CN110883696B - 一种上抛光盘水冷却系统 - Google Patents
一种上抛光盘水冷却系统 Download PDFInfo
- Publication number
- CN110883696B CN110883696B CN201911260499.9A CN201911260499A CN110883696B CN 110883696 B CN110883696 B CN 110883696B CN 201911260499 A CN201911260499 A CN 201911260499A CN 110883696 B CN110883696 B CN 110883696B
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- CN
- China
- Prior art keywords
- water
- cooling
- disc
- disk
- upper polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911260499.9A CN110883696B (zh) | 2019-12-10 | 2019-12-10 | 一种上抛光盘水冷却系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911260499.9A CN110883696B (zh) | 2019-12-10 | 2019-12-10 | 一种上抛光盘水冷却系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110883696A CN110883696A (zh) | 2020-03-17 |
CN110883696B true CN110883696B (zh) | 2021-10-01 |
Family
ID=69751340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201911260499.9A Active CN110883696B (zh) | 2019-12-10 | 2019-12-10 | 一种上抛光盘水冷却系统 |
Country Status (1)
Country | Link |
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CN (1) | CN110883696B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113500524A (zh) * | 2020-07-30 | 2021-10-15 | 赣州市业润自动化设备有限公司 | 一种化学机械水冷式研磨头 |
CN111922856B (zh) * | 2020-08-06 | 2022-01-18 | 泉州市海恩德机电科技发展有限公司 | 具有圆周供水机构的多磨头装置 |
CN115229629B (zh) * | 2022-06-28 | 2024-05-24 | 满洲里达赉湖热电有限公司 | 一种手持抛磨机的冷却结构 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4450652A (en) * | 1981-09-04 | 1984-05-29 | Monsanto Company | Temperature control for wafer polishing |
US6358119B1 (en) * | 1999-06-21 | 2002-03-19 | Taiwan Semiconductor Manufacturing Company | Way to remove CU line damage after CU CMP |
DE10161616A1 (de) * | 2001-12-14 | 2003-06-26 | Bosch Gmbh Robert | Handwerkzeugmaschine mit Motorluftkühlung und Spanabsaugung |
CN1648422A (zh) * | 2005-02-22 | 2005-08-03 | 赵清福 | 层叠式铝合金机油冷却器 |
CN102725831A (zh) * | 2010-08-11 | 2012-10-10 | 应用材料公司 | 在研磨期间用于温度控制的设备及方法 |
CN104772694A (zh) * | 2015-03-27 | 2015-07-15 | 苏州赫瑞特电子专用设备科技有限公司 | 一种抛光机的上抛光盘 |
CN105220126A (zh) * | 2014-05-28 | 2016-01-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 冷却装置、加载腔室及半导体加工设备 |
CN205950533U (zh) * | 2016-08-30 | 2017-02-15 | 中山市禾钜金属制品有限公司 | 一种冷却抛光盘 |
-
2019
- 2019-12-10 CN CN201911260499.9A patent/CN110883696B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4450652A (en) * | 1981-09-04 | 1984-05-29 | Monsanto Company | Temperature control for wafer polishing |
US6358119B1 (en) * | 1999-06-21 | 2002-03-19 | Taiwan Semiconductor Manufacturing Company | Way to remove CU line damage after CU CMP |
DE10161616A1 (de) * | 2001-12-14 | 2003-06-26 | Bosch Gmbh Robert | Handwerkzeugmaschine mit Motorluftkühlung und Spanabsaugung |
CN1648422A (zh) * | 2005-02-22 | 2005-08-03 | 赵清福 | 层叠式铝合金机油冷却器 |
CN102725831A (zh) * | 2010-08-11 | 2012-10-10 | 应用材料公司 | 在研磨期间用于温度控制的设备及方法 |
CN105220126A (zh) * | 2014-05-28 | 2016-01-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 冷却装置、加载腔室及半导体加工设备 |
CN104772694A (zh) * | 2015-03-27 | 2015-07-15 | 苏州赫瑞特电子专用设备科技有限公司 | 一种抛光机的上抛光盘 |
CN205950533U (zh) * | 2016-08-30 | 2017-02-15 | 中山市禾钜金属制品有限公司 | 一种冷却抛光盘 |
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Publication number | Publication date |
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CN110883696A (zh) | 2020-03-17 |
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PB01 | Publication | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20211022 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |