TW220008B - Metalization process for multi-layered ceramics substrate - Google Patents
Metalization process for multi-layered ceramics substrateInfo
- Publication number
- TW220008B TW220008B TW81108609A TW81108609A TW220008B TW 220008 B TW220008 B TW 220008B TW 81108609 A TW81108609 A TW 81108609A TW 81108609 A TW81108609 A TW 81108609A TW 220008 B TW220008 B TW 220008B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- conducting
- photo
- resistor
- metal
- Prior art date
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
A method to make metal wiring layer on multi-layered ceramics substrate, which includes conducting wires and holes, for LSI semiconductor chip's connection, comprises: - net-plate printing an erodable conducting metal ink layer on the ceramics ubstrate and also drying and burning; - depositing a photo-resistor layer on the metal ink and also exposing and eveloping; - eroding the part of burned metal ink which is exposed outside the photo- esistor's covering area to form the metal wiring figure, and then removing he photo-resistor; - forming a dielectric layer, which has conducting holes, on the ceramics ubstrate and the metal wiring; - filling conducting ink into the conducting hole and also drying and urning; - repeating the above processes until the required wiring layer is stablished; - net-plate printing a conducting metal ink layer whose top is erodable and lso drying and burning; - depositing a photo-resistor layer on the surface and also developing after xposing and forming a figure with very thin wirings; - eroding the part of top conducting metal layer which is exposed outside the hoto-resistor and forming the required top layer's metal wiring figure; - removing the remained photo-resistor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW81108609A TW220008B (en) | 1992-10-23 | 1992-10-23 | Metalization process for multi-layered ceramics substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW81108609A TW220008B (en) | 1992-10-23 | 1992-10-23 | Metalization process for multi-layered ceramics substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
TW220008B true TW220008B (en) | 1994-02-01 |
Family
ID=51348061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW81108609A TW220008B (en) | 1992-10-23 | 1992-10-23 | Metalization process for multi-layered ceramics substrate |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW220008B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI458639B (en) * | 2011-10-19 | 2014-11-01 | Viking Tech Corp | A method for selective metallization on a ceramic substrate |
-
1992
- 1992-10-23 TW TW81108609A patent/TW220008B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI458639B (en) * | 2011-10-19 | 2014-11-01 | Viking Tech Corp | A method for selective metallization on a ceramic substrate |
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