TW229331B - - Google Patents

Info

Publication number
TW229331B
TW229331B TW082107856A TW82107856A TW229331B TW 229331 B TW229331 B TW 229331B TW 082107856 A TW082107856 A TW 082107856A TW 82107856 A TW82107856 A TW 82107856A TW 229331 B TW229331 B TW 229331B
Authority
TW
Taiwan
Application number
TW082107856A
Other languages
Chinese (zh)
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW229331B publication Critical patent/TW229331B/zh

Links

Classifications

    • H10W99/00—
    • H10W20/48—
    • H10W20/495—
    • H10W70/415—
    • H10W72/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
TW082107856A 1992-09-02 1993-09-24 TW229331B (index.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US93918892A 1992-09-02 1992-09-02

Publications (1)

Publication Number Publication Date
TW229331B true TW229331B (index.php) 1994-09-01

Family

ID=25472701

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082107856A TW229331B (index.php) 1992-09-02 1993-09-24

Country Status (6)

Country Link
US (1) US5334802A (index.php)
EP (1) EP0586163B1 (index.php)
JP (1) JPH0794660A (index.php)
KR (1) KR100281986B1 (index.php)
DE (1) DE69314584T2 (index.php)
TW (1) TW229331B (index.php)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6525976B1 (en) 2000-10-24 2003-02-25 Excellatron Solid State, Llc Systems and methods for reducing noise in mixed-mode integrated circuits
KR20030084086A (ko) * 2002-04-24 2003-11-01 엑셀라트론 솔리드 스테이트 엘엘씨 혼합-모드 집적회로의 노이즈 감소를 위한 시스템 및 방법
US7830221B2 (en) * 2008-01-25 2010-11-09 Micron Technology, Inc. Coupling cancellation scheme

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862245A (en) * 1985-04-18 1989-08-29 International Business Machines Corporation Package semiconductor chip
JPH0279463A (ja) * 1988-09-14 1990-03-20 Mitsubishi Electric Corp 半導体記憶装置
KR0158868B1 (ko) * 1988-09-20 1998-12-01 미다 가쓰시게 반도체장치
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
DE69033280T2 (de) * 1989-06-30 1999-12-30 Texas Instruments Inc., Dallas Anschlussrahmen mit ausgeglichener Kapazität für integrierte Schaltungen
JPH088330B2 (ja) * 1989-07-19 1996-01-29 日本電気株式会社 Ｌｏｃ型リードフレームを備えた半導体集積回路装置
US4965654A (en) * 1989-10-30 1990-10-23 International Business Machines Corporation Semiconductor package with ground plane
US5197184A (en) * 1990-09-11 1993-03-30 Hughes Aircraft Company Method of forming three-dimensional circuitry

Also Published As

Publication number Publication date
EP0586163B1 (en) 1997-10-15
KR100281986B1 (ko) 2001-03-02
EP0586163A3 (index.php) 1994-03-23
KR940008023A (ko) 1994-04-28
DE69314584T2 (de) 1998-02-19
JPH0794660A (ja) 1995-04-07
EP0586163A2 (en) 1994-03-09
DE69314584D1 (de) 1997-11-20
US5334802A (en) 1994-08-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees