TW224563B - - Google Patents

Info

Publication number
TW224563B
TW224563B TW082103132A TW82103132A TW224563B TW 224563 B TW224563 B TW 224563B TW 082103132 A TW082103132 A TW 082103132A TW 82103132 A TW82103132 A TW 82103132A TW 224563 B TW224563 B TW 224563B
Authority
TW
Taiwan
Application number
TW082103132A
Other languages
Chinese (zh)
Original Assignee
Siemens Comp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Comp Inc filed Critical Siemens Comp Inc
Application granted granted Critical
Publication of TW224563B publication Critical patent/TW224563B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754—Connector integrally incorporated in the printed circuit board [PCB] or in housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW082103132A 1992-04-30 1993-04-23 TW224563B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/876,640 US5311407A (en) 1992-04-30 1992-04-30 Printed circuit based for mounted semiconductors and other electronic components

Publications (1)

Publication Number Publication Date
TW224563B true TW224563B (enExample) 1994-06-01

Family

ID=25368240

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082103132A TW224563B (enExample) 1992-04-30 1993-04-23

Country Status (5)

Country Link
US (2) US5311407A (enExample)
EP (1) EP0567814B1 (enExample)
JP (1) JPH0669402A (enExample)
DE (1) DE69320090T2 (enExample)
TW (1) TW224563B (enExample)

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US5781447A (en) * 1993-08-13 1998-07-14 Micron Eletronics, Inc. System for recreating a printed circuit board from disjointly formatted data
US5420752A (en) * 1993-08-18 1995-05-30 Lsi Logic Corporation GPT system for encapsulating an integrated circuit package
US6031723A (en) * 1994-08-18 2000-02-29 Allen-Bradley Company, Llc Insulated surface mount circuit board construction
US5667388A (en) * 1994-11-14 1997-09-16 Intel Corporation Printed circuit board adapter carrier for input/output cards
US5659950A (en) * 1995-03-23 1997-08-26 Motorola, Inc. Method of forming a package assembly
US5612511A (en) * 1995-09-25 1997-03-18 Hewlett-Packard Company Double-sided electrical interconnect flexible circuit for ink-jet hard copy systems
US5598033A (en) * 1995-10-16 1997-01-28 Advanced Micro Devices, Inc. Micro BGA stacking scheme
US5991160A (en) * 1995-12-27 1999-11-23 Infineon Technologies Corporation Surface mount LED alphanumeric display
DE19600617A1 (de) * 1996-01-10 1997-07-17 Bosch Gmbh Robert Elektrisches Gerät
US5940686A (en) * 1996-04-12 1999-08-17 Conexant Systems, Inc. Method for manufacturing multi-chip modules utilizing direct lead attach
DE19618099A1 (de) * 1996-05-06 1997-11-13 Siemens Ag Leiterverbundsystem und Verfahren zur Herstellung elektrisch leitender Verbindungen zwischen zwei oder mehr Leiterstrukturen
US6112406A (en) * 1996-05-06 2000-09-05 Siemens Aktiengesellschaft Method for producing electrically conductive connections between two or more conductor structures
US6078359A (en) * 1996-07-15 2000-06-20 The Regents Of The University Of California Vacuum compatible miniature CCD camera head
US5786238A (en) * 1997-02-13 1998-07-28 Generyal Dynamics Information Systems, Inc. Laminated multilayer substrates
US6687980B1 (en) 1997-03-04 2004-02-10 Tessera, Inc. Apparatus for processing flexible tape for microelectronic assemblies
US6049972A (en) * 1997-03-04 2000-04-18 Tessera, Inc. Universal unit strip/carrier frame assembly and methods
US6188874B1 (en) 1997-06-27 2001-02-13 Lockheed Martin Corporation Control and telemetry signal communication system for geostationary satellites
JP3506002B2 (ja) * 1997-07-28 2004-03-15 松下電工株式会社 プリント配線板の製造方法
US6047470A (en) * 1997-08-20 2000-04-11 Micron Technology, Inc. Singulation methods
US6574858B1 (en) * 1998-02-13 2003-06-10 Micron Technology, Inc. Method of manufacturing a chip package
US6329705B1 (en) * 1998-05-20 2001-12-11 Micron Technology, Inc. Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and method of designing and fabricating such leadframes
SE513786C2 (sv) 1999-03-09 2000-11-06 Ericsson Telefon Ab L M Metod för framställning av mönsterkort samt anordning för värmeavledning framställt enligt metoden
US6713854B1 (en) 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
US7102892B2 (en) * 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US6487078B2 (en) * 2000-03-13 2002-11-26 Legacy Electronics, Inc. Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
US7337522B2 (en) * 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
US7103970B2 (en) * 2001-03-14 2006-09-12 Legacy Electronics, Inc. Method for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
US20030168249A1 (en) * 2002-02-14 2003-09-11 Ngk Spark Plug Co., Ltd. Wiring board and method for producing the same
EP2365539B1 (en) * 2003-05-26 2018-05-02 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device
US7435097B2 (en) * 2005-01-12 2008-10-14 Legacy Electronics, Inc. Radial circuit board, system, and methods
US7977698B2 (en) * 2005-03-18 2011-07-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. System and method for surface mountable display
US20060231848A1 (en) * 2005-04-14 2006-10-19 Chien-Kun Fu Light emitting diode package for enhancing light extraction
TWM281293U (en) * 2005-05-06 2005-11-21 Harvatek Corp Optoelectronic chip array package structure
KR100663549B1 (ko) * 2005-12-21 2007-01-02 삼성전자주식회사 반도체 패키지 및 그 제조방법
KR100770934B1 (ko) * 2006-09-26 2007-10-26 삼성전자주식회사 반도체 패키지와 그를 이용한 반도체 시스템 패키지
EP2220430A4 (en) * 2007-11-19 2010-12-22 Nexxus Lighting Inc DEVICE AND METHOD FOR HEAT MANAGEMENT OF LUMINAIRE DIODES
US20100025862A1 (en) * 2008-07-29 2010-02-04 Peter Alfred Gruber Integrated Circuit Interconnect Method and Apparatus
JP2010258271A (ja) * 2009-04-27 2010-11-11 Yazaki Corp 均熱プレートを備えた配線基板及びその製造方法
TWI381780B (zh) 2010-04-28 2013-01-01 Wus Printed Circuit Co Ltd 可辨識印刷電路板之製造方法
JP6114184B2 (ja) * 2011-04-04 2017-04-12 ローム株式会社 半導体装置および半導体装置の製造方法
US8994157B1 (en) 2011-05-27 2015-03-31 Scientific Components Corporation Circuit system in a package
TWI464868B (zh) * 2011-09-14 2014-12-11 隆達電子股份有限公司 固態光源模組及固態光源陣列
FR2999862A1 (fr) * 2012-12-14 2014-06-20 Valeo Systemes Thermiques Circuit imprime comportant un dispositif de refroidissement insert caloporteur
TWI544868B (zh) * 2014-07-11 2016-08-01 台達電子工業股份有限公司 散熱模組及其結合方法
US10319674B2 (en) * 2014-10-29 2019-06-11 Infineon Technologies Americas Corp. Packaged assembly for high density power applications
US10343496B2 (en) * 2015-10-07 2019-07-09 GM Global Technology Operations LLC Antimicrobial UV-C treatment for automotive HVAC systems

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4305204A (en) * 1980-01-16 1981-12-15 Litronix, Inc. Method for making display device
US4393581A (en) * 1980-01-22 1983-07-19 Amp Incorporated Method of forming leads on a lead frame
JPS60109362U (ja) * 1983-12-28 1985-07-25 アルプス電気株式会社 多層プリント基板のア−ス構造
US4677528A (en) * 1984-05-31 1987-06-30 Motorola, Inc. Flexible printed circuit board having integrated circuit die or the like affixed thereto
JPH0412714Y2 (enExample) * 1984-10-09 1992-03-26
JPS61159793A (ja) * 1984-12-31 1986-07-19 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
US4763188A (en) * 1986-08-08 1988-08-09 Thomas Johnson Packaging system for multiple semiconductor devices
JPH01199497A (ja) * 1987-11-10 1989-08-10 Ibiden Co Ltd 電子部品塔載用基板
JP2603102B2 (ja) * 1988-05-12 1997-04-23 イビデン株式会社 電子部品搭載用基板の製造方法

Also Published As

Publication number Publication date
DE69320090T2 (de) 1999-02-11
US5357674A (en) 1994-10-25
DE69320090D1 (de) 1998-09-10
US5311407A (en) 1994-05-10
JPH0669402A (ja) 1994-03-11
EP0567814B1 (en) 1998-08-05
EP0567814A1 (en) 1993-11-03

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