|
DE69325614T2
(de)
*
|
1992-05-01 |
2000-01-13 |
Texas Instruments Inc |
Pb/Bi enthaltende Oxide von hohen Dielektrizitätskonstanten unter Verwendung von Perovskiten als Pufferschicht, die keine Pb/Bi enthalten
|
|
US5572052A
(en)
*
|
1992-07-24 |
1996-11-05 |
Mitsubishi Denki Kabushiki Kaisha |
Electronic device using zirconate titanate and barium titanate ferroelectrics in insulating layer
|
|
US6664115B2
(en)
*
|
1992-10-23 |
2003-12-16 |
Symetrix Corporation |
Metal insulator structure with polarization-compatible buffer layer
|
|
DE69401826T2
(de)
*
|
1993-03-25 |
1997-06-12 |
Matsushita Electric Ind Co Ltd |
Dünnschichtkondensator und Verfahren zu seiner Herstellung
|
|
DE69404189T2
(de)
*
|
1993-03-31 |
1998-01-08 |
Texas Instruments Inc |
Leicht donatoren-dotierte Elektroden für Materialien mit hoher dielektrischer Konstante
|
|
US6404003B1
(en)
|
1999-07-28 |
2002-06-11 |
Symetrix Corporation |
Thin film capacitors on silicon germanium substrate
|
|
JP3113141B2
(ja)
*
|
1993-12-28 |
2000-11-27 |
シャープ株式会社 |
強誘電体結晶薄膜被覆基板、その製造方法及び強誘電体結晶薄膜被覆基板を用いた強誘電体薄膜デバイス
|
|
JPH07307444A
(ja)
*
|
1994-05-16 |
1995-11-21 |
Mitsubishi Materials Corp |
不揮発性強誘電体薄膜メモリのパターン形成方法
|
|
US5753945A
(en)
*
|
1995-06-29 |
1998-05-19 |
Northern Telecom Limited |
Integrated circuit structure comprising a zirconium titanium oxide barrier layer and method of forming a zirconium titanium oxide barrier layer
|
|
US5948216A
(en)
*
|
1996-05-17 |
1999-09-07 |
Lucent Technologies Inc. |
Method for making thin film tantalum oxide layers with enhanced dielectric properties and capacitors employing such layers
|
|
JP3052842B2
(ja)
*
|
1996-06-07 |
2000-06-19 |
富士ゼロックス株式会社 |
強誘電体薄膜素子の製造方法
|
|
US6225655B1
(en)
*
|
1996-10-25 |
2001-05-01 |
Texas Instruments Incorporated |
Ferroelectric transistors using thin film semiconductor gate electrodes
|
|
JP3011122B2
(ja)
*
|
1996-12-03 |
2000-02-21 |
住友電気工業株式会社 |
積層型酸化物絶縁膜
|
|
US5973351A
(en)
*
|
1997-01-22 |
1999-10-26 |
International Business Machines Corporation |
Semiconductor device with high dielectric constant insulator material
|
|
JP3337622B2
(ja)
*
|
1997-07-16 |
2002-10-21 |
松下電器産業株式会社 |
選択的エッチング液及びそのエッチング液を用いた半導体装置の製造方法
|
|
US6074885A
(en)
*
|
1997-11-25 |
2000-06-13 |
Radiant Technologies, Inc |
Lead titanate isolation layers for use in fabricating PZT-based capacitors and similar structures
|
|
EP0926739A1
(en)
*
|
1997-12-24 |
1999-06-30 |
Texas Instruments Incorporated |
A structure of and method for forming a mis field effect transistor
|
|
KR100436059B1
(ko)
|
1997-12-30 |
2004-12-17 |
주식회사 하이닉스반도체 |
강유전체 캐패시터 형성 방법
|
|
KR20000026967A
(ko)
|
1998-10-24 |
2000-05-15 |
김영환 |
반도체 장치의 커패시터 및 그 형성 방법
|
|
US6270568B1
(en)
*
|
1999-07-15 |
2001-08-07 |
Motorola, Inc. |
Method for fabricating a semiconductor structure with reduced leakage current density
|
|
TW417293B
(en)
|
1999-08-27 |
2001-01-01 |
Taiwan Semiconductor Mfg |
Formation of DRAM capacitor
|
|
US6392257B1
(en)
|
2000-02-10 |
2002-05-21 |
Motorola Inc. |
Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same
|
|
US6693033B2
(en)
|
2000-02-10 |
2004-02-17 |
Motorola, Inc. |
Method of removing an amorphous oxide from a monocrystalline surface
|
|
JP4445091B2
(ja)
*
|
2000-04-07 |
2010-04-07 |
康夫 垂井 |
強誘電体記憶素子
|
|
EP1290733A1
(en)
|
2000-05-31 |
2003-03-12 |
Motorola, Inc. |
Semiconductor device and method for manufacturing the same
|
|
US6410941B1
(en)
|
2000-06-30 |
2002-06-25 |
Motorola, Inc. |
Reconfigurable systems using hybrid integrated circuits with optical ports
|
|
US6477285B1
(en)
|
2000-06-30 |
2002-11-05 |
Motorola, Inc. |
Integrated circuits with optical signal propagation
|
|
US6427066B1
(en)
|
2000-06-30 |
2002-07-30 |
Motorola, Inc. |
Apparatus and method for effecting communications among a plurality of remote stations
|
|
US6501973B1
(en)
|
2000-06-30 |
2002-12-31 |
Motorola, Inc. |
Apparatus and method for measuring selected physical condition of an animate subject
|
|
US6482538B2
(en)
|
2000-07-24 |
2002-11-19 |
Motorola, Inc. |
Microelectronic piezoelectric structure and method of forming the same
|
|
WO2002009187A2
(en)
|
2000-07-24 |
2002-01-31 |
Motorola, Inc. |
Heterojunction tunneling diodes and process for fabricating same
|
|
US6432546B1
(en)
|
2000-07-24 |
2002-08-13 |
Motorola, Inc. |
Microelectronic piezoelectric structure and method of forming the same
|
|
US6555946B1
(en)
|
2000-07-24 |
2003-04-29 |
Motorola, Inc. |
Acoustic wave device and process for forming the same
|
|
US6590236B1
(en)
|
2000-07-24 |
2003-07-08 |
Motorola, Inc. |
Semiconductor structure for use with high-frequency signals
|
|
US6493497B1
(en)
|
2000-09-26 |
2002-12-10 |
Motorola, Inc. |
Electro-optic structure and process for fabricating same
|
|
US6638838B1
(en)
|
2000-10-02 |
2003-10-28 |
Motorola, Inc. |
Semiconductor structure including a partially annealed layer and method of forming the same
|
|
US6583034B2
(en)
|
2000-11-22 |
2003-06-24 |
Motorola, Inc. |
Semiconductor structure including a compliant substrate having a graded monocrystalline layer and methods for fabricating the structure and semiconductor devices including the structure
|
|
US6563118B2
(en)
|
2000-12-08 |
2003-05-13 |
Motorola, Inc. |
Pyroelectric device on a monocrystalline semiconductor substrate and process for fabricating same
|
|
US6559471B2
(en)
|
2000-12-08 |
2003-05-06 |
Motorola, Inc. |
Quantum well infrared photodetector and method for fabricating same
|
|
US20020096683A1
(en)
*
|
2001-01-19 |
2002-07-25 |
Motorola, Inc. |
Structure and method for fabricating GaN devices utilizing the formation of a compliant substrate
|
|
US6673646B2
(en)
|
2001-02-28 |
2004-01-06 |
Motorola, Inc. |
Growth of compound semiconductor structures on patterned oxide films and process for fabricating same
|
|
US7046719B2
(en)
|
2001-03-08 |
2006-05-16 |
Motorola, Inc. |
Soft handoff between cellular systems employing different encoding rates
|
|
WO2002082551A1
(en)
|
2001-04-02 |
2002-10-17 |
Motorola, Inc. |
A semiconductor structure exhibiting reduced leakage current
|
|
US6709989B2
(en)
|
2001-06-21 |
2004-03-23 |
Motorola, Inc. |
Method for fabricating a semiconductor structure including a metal oxide interface with silicon
|
|
US6992321B2
(en)
|
2001-07-13 |
2006-01-31 |
Motorola, Inc. |
Structure and method for fabricating semiconductor structures and devices utilizing piezoelectric materials
|
|
US6531740B2
(en)
|
2001-07-17 |
2003-03-11 |
Motorola, Inc. |
Integrated impedance matching and stability network
|
|
US6646293B2
(en)
|
2001-07-18 |
2003-11-11 |
Motorola, Inc. |
Structure for fabricating high electron mobility transistors utilizing the formation of complaint substrates
|
|
US6693298B2
(en)
|
2001-07-20 |
2004-02-17 |
Motorola, Inc. |
Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same
|
|
US7019332B2
(en)
|
2001-07-20 |
2006-03-28 |
Freescale Semiconductor, Inc. |
Fabrication of a wavelength locker within a semiconductor structure
|
|
US6498358B1
(en)
*
|
2001-07-20 |
2002-12-24 |
Motorola, Inc. |
Structure and method for fabricating an electro-optic system having an electrochromic diffraction grating
|
|
US6472694B1
(en)
|
2001-07-23 |
2002-10-29 |
Motorola, Inc. |
Microprocessor structure having a compound semiconductor layer
|
|
US6855992B2
(en)
|
2001-07-24 |
2005-02-15 |
Motorola Inc. |
Structure and method for fabricating configurable transistor devices utilizing the formation of a compliant substrate for materials used to form the same
|
|
US6667196B2
(en)
|
2001-07-25 |
2003-12-23 |
Motorola, Inc. |
Method for real-time monitoring and controlling perovskite oxide film growth and semiconductor structure formed using the method
|
|
US6585424B2
(en)
|
2001-07-25 |
2003-07-01 |
Motorola, Inc. |
Structure and method for fabricating an electro-rheological lens
|
|
US6594414B2
(en)
|
2001-07-25 |
2003-07-15 |
Motorola, Inc. |
Structure and method of fabrication for an optical switch
|
|
US6462360B1
(en)
|
2001-08-06 |
2002-10-08 |
Motorola, Inc. |
Integrated gallium arsenide communications systems
|
|
US6639249B2
(en)
|
2001-08-06 |
2003-10-28 |
Motorola, Inc. |
Structure and method for fabrication for a solid-state lighting device
|
|
US6589856B2
(en)
|
2001-08-06 |
2003-07-08 |
Motorola, Inc. |
Method and apparatus for controlling anti-phase domains in semiconductor structures and devices
|
|
US20030034491A1
(en)
|
2001-08-14 |
2003-02-20 |
Motorola, Inc. |
Structure and method for fabricating semiconductor structures and devices for detecting an object
|
|
US6673667B2
(en)
|
2001-08-15 |
2004-01-06 |
Motorola, Inc. |
Method for manufacturing a substantially integral monolithic apparatus including a plurality of semiconductor materials
|
|
US20030071327A1
(en)
|
2001-10-17 |
2003-04-17 |
Motorola, Inc. |
Method and apparatus utilizing monocrystalline insulator
|
|
US6916717B2
(en)
|
2002-05-03 |
2005-07-12 |
Motorola, Inc. |
Method for growing a monocrystalline oxide layer and for fabricating a semiconductor device on a monocrystalline substrate
|
|
US7169619B2
(en)
|
2002-11-19 |
2007-01-30 |
Freescale Semiconductor, Inc. |
Method for fabricating semiconductor structures on vicinal substrates using a low temperature, low pressure, alkaline earth metal-rich process
|
|
US6885065B2
(en)
|
2002-11-20 |
2005-04-26 |
Freescale Semiconductor, Inc. |
Ferromagnetic semiconductor structure and method for forming the same
|
|
US7453129B2
(en)
|
2002-12-18 |
2008-11-18 |
Noble Peak Vision Corp. |
Image sensor comprising isolated germanium photodetectors integrated with a silicon substrate and silicon circuitry
|
|
US6965128B2
(en)
|
2003-02-03 |
2005-11-15 |
Freescale Semiconductor, Inc. |
Structure and method for fabricating semiconductor microresonator devices
|
|
US7020374B2
(en)
|
2003-02-03 |
2006-03-28 |
Freescale Semiconductor, Inc. |
Optical waveguide structure and method for fabricating the same
|
|
US7320931B2
(en)
*
|
2004-07-30 |
2008-01-22 |
Freescale Semiconductor Inc. |
Interfacial layer for use with high k dielectric materials
|
|
US8124513B2
(en)
*
|
2009-03-18 |
2012-02-28 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Germanium field effect transistors and fabrication thereof
|
|
EP2270840B1
(en)
*
|
2009-06-29 |
2020-06-03 |
IMEC vzw |
Method for manufacturing an III-V material substrate and the substrate thereof
|
|
US20170185400A1
(en)
|
2015-12-23 |
2017-06-29 |
Intel Corporation |
Mode-specific endbranch for control flow termination
|
|
EP3670708A1
(en)
|
2018-12-20 |
2020-06-24 |
IMEC vzw |
Perovskite oxides with a-axis orientation
|
|
KR102905840B1
(ko)
*
|
2024-02-08 |
2025-12-29 |
서울대학교산학협력단 |
커패시터와 그 제조 방법 및 커패시터를 포함하는 소자
|