TW253073B - - Google Patents

Info

Publication number
TW253073B
TW253073B TW083110288A TW83110288A TW253073B TW 253073 B TW253073 B TW 253073B TW 083110288 A TW083110288 A TW 083110288A TW 83110288 A TW83110288 A TW 83110288A TW 253073 B TW253073 B TW 253073B
Authority
TW
Taiwan
Application number
TW083110288A
Other languages
Chinese (zh)
Original Assignee
Toshiba Seiki Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4333694A external-priority patent/JP3248647B2/ja
Application filed by Toshiba Seiki Kk filed Critical Toshiba Seiki Kk
Application granted granted Critical
Publication of TW253073B publication Critical patent/TW253073B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
TW083110288A 1993-11-26 1994-11-07 TW253073B (oth)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP31926193 1993-11-26
JP4333694A JP3248647B2 (ja) 1994-02-18 1994-02-18 ウエハシート引伸し装置

Publications (1)

Publication Number Publication Date
TW253073B true TW253073B (oth) 1995-08-01

Family

ID=26383094

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083110288A TW253073B (oth) 1993-11-26 1994-11-07

Country Status (5)

Country Link
US (1) US5516026A (oth)
KR (1) KR0163366B1 (oth)
GB (1) GB2284302B (oth)
HK (1) HK1005215A1 (oth)
TW (1) TW253073B (oth)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI635558B (zh) * 2017-10-02 2018-09-11 王傳璋 Temporary expansion fixture after wafer cutting

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69534124T2 (de) * 1994-04-18 2006-05-04 Micron Technology, Inc. Verfahren und Vorrichtung zum automatischen Positionieren elektronischer Würfel in Bauteilverpackungen
KR0175267B1 (ko) * 1995-09-30 1999-04-01 김광호 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치
KR100199293B1 (ko) * 1996-11-08 1999-06-15 윤종용 반도체 패키지 제조 장치
US5939777A (en) * 1996-12-06 1999-08-17 Texas Instruments Incorporated High aspect ratio integrated circuit chip and method for producing the same
EP0923111B1 (de) * 1997-12-07 2007-05-02 Oerlikon Assembly Equipment AG, Steinhausen Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
JP3838797B2 (ja) * 1998-10-27 2006-10-25 松下電器産業株式会社 部品の貼り着け方法とその装置
US6730998B1 (en) * 2000-02-10 2004-05-04 Micron Technology, Inc. Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same
US6426552B1 (en) 2000-05-19 2002-07-30 Micron Technology, Inc. Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
US6432752B1 (en) * 2000-08-17 2002-08-13 Micron Technology, Inc. Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
SG97164A1 (en) 2000-09-21 2003-07-18 Micron Technology Inc Individual selective rework of defective bga solder balls
US20040164461A1 (en) * 2002-11-11 2004-08-26 Ahmad Syed Sajid Programmed material consolidation systems including multiple fabrication sites and associated methods
US7216009B2 (en) * 2004-06-14 2007-05-08 Micron Technology, Inc. Machine vision systems for use with programmable material consolidation system and associated methods and structures
CN100479123C (zh) * 2004-09-30 2009-04-15 广东工业大学 平面双滑块并联机构二自由度粘片机焊头结构及动作过程
GB2473600B (en) * 2009-08-25 2013-09-25 Pillarhouse Int Ltd Quick-loading soldering apparatus
JP7465199B2 (ja) * 2019-12-11 2024-04-10 芝浦メカトロニクス株式会社 実装装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
JPH0468553A (ja) * 1990-07-10 1992-03-04 Toshiba Seiki Kk ウエハエキスパンド装置
JP2635889B2 (ja) * 1992-06-24 1997-07-30 株式会社東芝 ダイボンディング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI635558B (zh) * 2017-10-02 2018-09-11 王傳璋 Temporary expansion fixture after wafer cutting

Also Published As

Publication number Publication date
GB2284302A (en) 1995-05-31
GB9423244D0 (en) 1995-01-04
KR950015676A (ko) 1995-06-17
KR0163366B1 (ko) 1999-02-01
GB2284302B (en) 1997-11-26
US5516026A (en) 1996-05-14
HK1005215A1 (en) 1998-12-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees