TW220008B - Metalization process for multi-layered ceramics substrate - Google Patents

Metalization process for multi-layered ceramics substrate

Info

Publication number
TW220008B
TW220008B TW81108609A TW81108609A TW220008B TW 220008 B TW220008 B TW 220008B TW 81108609 A TW81108609 A TW 81108609A TW 81108609 A TW81108609 A TW 81108609A TW 220008 B TW220008 B TW 220008B
Authority
TW
Taiwan
Prior art keywords
layer
conducting
photo
resistor
metal
Prior art date
Application number
TW81108609A
Other languages
Chinese (zh)
Inventor
Shyr-Long Wey
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW81108609A priority Critical patent/TW220008B/en
Application granted granted Critical
Publication of TW220008B publication Critical patent/TW220008B/en

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

A method to make metal wiring layer on multi-layered ceramics substrate, which includes conducting wires and holes, for LSI semiconductor chip's connection, comprises: - net-plate printing an erodable conducting metal ink layer on the ceramics ubstrate and also drying and burning; - depositing a photo-resistor layer on the metal ink and also exposing and eveloping; - eroding the part of burned metal ink which is exposed outside the photo- esistor's covering area to form the metal wiring figure, and then removing he photo-resistor; - forming a dielectric layer, which has conducting holes, on the ceramics ubstrate and the metal wiring; - filling conducting ink into the conducting hole and also drying and urning; - repeating the above processes until the required wiring layer is stablished; - net-plate printing a conducting metal ink layer whose top is erodable and lso drying and burning; - depositing a photo-resistor layer on the surface and also developing after xposing and forming a figure with very thin wirings; - eroding the part of top conducting metal layer which is exposed outside the hoto-resistor and forming the required top layer's metal wiring figure; - removing the remained photo-resistor.
TW81108609A 1992-10-23 1992-10-23 Metalization process for multi-layered ceramics substrate TW220008B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW81108609A TW220008B (en) 1992-10-23 1992-10-23 Metalization process for multi-layered ceramics substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW81108609A TW220008B (en) 1992-10-23 1992-10-23 Metalization process for multi-layered ceramics substrate

Publications (1)

Publication Number Publication Date
TW220008B true TW220008B (en) 1994-02-01

Family

ID=51348061

Family Applications (1)

Application Number Title Priority Date Filing Date
TW81108609A TW220008B (en) 1992-10-23 1992-10-23 Metalization process for multi-layered ceramics substrate

Country Status (1)

Country Link
TW (1) TW220008B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458639B (en) * 2011-10-19 2014-11-01 Viking Tech Corp A method for selective metallization on a ceramic substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458639B (en) * 2011-10-19 2014-11-01 Viking Tech Corp A method for selective metallization on a ceramic substrate

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