (en) 1983-03-16

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